JP2003307542A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket for pressure-contacting a pin terminal or a coil contact against a burn-in board interposed between the pin terminal or the coil contact contacting an IC bump and an IC tester. <P>SOLUTION: The IC socket electrically mechanically connects the bump 29 arranged in a matrix shape on a bottom surface of the IC 28 with the burn-in board 6 through the pin terminal 14 the coil contact 21. A tip of a tapered small diameter coil 211' of the coil contact 21 mutually contacted with a planar electrode 62 formed on the burn-in board 6 protrudes above a tip of the pin terminal 14. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to a pin terminal or a coil contact which contacts a bump of an IC and a burn-in board interposed between an IC tester and the pin terminal or the coil contact. The present invention relates to an IC socket that can be brought into pressure contact.

[0002]

2. Description of the Related Art A first prior art example will be described with reference to FIGS. FIG. 8 is a diagram showing a steady state in which IC is not measured, and FIG. 9 is a diagram showing an IC measurement state. 14 is a pin terminal. The pin terminal 14 has a bulged terminal electrode 141 in the middle thereof, a pin contact portion 142 in the lower half, and a taper portion 143 in the upper half. Reference numeral 10 denotes a terminal guide, and pin terminal insertion holes 101 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. Reference numeral 21 denotes a coil contact, which has a tapered small-diameter coil portion 211 whose tip is wound in a taper shape, and a lower-half portion which is a large-diameter coil portion 212. Here, the inner shape of the tapered small-diameter coil portion 211 and the outer shape of the tip end portion of the taper portion 143 are substantially similar to each other, and the dimensions are the same even if the tip end of the taper portion 143 is pressed into the tapered small-diameter coil portion 211.
It is formed in a shape and dimension in which 43 does not penetrate. The upper half portion of the tapered portion 143 of the pin terminal 14 has a longer total length than the total length of the coil contact 21.

A guide plate 15 has coil contact insertion holes 151 formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. 152 is a guide plate 1
5 is a concave portion of the terminal electrode formed on the lower surface of
41 is accommodated. Reference numeral 20 is a float, and the through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. This float 20 is biased upward by a float spring 45, and IC2
In the steady state where 8 is not measured, the level is as shown in FIG. A float pin indicated by 44 is inserted into the float spring 45 and guided thereby. 4 indicates a base. Reference numeral 41 denotes a pin terminal coil contact accommodating portion formed by penetrating the base 4, and a supporting flange 42 is formed at a lower portion so as to project inward. Float pin fitting holes 43 are formed in the base 4 so as to be separated from each other in the vertical direction. The float 20 has a float pin guide hole 2 corresponding to the float pin fitting hole 43.
05 is formed. The float pin 44 is fitted and fixed in the float pin fitting hole 43. A spring fitting hole 204 into which the float spring 45 is fitted and positioned is formed in the float 20.

The base 4 is provided with a frame (not shown) which is rotationally engaged with the base 4. At the time of measurement, the IC 28 is rotationally positioned with respect to the opening 206 formed in the float 20 while being held by the frame. Here, a method of measuring the IC will be described. IC28
Is rotationally positioned in the state shown in FIG. 8 with respect to the opening 206 formed in the float 20 while being held by a frame (not shown). Rotate the frame further to I
When C28 is pressed downward, the lower surface of the IC 28 displaces the float 20 downward while compressing the float spring 45, and the bump 29 of the IC 28 comes into contact with the upper end of the tapered small-diameter coil portion 211 of the coil contact 21. .
When the frame is further rotated to press the IC 28 downward, the bump 29 compresses and deforms the coil contact 21 downward while the lower surface of the IC 28 displaces the float 20 downward, and the tapered small-diameter coil portion 211 is provided with the pin terminal 14. The displacement of the tapered small-diameter coil portion 211 is stopped when the tapered tip of the tapered portion 143 is fitted and strongly engaged. Here, the bump 29 of the IC 28 and the pin terminal 14
The coil contact 21 is interposed between the bump 29 and the terminal electrode 141 between the pin contact portion 142 and the pin contact portion 142 and is strongly pressed against both by the elastic restoring force, so that good electrical contact is secured. The bump 29 of the IC 28 is the coil contact 21.
The taper small-diameter coil portion 211 having a substantially cylindrical shape is brought into a close-wound state by strongly pressing the taper portion 143 of the pin terminal 14 through the taper small-diameter coil portion 211.
And the tapered portion 143 of the pin terminal 14 through the terminal electrode 1
It is electrically connected to 41, and bridges a portion of the large-diameter coil portion 212 of the coil contact 21 that operates as an elastic coil. After all, bump 29 of IC 28 and pin terminal 1
4 does not have a portion that operates as an electric coil between the pin contact portion 142 and the pin contact portion 142, the effect of reducing the inductance of the IC socket in a high-frequency electric signal is large, and the pure resistance value between the bump 29 and the pin contact portion 142 is large. Is also reduced.

A modification of the first prior art will be described with reference to FIG. In this modification, a flexible anisotropic conductive adhesive sheet 50 is bonded to the entire lower surface of the guide plate 15 as shown in the drawing, and the lower end portion of the coil contact 21 and the pin terminal 14 are joined.
Is interposed between the upper surfaces of the swelled terminal electrodes 141. FIG. 10 shows a state in which the IC 28 is pressed downward,
In the downward pressing state of the IC 28, the flexible anisotropic conductive adhesive sheet 50 is compressed and sandwiched between the lower end portion of the coil contact 21 and the upper surface of the terminal electrode 141 of the pin terminal 14 to ensure electrical connection therebetween. To That is, the coil contact 21
In some cases, due to variations in the manufacture of the pin terminals 14, mechanical contact between the two becomes insufficient, and proper electrical connection cannot be guaranteed. However, this insufficient mechanical contact results in flexibility between the two. The absorption is canceled by interposing the anisotropic conductive adhesive sheet 50.

