JP5726588B2 - Contact pin and socket for electrical parts - Google Patents

Description

  The present invention includes a contact pin for electrically connecting a first electrical component and a second electrical component, and a semiconductor device (hereinafter referred to as an “IC package”) provided with these contact pins and disposed on a wiring board. The present invention relates to a socket for an electrical component that accommodates the electrical component in order to perform a test of the electrical component.

  Conventionally, as this type of contact pin, for example, there is the one shown schematically in FIG. The contact pin 1 includes a first contact member 2 made of a conductive material that comes into contact with a terminal of an IC package (not shown), and a cylindrical body made of a conductive material in which the first contact member 2 can be moved up and down. 3 and a coil spring 4 that is accommodated in the cylindrical body 3 and biases the first contact member 2 toward the IC package. The first contact member 2 is formed with an inclined contact surface 2a with which the end surface of the coil spring 4 contacts.

  A large number of such contact pins 1 are disposed in an IC socket (not shown), and the IC socket is disposed on the wiring board, and is a terminal of the IC package at the upper end of the first contact member 2. The spherical terminal is contacted and the IC package is pushed downward.

  As a result, the first contact member 2 is lowered against the biasing force of the coil spring 4 and the contact surface 2a is inclined. Therefore, when the first contact member 2 is inclined, the cylindrical body 3 is inclined. Will be brought into a good conduction state.

  In addition, as this kind of thing, there exists a thing as described in patent document 1, for example.

JP 2005-172581 A.

  However, in such a conventional device, as shown in FIG. 6, when the first contact member 2 is lowered and tilted, the portion 4 a of the coil spring 4 becomes the first contact member 2 and the cylindrical body. 3, and the first contact member 2 may be defective in operation.

  Therefore, according to the present invention, the first contact member can be tilted to ensure electrical conductivity, and the coil spring does not bite between the first contact member and the inner peripheral surface of the cylindrical body. It is another object of the present invention to provide a socket for electrical parts.

In order to achieve the above object, according to the present invention, in a contact pin for electrically connecting a first electrical component and a second electrical component, a first material made of a conductive material that contacts the first electrical component. A contact member, a cylinder made of a conductive material in which the first contact member is movably accommodated, and accommodated in the cylinder, and biasing the first contact member toward the first electrical component side The first contact member has a housing portion that is housed in the cylindrical body, and the end surface portion of the housing portion that contacts the end surface of the coil spring has a step shape. A first surface portion that protrudes toward the coil spring, and a second surface portion that is located on a side away from the coil spring with respect to the first surface portion, and the outer peripheral surface of the first surface portion is substantially the same. It has an arc shape and is substantially the same as the outer peripheral surface of the housing part. Are formed in the same curvature, in the first state in which external force in a direction of pushing in the cylinder body to the contact member does not act, the end face of the coil spring relative to said first face abuts said second face In contrast, the present invention is characterized in that the end face of the coil spring is a contact pin configured to be separated.

Another feature is that the first contact member is movably accommodated on one end side of the cylindrical body, and the other end side of the cylindrical body is made of a conductive material that is in contact with the second electrical component. Two contact members are movably accommodated, the coil spring is interposed between the first contact member and the second contact member, and the second contact member is accommodated in the cylinder. A first surface portion projecting toward the coil spring, and an end surface portion of the housing portion with which the end surface of the coil spring abuts is formed in a step shape . A second surface portion located on the side away from the coil spring, the outer peripheral surface of the first surface portion has a substantially arc shape, and is formed with substantially the same curvature as the outer peripheral surface of the housing portion, An external force is applied to the second contact member in the direction of pushing into the cylinder. The Not state, contact end face of the coil spring relative to said first surface portion is brought, in the end surface of the coil spring relative to the second surface portion is configured so as to be separated.

  Another feature is that the first surface portion is inclined.

  The contact pin according to any one of claims 1 to 4, wherein another feature is that the socket body is disposed on the wiring board as the second electrical component and accommodates the first electrical component. There is a plurality of sockets for electric parts.

