JP5847530B2 - Socket for electrical parts - Google Patents

Description

  The present invention relates to a socket for an electric component that is disposed on a wiring board and accommodates the electric component in order to test an electric component such as a semiconductor device (hereinafter referred to as “IC package”).

  Conventionally, as this type of “electrical component socket”, for example, there is an IC socket that detachably accommodates an IC package as an “electrical component”.

  This IC socket has a resin socket body that is disposed on a wiring board and accommodates an IC package. The socket body has a plurality of circular cross-section insertion holes into which a plurality of contact pins are inserted. Has been.

  And as this contact pin, while an upper end part is press-contacted to the spherical terminal of IC package, and a lower end part is press-contacted to the metal disk-shaped contact pad of a wiring board, these spherical terminal and contact pad A so-called surface pressure contact type contact pin that electrically connects the two is widely used (see, for example, Patent Document 1).

JP 2005-241426 A

  However, in such a conventional device, although the hole diameter of the insertion hole is designed to substantially match the diameter of the contact pad, in practice, due to the influence of tolerance, the insertion hole of the socket body is In some cases, the peripheral edge partly overlaps the contact pad in plan view. For example, when the hole diameter of the insertion hole is slightly smaller than the diameter of the contact pad, the peripheral edge portion of the insertion hole of the socket body overlaps with the contact pad in an annular shape in plan view. In addition, even if the hole diameter of the insertion hole is equal to or larger than the diameter of the contact pad, if the insertion hole slightly deviates from the contact pad, the periphery of the insertion hole of the socket body is in a crescent shape in plan view with the contact pad There is a risk of overlapping.

  In such a case, when the upper and lower ends of the contact pin are pressed against the spherical terminal and the contact pad, when the socket body is pressed against the wiring board side with a pusher, if the load is large, the resin socket body is inserted. The holes are crushed in contact with the metal contact pads. In particular, when the number of contact pins is small, the force per unit area, that is, the pressure increases, so that the insertion hole is easily crushed. As a result, a burr is generated around the insertion hole, and a contact pin may be caught on the burr to cause a pin stack.

  Therefore, the present invention avoids a situation in which the insertion hole contacts the contact pad and is crushed even when the peripheral edge of the insertion hole of the socket body partially overlaps the contact pad in plan view. It is an object of the present invention to provide a socket for an electrical component that can prevent the occurrence of this.

In order to achieve the above object, the present invention provides a socket body disposed on a wiring board having a contact pad protruding upward, and an electrical component is accommodated therein, and a terminal of the electrical component provided in the socket body. with the upper end portion is pressed against the, by the lower end portion is pressed against the contact pads of the wiring substrate, a electrical component socket having a plurality of contact pins for electrically connecting the terminals and the contact pads In the socket body, the plurality of contact pins are inserted, and a plurality of insertion holes for accommodating the contact pins are formed by being pressed against and raised by the contact pads of the wiring board. The plurality of contact pins in the insertion hole forming region in which the plurality of insertion holes are formed on the lower surface of the socket body. In There predetermined pin arrangement region inserted, is formed across the recess which is recessed upwardly in said plurality of insertion holes, by which the socket body is arranged on the wiring board, the plurality of contact pins The electrical component socket is configured such that a vertical gap is formed between the upper surface of the recess and the upper surface of the contact pad in a state where the contact pad of the wiring board is pushed up and raised. To do.

  Another feature is that the insertion hole has a circular cross section, the contact pad has a disk shape, and the diameter of the insertion hole is smaller than the diameter of the contact pad.

  Another feature is that the socket body is configured to be positioned at the lowest position on the wiring board by having a lower surface abutting against a standoff pad provided around the contact pad. is there.

  According to the present invention, the recess is formed in the pin arrangement region on the lower surface of the socket body, and the vertical gap is formed between the upper surface of the recess and the upper surface of the contact pad. Will not touch. Therefore, even when the peripheral edge portion of the insertion hole of the socket body partially overlaps the contact pad in plan view, the situation where the insertion hole contacts the contact pad and is crushed is avoided, and the occurrence of pin stack is prevented. Can be prevented.

  According to another feature, since the hole diameter of the insertion hole is smaller than the diameter of the contact pad, even if the insertion hole is surely in contact with the contact pad if there is no recess on the lower surface of the socket body, the above-described effects are exhibited. This increases the utility value of the present invention.