A second prior example will be described with reference to FIGS. 11 and 12. FIG. 11 shows a state before contact, and FIG. 12 shows a contact state at the time of measurement. In the first prior art example, the number of pin terminals was only one, but in the second example, in addition to the pin terminal 14, a movable pin terminal 14 having substantially the same configuration as the pin terminal 14. Use two of '. Correspondingly, a movable pin terminal guide 10 'for guiding the movable pin terminal 14' is provided. Movable pin terminal guide 1
Movable pin terminal insertion holes 101 ′ are formed in a matrix at 0 ′ at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The pin terminal 14 has a bulged terminal electrode 141 in the middle thereof, a lower half portion formed in the pin contact portion 142, and an upper half portion formed in an elastic strip 144 which is easily deformed when a force is applied. . The movable pin terminal 14 ′ has substantially the same configuration as the pin terminal 14 which is inverted, the intermediate portion is formed on the bulged terminal electrode 141 ′, and the upper half portion is formed on the pin contact portion 142 ′. The lower half is formed into an elastic strip 144 '. In the second embodiment, the pin terminal 14 and the movable pin terminal 14 'are configured such that the diameter of the terminal electrode 141' is slightly smaller than the diameter of the terminal electrode 141 of the pin terminal 14. Become. The coil contact 21 of the second embodiment is formed of a cylindrical coil spring having a simple shape and wound to have the same diameter over the entire length. Here, the total length of the coil contact 21 is slightly larger than the sum of the total length of the elastic strip 144 of the pin terminal 14 and the total length of the elastic strip 144 'of the movable pin terminal 14'. The float pin of FIG. 11 has the same structure as the float pin of FIG. 9 described above.

The IC 28 is similar to the case of the first prior art example.
Float 2 held in a frame (not shown)
It is rotationally positioned in the state shown in FIG. 11 with respect to the opening 206 formed in 0. Rotate the frame further to IC
When 28 is pressed downward, the lower surface of the IC 28 displaces the float 20 downward while compressing the float spring 45, and the bump 29 of the IC 28 contacts the upper end of the pin contact portion 142 'of the movable pin terminal 14'. When the frame is rotated to press the IC 28 further downward, the lower surface of the IC 28 displaces the float 20 downward and the bump 29
Gradually compresses and displaces the coil contact 21 downward through the pin contact portion 142 ′ of the movable pin terminal 14 ′ and the terminal electrode 141 ′. While this displacement progresses, the elastic strip 144 ′ of the movable pin terminal 14 ′ comes into contact with the elastic strip 144 of the pin terminal 14, and when both are deformed and strongly engaged, the displacement and elastic strip of the coil contact 21. The deformation of the piece 144 'and the elastic strip 144 is stopped.

In this case, the coil contact 21 is interposed between the movable pin terminal 14 'and the pin terminal 14 between the bump 29 of the IC 28 and the pin contact portion 142 of the pin terminal 14, and the elastic restoring force of the coil contact 21 strongly presses the two. And movable pin terminal 1
The 4'pin contact portion 142 'strongly presses against the bump 29 to ensure good electrical contact. Where I
In the bump 29 of C28, the elastic strip 144 'of the movable pin terminal 14' contacts the elastic strip 144 of the pin terminal 14,
By deforming and engaging strongly, the pin contact portion 1 is directly connected via the rod-shaped movable pin terminal 14 ′ and the pin terminal 14.
Since the bump 29 and the pin contact portion 142 are directly electrically connected without going through the coil contact 21 that operates as an elastic coil, the inductance of this IC socket in a high frequency electric signal is reduced. The effect is great, and the pure resistance value between the bump 29 and the pin contact portion 142 is also reduced.

The coil contact 21 of the second prior art example is
As described above, since the coil spring has a simple shape and is wound to have the same diameter over the entire length, it can be manufactured easily, easily and inexpensively. However, in this preceding example,
Apparently, two types of pin terminals, a pin terminal 14 and a movable pin terminal 14 ', are required.
The diameter of 1'is almost the same as the diameter of the terminal electrode 141 of the pin terminal 14, but is slightly smaller than that of the terminal electrode 141. The pin electrode 14 and the movable pin terminal 14 ′ can be made common by designing the diameter of the terminal electrode 141 ′ and the diameter of the terminal electrode 141 to be the same.

Referring to FIG. 13, also in the second prior art example, the flexible anisotropic conductive adhesive sheet 50 is bonded to the entire lower surface of the guide plate 15, and the lower end of the coil contact 21 and the terminal of the pin terminal 14 are connected. By interposing it with the upper surface of the electrode 141, the insufficient mechanical contact between the two can be absorbed and eliminated by interposing the flexible anisotropic conductive adhesive sheet 50 therebetween. In addition to the preceding examples,
There is a document describing a technique corresponding to a conventional example of the invention of this application (see, for example, Patent Document 1).

[0011]

[Patent Document 1] Japanese Patent Laid-Open No. 2001-93634

[0012]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
It is an IC socket that reduces the inductance and pure resistance of the coil contact 21 existing between the bump 29 of 28 and the pin terminal 14 over a high frequency electric signal ranging from a DC electric signal to a GHz order. In all of these IC sockets, when the pin terminals 14 of the IC socket, which are in electrical contact with the bumps 29 of the IC, are electromechanically connected to the IC tester side, electrode holes are formed in a burn-in board (not shown) interposed therebetween. The pin terminal 14 is inserted here and fixed by soldering.

However, when inserting the pin terminal of the IC socket into the electrode hole of the burn-in board, there is a slight manufacturing error and mounting position deviation on the pin terminal side, and there is a position deviation in the electrode hole of the burn-in board. Since the pin terminal 14 is thin, the pin terminal 14 is deformed during handling and makes it difficult to insert the IC socket into the burn-in board. If the IC socket needs to be replaced due to a defect or life of the IC socket after the pin terminal 14 is fixed by soldering, it becomes difficult to remove the IC socket.

In the above-mentioned prior art example, the pitch of the pin terminals 14 is a narrow pitch of about 0.5 mm, and when a large number of solders of 300 pins or more are soldered, a solder bridge is formed between the pin terminals 14. Easy to occur. Therefore, it is necessary to inspect whether or not there is a short circuit due to the solder bridge and to repair the solder bridge after soldering. A board called a burn-in board, to which an IC socket is attached and connected, is a large-sized and multi-layer board, which is becoming more and more expensive as the IC is downsized and the number of pins is increased. If the through-hole electrodes, which are holes for mounting IC sockets on this board, have a narrow pitch of about 0.5 mm, the hole diameter will be φ = 0.3 mm or less.
There is a high possibility that a defect will occur between the No. 4 and the through-hole electrode. As a measure for improving the yield of substrates, there is an increasing demand to develop an IC socket that can be attached and connected to an IC socket without requiring a hole for mounting the IC socket. The present invention provides an IC socket that solves the above-mentioned problems by bringing the pin terminals into pressure contact with a burn-in board that is interposed between the pin terminals that contact the bumps of the IC and the IC tester side. .

