JP4257714B2 - Socket for electrical parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical component socket used for conducting an electrical test of an IC (electrical component) such as a BGA, and a contact sheet used for the electrical component socket.
[0002]
[Prior art]
The present applicant has already devised and applied for an electrical component socket 100 as shown in FIGS. 15 to 16 (see Japanese Patent Application No. 10-62228). The electrical component socket 100 includes an insulating resin film (contact sheet) 103 on which a circuit pattern (not shown) corresponding to a bump (terminal) 102 of an IC 101 as an electrical component is formed, and the insulating resin film 103. And a terminal pin unit 105 having an upper end connected to the circuit pattern and a lower end connected to an electrical test circuit (not shown). A silicon rubber plate 106 is disposed on the back surface of the insulating resin film 103 on which the IC 101 is placed. A pressing member 107 is attached to the upper surface of the support board 104 so that it can be opened and closed via the socket body 108.
[0003]
In the socket 100 for electric parts as described above, when the IC 101 is pressed downward by the pressing member 107, the bumps 102 of the IC 101 elastically deform (depress) the silicon rubber plate 106, so that the elastic recovery of the silicon rubber plate 106 is performed. The bump 102 of the IC 101 and the circuit pattern can be brought into contact with each other with a desired contact pressure. The electrical component socket 100 electrically connects the IC 101 and an external electrical test circuit (not shown) via the terminal pin unit 105 and the circuit pattern, and performs an electrical test such as an accurate burn-in test. Can be done.
[0004]
[Problems to be solved by the invention]
However, the electrical component socket 100 because the substantially leading end of the bump 102 of the spherical IC101 is pressed to the circuit pattern of the plate-shaped insulating resin film 103, as shown in FIG. 16 (b), a soft solder There is a possibility that the tip 102a of the formed bump 102 is deformed. If the tip 102a of the bump 102 of the IC 101 is deformed, there is a risk that a defect such as a contact failure may occur when the IC 101 is mounted after the electrical test is completed.
[0005]
Accordingly, an object of the present invention is to provide a socket for electrical parts having a contact sheet such as the tip of the bump of the IC does not collapse.
[0006]
[Means for Solving the Problems]
An electrical component socket according to the present invention includes a contact sheet in which an energizable contact that contacts an approximately spherical terminal of an electrical component is formed on an insulating resin film that is elastically deformable, and the contact of the contact sheet Connecting means for electrically connecting the external electrical test circuit, a support board to which the connecting means and the contact sheet are attached, and a pressing means for pressing the electrical component toward the contact sheet. . A plurality of terminal receiving holes are formed in the insulating resin film of the contact sheet so as to correspond to the plurality of terminals. In addition, at the opening edge of the terminal receiving hole, the contact is formed in a ring shape so as to continue from the front surface side to the back surface side of the insulating resin film. A circuit sheet is disposed on the back side of the contact sheet. The circuit sheet includes: (1) a conductive pin made of a conductive material that comes into contact with the contact and protrudes from a back surface side of an insulating resin film constituting the circuit sheet; and (2) the circuit sheet. A connection pad formed on the back side of the insulating resin film and in contact with a terminal pin electrically connected to the external electrical test circuit; and (3) formed on the back side of the insulating resin film constituting the circuit sheet. And a circuit pattern for connecting the contact and the connection pad. Further, the connection means is constituted by the energization pin, the connection pad, the circuit pattern, and the terminal pin.
[0007]
According to the present invention having such a configuration, the substantially spherical terminal of the electrical component is received by the ring-shaped contact, and the electrical test of the electrical component is performed in a state where the substantially spherical terminal and the contact are in contact with the ring. Is done. As a result, the electrical test of the electrical component is not performed while the tip of the substantially spherical terminal is pressed by the contact, and the tip of the terminal of the electrical component is deformed by the electrical test of the electrical component. Therefore, there is no problem caused by deformation of the substantially spherical terminal during mounting of the electrical component.