  According to another feature, the socket body is positioned at the lowest position by the lower surface contacting the standoff pad provided on the wiring board, so when the socket body is pressed to the wiring board side, Contact between the insertion hole and the contact pad can be reliably avoided.

1 is a plan view of an IC socket according to an embodiment of the present invention. It is a front view of IC socket concerning the embodiment. It is an expanded sectional view which shows the insertion hole of the unit of IC socket shown in FIG. It is an expanded sectional view which shows the recessed part formed in the insertion hole of the unit of the IC socket shown in FIG. It is a bottom view which shows the unit of the IC socket which concerns on the same embodiment. It is a figure which shows the IC package accommodated in the IC socket which concerns on the embodiment, Comprising: (a) is the front view, (b) is the bottom view.

  Embodiments of the present invention will be described below.

  1 to 6 show an embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in FIG. 1 denotes an IC socket as an “electrical component socket”, and the IC socket 11 is arranged on the wiring board P as shown in FIG. In order to perform a burn-in test or the like of the IC package 12 (see FIGS. 3 and 6) which is an “electric part”, a spherical terminal 12a as a “terminal” of the IC package 12 and the wiring board P An electrical connection with the metal contact pad 30 (see FIGS. 3 and 4) is intended.

  The IC package 12 is called a ball grid array (BGA) and has a rectangular package body 12b in a plan view as shown in FIG. 6, and a plurality of spherical shapes are formed on the lower surface of the package body 12b. The terminals 12a are arranged in a lattice shape (grid shape) and protrude downward.

  As shown in FIGS. 1 and 2, the IC socket 11 is fixed on the wiring board P, and is made of a resin socket main body 14 in which the IC package 12 is accommodated. A coil spring 13 is interposed in the socket main body 14. And a cover member 15 that presses the IC package 12.

  More specifically, as shown in FIGS. 1 and 2, the cover member 15 is rotated by the cover body 15a, the pusher 15c urged downward by the cover body 15a via the spring 15b, and the cover body 15a. And a latch 15d for holding the cover member 15 in a closed state.

  1 to 4, the socket body 14 includes a frame body 23, a resin unit 21 disposed in the frame body 23 and provided with a plurality of contact pins 20, The unit 21 includes a floating plate 22 that is disposed on the upper side of the unit 21 so as to be movable up and down and accommodates the IC package 12, and a coil spring (not shown) that biases the floating plate 22 upward. The unit 21 further includes a flat plate-like first plate 16 and a flat plate-like second plate 17 disposed and fixed above the first plate 16. Each of the floating plate 22, the first plate 16, and the second plate 17 includes a plurality of circular cross-section insertion holes 22a, a plurality of circular cross-section stepped insertion holes 16a, and a plurality of circular cross-section steps. An insertion hole 17a is formed penetrating in the vertical direction (arrow Z direction), and a contact pin 20 is inserted in a part of these insertion holes 22a, 16a, 17a in the vertical direction. Each insertion hole 16a of the first plate 16 is formed with a predetermined hole diameter D1 (for example, D1 = 0.25 to 0.5 mm).

  This contact pin 20 is of a so-called surface pressure contact type, and as shown in FIG. 3, a lower plunger 26 as a conductive “lower end” and an upper plunger 27 as a conductive “upper end”. And a conductive spring 29 that urges the plungers 26 and 27 upward and downward apart from each other. In the contact pin 20, the stepped portion 26 a of the lower plunger 26 is engaged with the stepped portion 16 b of the insertion hole 16 a of the first plate 16, and the stepped portion 27 a of the upper plunger 27 is inserted into the second plate 17. By being locked to the stepped portion 17b of the hole 17a, the unit 21 is fixed.

  Further, as shown in FIGS. 3, 4 and 5, an insertion hole forming area A1 having a plurality of insertion holes 17a is formed on the lower surface of the unit 21, and the insertion hole forming area A1 is inserted into the insertion hole forming area A1. A rectangular pin arrangement region A2 in which the contact pin 20 is inserted into the hole 16a, and a non-pinned portion in which the contact pin 20 is not inserted into the insertion hole 16a. It is comprised from arrangement | positioning area | region A3. In the pin arrangement region A2, as shown in FIG. 4, a concave portion 18 recessed upward is formed with a predetermined depth D3 (for example, D3 = 0.05 to 0.1 mm).