[0015]

According to a first aspect of the present invention, there is provided an IC socket in which bumps 29 arrayed in a matrix on the bottom surface of an IC 28 are electromechanically connected to a burn-in board 6 via pin terminals 14 and coil contacts 21. In the above, an IC socket is constructed in which the tip end of the tapered small-diameter coil portion 211 ′ of the coil contact 21 that engages with and contacts the flat electrode 62 formed on the surface of the burn-in board 6 is projected from the tip end portion of the pin terminal 14. According to a second aspect of the present invention, in the IC socket according to the first aspect, the intermediate terminal portion is the bulged stopper 145, the upper half portion is the tapered portion 143, and the lower half portion is the lower tapered portion 143 '. A tapered small-diameter coil portion 2 having a top end portion of the upper half portion wound in a taper shape.
11, a coil contact 21 having a large diameter coil portion 212 in the lower half portion is provided, and a tip end of the lower half portion is formed into a lower tapered small diameter coil portion 211 ′ and an upper half portion. And a taper portion 1 inside the coil contact 21.
An IC socket in which the coil contact 21 and the lower coil contact 21 ′ are interposed between the bump 29 and the planar electrode 62 while the lower taper portion 143 ′ is inserted inside the lower coil contact 21 ′. Configured.

Further, claim 3: I described in claim 2
In the C socket, the inner shape of the tapered small-diameter coil portion and the outer shape of the tip end portion of the tapered portion are substantially similar to each other in the tapered small-diameter coil portion and the taper small-diameter coil portion. An IC socket was formed in such a shape that the tip of the tapered portion does not penetrate even when pressed. Further, the IC socket according to claim 4 is provided with the guide plate 15 in which the coil contact insertion holes 151 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The lower guide plate 15 ′ having the same configuration as the guide plate 15 having the coil contact insertion holes 151 ′ formed in a matrix pattern at the same pitch as the arrangement pitch of the IC 28 is arranged in the matrix pattern at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. A through hole 201 is formed in the
And the float 20 in which the float pin fitting hole 205 communicating with the float 20 is formed, and the IC socket having the float spring 45 for biasing the float 20 is configured.

Here, claim 5: In the IC socket according to any one of claims 2 to 4, the flexible anisotropic conductive adhesive sheet 5 is formed on the entire lower surface of the guide plate 15.
0 is joined to be interposed between the lower end of the coil contact 21 and the upper surface of the bulging stopper 145 in the middle of the pin terminal 14, and the lower flexible anisotropic conductivity is provided on the entire upper surface of the lower guide plate 15 ′. The adhesive sheet 50 'was joined to form an IC socket interposed between the upper end of the lower coil contact 21' and the lower surface of the bulging stopper 145 in the middle of the pin terminal 14. According to a sixth aspect of the invention, in an IC socket in which bumps 29 arrayed and formed in a matrix on the bottom surface of the IC 28 are electromechanically connected to the burn-in board 6 via the pin terminals 14 and the coil contacts 21, The diameter of the half-pin contact portion 142 is larger than that of the upper half-taper portion 143, and the large-diameter pin contact portion 142 that engages with the flat electrode 62 formed on the surface of the burn-in board 6 is formed. An IC socket was made to project from the tip of the coil contact 21.

Further, claim 7: I described in claim 6
In the C socket, the stopper 145 having a bulged middle portion
And a pin terminal 14 having an upper half part as a tapered part 143 and a lower half part as a pin contact part 142, and a tip end of the upper half part is a tapered small-diameter coil part 211 and Coil contact 2 whose half is a large-diameter coil 212
1 and the IC socket was constructed in which the coil contact 21 and the pin terminal 14 were interposed between the bump 29 and the planar electrode 62 with the tapered portion 143 being inserted inside the coil contact 21. Claim 8: The IC socket according to claim 7, further comprising a terminal guide 10 in which the pin terminal insertion holes 101 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. Two
The guide plate 15 is provided with the coil contact insertion holes 151 corresponding to the diameter of the large-diameter coil portion 212 in a matrix at the same pitch as the array pitch of 9 and is arranged in a matrix at the same pitch as the array pitch of the bumps 29 of the IC 28. Coil contact insertion hole 301 corresponding to the diameter of the tapered small-diameter coil portion 211
The second guide plate 30 is formed, the through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28, and the spring fitting holes 204 are formed.
And the float 20 in which the float pin fitting hole 205 communicating with the float 20 is formed, and the IC socket having the float spring 45 for biasing the float 20 is configured.

Here, claim 9: the IC socket according to any one of claims 6 and 7, wherein I
The terminal guide 10 in which the pin terminal insertion holes 101 are formed in a matrix shape at the same pitch as the arrangement pitch of the bumps 29 of the C28 is provided, and the large diameter coil portions 212 of the large diameter coil portion 212 are arranged in the same pitch as the arrangement pitch of the bumps 29 of the IC 28. Guide plate 15 having a coil contact insertion hole 151 corresponding to the diameter
And the coil contact insertion hole 151 has the stepped portion 15
3 to form a tapered small-diameter coil portion 2 of the coil contact 21.
11 and a large diameter portion corresponding to the diameter of the large diameter coil portion 212. The through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28, and the springs are formed. The IC socket is provided with the fitting hole 204 and the float 20 in which the float pin fitting hole 205 communicating with the fitting hole 204 is formed, and the float spring 45 for biasing the float 20.

A tenth aspect of the invention is an IC socket according to any one of the sixth to ninth aspects,
An IC in which a flexible conductive adhesive ring 500 is joined to each of the upper surfaces of the stoppers 145 of the pin terminals 14 and is interposed between the lower end of the coil contact 21 and the upper surface of the stopper 145.
Configured the socket. Here, claim 11: in an IC socket in which bumps 29 arrayed and formed in a matrix on the bottom surface of an IC 28 are electromechanically connected to the burn-in board 6 via coil contacts 21, the coil contacts 21 are upper small-diameter coil portions. 211, the lower small-diameter coil portion 211 ′, and an intermediate large-diameter coil portion 213 integrally formed between the two, and the coils are arranged in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The base plate 4 is provided with the guide plate 15 having the contact insertion holes 151 formed therein, and the base 4 having the coil contact insertion holes 40 formed in a matrix at the same pitch as the bump arrangement pitch 29 of the IC 28. The end is an expansion opening portion 400 corresponding to the intermediate large-diameter coil portion 213 of the coil contact 21, and has the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The through holes 201 are formed in a matrix at one pitch, and the spring fitting holes 204 and the float pin fitting holes 2 communicating with the spring fitting holes 204 are formed.
05 comprises a float 20 on which the float 20
IC with a float spring 45 for biasing
Configured the socket.