  According to this invention, by forming the end surface portion of the first contact member into a stepped shape, the first contact member can be tilted to improve the conductivity with the cylinder, and a part of the coil spring However, it can prevent biting between the first contact member and the cylindrical body.

  According to another feature, the second contact member is provided, and the end surface portion of the second contact member is formed in a step shape, whereby the second contact member is inclined to improve the conductivity with the cylinder. In addition, it is possible to prevent a part of the coil spring from being caught between the second contact member and the cylindrical body.

  According to another feature, each contact member can be more easily tilted by tilting the first surface portion.

It is a partial cross section figure of IC socket concerning Embodiment 1 of this invention, and is a figure which shows the state before the attachment to a wiring board. FIG. 4 is a partial cross-sectional view of the IC socket according to the first embodiment, showing a state after being attached to a wiring board. FIG. 6 is a partial cross-sectional view of the IC socket according to the first embodiment, showing a state where the IC package is pressed downward after being attached to the wiring board. It is the figure which looked at the 1st contact member of the contact pin concerning the embodiment 1 from the lower part. It is sectional drawing which shows the outline of the upper part side of the contact pin which concerns on Embodiment 2 of this invention. It is sectional drawing equivalent to FIG. 5 which shows a prior art example.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 4 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 11 in FIG. 1 denotes an IC socket as a “socket for electrical parts”. The IC socket 11 is arranged on the wiring board P which is a “second electrical part”. In order to perform a burn-in test or the like of the IC package 12 that is the “first electrical component”, the electrical connection between the spherical terminal 12b as the “terminal” of the IC package 12 and its wiring board P Is intended.

  Although not shown in detail, the IC package 12 has a rectangular package body 12a in plan view, and a plurality of spherical terminals 12b are formed in a matrix shape on the lower surface of the package body 12a (see FIG. 3).

  On the other hand, as shown in FIG. 2 and the like, the IC socket 11 is fixed on the wiring board P, and is provided with a socket main body 14 in which the IC package 12 is accommodated, and the socket main body 14 so as to be freely opened and closed. A cover member (not shown) that is pressed and a lock mechanism (not shown) that locks when the cover member is closed are provided. Further, a floating plate (not shown) for mounting the IC package 12 is provided on the upper side of the socket body 14.

  More specifically, the socket body 14 is fixed on the wiring board P, and is made of a synthetic resin and has an insulating lower plate 15, and is made of a synthetic resin and disposed on the lower plate 15 and has an insulating property. And an upper plate 16.

  A plurality of contact pins 17 are held by the through holes 15a and 16a of both the plates 15 and 16, respectively.

  The through holes 15a and 16a are respectively formed with large diameter portions 15b and 16b and small diameter portions 15c and 16c.

  The contact pin 17 includes a first contact member 18 made of a conductive material in contact with the IC package 12, a second contact member 19 made of a conductive material in contact with the wiring board P, and the first contact member. 18 is one end side, and the second contact member 19 is made of a conductive material that is movably accommodated on the other end side, and the first contact member 18 and the second contact member 18 are accommodated in the cylinder 20. And a coil spring 21 interposed between the contact members 19.

  The cylindrical body 20 is formed of a conductive material in a cylindrical shape, is formed to have a diameter accommodated in the large diameter portions 15b and 16b of both plates 15 and 16, and both end portions 20a are reduced in diameter.

  By the coil spring 21, the first contact member 18 is urged toward the IC package 12, and the second contact member 19 is urged toward the wiring board P.

  The first contact member 18 includes a large-diameter accommodating portion 18a accommodated in the cylindrical body 20, and an upper contact portion 18b that protrudes upward from the accommodating portion 18a and contacts the spherical terminal 12b of the IC package 12. Is integrally molded. The upper contact portion 18b is inserted through the small diameter portion 16c of the upper plate 16 and protrudes upward. The upper end portion is formed in a so-called crown shape, and the spherical terminal 12b is brought into contact with the upper end portion 18b as shown in FIG. It is like that.

