JP5845833B2 - シリケート複合研磨パッド - Google Patents
シリケート複合研磨パッド Download PDFInfo
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- JP5845833B2 JP5845833B2 JP2011246632A JP2011246632A JP5845833B2 JP 5845833 B2 JP5845833 B2 JP 5845833B2 JP 2011246632 A JP2011246632 A JP 2011246632A JP 2011246632 A JP2011246632 A JP 2011246632A JP 5845833 B2 JP5845833 B2 JP 5845833B2
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- polymer
- silicate
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- polishing pad
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 title claims description 95
- 238000005498 polishing Methods 0.000 title claims description 84
- 239000002131 composite material Substances 0.000 title description 4
- 229920000642 polymer Polymers 0.000 claims description 124
- 239000002245 particle Substances 0.000 claims description 64
- 239000011159 matrix material Substances 0.000 claims description 25
- 239000012530 fluid Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 6
- 229920005862 polyol Polymers 0.000 description 23
- 150000003077 polyols Chemical class 0.000 description 22
- 229920001577 copolymer Polymers 0.000 description 20
- -1 polyethylene copolymer Polymers 0.000 description 20
- 239000007789 gas Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 238000000926 separation method Methods 0.000 description 15
- 239000012948 isocyanate Substances 0.000 description 14
- 229920002635 polyurethane Polymers 0.000 description 14
- 239000004814 polyurethane Substances 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 230000007547 defect Effects 0.000 description 11
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 10
- 229920000909 polytetrahydrofuran Polymers 0.000 description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 239000007795 chemical reaction product Substances 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000011859 microparticle Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 150000002513 isocyanates Chemical class 0.000 description 7
- 238000001878 scanning electron micrograph Methods 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
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- 239000000047 product Substances 0.000 description 5
- 238000006748 scratching Methods 0.000 description 5
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- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000011362 coarse particle Substances 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
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- 238000009826 distribution Methods 0.000 description 2
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- 238000011049 filling Methods 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 229910052919 magnesium silicate Inorganic materials 0.000 description 2
- 235000019792 magnesium silicate Nutrition 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- AXKZIDYFAMKWSA-UHFFFAOYSA-N 1,6-dioxacyclododecane-7,12-dione Chemical compound O=C1CCCCC(=O)OCCCCO1 AXKZIDYFAMKWSA-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- BSYVFGQQLJNJJG-UHFFFAOYSA-N 2-[2-(2-aminophenyl)sulfanylethylsulfanyl]aniline Chemical compound NC1=CC=CC=C1SCCSC1=CC=CC=C1N BSYVFGQQLJNJJG-UHFFFAOYSA-N 0.000 description 1
- WABOBVQONKAELR-UHFFFAOYSA-N 2-methyl-4-(2-methylbutan-2-yl)benzene-1,3-diamine Chemical compound CCC(C)(C)C1=CC=C(N)C(C)=C1N WABOBVQONKAELR-UHFFFAOYSA-N 0.000 description 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 description 1
- YJIHNAUJGMTCFJ-UHFFFAOYSA-N 4-methyl-6-(2-methylbutan-2-yl)benzene-1,3-diamine Chemical compound CCC(C)(C)C1=CC(C)=C(N)C=C1N YJIHNAUJGMTCFJ-UHFFFAOYSA-N 0.000 description 1
- HLDUVPFXLWEZOG-UHFFFAOYSA-N 4-tert-butyl-6-methylbenzene-1,3-diamine Chemical compound CC1=CC(C(C)(C)C)=C(N)C=C1N HLDUVPFXLWEZOG-UHFFFAOYSA-N 0.000 description 1