According to a twelfth aspect of the present invention, bumps 29 arrayed and formed in a matrix on the bottom surface of the IC 28 are used as the coil contacts 2.
Electromechanically connecting to burn-in board 6 via I
In the C socket, the coil contacts 21 have a two-step diameter of an upper small-diameter coil portion 211 and a lower large-diameter coil portion 212, and are inserted in a matrix at the same pitch as the bump arrangement pitch 29 of the IC 28. The base 4 is formed with a hole 40, and the coil contact insertion hole 40 has a two-step diameter of a small diameter hole portion 401 on the upper side and a large diameter hole portion 402 on the lower side. The float 20 is provided with through holes 201 formed in a matrix at the same pitch as the arrangement pitch and at the same time, spring fitting holes 204 and float pin fitting holes 205 communicating therewith are formed.
The intermediate film sheet 22 having rubber elasticity for holding the coil contacts 21 in which the openings 221 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of C28 is provided, and the coil contacts 21 are inserted into the openings 221. An IC socket was constructed in which the intermediate film sheet 22 was interposed between the upper surface of the base 4 and the lower surface of the float 20.

A thirteenth aspect: In the IC socket according to the twelfth aspect, the opening 221 has the coil contact 21.
Of the taper-shaped small-diameter coil portion 211 has a diameter slightly smaller than the outer diameter of the small-diameter coil portion 211.
An IC socket having No. 22 was formed.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to the example of FIG. In the embodiment, common reference numerals are given to members common to the preceding example of FIG. Referring to FIG. 1, 14 is a pin terminal. The pin terminal 14 has a stopper 145 bulging in the middle thereof, a taper portion 143 in the upper half portion, and a lower taper portion 14 in the lower half portion.
3 '. 15 'is a lower guide plate. The lower guide plate 15 'has the same structure as the guide plate 15 and has coil contact insertion holes 151' formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28.

Reference numeral 21 'is a lower coil contact. The lower coil contact 21 'has the same structure as the coil contact 21. The lower coil contact 21' is a lower tapered small-diameter coil portion 211 'whose tip is wound in a tapered shape, and the upper half is a lower large-diameter coil. Part 212 '. Lower taper small-diameter coil section 21
The inner shape of 1 ′ and the outer shape of the tip of the lower taper portion 143 ′ are substantially similar to each other, and the dimensions are lower even if the tip of the lower taper portion 143 ′ is pressed into the lower taper small-diameter coil portion 211 ′. The side taper portion 143 ′ is formed in a shape dimension that does not penetrate. Reference numeral 62 is a plane electrode, which is formed on the surface of the burn-in board 6 in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28.

Here, in FIG. 1, the protruding portion 46 of the base 4 is fitted and fixed in the socket fitting hole 61 of the burn-in board 6,
It shows a state where the IC 28 is pressed downward and is in an IC measurement state. As described above, the base 4 is provided with a frame (not shown) that is rotationally engaged with the base 4, and the IC 28 is rotationally positioned with respect to the opening 206 formed in the float 20 while being held by the frame during measurement. Then, the IC 28 is pressed downward to the IC measurement state shown in the figure. The float 20 is biased upward by the float spring 45 and separates the bump 29 of the IC 28 upward from the tapered small-diameter coil portion 211 in a steady state where the IC 28 is not measured. In this steady state, the lower end of the lower tapered small-diameter coil portion 211 ′ is in contact with the flat electrode 62 formed on the surface of the burn-in board 6.

The lower end of the lower tapered small-diameter coil portion 211 'is formed on the surface of the burn-in board 6 as a flat electrode 62.
When the IC 28 is pressed downward in a steady state in which the IC 28 is engaged and contacted with the
The float 20 is displaced downward while compressing the
The bump 29 of 28 comes into contact with the upper end of the tapered small-diameter coil portion 211 of the coil contact 21. When the frame is further rotated to press the IC 28 downward, the bump 29 compresses and deforms the coil contact 21 downward while the lower surface of the IC 28 displaces the float 20 downward, and the tapered small-diameter coil portion 211 is provided with the pin terminal 14. The displacement of the tapered small-diameter coil portion 211 is stopped when the tapered tip of the tapered portion 143 is fitted and strongly engaged. Similarly, the tip end portion of the lower taper portion 143 ′ of the pin terminal 14 is fitted into the lower taper small-diameter coil portion 211 ′, and the both are strongly engaged.

A coil contact 21 is provided between the bump 29 of the IC 28 and the coil stopper 145 of the pin terminal 14.
Is interposed between the bump 29 and the coil stopper 145 and strongly pressed against them due to its elastic restoring force, whereby good electrical contact is secured. Also between the flat electrode 62 of the burn-in board 6 and the coil stopper 145 of the pin terminal 14, the lower coil contact 21 ′ has the flat electrode 62 and the coil stopper 1.
Good electrical contact is ensured by interposing 45 and strongly pressing them due to their elastic restoring force. That is, the taper small diameter coil portion 211 of the coil contact 21 is strongly pressed into contact with the taper portion 143 of the pin terminal 14 so that the taper small diameter coil portion 211 and the pin terminal 14 are in a closely wound state. The taper portion 143 is strongly electrically connected to the taper portion 143, and the taper portion 143 ′ is strongly pressed against the taper portion 143 ′ of the pin terminal 14 via the taper small diameter coil portion 211 ′ of the bottom coil contact 21 ′ so that a tight winding state is achieved. The substantially cylindrical lower taper small-diameter coil portion 211 ′ thus formed and the lower taper portion 143 ′ of the pin terminal 14 are strongly electrically connected. After all, between the bump 29 of the IC 28 and the plane electrode 62 of the burn-in board 6, the substantially cylindrical tapered small-diameter coil portion 211 in the close-wound state, the pin terminal 14, and the substantially cylindrical shape in the close-wound state. The large-diameter coil portions 212 and 212 ′, which are electrically connected through the lower tapered small-diameter coil portion 211 ′ and operate as elastic coils of the coil contacts 21 and 21 ′, are bridged to the bump 29 and the plane. Since it does not exist as an electric path between the electrodes 62, the effect of reducing the inductance in this IC socket for a high frequency electric signal is large, and the pure resistance value between the bump 29 and the planar electrode 62 is also reduced.

Then, the through-hole electrode for inserting the pin terminal is not formed on the burn-in board 6 side, and this is used as the flat electrode 62.
By adopting a configuration in which the lower tapered small-diameter coil portion 211 ′ is engaged and contacted with, the inconvenience that the pin terminal 14 is deformed during handling and it is difficult to insert the IC socket into the burn-in board is essentially eliminated. Thus, the degree of freedom in wiring design around the plane electrode 62 of the burn-in board 6 is increased. Further, the IC socket is fixedly attached to the burn-in board 6 by fitting the projecting portion 46 of the base 4 into the socket fitting hole 61 of the burn-in board 6 and fixing the IC socket to the board by screwing at an outside portion of the base not shown. Since it is not necessary to solder the pin terminal 14 to the burn-in board 6, it is extremely easy and easy to attach and detach the IC socket.