[0009]
Further , according to the present invention having such a configuration, the contact is formed on the contact sheet, the circuit pattern is formed on the circuit sheet, and the contact and the circuit pattern are formed separately. because you are, in comparison with the case of forming a contact with the circuit pattern on the same surface, the connecting means can be easily manufactured, you facilitate the thus manufactured electrical component socket.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0015]
[First Embodiment]
As shown in FIGS. 1 to 2, the electrical component socket 1 of the present embodiment includes a support board 2 formed in a plate shape with an insulating resin material (e.g., polyetherimide), and the support board 2. A circuit sheet 3 that is superimposed on the circuit sheet 3, a contact sheet 4 that is superimposed on the circuit sheet 3, and a pressing jig 5 that is superimposed on the contact sheet 4. The support board 2, the circuit sheet 3, the contact sheet 4, and the pressing jig 5 are integrally fastened and fixed by fastening means 8 including screws 6 and nuts 7.
[0016]
As shown in FIGS. 1 to 3 and FIGS. 8 to 10, the contact sheet 4 has a plurality of contacts 12 on the insulating resin film 13 so as to correspond to the bumps (terminals) 11 of the IC 10 as an electrical component. Is formed. The contact 12 is formed at the opening edge of the terminal receiving hole 14 formed by drilling the insulating resin film 13 with a laser beam or the like. And this contactor 12 is formed in the substantially ring shape with the electroconductive material which was excellent in the whole. That is, the contact 12 has a surface side flange 12a protruding to the surface side of the insulating resin film 13 which is a surface facing the bump 11, and a back surface side flange 12b protruding to the back side of the insulating resin film 13. The cylindrical portion 12c that connects the flange portions 12a and 12b, as shown in FIG. 10, receives the bump 11 of the IC 10 in the hole 12d, and supports the bump 11 of the IC 10 at the upper edge of the hole 12d. It is supposed to be. In this manner, the tip of the bump 11 of the soft IC 10 is not deformed during the electrical test of the IC 10 (see FIG. 19B), and there is no problem when the IC 10 is mounted.
[0017]
Further, as shown in FIGS. 1 and 8, the contact sheet 4 is formed with four positioning holes 17 that engage with the positioning protrusions 16 on the lower surface of the socket body 15 at positions outside the region where the contact 12 is formed. Further, four holes 18 for receiving the shaft portion of the screw 6 are formed outside the positioning hole 17. Note that the contact sheet 4 is formed to have substantially the same size as the outer peripheral edge of the lower surface of the socket body 15, and is formed in a rectangular shape like the lower surface of the socket body 15.
[0018]
As shown in FIGS. 1 to 3, 6, and 7, the circuit sheet 3 includes an insulating resin film in which an energizing pin 20 made of a conductive material that comes into contact with the back surface side flange portion 12 b of the contact 12 of the contact sheet 4. 21 is formed in plural. Here, the energization pin 20 is formed in the hole 22 of the insulating resin film 21 opened by a laser beam or the like, and one end (the upper end in FIG. 7B) is the contact 12 of the contact sheet 4. The hook-shaped portion 20a at the other end (the lower end in FIG. 7B) is in contact with the back-side flange portion 12b and protrudes toward the back surface (surface facing the support board 2) of the insulating resin film 21.
[0019]
The circuit sheet 3 has the same number of connection pads 23 as the current-carrying pins 20 on the back surface side and each edge side of the rectangular insulating resin film 21, and connects the connection pads 23 and the current-carrying pins 20. A circuit pattern 24 made of a conductive material is formed. Here, the connection pad 23 and the circuit pattern 24 are formed in a predetermined shape with copper on the lower surface of the insulating resin film 21, and then nickel-plated on the copper, and further gold, rhodium or solder on the nickel plating. Etc. are formed by plating. Note that the insulating resin film 21 constituting the circuit sheet 3 is formed to have substantially the same size as the support board 2 so as to overlap the upper surface 2 a of the support board 2, and is formed on the positioning protrusion 16 on the lower surface of the socket body 15. Four engaging positioning holes 25 are formed, and four holes 26 for receiving the shaft portion of the screw 6 are formed.