  The method for forming the recess 18 is not particularly limited. For example, when the first plate 16 of the unit 21 is manufactured by injection molding, a convex portion is provided in advance in a portion where the concave portion 18 is formed in the molding die, and the concave portion 18 is formed by injection molding using this molding die. The 1st plate 16 provided with can be obtained. Alternatively, the concave portion 18 may be formed by cutting the first plate 16 without the concave portion 18 with a tool such as an end mill. Furthermore, the unit 21 is made thinner by the depth D3 of the recess 18 and the recess 18 is not provided, and a spacer having a thickness corresponding to the depth D3 of the recess 18 is provided in the pin non-arrangement region A3 on the lower surface of the unit 21. Or a spacer having a thickness corresponding to the depth D3 of the recess 18 may be attached only to the portion in contact with the stand-off pad 31.

  Furthermore, on the wiring board P, as shown in FIGS. 3 and 4, a plurality of conductive materials facing the plurality of insertion holes 16 a of the first plate 16 in the pin arrangement region A <b> 2 on the lower surface of the unit 21. The disk-like contact pads 30 are attached at a predetermined pitch, and a plurality of disk-like standoff pads 31 are attached at a predetermined pitch in the pin non-arrangement region A3 on the lower surface of the unit 21. The stand-off pad 31 is substantially the same size as the contact pad 30, that is, the diameter D2 (for example, D2 = 0.25 to 0.5 mm) and the thickness T1 (for example, T1 = 0.05 to 0.1 mm). Is formed.

  Here, in the pin arrangement region A2, as shown in FIG. 4, since the concave portion 18 that is recessed upward is provided, the vertical direction is provided between the upper surface 18a of the concave portion 18 and the upper surface 30a of the contact pad 30. A gap in the direction of arrow Z is formed.

  Next, how to use the IC socket 11 will be described.

  First, the IC socket 11 is mounted on the wiring board P, and the socket body 14 is fixed to the wiring board P. As a result, in the pin arrangement area A2 on the lower surface of the unit 21, the lower plunger 26 of each contact pin 20 comes into contact with the contact pad 30 of the wiring board P and then rises in a form pushed up by the contact pad 30. As shown in FIG. 4, the IC socket 11 stops when the pin non-arrangement area A <b> 3 on the lower surface of the unit 21 contacts the standoff pad 31 of the wiring board P.

  Subsequently, the IC package 12 is accommodated on the floating plate 22 of the IC socket 11, the cover member 15 is rotated in the closing direction (the direction of arrow N in FIG. 2), and the pusher 15c resists the elasticity of the spring 15b. The IC package 12 is pressed downward. Accordingly, after each spherical terminal 12a of the IC package 12 contacts the plunger 27 on the upper side of each contact pin 20, the IC package 12 alone moves the plunger 27 on the upper side of the contact pin 20 against the elasticity of the spring 29. The IC package 12 descends while being compressed, and stops once when the peripheral edge of the IC package 12 comes into contact with a mounting portion (not shown) of the floating plate 22. Thereafter, the IC package 12 is further lowered together with the floating plate 22 while pressing and contracting the plunger 27 on the upper side of the contact pin 20 against the elasticity of the spring 29, and stops when the floating plate 22 contacts the second plate 17.

  As a result, the respective spherical terminals 12a of the IC package 12 and the respective contact pads 30 of the wiring board P are electrically connected to each other through the respective contact pins 20. Further, since the pressing force from the pusher 15c is transmitted to the first plate 16 via the IC package 12, the floating plate 22, and the second plate 17, the first plate 16 is pressed to the wiring board P side.

  At this time, if the concave portion 18 is not provided on the lower surface of the unit 21, the peripheral portion of the insertion hole 16a of the first plate 16 is seen from the contact pad 30 in a plan view due to the influence of tolerance and the like as in the conventional IC package. In this case, the insertion hole 16a of the resin first plate 16 contacts the metal contact pad 30 and is crushed. Therefore, burrs are generated around the insertion hole 16a, and the contact pins 20 may be caught by the burrs, thereby causing a pin stack.