A modification of the above embodiment will be described with reference to FIG. In this modified example, the flexible anisotropic conductive adhesive sheet 50 is bonded to the entire lower surface of the guide plate 15, and the space between the lower end of the coil contact 21 and the upper surface of the bulged stopper 145 in the middle of the pin terminal 14 is joined. Intervene. Lower guide plate 1
5'is also bonded to the lower flexible anisotropic conductive adhesive sheet 50 'on the entire upper surface thereof, and between the upper end of the lower coil contact 21' and the lower surface of the bulging stopper 145 in the middle of the pin terminal 14. Intervene. In this case, pin terminal insertion holes are formed in a matrix in the flexible anisotropic conductive adhesive sheet 50, 50 'at the same pitch as the arrangement pitch of the bumps 29 of the IC.

FIG. 2 shows a state in which the IC 28 is pressed downward, and in the downward pressed state of the IC 28, the flexible anisotropic conductive adhesive sheet 50 has the coil contact 21.
It is compressed and sandwiched between the lower end of the pin and the upper surface of the stopper 145 of the pin terminal 14 to ensure electrical connection between the two. The lower flexible anisotropic conductive adhesive sheet 50 ′ is provided with the upper end of the lower coil contact 21 ′ and the stopper 145 of the pin terminal 14.
It is compressed and sandwiched between the lower surface and the lower surface to ensure an electrical connection between the two. That is, the coil contact 21 and the lower coil contact 2
1 ', the mechanical contact between the stopper terminals 145 of the pin terminals 14 may be insufficient due to manufacturing variations, and proper electrical connection may not be guaranteed. However, this mechanical contact is insufficient. The absorption is eliminated by interposing a flexible anisotropic conductive adhesive sheet 50 between them.

Another embodiment of the present invention will be described with reference to FIG. In this embodiment, common reference numerals are given to members common to the preceding example of FIG. In FIG. 3, the diameter of the lower pin contact portion 142 of the bulging stopper 145 in the middle portion of the pin terminal 14 is larger than the diameter of the upper tapered portion 143 of the stopper 145. Reference numeral 30 is a second guide plate. The second guide plate 30 has coil contact insertion holes 301 formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28, and the tapered small-diameter coil portion 211 of the coil contact 21.
The diameter is smaller than that of the coil contact insertion hole 151 of the guide 15 corresponding to the diameter of By using this second guide plate 30 together with the guide 15, the coil contact 21 is stably assured of linearity in the longitudinal direction over its entire length.

Here, in FIG. 3, the projecting portion 46 of the base 4 is fitted and fixed in the socket fitting hole 61 of the burn-in board 6,
It shows a state where the IC 28 is pressed downward and is in an IC measurement state. In the steady state, the lower end of the large-diameter pin contact portion 142 of the pin terminal 14 is in contact with the flat electrode 62 formed on the surface of the burn-in board 6. Here, when the IC 28 is pressed downward, the IC 28
The lower surface of the IC moves the float 20 downward while compressing the float spring 45, and the bump 29 of the IC 28 comes into contact with the upper end of the tapered small-diameter coil portion 211 of the coil contact 21. When the frame is further rotated to press the IC 28 downward, the bump 29 compresses and deforms the coil contact 21 downward while the lower surface of the IC 28 displaces the float 20 downward, and the tapered small-diameter coil portion 211 is provided with the pin terminal 14. The displacement of the tapered small-diameter coil portion 211 is stopped when the tapered tip of the tapered portion 143 is fitted and strongly engaged. As a result, the large-diameter pin contact portion 142 of the pin terminal 14 also comes into engagement contact with the planar electrode 62 of the burn-in board 6.

A coil contact 21 is provided between the bump 29 of the IC 28 and the coil stopper 145 of the pin terminal 14.
Is interposed between the bump 29 and the coil stopper 145 and strongly pressed against them due to its elastic restoring force, whereby good electrical contact is secured. The large diameter pin contact portion 142 of the pin terminal 14 and the flat electrode 6 of the burn-in board 6 are
Good electrical contact is also ensured between the two. That is, the taper small diameter coil portion 2 of the coil contact 21 is pressed tightly to the taper portion 143 of the pin terminal 14 so as to be tightly wound to form a substantially cylindrical taper small diameter coil portion 2.
11 and the tapered portion 143 of the pin terminal 14 are strongly electrically connected, and the pin contact portion 142 of the pin terminal 14 having a large diameter and the flat electrode 62 of the burn-in board 6 are also strongly electrically connected. Between the 29 and the flat electrode 62 of the burn-in board 6, the substantially cylindrical tapered small-diameter coil portion 211 and the pin terminal 1 which are closely wound.
4, the large-diameter coil portion 212, which is electrically connected via the coil contact 21 and operates as an elastic coil, is bridged and does not exist as an electric path between the bump 29 and the plane electrode 62. The effect of reducing the inductance in this IC socket for electric signals is great, and the pure resistance value between the bump 29 and the plane electrode 62 is also reduced.

As in the previous embodiment, in this embodiment as well, the through-hole electrode for inserting the pin terminal is not formed on the burn-in board 6 side to form the flat electrode 62, which is compared with the tapered portion 143. By adopting a configuration in which the pin contact portion 142 having a large diameter is engaged and contacted with each other, the inconvenience that the pin terminal 14 is deformed during handling is solved, and the degree of freedom in wiring design around the plane electrode 62 of the burn-in board 6 is eliminated. Increase. The IC socket is fixedly attached to the burn-in board 6 by fitting the projecting portion 46 of the base 4 into the socket fitting hole 61 of the burn-in board 6, and soldering the pin terminal 14 to the burn-in board 6. It is extremely easy and easy to attach and detach the IC socket because it does not require.

A modification of the embodiment shown in FIG. 3 will be described with reference to FIG. In this modification, a flexible conductive adhesive ring 500 is joined to each of the upper surfaces of the stoppers 145 of the pin terminals 14, and the lower end of the coil contact 21 and the stopper 1 are joined together.
It is interposed between the upper surface of 45. In this case, the flexible conductive adhesive ring 500 has a pin terminal insertion hole formed in the center thereof. FIG. 4 shows a state in which the IC 28 is pressed downward, and in the downward pressed state of the IC 28,
The flexible conductive adhesive ring 500 is compressed and sandwiched between the lower end of the coil contact 21 and the upper surface of the stopper 145 to ensure an electrical connection between the two. That is, the mechanical contact between the coil contact 21 and the stopper 145 of the pin terminal 14 may be insufficient due to manufacturing variations, and proper electrical connection may not be guaranteed. Insufficiency is due to the flexible conductive adhesive ring 500 between the two
The absorption is canceled by interposing.