[0020]
As shown in FIGS. 1 to 5, the support board 2 is formed with a rectangular rubber accommodating hole 27 having the same size as that of the IC 10, and a silicon rubber sheet 28 is accommodated in the rubber accommodating hole 27. Yes. The silicon rubber sheet 28 elastically supports the IC 10 via the circuit sheet 3 and the contact sheet 4. The support board 2 is provided with terminal pins 30 as many as the connection pads 23 of the circuit sheet 3 at positions corresponding to the connection pads 23 of the circuit sheet 3 on the edge side. The terminal pin 30 is formed of a conductive material, and the upper end of the terminal pin 30 abuts on the connection pad 23 of the circuit sheet 3 and the lower end protruding below the support board 2 is an external electrical test circuit not shown. It can be fitted in the mounting hole.
[0021]
The support board 2 is formed in a flat shape so that the upper surface 2a can support the rear surface side of the circuit sheet 3 (see FIGS. 2 and 5), and the positioning projections on the lower surface of the socket body 15 are formed on the upper surface 2a. Four positioning holes 31 to be engaged with 16 are formed. Four holes 32 and 33 for receiving the screw 6 and the nut 7 are formed outside the positioning hole 31.
[0022]
As shown in FIGS. 1 to 3 and 11 to 14, the pressing jig 5 includes a socket body 15 fixed on the support board 2 via the contact sheet 4 and the circuit sheet 3, and the socket body 15. And a cover 35 that opens and closes a rectangular IC introduction port 34 of the socket body 15.
[0023]
Among these, as described above, the socket body 15 has the positioning projection 16 formed on the lower surface thereof, and the positioning projection 16 is formed on the positioning hole 17 of the contact sheet 4, the positioning hole 25 of the circuit sheet 3 and the support board 2. By engaging with the positioning hole 31, the socket body 15 itself, the contact sheet 4 and the circuit sheet 3 are positioned with respect to the support board 2. The socket body 15 is formed with guide walls 36 for guiding the IC 10 to a predetermined position on the contact sheet 4 at the four corners of the rectangular IC inlet 34. The guide wall 36 is inclined so as to enlarge the IC introduction port 34 as it goes upward, so that the IC 10 can be smoothly guided. Here, the guide wall 36 functions as positioning means for positioning the IC 10.
[0024]
Further, on one side surface side of the socket body 15, a cover attaching portion 37 for attaching the cover 35 so as to be rotatable is formed. The cover attaching portion 37 is attached so that the arm portion 38 of the cover 35 can be rotated via the rotation shaft 40. Furthermore, a hook 42 that engages with a stepped portion 41 of the cover 35 is attached to the other side surface side of the socket body 15 so as to be rotatable via a rotation shaft 43. The cover 35 is always urged by a spring 44 in the clockwise direction (opening direction) in FIGS. The hook 42 is always urged by a spring 45 in the clockwise direction in FIGS. 11 and 12 (the direction in which the cover 31 is closed).
[0025]
An IC pressing block 46 is attached to the cover 35. As shown in FIGS. 11, 12, and 14, the IC pressing block 46 is housed so as to be slidable in a block housing recess 47 formed on the lower surface side of the cover 35, and a pair of tongues formed on both sides of the upper part. A shaft 51 is fitted into the mounting hole 50 of the piece 48, and both end portions of the shaft 51 are engaged so as to be slidable into the long holes 53 of the side wall 52 of the block housing recess 47. A spring accommodation hole 54 is formed above the block accommodation recess 47 of the cover 35, and a compression coil spring 55 is accommodated in the spring accommodation hole 54. The compression coil spring 55 always urges the IC pressing block 46 downward in FIGS. 11 and 14 through the shaft 51, and the bump 11 of the IC 10 is contacted with the contact sheet 4 through the IC pressing block 46. The bumps 11 and the contacts 12 are brought into contact with each other with a desired contact pressure (see FIG. 3).
