JP5846586B2 - 電子部品用ソケット - Google Patents
電子部品用ソケット Download PDFInfo
- Publication number
- JP5846586B2 JP5846586B2 JP2013022160A JP2013022160A JP5846586B2 JP 5846586 B2 JP5846586 B2 JP 5846586B2 JP 2013022160 A JP2013022160 A JP 2013022160A JP 2013022160 A JP2013022160 A JP 2013022160A JP 5846586 B2 JP5846586 B2 JP 5846586B2
- Authority
- JP
- Japan
- Prior art keywords
- moving member
- electronic component
- contact
- elastic
- contact portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 description 27
- 239000000463 material Substances 0.000 description 8
- 229920003002 synthetic resin Polymers 0.000 description 8
- 239000000057 synthetic resin Substances 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6596—Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connecting Device With Holders (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013022160A JP5846586B2 (ja) | 2012-05-14 | 2013-02-07 | 電子部品用ソケット |
| CN201310124340.0A CN103427237B (zh) | 2012-05-14 | 2013-04-11 | 电子部件用插座 |
| US13/860,981 US9083120B2 (en) | 2012-05-14 | 2013-04-11 | Socket for electronic components |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012110185 | 2012-05-14 | ||
| JP2012110185 | 2012-05-14 | ||
| JP2013022160A JP5846586B2 (ja) | 2012-05-14 | 2013-02-07 | 電子部品用ソケット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013258131A JP2013258131A (ja) | 2013-12-26 |
| JP2013258131A5 JP2013258131A5 (enExample) | 2014-11-20 |
| JP5846586B2 true JP5846586B2 (ja) | 2016-01-20 |
Family
ID=49548928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013022160A Expired - Fee Related JP5846586B2 (ja) | 2012-05-14 | 2013-02-07 | 電子部品用ソケット |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9083120B2 (enExample) |
| JP (1) | JP5846586B2 (enExample) |
| CN (1) | CN103427237B (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5863041B2 (ja) * | 2012-06-01 | 2016-02-16 | アルプス電気株式会社 | 電子部品用ソケット |
| JP2015065147A (ja) * | 2013-08-29 | 2015-04-09 | アルプス電気株式会社 | 電子部品用ソケット |
| JP6284124B2 (ja) * | 2014-07-02 | 2018-02-28 | アルプス電気株式会社 | 電子部品用ソケット |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3587028A (en) * | 1969-04-28 | 1971-06-22 | Ibm | Coaxial connector guide and grounding structure |
| FR2553588B1 (fr) * | 1983-10-14 | 1986-01-03 | Telecommunications Sa | Dispositif de connexion pour test de circuit imprime |
| JP2000067956A (ja) * | 1998-08-24 | 2000-03-03 | Fujitsu Takamisawa Component Ltd | プラグ、ジャック、及びコネクタ装置 |
| JP2001015223A (ja) * | 1999-06-25 | 2001-01-19 | Nec Corp | 汎用コネクタおよびその結合方法 |
| JP2002134202A (ja) * | 2000-10-27 | 2002-05-10 | Otax Co Ltd | 電子部品用ソケット |
| US6428358B1 (en) | 2000-12-28 | 2002-08-06 | Intel Corporation | Socket with embedded conductive structure and method of fabrication therefor |
| JP2010197402A (ja) * | 2003-11-05 | 2010-09-09 | Nhk Spring Co Ltd | 導電性接触子ホルダ、導電性接触子ユニット |
| JP4810998B2 (ja) * | 2005-11-30 | 2011-11-09 | ミツミ電機株式会社 | 接続端子及び電子部品の接続装置 |
| JP2007178165A (ja) * | 2005-12-27 | 2007-07-12 | Yokowo Co Ltd | 検査ユニット |
-
2013
- 2013-02-07 JP JP2013022160A patent/JP5846586B2/ja not_active Expired - Fee Related
- 2013-04-11 CN CN201310124340.0A patent/CN103427237B/zh not_active Expired - Fee Related
- 2013-04-11 US US13/860,981 patent/US9083120B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN103427237A (zh) | 2013-12-04 |
| JP2013258131A (ja) | 2013-12-26 |
| US20130303005A1 (en) | 2013-11-14 |
| CN103427237B (zh) | 2016-12-28 |
| US9083120B2 (en) | 2015-07-14 |
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