The embodiment shown in FIGS. 3 and 4 is different from the previous embodiment shown in FIGS. 1 and 2 in that the lower coil contact 21 'other than the coil contact 21 is not used. Is a preferred embodiment from the viewpoint of IC socket manufacturing cost. 4 is an example in which the flexible conductive adhesive ring 500 is interposed between the lower end of the coil contact 21 and the upper surface of the stopper 145, the flexible anisotropic conductive adhesive sheet 50 is attached to the guide plate 15. The amount of the flexible anisotropic conductive adhesive used is greatly reduced as compared with the embodiment in which the IC socket is joined, which leads to a reduction in the manufacturing cost of the IC socket. Further, the flexible conductive adhesive ring 500 has the pin terminal 1
4, the pin terminal 14 can be assembled with the coil contact 21 as a single product, and
The assembling work of the C socket can be simplified.

Still another embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a view showing an unused state in which the IC socket is not yet attached to the burn-in board side,
FIG. 6 is a diagram showing the IC socket attached to the burn-in board side, and FIG. 7 is a diagram showing the IC measurement state.
This embodiment corresponds to the second guide plate 3 in the embodiment of FIG.
By omitting 0 and forming the step portion 153 in the coil contact insertion hole 151 of the guide 15, the coil contact insertion hole 15
In this example, 1 is composed of a small diameter portion corresponding to the diameter of the tapered small diameter coil portion 211 of the coil contact 21 and a large diameter portion corresponding to the diameter of the large diameter coil portion 212. By configuring the coil contact insertion hole 151 of the guide 15 in this way, the coil contact 21 is stably assured of linearity in the longitudinal direction over its entire length.

The embodiment shown in FIGS. 5 to 7 has a simplified overall structure of the IC socket in that the second guide plate 30 is not used in addition to the guide 15 as compared with the embodiments shown in FIGS. Therefore, it is preferable from the viewpoint of the IC socket manufacturing cost. The eighth embodiment will be described with reference to FIG. In the eighth embodiment as well, similar to the previous embodiment, the bumps 29 arrayed and formed in a matrix on the bottom surface of the IC 28 are connected to the coil contacts 21.
IC that is electromechanically connected to the burn-in board 6 via the
It is a socket. The coil contact 21 is composed of an upper small-diameter coil portion 211, a lower small-diameter coil portion 211 ', and an intermediate large-diameter coil portion 213 integrally formed therebetween. The coil contact insertion holes 15 are arranged in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28.
1 is provided with the guide plate 15 and the base 4 is provided with the coil contact insertion holes 40 formed in a matrix at the same pitch as the bump arrangement pitch 29 of the IC 28.
The open end of the insertion hole 40 is an expanded opening 400 corresponding to the intermediate large-diameter coil portion 213 of the coil contact 21. Further, the through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28, and the spring fitting holes 204 and the float pin fitting holes 2 communicating with the spring fitting holes 204 are formed.
05 is formed on the float 20. 44 is a float pin, and 45 is a float spring that biases the float 20.

The eighth embodiment described above is different from the previous embodiment in that the coil contact 21 is particularly different.
To the coil contact 21 to reduce the coil resistance of the pin terminal 14
The point is that the number of parts is reduced by that amount without being incorporated inside. The cost of the IC socket as a whole is reduced by this decrease. Although the pin terminal 14 is generally more expensive than the coil contact 21 depending on the specifications and the shape and structure, the cost reduction effect by not using the pin terminal 14 as the whole IC socket using a large number of coil contacts 21 Is big. Although the eighth embodiment is not particularly expected to have the effect of reducing the coil resistance, it is an IC socket that is sufficiently useful when the cost reduction effect of the entire IC socket is more important. Then, in the eighth embodiment, the coil contact insertion hole 40 is formed in the base 4.
To form the coil contact insertion hole 40 in the guide plate 15
The coil contact insertion hole 151 formed in the above and the through hole 201 formed in the float 20 are made to cooperate with each other so as to guide and hold the coil contact 21 sufficiently stably. That is, the coil contact 21 has a coil contact insertion hole 40 of the float 20, the upper end of which is the expansion opening 400 corresponding to the intermediate large-diameter coil portion 213, the coil contact insertion hole 151 of the guide plate 15, and the float 20. Through hole 20
The intermediate large-diameter coil portion 213
Is held in the expanding opening portion 400 and is prevented from moving upward by the lower surface of the guide plate 15, so that the coil contact 21 is stably held and guided. Further, since the second guide plate other than the guide 15 is not used, the overall structure of the IC socket can be simplified and thinned.

The ninth embodiment will be described with reference to FIGS. FIG. 15 is a diagram showing the entire IC socket and burn-in board. FIG. 15 (a) is a diagram showing the cover closed with the float raised without a holding plate, and FIG. 15 (b) lowered the float. Figure showing the state,
FIG. 15B is a diagram showing a state in which the IC is mounted and the float is lowered. 16 is a large circle in FIG.
It is a figure which expands and shows the member enclosed by. The ninth embodiment is also an IC socket in which bumps arranged in a matrix on the bottom surface of the IC are electromechanically connected to the burn-in board via coil contacts. The ninth embodiment differs from the eighth embodiment in that the coil contact insertion hole is formed in the base as in the eighth embodiment, but this coil contact insertion hole is formed without using a special guide plate. And that the coil contact is stably held and guided only by the through hole formed in the float.

More specifically, the coil contact 21 has a two-step diameter including an upper small-diameter coil portion 211 and a lower large-diameter coil portion 212. Further, the base 4 having the coil contact insertion holes 40 formed in a matrix at the same pitch as the bump arrangement pitch 29 of the IC 28 is provided. Here, the coil contact insertion hole 40 of this embodiment has a two-step diameter of an upper small diameter hole portion 401 and a lower large diameter hole portion 402. Further, the float 20 is provided. Although not explicitly shown in FIG. 15, this float also has a configuration similar to that of the float shown in FIG. 14, and the through holes 201 are formed in a matrix at the same pitch as the arrangement pitch of the bumps 29 of the IC 28 and the spring fitting is performed. The float 20 is provided with a hole 204 and a float pin fitting hole 205 communicating with the hole 204. 44 is a float pin, and 45 is a float spring that biases the float 20.