- 208000032484 Accidental exposure to product Diseases 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229920006309 Invista Polymers 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 229920013701 VORANOL™ Polymers 0.000 description 1
- 231100000818 accidental exposure Toxicity 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229920000891 common polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004503 fine granule Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920003226 polyurethane urea Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
半導体、磁性および光学基板のうち少なくとも1つを研磨するのに有用である研磨パッドであって、
研磨表面を有するポリマーマトリックス、
前記ポリマーマトリックス内および前記ポリマーマトリックスの前記研磨表面に分散されており、外表面を有し、かつ前記研磨表面にテクスチャを作り出すために流体で充填されているポリマーマイクロエレメント、および
前記ポリマーマイクロエレメントの各々の中に分散されており、前記ポリマーマイクロエレメントの外表面の50%未満を被覆するように距離を保つシリケート含有領域、を含み、
前記ポリマーマイクロエレメントの総計の0.1重量%未満が、
i)5μmを超える粒子サイズを有するシリケート粒子、
ii)前記ポリマーマイクロエレメントの外表面を50%を超えて覆うシリケート含有領域、および
iii)シリケート粒子と凝集して平均120μmを超えるクラスターサイズになったポリマーマイクロエレメントに関連する、研磨パッドである。
半導体、磁性および光学基板のうち少なくとも1つを研磨するのに有用である研磨パッドであって、
研磨表面を有するポリマーマトリックス、
前記ポリマーマトリックス内および前記ポリマーマトリックスの前記研磨表面に分散されており、外表面を有し、かつ前記研磨表面にテクスチャを作り出すために流体で充填されているポリマーマイクロエレメント、および
前記ポリマーマイクロエレメントの各々の中に分散されており、前記ポリマーマイクロエレメントの外表面の1〜40%を被覆するように距離を保つシリケート含有領域、を含み、
前記ポリマーマイクロエレメントの総計の0.05重量%未満が、
i)5μmを超える粒子サイズを有するシリケート粒子、
ii)前記ポリマーマイクロエレメントの外表面を50%を超えて覆うシリケート含有領域、および
iii)シリケート粒子と凝集して平均120μmを超えるクラスターサイズになったポリマーマイクロエレメントに関連する、研磨パッドである。
Matsubo CorporationからのElbow-Jet Model Labo空気選別機は、平均直径40ミクロンおよび密度42g/literを有するポリアクリルニトリルのイソブタン充填コポリマーおよびポリビニリジンジクロリドの試料を分離した。これらの中空微粒子は、前記コポリマー中に埋め込まれたケイ酸アルミニウムおよびケイ酸マグネシウム粒子を含んでいた。前記シリケートは前記微粒子の外表面面積の約10〜20%を覆っていた。加えて、前記試料は、5μmを超える粒子サイズを有するシリケート粒子に関連するコポリマー微粒子;ii)ポリマーマイクロエレメントの50%を超える外表面を覆うシリケート含有領域;およびiii)シリケート粒子と120μmを超える平均クラスターサイズまで凝集したポリマーマイクロエレメントを含んでいた。前記Elbow-Jet model Laboはコアンダブロックおよび図1Aおよび図1Bに記載の構造を含んでいた。ポリマー微粒子を振動フィーダを通してガスジェット中に供給して、表1の結果を得た。
下記の試験で燃焼後の残渣を測定した。
前記エルボウジェット装置で選別した後、3個の処理されたシリケートポリマー含有マイクロエレメントの0.25gの試験片を40mlの超純水中に浸漬した。前記試験片を十分混合し、かつ3日間沈殿させた。前記粗片は目に見える沈殿物を数分後に生成し、前記細片は目に見える沈殿物を数時間後に生成し、かつ前記中間片は沈殿物を24時間後に生成した。浮遊するポリマーマイクロエレメントおよび水を除去し、沈殿スラグおよび少量の水を残した。前記試験片を1晩乾かせた。沈殿物の重量を判定するために、乾燥後、容器と沈殿物の重量を測定し、前記沈殿物を除去し、そして容器を洗浄、乾燥して重量を再測定した。図5〜7は前記選別技術を通して得られたシリケートサイズおよび形態の著しい差異を示す。図5は沈殿プロセスの間に沈殿した細粒ポリマーおよびシリケート粒子の捕集物を示す。図6はシリケート粒子によって50%を超える外表面が覆われた、大型シリケート粒子(5μmを超える)およびポリマーマイクロエレメントを示す。図7は、その他の顕微鏡写真より約10倍高い倍率で、シリケート細粒および破砕されたポリマーマイクロエレメントを示す。バッグ状の形状を有する前記破砕されたポリマーマイクロエレメントは、沈殿プロセスの間に沈んだものである。
銅との研磨比較のために一連の3種類の成型された研磨パッドを準備した。
Claims (8)
- 半導体、磁性および光学基板のうち少なくとも1つを研磨するのに有用である研磨パッドであって、
研磨表面を有するポリマーマトリックス、
前記ポリマーマトリックス内および前記ポリマーマトリックスの前記研磨表面に分散されており、外表面を有し、かつ前記研磨表面にテクスチャを作り出すために流体で充填されているポリマーマイクロエレメント、および
前記ポリマーマイクロエレメントの各々に埋め込まれ又は結合されており、前記ポリマーマイクロエレメントの外表面の50%未満を被覆するように距離を保つシリケート含有領域、を含み、
前記ポリマーマイクロエレメントの総計の0.1重量%未満が、
i)5μmを超える粒子サイズを有するシリケート粒子、
ii)前記ポリマーマイクロエレメントの外表面を50%を超えて覆うシリケート含有領域、および
iii)シリケート粒子と凝集して平均120μmを超えるクラスターサイズになったポリマーマイクロエレメントである、研磨パッド。 - 前記ポリマーマイクロエレメントの前記シリケート含有領域が0.01〜3μmの平均サイズを有する、請求項1に記載の研磨パッド。
- 前記ポリマーマイクロエレメントが5〜200ミクロンの平均サイズを有する、請求項1に記載の研磨パッド。
- 前記シリケート含有領域が前記ポリマーマイクロエレメントの外表面の1〜40%を覆う、請求項1に記載の研磨パッド。
- 半導体、磁性および光学基板のうち少なくとも1つを研磨するのに有用である研磨パッドであって、
研磨表面を有するポリマーマトリックス、
前記ポリマーマトリックス内および前記ポリマーマトリックスの前記研磨表面に分散されており、外表面を有し、かつ前記研磨表面にテクスチャを作り出すために流体で充填されているポリマーマイクロエレメント、および
前記ポリマーマイクロエレメントの各々に埋め込まれ又は結合されており、前記ポリマーマイクロエレメントの外表面の1〜40%を被覆するように距離を保つシリケート含有領域、を含み、
前記ポリマーマイクロエレメントの総計の0.05重量%未満が、
i)5μmを超える粒子サイズを有するシリケート粒子、
ii)前記ポリマーマイクロエレメントの外表面を50%を超えて覆うシリケート含有領域、および
iii)シリケート粒子と凝集して平均120μmを超えるクラスターサイズになったポリマーマイクロエレメントである、研磨パッド。 - 前記ポリマーマイクロエレメント上に分散する前記シリケート含有領域が0.01〜2ミクロンの平均粒子サイズを有する、請求項5に記載の研磨パッド。
- 前記ポリマーマイクロエレメントが10〜100ミクロンの平均サイズを有する、請求項5に記載の研磨パッド。
- 前記シリケート含有領域が前記ポリマーマイクロエレメントの外表面の2〜30%を覆う、請求項5に記載の研磨パッド。
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