[0026]
Here, in the state where the cover 35 is opened, the IC pressing block 46 is pressed against the lower end of the long hole 53 by the shaft 51 being pressed by the compression coil spring 55. Further, when the cover 35 is closed, the IC pressing block 46 compresses and compresses the compression coil spring 55 by the thickness of the IC 10, the shaft 51 slides in the long hole 53, and the side wall 46a of the IC pressing block 46 is blocked. It slides while being guided by the side wall 47 a of the housing recess 47.
[0027]
Note that the lower surface 49 of the IC pressing block 46 is formed in a rectangular shape in accordance with the shape of the IC 10, and the rectangular lower surface 49 presses the upper surface of the IC 10 (see FIG. 3). Accordingly, the IC 10 is pressed by the lower surface of the IC pressing block 46, and the bumps 11 of the IC 10 are surely brought into contact with the contact 12 of the contact sheet 4. Here, the cover 35, the IC pressing block 46 and the compression coil spring 55 constitute a pressing means 56.
[0028]
An inclined wall 57 is formed above the step portion 41 of the cover 35. Therefore, a sufficient space for operating the hook 42 is secured in the vicinity of the operation portion 42a at the tip of the hook 42 so that the hook 42 can be easily operated mechanically or manually.
[0029]
In the electrical component socket 1 having the above-described configuration, when the engagement between the hook 42 and the stepped portion 41 of the cover 35 is released, the cover 35 is rotated in the clockwise direction in FIG. The IC introduction port 34 of the main body 15 is opened (see FIG. 12). Next, the IC 10 is inserted into the IC introduction port 34 of the socket body 15 with the bumps 11 facing down (see FIGS. 1 and 3). At this time, the IC 10 is guided by the guide wall 36 of the socket body 15 and placed at a predetermined position on the contact sheet 4, and the bumps 11 of the IC 10 are positioned with respect to the contact 12 of the contact sheet 4 (FIG. 3). reference).
[0030]
After the IC 10 is accommodated in the socket body 15, the cover 35 is closed, and when the hook 42 is engaged with the step portion 41 of the cover 35, the cover 35 is locked to the upper part of the socket body 15. At this time, the compression coil spring 55 is compressed by the thickness of the IC 10, and the spring force of the compression coil spring 55 acts on the IC 10 via the IC pressing block 46. As a result, the bump 11 of the IC 10 elastically deforms the contact sheet 4 and the silicon rubber sheet 28 and contacts the contact 12 of the contact sheet 4 with a desired contact pressure. The bumps 11 of the IC 10 are electrically connected to an external electrical test circuit via the contact 12 of the contact sheet 4, the energization pins 20 of the circuit sheet 3, the circuit pattern 24, the connection pads 23, and the terminal pins 30 of the support board 2. Connected to. Here, the energization pins 20, the circuit pattern 24, the connection pads 23 and the terminal pins 30 of the support board 2 of the circuit sheet 3 electrically connect the bumps 11 of the IC 10 and an external electrical test circuit (not shown). The connection means 60 is comprised.
[0031]
As described above, in this embodiment, the contact 12 of the contact sheet 4 that contacts the bump 11 of the IC 10 is formed in a ring shape, and the bump 11 of the IC 10 is received in the ring-shaped hole 12d. Since the bump 11 of the IC 10 and the contact 12 can be brought into contact with each other in a ring shape, the tip of the bump 11 of the IC 10 is not deformed by the electrical test of the IC 10, and the bump 11 of the IC 10 is mounted when the IC 10 is mounted. There is no inconvenience caused by deformation.
[0032]
In the present embodiment, as described above, since the bump 11 of the IC 10 is received in the ring-shaped hole 12d of the contact 12, the bump 11 of the IC 10 is pressed against the contact 12. Then, the bump 11 of the IC 10 is rubbed at the edge of the hole 12d of the contact 12 and the oxide film on the surface of the bump 11 is peeled off, so that the electrical connection between the bump 11 of the IC 10 and the contact 12 is improved. An effect can be obtained.