Reference numeral 22 is an intermediate film sheet having rubber elasticity for holding the coil contact 21. Openings 221 are formed in a matrix in the intermediate film sheet 22 having rubber elasticity at the same pitch as the arrangement pitch of the bumps 29 of the IC 28. The opening 221 has a diameter slightly smaller than the outer diameter of the tapered small-diameter coil portion 211 of the coil contact 21. Radial cuts 222 are formed in these openings 221. By inserting the small-diameter coil portion 211 of the coil contact 21 into the opening 221 of the intermediate film sheet 22 from the lower side of the sheet, the opening 221 formed with the notch 222 is expanded and the coil contact 2 is formed.
1 is held on the intermediate film sheet 22. The holding force is set to such a level that the coil contact 21 does not fall off the intermediate film sheet 22 due to the weight of the coil contact 21 and the vibration applied from the outside. By the way, when the IC socket is attached to the burn-in board 6, a force is generated to push the coil contact 2 upward from below. This force cannot be blocked by the intermediate film sheet 22, but as described above, by configuring the coil contact insertion hole 40 of the base 4 to have a two-step diameter of the small diameter hole portion 401 and the large diameter hole portion 402, Similarly, the small-diameter coil portion 21
1 and the large-diameter coil portion 212, the large-diameter coil portion 212 includes the small-diameter hole portion 401 and the large-diameter hole portion 4.
Since it is received at the boundary of No. 02, and the guide plate 15 is not used, the overall structure of the IC socket can be further simplified and thinned as compared with the immediately preceding eighth embodiment.

In FIG. 15, 7 is a cover of the IC socket, and 70 is a holding plate. Reference numeral 71 denotes a cover fixing shaft that pivotally supports the cover 7 on the IC socket main body in a state of being biased by a spring that biases the cover 7 in a releasing direction. 72 is a cover locking member. Here, the cover locking member 72 is disengaged to release the cover 7, the IC 28 is attached to the center of the float 20, and then the cover 7 is rotated to move the IC 28 via the pressing plate 70.
The IC 28 is electromechanically connected to the burn-in board 6 by pressing and locking the cover locking member 72 to the main body.

[0044]

As described above, according to the embodiment of FIGS. 1 and 2 of the present invention, the through hole electrode for inserting the pin terminal is not formed on the burn-in board, and this is used as the planar electrode on the lower side. By adopting a configuration in which the tapered small-diameter coil portion is engaged and contacted, the inconvenience that the pin terminal is deformed during handling and makes it difficult to insert the IC socket into the burn-in board is essentially eliminated, and the flat surface of the burn-in board is eliminated. Increase the flexibility of wiring design around the electrodes. The mounting and fixing of the IC socket to the burn-in board is performed by fitting the base into the socket fitting hole of the burn-in board, and it is not necessary to solder the pin terminals to the burn-in board. Is very easy and easy.

According to the embodiment shown in FIGS. 3 and 4, as in the previous embodiment, the through hole electrode for inserting the pin terminal is not formed on the burn-in board to form a flat electrode, which is compared with the tapered portion. By adopting a configuration in which the pin contact portion having a large diameter is engaged and contacted, the inconvenience that the pin terminal is deformed during handling is eliminated, and the degree of freedom in wiring design around the plane electrode of the burn-in board is increased. The mounting and fixing of the IC socket to the burn-in board is performed by fitting the base into the socket fitting hole of the burn-in board, and it is not necessary to solder the pin terminals to the burn-in board. Is very easy and easy. Further, as compared with the above-described embodiments of FIGS. 1 and 2, the configuration of the entire IC socket is simplified in that no lower coil contact other than the coil contact is used, which is preferable from the viewpoint of IC socket manufacturing cost. Is.

According to the embodiment shown in FIGS. 5 and 7, the second guide plate is omitted in the embodiment shown in FIGS. 3 and 4, and a step portion is formed in the coil contact insertion hole of the guide to form the coil contact insertion hole. Is composed of a small-diameter portion corresponding to the diameter of the tapered small-diameter coil portion of the coil contact and a large-diameter portion corresponding to the diameter of the large-diameter coil portion. Stable linearity in the length direction is guaranteed. Since the second guide plate is not used other than the guide, IC
The structure of the entire socket is simplified, which is convenient from the viewpoint of the IC socket manufacturing cost. According to the embodiment of FIG. 14, the pin terminal for reducing the coil resistance of the coil contact is not incorporated inside the coil contact, and the number of parts is reduced by that much. Has been reduced. Further, since the second guide plate is not used other than the guide, the configuration of the entire IC socket can be simplified and thinned.

Further, according to the embodiments shown in FIGS. 15 and 16, the pin terminal for reducing the coil resistance of the coil contact is not incorporated inside the coil contact, and the number of parts is reduced accordingly. , The cost of the entire IC socket is reduced. Further, compared to the immediately preceding embodiment of FIG. 14 in that no guide plate is used, the overall structure of the IC socket can be further simplified and made thinner.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an example.

FIG. 2 is a diagram illustrating a modified example of the embodiment.

FIG. 3 is a diagram illustrating another embodiment.

FIG. 4 is a diagram illustrating a modified example of another embodiment.

FIG. 5 is a diagram illustrating still another embodiment.

FIG. 6 is a view showing an assembled state of still another embodiment.

FIG. 7 is a diagram showing a measurement state of yet another embodiment.

FIG. 8 is a diagram illustrating a preceding example.

FIG. 9 is a diagram showing a measurement state of a prior art example.

FIG. 10 is a diagram illustrating a modified example of the preceding example.

FIG. 11 is a diagram illustrating another prior art example.

FIG. 12 is a diagram showing a measurement state of another prior art example.

FIG. 13 is a diagram illustrating a modified example of another preceding example.

FIG. 14 is a diagram illustrating an eighth embodiment.

FIG. 15 is a diagram illustrating a ninth embodiment.

FIG. 16 is a diagram for explaining the details of the ninth embodiment.

[Explanation of symbols]

14-pin terminal 21 Coil contact 211 'Tapered small diameter coil 28 IC 29 Bump 6 Burn-in board 62 Planar electrode

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01R 33/76 H01R 33/76 505Z 505 23/68 303E F term (reference) 2G003 AA07 AC01 AD01 AD09 AG01 AG08 AG12 AG16 2G011 AA17 AB01 AB06 AB07 AC31 AE22 AF02 AF07 5E023 AA04 AA22 BB17 BB24 CC02 DD26 EE02 EE16 EE18 FF07 HH06 5E024 CA12 CA18 CB05

Claims (13)

