JP2012101354A5 - - Google Patents
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- Publication number
- JP2012101354A5 JP2012101354A5 JP2011246632A JP2011246632A JP2012101354A5 JP 2012101354 A5 JP2012101354 A5 JP 2012101354A5 JP 2011246632 A JP2011246632 A JP 2011246632A JP 2011246632 A JP2011246632 A JP 2011246632A JP 2012101354 A5 JP2012101354 A5 JP 2012101354A5
- Authority
- JP
- Japan
- Prior art keywords
- silicate
- polishing pad
- average size
- region associated
- containing region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
Claims (1)
- 前記ポリマーマイクロエレメントに関連する前記シリケート含有領域が０．０１〜３μmの平均サイズを有する、請求項１に記載の研磨パッド。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/945,557 US8257152B2 (en) | 2010-11-12 | 2010-11-12 | Silicate composite polishing pad |
| US12/945,557 | 2010-11-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012101354A JP2012101354A (ja) | 2012-05-31 |
| JP2012101354A5 true JP2012101354A5 (ja) | 2015-03-05 |
| JP5845833B2 JP5845833B2 (ja) | 2016-01-20 |
Family
ID=45999137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011246632A Active JP5845833B2 (ja) | 2010-11-12 | 2011-11-10 | シリケート複合研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8257152B2 (ja) |
| JP (1) | JP5845833B2 (ja) |
| KR (1) | KR101915318B1 (ja) |
| CN (1) | CN102528647B (ja) |
| DE (1) | DE102011117867A1 (ja) |
| FR (1) | FR2967367B1 (ja) |
| TW (1) | TWI515082B (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9073172B2 (en) | 2012-05-11 | 2015-07-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Alkaline-earth metal oxide-polymeric polishing pad |
| US8894732B2 (en) | 2012-05-11 | 2014-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Hollow polymeric-alkaline earth metal oxide composite |
| US8888877B2 (en) | 2012-05-11 | 2014-11-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Forming alkaline-earth metal oxide polishing pad |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9731398B2 (en) * | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
| US11524390B2 (en) * | 2017-05-01 | 2022-12-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Methods of making chemical mechanical polishing layers having improved uniformity |
| CN112743443A (zh) * | 2019-10-29 | 2021-05-04 | 山西钜星超硬工具制品有限公司 | 一种珩磨油石 |
| CN112812743A (zh) * | 2019-11-15 | 2021-05-18 | 圣戈班磨料磨具有限公司 | 磨料制品及其形成方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL162006C (nl) * | 1973-09-26 | Norddeutsche Schleifmittel Ind | Slijpwerktuig. | |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5334335A (en) * | 1992-10-19 | 1994-08-02 | Clearfix Corporation | Compositions and methods for repairing and removing scratches and other imperfections from plastic surfaces |
| US5934478A (en) * | 1995-07-25 | 1999-08-10 | Canon Kabushiki Kaisha | Gas stream classifier and process for producing toner |
| US5976000A (en) * | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
| US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
| GB2334205B (en) * | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
| US6585574B1 (en) * | 1998-06-02 | 2003-07-01 | Brian Lombardo | Polishing pad with reduced moisture absorption |
| US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
| US6641463B1 (en) * | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
| US6454644B1 (en) * | 2000-07-31 | 2002-09-24 | Ebara Corporation | Polisher and method for manufacturing same and polishing tool |
| US6659846B2 (en) * | 2001-09-17 | 2003-12-09 | Agere Systems, Inc. | Pad for chemical mechanical polishing |
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US7579071B2 (en) * | 2002-09-17 | 2009-08-25 | Korea Polyol Co., Ltd. | Polishing pad containing embedded liquid microelements and method of manufacturing the same |
| US20050176251A1 (en) * | 2004-02-05 | 2005-08-11 | Duong Chau H. | Polishing pad with releasable slick particles |
| US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
| TWI293266B (en) * | 2004-05-05 | 2008-02-11 | Iv Technologies Co Ltd | A single-layer polishing pad and a method of producing the same |
| US20060154579A1 (en) * | 2005-01-12 | 2006-07-13 | Psiloquest | Thermoplastic chemical mechanical polishing pad and method of manufacture |
| US7591865B2 (en) * | 2005-01-28 | 2009-09-22 | Saint-Gobain Abrasives, Inc. | Method of forming structured abrasive article |
| US20070049164A1 (en) * | 2005-08-26 | 2007-03-01 | Thomson Clifford O | Polishing pad and method for manufacturing polishing pads |
| RU2301141C1 (ru) * | 2005-11-30 | 2007-06-20 | Открытое акционерное общество "ФОМОС-МАТЕРИАЛС" | Способ обработки подложек монокристаллического лантангаллиевого силиката |
| TW200817497A (en) * | 2006-08-14 | 2008-04-16 | Nippon Chemical Ind | Polishing composition for semiconductor wafer, production method thereof, and polishing method |
| US8083820B2 (en) * | 2006-12-22 | 2011-12-27 | 3M Innovative Properties Company | Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same |
| JP2009184858A (ja) * | 2008-02-04 | 2009-08-20 | Nippon Chem Ind Co Ltd | ヒドラジンが固定化されたシリカ粒子よりなるコロイダルシリカ |
| TW201016391A (en) * | 2008-10-20 | 2010-05-01 | Bestac Advanced Material Co Ltd | Polishing pad having abrasive grains and method for making the same |
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2010
- 2010-11-12 US US12/945,557 patent/US8257152B2/en active Active
-
2011
- 2011-11-08 DE DE102011117867A patent/DE102011117867A1/de active Pending
- 2011-11-08 TW TW100140663A patent/TWI515082B/zh active
- 2011-11-10 JP JP2011246632A patent/JP5845833B2/ja active Active
- 2011-11-10 FR FR1160257A patent/FR2967367B1/fr active Active
- 2011-11-11 KR KR1020110117500A patent/KR101915318B1/ko active IP Right Grant
- 2011-11-11 CN CN201110371457.XA patent/CN102528647B/zh active Active