JP5850847B2 - 誘電体バリア放電によって基板の表面を被覆するための装置、無機基板上に膜を蒸着するための方法及び誘電体バリア放電によって基板の表面を被覆するための装置の使用 - Google Patents
誘電体バリア放電によって基板の表面を被覆するための装置、無機基板上に膜を蒸着するための方法及び誘電体バリア放電によって基板の表面を被覆するための装置の使用 Download PDFInfo
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- JP5850847B2 JP5850847B2 JP2012540404A JP2012540404A JP5850847B2 JP 5850847 B2 JP5850847 B2 JP 5850847B2 JP 2012540404 A JP2012540404 A JP 2012540404A JP 2012540404 A JP2012540404 A JP 2012540404A JP 5850847 B2 JP5850847 B2 JP 5850847B2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
- H05H2242/20—Power circuits
- H05H2242/22—DC, AC or pulsed generators
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Surface Treatment Of Glass (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09176940.6 | 2009-11-24 | ||
EP09176940 | 2009-11-24 | ||
EP10153448.5 | 2010-02-12 | ||
EP10153448A EP2326151A1 (fr) | 2009-11-24 | 2010-02-12 | Procédé et dispositif de polarisation d'une électrode DBD |
PCT/EP2010/068049 WO2011064217A1 (fr) | 2009-11-24 | 2010-11-23 | Procédé et dispositif de polarisation d'une électrode dbd |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013511816A JP2013511816A (ja) | 2013-04-04 |
JP5850847B2 true JP5850847B2 (ja) | 2016-02-03 |
Family
ID=42983804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012540404A Expired - Fee Related JP5850847B2 (ja) | 2009-11-24 | 2010-11-23 | 誘電体バリア放電によって基板の表面を被覆するための装置、無機基板上に膜を蒸着するための方法及び誘電体バリア放電によって基板の表面を被覆するための装置の使用 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9401265B2 (pt) |
EP (2) | EP2326151A1 (pt) |
JP (1) | JP5850847B2 (pt) |
CN (1) | CN102668721B (pt) |
AR (1) | AR087137A1 (pt) |
BR (1) | BR112012012496B1 (pt) |
EA (1) | EA023480B1 (pt) |
PL (1) | PL2505041T3 (pt) |
SI (1) | SI2505041T1 (pt) |
WO (1) | WO2011064217A1 (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014097621A1 (en) * | 2012-12-21 | 2014-06-26 | Asahi Glass Company Limited | Pair of electrodes for dbd plasma process |
SG11201912569UA (en) | 2017-06-27 | 2020-01-30 | Canon Anelva Corp | Plasma processing apparatus |
PL3648551T3 (pl) | 2017-06-27 | 2021-12-06 | Canon Anelva Corporation | Urządzenie do obróbki plazmowej |
WO2019003312A1 (ja) * | 2017-06-27 | 2019-01-03 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
KR102421625B1 (ko) * | 2017-06-27 | 2022-07-19 | 캐논 아네르바 가부시키가이샤 | 플라스마 처리 장치 |
CZ2018206A3 (cs) * | 2018-05-02 | 2019-06-12 | Fyzikální Ústav Av Čr, V. V. I. | Způsob generování nízkoteplotního plazmatu, způsob povlakování vnitřního povrchu dutých elektricky vodivých nebo feromagnetických trubic a zařízení pro provádění těchto způsobů |
JP6688440B1 (ja) | 2018-06-26 | 2020-04-28 | キヤノンアネルバ株式会社 | プラズマ処理装置、プラズマ処理方法、プログラムおよびメモリ媒体 |
TWI728569B (zh) * | 2019-11-25 | 2021-05-21 | 馗鼎奈米科技股份有限公司 | 放電極化設備 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3619352A1 (de) | 1986-06-09 | 1987-12-10 | Philips Patentverwaltung | Eintaktdurchflusswandler |
JP3577601B2 (ja) * | 1993-09-20 | 2004-10-13 | 株式会社ダイオー | 大気圧グロ−放電プラズマ処理法 |
JPH07155529A (ja) * | 1993-12-01 | 1995-06-20 | Takuma Co Ltd | ガス処理装置とそれの運転方法 |
DE19537212A1 (de) | 1994-10-06 | 1996-04-11 | Leybold Ag | Vorrichtung zum Beschichten von Substraten im Vakuum |
US5573597A (en) * | 1995-06-07 | 1996-11-12 | Sony Corporation | Plasma processing system with reduced particle contamination |
JPH08337497A (ja) * | 1995-06-09 | 1996-12-24 | Iwatani Internatl Corp | ダイヤモンド薄膜の気相合成法 |
WO1997013266A2 (en) * | 1995-06-19 | 1997-04-10 | The University Of Tennessee Research Corporation | Discharge methods and electrodes for generating plasmas at one atmosphere of pressure, and materials treated therewith |