  On the other hand, in this embodiment, the lower surface of the unit 21 is provided with the concave portion 18 that is recessed upward in the pin disposition region A2 as described above. Therefore, the upper surface 18a of the concave portion 18 and the contact pad 30 are provided. A gap in the vertical direction (arrow Z direction) is formed between the upper surface 30a and the insertion hole 16a of the first plate 16 does not contact the contact pad 30. Therefore, even when the peripheral edge portion of the insertion hole 16a of the first plate 16 partially overlaps the contact pad 30 in a plan view, the situation where the insertion hole 16a contacts the contact pad 30 and is crushed is avoided. It is possible to prevent pin stacks from occurring.

  In particular, when the hole diameter D1 of the insertion hole 16a of the first plate 16 is smaller than the diameter D2 of the contact pad 30, the insertion hole 16a is surely formed in the contact pad 30 unless the concave portion 18 is provided on the lower surface of the unit 21. However, even in this case, it is possible to avoid the situation where the insertion hole 16a contacts the contact pad 30 and is crushed, thereby preventing the occurrence of pin stack.

  When the hole diameter D1 of the insertion hole 16a of the first plate 16 is smaller than the diameter D2 of the contact pad 30, in other words, when the diameter D2 of the contact pad 30 is larger than the hole diameter D1 of the insertion hole 16a of the first plate 16. Even if the insertion hole 16a is slightly displaced from the contact pad 30, the contact pin 20 and the contact pad 30 are reliably in contact with each other.

  Further, since the IC socket 11 is positioned at the lowest position when the pin non-arrangement area A3 on the lower surface of the unit 21 contacts the standoff pad 31, the first plate 16 is pressed to the wiring board P side. Sometimes, the contact between the insertion hole 16a and the contact pad 30 can be reliably avoided.

  In this state, a current is passed through the IC package 12 to perform a burn-in test or the like.

  In the above embodiment, the present invention is applied to the IC socket 11 as the “electrical component socket”. However, the present invention is not limited to this and can be applied to other devices.

  In the above embodiment, the contact pin 20 including the two plungers 26 and 27 and the spring 29 is used. However, as long as the contact pin 20 is of the surface pressure contact type, the present invention is similarly applied to any contact pin 20 used. Can be applied to.

  Moreover, although the said embodiment demonstrated the socket main body 14 provided with the unit 21, the floating plate 22, etc., this invention is applicable also to what does not have the floating plate 22. FIG.

  Moreover, in the said embodiment, although the unit 21 which consists of 2 components of the 1st plate 16 and the 2nd plate 17 was demonstrated, even when the unit 21 of 1 components is used, this invention can be applied similarly. .

  Further, the electrical component socket of the present invention can be applied to a so-called open top type IC socket or the like.

11 IC socket (socket for electrical parts)
12 IC package (electrical parts)
12a Spherical terminal (terminal)
14 Socket body
16a Insertion hole
18 recess
18a top view
20 Contact pin
26 Lower plunger (lower end)
27 Upper plunger (upper end)
30 contact pads
30a Top view
31 Standoff pad
A1 Insertion hole formation area
A2 Pin layout area P Wiring board

Claims (3)

A socket body disposed on a wiring board having a contact pad protruding upward ;
Provided on the socket body, together with the upper end portion is pressed against the terminal of the electrical part, by the lower end portion is pressed against the contact pads of the wiring board, for electrically connecting the terminals and the contact pads A socket for an electrical component having a plurality of contact pins,
In the socket main body, the plurality of contact pins are inserted, and a plurality of insertion holes that can accommodate the contact pins are formed by being pressed against and raised by the contact pads of the wiring board ,
On the lower surface of the socket body, in the predetermined pin arrangement region where the plurality of contact pins are inserted in the insertion hole forming region where the plurality of insertion holes are formed, a concave portion recessed upward is formed in the plurality of insertion holes. And the socket body is disposed on the wiring board, so that the plurality of contact pins are pushed up and raised by the contact pads of the wiring board, and the upper surface of the recess and the A socket for electrical parts, characterized in that a vertical gap is formed between the upper surface of the contact pads.   2. The electrical component socket according to claim 1, wherein the insertion hole has a circular cross section, the contact pad has a disk shape, and the diameter of the insertion hole is smaller than the diameter of the contact pad.   The socket main body is configured to be positioned at the lowest position by contacting a lower surface of a stand-off pad provided around the contact pad on the wiring board. The socket for electrical components according to 1 or 2.

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