  The housing portion 18a of the first contact member 18 has a stepped end surface portion 18c with which the end surface 21a of the coil spring 21 abuts, so that the end surface portion 18c protrudes toward the coil spring 21 side. And a second surface portion 18e located on the side (upward) away from the coil spring 21 with respect to the first surface portion 18d. As shown in FIG. 4, the first surface portion 18 d has a shape of a part of a circle cut out by a string.

  As shown in FIG. 1, in the state where the external force in the direction of pushing into the cylindrical body 20 does not act on the first contact member 18, the end surface 21a of the coil spring 21 contacts the first surface portion 18d, The end surface 21a of the coil spring 21 is separated from the two-surface portion 18e (so that a gap C is formed in FIG. 1).

  The second contact member 19 includes a large-diameter accommodating portion 19a accommodated in the cylindrical body 20, and a lower contact portion 19b that protrudes downward from the accommodating portion 19a and contacts the wiring board P. It is integrally molded. The lower contact portion 19b is inserted into the small diameter portion 15c of the lower plate 15 and protrudes downward, and comes into contact with an electrode portion (not shown) of the wiring board P.

  The housing portion 19a of the second contact member 19 has an end surface portion 19c with which the end surface 21a of the coil spring 21 abuts in a step shape so that the end surface portion 19c protrudes toward the coil spring 21 side. And a second surface portion 19e located on the side (downward) away from the coil spring 21 with respect to the first surface portion 19d. The first surface portion 19d has a shape of a part of a circle cut out by a string, like the first surface portion 18d shown in FIG.

  As shown in FIG. 1, in the state where the external force in the direction of pushing into the cylindrical body 20 is not applied to the second contact member 19, the end surface 21a of the coil spring 21 abuts against the first surface portion 19d, The end surface 21a of the coil spring 21 is separated from the two-surface portion 19e (so that a gap C is formed).

  Next, how to use the IC socket 11 will be described.

  First, in a state before the IC socket 11 is arranged on the wiring board P (for example, during transportation), the second contact member 19 is urged by a coil spring 21 as shown in FIG. A lower contact portion 19b of the second contact member 19 protrudes downward.

  From this state, when the lower plate 15 of the IC socket 11 is placed and placed on the wiring board P, the lower contact portion 19b of the second contact member 19 is placed on the wiring board P as shown in FIG. It abuts and is pushed up against the urging force of the coil spring 21.

  In this state, since the end surface portion 19c of the second contact member 19 is formed in a stepped shape, the biasing force of the coil spring 21 acts on the first surface portion 19d side (one side), as shown in FIG. The second contact member 19 is inclined obliquely. As a result, the second contact member 19 is reliably brought into contact with the inner peripheral surface of the cylindrical body 20, thereby ensuring conduction performance.

  Moreover, since the end surface portion 19c is formed in a stepped shape having a predetermined height, the coil spring 21 is different from the conventional one, and the housing portion 19a of the second contact member 19 and the inner peripheral surface of the cylindrical body 20 There will be no bite between them. Therefore, the stability of the operation of the second contact member 19 can be ensured.

  When the IC package 12 is housed on a floating plate (not shown) and is pushed downward by an urging force of a spring (not shown) by an automatic machine or the like, the spherical terminal 12b of the IC package 12 is a first contact member. The first contact member 18 is pressed downward against the biasing force of the coil spring 21 (see FIG. 3).

  In this state, since the end surface portion 18c of the first contact member 18 is formed in a stepped shape, the biasing force of the coil spring 21 acts on the first surface portion 18d side (one side), as shown in FIG. The first contact member 18 is inclined obliquely. As a result, the first contact member 18 is reliably brought into contact with the inner peripheral surface of the cylindrical body 20, thereby ensuring conduction performance.

  And since the end surface part 18c is formed in the level | step difference shape of predetermined | prescribed height, the coil spring 21 differs from the former, and the accommodating part 18a of the 1st contact member 18, the inner peripheral surface of the cylinder 20, and There will be no bite between them. Therefore, the stability of the operation of the first contact member 18 can be ensured.