CN1161820C (zh) * | 1998-07-31 | 2004-08-11 | 佳能株式会社 | 半导体层制造方法和制造设备、光生伏打电池的制造方法 |
FR2782837B1 (fr) * | 1998-08-28 | 2000-09-29 | Air Liquide | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
TWI225499B (en) * | 1999-04-15 | 2004-12-21 | Konishiroku Photo Ind | Protective film for polarizing plate |
EP1073091A3 (en) * | 1999-07-27 | 2004-10-06 | Matsushita Electric Works, Ltd. | Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus |
US6827870B1 (en) * | 1999-10-12 | 2004-12-07 | Wisconsin Alumni Research Foundation | Method and apparatus for etching and deposition using micro-plasmas |
WO2001059809A1 (en) | 2000-02-11 | 2001-08-16 | Dow Corning Ireland Limited | An atmospheric pressure plasma system |
JP2003003268A (ja) * | 2001-06-19 | 2003-01-08 | Konica Corp | 大気圧プラズマ処理装置、大気圧プラズマ処理方法、基材、光学フィルム、及び画像表示素子 |
CN1266988C (zh) * | 2002-11-26 | 2006-07-26 | 广东杰特科技发展有限公司 | 发生随机性流光放电等离子体的工业装置及其应用 |
US7988816B2 (en) * | 2004-06-21 | 2011-08-02 | Tokyo Electron Limited | Plasma processing apparatus and method |
WO2007024134A1 (en) * | 2005-08-26 | 2007-03-01 | Fujifilm Manufacturing Europe B.V. | Method and arrangement for generating and controlling a discharge plasma |
US7589470B2 (en) * | 2006-01-31 | 2009-09-15 | Dublin City University | Method and apparatus for producing plasma |
JP2009525381A (ja) * | 2006-02-02 | 2009-07-09 | フジフィルム マニュファクチャリング ユーロプ ビー.ブイ. | プラズマによる表面処理方法及び表面処理装置 |
KR20080024885A (ko) * | 2006-09-15 | 2008-03-19 | 이택기 | 플라즈마 반응기의 파라미터 계산 방법 |
CN201017845Y (zh) * | 2007-03-14 | 2008-02-06 | 万京林 | 差分馈电介质阻挡放电低温等离子体装置 |
EP2145701A1 (fr) * | 2008-07-16 | 2010-01-20 | AGC Flat Glass Europe SA | Procédé et installation pour la préparation de surface par décharge à barrière diélectrique |
EP2145978A1 (fr) * | 2008-07-16 | 2010-01-20 | AGC Flat Glass Europe SA | Procédé et installation pour le dépôt de couches sur un substrat |
EP2180768A1 (en) * | 2008-10-23 | 2010-04-28 | TNO Nederlandse Organisatie voor Toegepast Wetenschappelijk Onderzoek | Apparatus and method for treating an object |
-
2010
- 2010-02-12 EP EP10153448A patent/EP2326151A1/fr not_active Withdrawn
- 2010-11-23 US US13/511,163 patent/US9401265B2/en not_active Expired - Fee Related
- 2010-11-23 PL PL10784500T patent/PL2505041T3/pl unknown
- 2010-11-23 EP EP10784500.0A patent/EP2505041B8/fr active Active
- 2010-11-23 WO PCT/EP2010/068049 patent/WO2011064217A1/fr active Application Filing
- 2010-11-23 BR BR112012012496-0A patent/BR112012012496B1/pt not_active IP Right Cessation
- 2010-11-23 JP JP2012540404A patent/JP5850847B2/ja not_active Expired - Fee Related
- 2010-11-23 EA EA201290431A patent/EA023480B1/ru not_active IP Right Cessation
- 2010-11-23 SI SI201030469T patent/SI2505041T1/sl unknown
- 2010-11-23 CN CN201080053108.7A patent/CN102668721B/zh not_active Expired - Fee Related
- 2010-11-24 AR ARP100104353A patent/AR087137A1/es not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SI2505041T1 (sl) | 2014-03-31 |
JP2013511816A (ja) | 2013-04-04 |
EP2326151A1 (fr) | 2011-05-25 |
EP2505041B1 (fr) | 2013-09-18 |
BR112012012496B1 (pt) | 2020-11-17 |
PL2505041T3 (pl) | 2014-07-31 |
BR112012012496A2 (pt) | 2016-04-12 |
EA201290431A1 (ru) | 2013-04-30 |
EP2505041B8 (fr) | 2014-04-23 |
US9401265B2 (en) | 2016-07-26 |
WO2011064217A1 (fr) | 2011-06-03 |
WO2011064217A8 (fr) | 2011-09-01 |
AR087137A1 (es) | 2014-02-26 |
US20120258260A1 (en) | 2012-10-11 |
CN102668721B (zh) | 2015-04-29 |
CN102668721A (zh) | 2012-09-12 |
EA023480B1 (ru) | 2016-06-30 |
EP2505041A1 (fr) | 2012-10-03 |
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