[Claims] 1. A flat electrode formed on the surface of a burn-in board in an IC socket in which bumps arrayed and formed in a matrix on the bottom surface of the IC are electromechanically connected to the burn-in board through pin terminals and coil contacts. An IC socket characterized in that the tip of the tapered small-diameter coil portion of the coil contact that engages and contacts with is protruded from the tip of the pin terminal. 2. The IC socket according to claim 1, further comprising: a pin terminal having a bulged stopper at an intermediate portion, a tapered portion at an upper half portion, and a lower tapered portion at a lower half portion, The lower part of the taper has a taper-shaped small-diameter coil part with the tip of the half part wound in a taper shape and a coil contact with the large-diameter part of the bottom half part. It has a lower coil contact with a small diameter coil part and an upper half part as the lower large diameter coil part.The taper part is inserted inside the coil contact and the lower taper part is inside the lower coil contact. An IC socket characterized in that a coil contact and a lower coil contact are interposed between a bump and a flat electrode when inserted. 3. The IC socket according to claim 2, wherein the inner shape of the tapered small diameter coil portion and the outer shape of the tip end portion of the tapered portion are substantially similar to each other in the tapered small diameter coil portion and the tapered portion. An IC socket characterized in that the tapered small-diameter coil portion is formed in a shape and dimension such that the tip of the tapered portion does not penetrate even if the tip of the tapered portion is pressed. 4. The IC socket according to claim 3, further comprising: a guide plate in which coil contact insertion holes are formed in a matrix at the same pitch as the arrangement pitch of the IC bumps, and the same arrangement pitch as the bumps of the IC. A lower guide plate having the same structure as the guide plate in which the coil contact insertion holes are formed in a matrix at a pitch is provided, and the through holes are formed in a matrix at the same pitch as the arrangement pitch of the IC bumps and the spring fitting holes are formed. An IC socket comprising a float having a float pin fitting hole communicating therewith, and a float spring biasing the float. 5. The IC socket according to any one of claims 2 to 4, wherein a flexible anisotropic conductive adhesive sheet is bonded to the entire lower surface of the guide plate, and the lower end of the coil contact and the pin are joined. It is interposed between the upper surface of the bulging stopper in the middle of the terminal, and the lower flexible anisotropic conductive adhesive sheet is bonded to the entire upper surface of the lower guide plate to connect the upper end of the lower coil contact and the pin terminal. I is interposed between the lower surfaces of the bulging stoppers in the middle of
C socket. 6. An IC socket for electromechanically connecting bumps arrayed and formed in a matrix on a bottom surface of an IC to a burn-in board via pin terminals and coil contacts, in a pin contact portion of a lower half portion of the pin terminal. Has a larger diameter than the tapered portion of the upper half, and the large diameter pin contact portion that engages with the flat electrode formed on the surface of the burn-in board is made to protrude from the tip of the coil contact. Characteristic IC socket. 7. The IC socket according to claim 6, further comprising: a pin terminal having a bulged stopper at an intermediate portion, a tapered portion at an upper half portion, and a pin contact portion at a lower half portion. The tip of the part is a taper-shaped small-diameter coil part and the lower half part is equipped with a coil contact with a large-diameter coil part.The coil contact and the pin are inserted with the taper part inserted inside the coil contact. An IC socket characterized in that a terminal is interposed between a bump and a plane electrode. 8. The IC socket according to claim 7, further comprising: a terminal guide having pin terminal insertion holes formed in a matrix at the same pitch as the arrangement pitch of the bumps of the IC, and the arrangement pitch of the bumps of the IC. Equipped with a guide plate in which coil contact insertion holes corresponding to the diameter of the large-diameter coil portion are formed in a matrix at the same pitch, and the diameter of the tapered small-diameter coil portion is arranged in a matrix at the same pitch as the pitch of the IC bumps. A second guide plate in which coil contact insertion holes are formed, through holes are formed in a matrix at the same pitch as the arrangement pitch of IC bumps, and spring fitting holes and float pin fitting holes communicating therewith are formed. An IC socket, comprising: a float having a groove formed therein; and a float spring biasing the float. 9. The IC socket according to claim 6, further comprising: a terminal guide having pin terminal insertion holes formed in a matrix at the same pitch as an arrangement pitch of IC bumps. A guide plate having coil contact insertion holes corresponding to the diameter of the large-diameter coil portion is formed in a matrix at the same pitch as the IC bump arrangement pitch, and the coil contact insertion holes have stepped portions formed therein. The coil contact has a small diameter portion corresponding to the diameter of the tapered small diameter coil portion and a large diameter portion corresponding to the diameter of the large diameter coil portion. The through holes are arranged in a matrix at the same pitch as the IC bump arrangement pitch. And a float in which a spring pin fitting hole communicating with the spring fitting hole is formed and a float spring for biasing the float is provided. IC socket to be. 10. The IC socket according to any one of claims 6 to 9, wherein a flexible conductive adhesive ring is joined to each of the upper surfaces of the stoppers of the pin terminals to form a lower end portion of the coil contact. An IC socket characterized by being interposed between the stopper and the upper surface. 11. An IC socket in which bumps arranged in a matrix on the bottom surface of an IC are electromechanically connected to a burn-in board via coil contacts, wherein the coil contacts are an upper small-diameter coil portion and a lower small-diameter coil. And a large-diameter coil portion integrally formed between the two parts, and a guide plate having coil contact insertion holes formed in a matrix at the same pitch as the pitch of the IC bumps. , A base having coil contact insertion holes formed in a matrix at the same pitch as the bump arrangement pitch of the IC, wherein the opening end of the insertion hole is an expanded opening corresponding to the intermediate large-diameter coil portion of the coil contact. It is said that through holes are formed in a matrix at the same pitch as the arrangement pitch of the IC bumps, and the spring fitting holes and the float pin fitting holes communicating therewith are formed. IC socket, characterized in that comprises a float made comprises a float spring for biasing the float. 12. An IC socket in which bumps arrayed in a matrix on the bottom surface of an IC are electromechanically connected to a burn-in board via coil contacts, wherein the coil contacts have a small diameter coil portion on the upper side and a large diameter portion on the lower side. It has a two-step diameter of the coil part, and has a base in which coil contact insertion holes are formed in a matrix at the same pitch as the arrangement pitch of the IC bumps, where the coil contact insertion holes are the upper small diameter holes. And the large diameter holes on the lower side are formed in two steps, through holes are formed in a matrix at the same pitch as the pitch of the bumps of the IC, and the spring fitting holes and the float pin fitting holes communicating with this are formed. And an intermediate film sheet having rubber elasticity for holding coil contacts, in which openings are formed in a matrix pattern at the same pitch as the arrangement pitch of the bumps of the IC. , IC socket, characterized in that while inserting the coil contacts opening and the intermediate film sheet is interposed between the lower surface of the base top surface and float. 13. The IC socket according to claim 12, wherein the opening has a diameter slightly smaller than the outer diameter of the tapered small-diameter coil portion of the coil contact, and the opening has a radial notch. An IC socket characterized by being formed.