  As a result, both contact members 18 and 19 of the contact pin 18 are made conductive through the cylindrical body 20, and the IC package 12 and the wiring board P are electrically connected via the contact pin 18, and the burn-in test of the IC package 12 is performed. Etc. will be performed satisfactorily.

Further, the step-shaped end surface portions 18c and 19c of the both contact members 18 and 19 are relatively easy because the first surface portions 18d and 19d and the second surface portions 18e and 19e are not formed obliquely unlike the prior art. Can be formed.
[Embodiment 2 of the Invention]

  FIG. 5 shows a second embodiment of the present invention.

  In the second embodiment, the first surface portion 18d of the first contact member 18 is inclined.

  In such a case, since the first surface portion 18d is inclined, the urging force of the coil spring 21 makes it easier for the first contact member 18 to be inclined, thereby ensuring electrical conductivity.

  Since other configurations and operations are the same as those of the first embodiment, description thereof is omitted.

  In the above-described embodiment, the contact pin 17 of the present invention is applied to the IC socket 11. However, the present invention is not limited to this and can be applied to other devices. Further, although the present invention is applied to the IC socket 11 as the “electrical component socket”, it is needless to say that the present invention is not limited to this and can be applied to other devices. In the above embodiment, both the first contact member 18 and the second contact member 19 are provided. However, at least one of them may be provided, or the first contact member 18 may be provided. The first surface portions 18d and 19d and the second surface portions 18e and 19e are formed on both the second contact member 19 and the second contact member 19, but may be provided on only one of them.

11 IC socket (socket for electrical parts)
12 IC package (first electrical component)
12b spherical terminal
14 Socket body
17 Contact pin
18 First contact member
18c End face
18d first side
18e Second side
19 First contact member
19c End face
19d first side
19e Second side
20 cylinder
21 Coil spring
P Wiring board (second electrical component)

Claims (4)

In the contact pin that electrically connects the first electrical component and the second electrical component,
A first contact member made of a conductive material in contact with the first electrical component;
A cylindrical body made of a conductive material in which the first contact member is movably accommodated;
A coil spring housed in the cylinder and biasing the first contact member toward the first electrical component;
The first contact member has a housing portion which is accommodated in the cylindrical body, the end face of the coil spring is formed on an end surface portion stepped shape of the receiving portion which abuts the coil spring A first surface portion projecting to the side, and a second surface portion located on a side away from the coil spring with respect to the first surface portion, and an outer peripheral surface of the first surface portion has a substantially arc shape, and the accommodating portion Is formed with the same curvature as the outer peripheral surface of
In the state where the external force in the direction of pushing into the cylindrical body is not applied to the first contact member, the end surface of the coil spring abuts on the first surface portion, and the end surface of the coil spring contacts the second surface portion. A contact pin configured to be spaced apart. The first contact member is movably accommodated at one end side of the cylindrical body, and a second contact member made of a conductive material in contact with the second electrical component is disposed at the other end side of the cylindrical body. The coil spring is movably accommodated, and the coil spring is interposed between the first contact member and the second contact member,
The second contact member has a housing portion which is accommodated in the cylindrical body, the end face of the housing part end surface of the coil spring is in contact is formed on the stepped shape, the coil spring A first surface portion projecting to the side, and a second surface portion located on a side away from the coil spring with respect to the first surface portion, and an outer peripheral surface of the first surface portion has a substantially arc shape, and the accommodating portion Is formed with the same curvature as the outer peripheral surface of
In the state where the external force in the direction of pushing into the cylindrical body is not applied to the second contact member, the end surface of the coil spring abuts on the first surface portion, and the end surface of the coil spring contacts the second surface portion. The contact pin according to claim 1, wherein the contact pin is configured to be separated. The contact pin according to claim 1, wherein the first surface portion is inclined. A plurality of contact pins according to any one of claims 1 to 3 are disposed on a socket body that is disposed on a wiring board that is the second electrical component and that accommodates the first electrical component. A socket for electrical parts characterized by the above.

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