[0038]
Further, in the first embodiment, the silicon rubber sheet 28 may be omitted, and the IC 10 may be supported only by the elastic deformation force of the contact sheet 4 and the circuit sheet 3.
[0039]
Furthermore, the electrical component socket according to the embodiment of the above you facilities, in addition to be used for electrical test of the burn-in test, and the like of a BGA type IC, can be used for electrical test of the LGA type IC is there.
[0040]
【The invention's effect】
As described above, in the present invention, the ring-shaped contact is formed at the opening edge of the terminal receiving hole of the contact sheet, and the substantially spherical terminal of the electrical component is received by the ring-shaped contact, Since the contact and the substantially spherical terminal can be energized in a ring-like contact state, the electrical test of the electrical component does not deform the tip of the bump of the electrical component. There is no inconvenience caused by deformation of bumps when mounting components.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a socket for electrical parts according to a first embodiment of the present invention.
FIG. 2 is a front cross-sectional view of the electrical component socket.
FIG. 3 is a partially enlarged view of FIG. 2;
FIG. 4 is a plan view of the support board according to the first embodiment of the present invention.
FIG. 5 is a sectional view of the support board.
FIG. 6 is a plan view of the circuit sheet according to the first embodiment of the present invention.
FIG. 7 is a partially enlarged view of the circuit sheet.
FIG. 7A is an enlarged plan view showing a part thereof, and FIG. 7B is a cross-sectional view taken along the line AA of FIG. 7A.
FIG. 8 is a plan view of a contact sheet.
FIG. 9 is an enlarged plan view showing a part of the contact of the contact sheet.
10 is a cross-sectional view taken along line BB in FIG.
FIG. 11 is a cross-sectional view of the pressing jig showing the first embodiment of the present invention (cross-sectional view cut along the line CC in FIG. 13).
FIG. 12 is a state diagram in which the cover of the pressing jig is opened.
FIG. 13 is a plan view showing a part of the pressing jig cut out.
14 is a sectional view taken along line D-D in FIG. 13.
FIG. 15 is a cross-sectional view of a conventional socket for electric parts.
16 is a partial detail view of FIG . 15;
FIG. 16A is an enlarged view showing a part of FIG. 15, and FIG. 16B is a view showing a terminal deformation state of the IC.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Socket for electrical parts, 2 ... Support board, 3 ... Circuit sheet, 4 ... Contact sheet, 10 ... IC (electric part), 11 ... Bump (terminal), 12 ... Contact, 13 ...... insulating resin film, 14 ...... terminal receiving holes, 24 ...... circuit pattern, 30 ...... terminal pins, 56 ...... pressing means, 60 ...... connected hands stage

Claims (1)

A contact sheet formed by an elastically deformable insulating resin film in which an electrically energizable contact that contacts the substantially spherical terminal of the electrical component;
Connection means for electrically connecting the contact of the contact sheet and an external electrical test circuit;
A support board to which the connection means and the contact sheet are attached;
A pressing means for pressing the electrical component toward the contact sheet, and an electrical component socket comprising:
A plurality of terminal receiving holes are formed in the insulating resin film of the contact sheet so as to correspond to the plurality of terminals,
At the opening edge of this terminal receiving hole, the contact is formed in a ring shape so as to continue from the front surface side to the back surface side of the insulating resin film ,
A circuit sheet is disposed on the back side of the contact sheet,
The circuit sheet includes: (1) a current-carrying pin made of a conductive material that contacts the contact and protrudes from the back side of the insulating resin film that forms the circuit sheet; and (2) an insulating property that forms the circuit sheet. Formed on the back side of the resin film and connected to the terminal pins that are electrically connected to the external electrical test circuit; and (3) formed on the back side of the insulating resin film constituting the circuit sheet, A circuit pattern for connecting the contact and the connection pad;
The connection means includes the energization pin, the connection pad, the circuit pattern, and the terminal pin.
A socket for electrical parts characterized by the above.

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