JP5842063B2 - 印刷機 - Google Patents
印刷機 Download PDFInfo
- Publication number
- JP5842063B2 JP5842063B2 JP2014532637A JP2014532637A JP5842063B2 JP 5842063 B2 JP5842063 B2 JP 5842063B2 JP 2014532637 A JP2014532637 A JP 2014532637A JP 2014532637 A JP2014532637 A JP 2014532637A JP 5842063 B2 JP5842063 B2 JP 5842063B2
- Authority
- JP
- Japan
- Prior art keywords
- squeegee
- solder
- scooping
- mask
- scraping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims description 127
- 238000007790 scraping Methods 0.000 claims description 73
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 239000006071 cream Substances 0.000 description 58
- 230000003028 elevating effect Effects 0.000 description 16
- 238000009434 installation Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
- B41F15/42—Inking units comprising squeegees or doctors
- B41F15/423—Driving means for reciprocating squeegees
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
- B41F15/46—Squeegees or doctors with two or more operative parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Description
Claims (4)
- 下方に基板が配置されたマスクの上面で印刷用スキージを有するスキージユニットを一方向に進退させて半田を移動させることにより前記基板に半田を印刷する印刷機であって、
前記スキージユニットとともに印刷動作の方向に進退する掻き取りスキージと、
前記スキージユニットとともに印刷動作の方向に進退し、半田を載せるための面を有する掬い取りスキージとを備え、
前記掻き取りスキージと前記掬い取りスキージとが印刷動作の方向で相対的に接離可能になって、前記マスク上面の半田を掬い取ることができ、
前記掻き取りスキージにおける前記掬い取りスキージに対向する面に、半田が前記掻き取りスキージに付着し難くなるようにする凹凸を表面に有する被覆部が取り付けられていることを特徴とする印刷機。 - 前記マスクの外周に枠が設けられており、前記掻き取りスキージと前記掬い取りスキージとが前記マスク枠の高さ以上に上昇可能になっている請求項1に記載の印刷機。
- 前記掻き取りスキージと前記掬い取りスキージとが別々に昇降可能になっている請求項1または2に記載の印刷機。
- 前記掻き取りスキージにおける前記掬い取りスキージに対向する面と反対の面に、凹凸を表面に有する被覆部が取り付けられている請求項1ないし3のうちいずれが一つに記載の印刷機。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/071880 WO2014033861A1 (ja) | 2012-08-29 | 2012-08-29 | 印刷機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5842063B2 true JP5842063B2 (ja) | 2016-01-13 |
JPWO2014033861A1 JPWO2014033861A1 (ja) | 2016-08-08 |
Family
ID=50182711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014532637A Active JP5842063B2 (ja) | 2012-08-29 | 2012-08-29 | 印刷機 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2873526B1 (ja) |
JP (1) | JP5842063B2 (ja) |
CN (1) | CN104411498B (ja) |
WO (1) | WO2014033861A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6803669B2 (ja) * | 2016-03-15 | 2020-12-23 | 株式会社Fuji | スクリーン印刷機 |
CN107351535B (zh) * | 2017-07-28 | 2019-02-05 | 常州市天方印刷有限公司 | 一种移动调节式油墨刮刀驱动装置 |
DE112018007698T5 (de) * | 2018-06-05 | 2021-02-25 | Yamaha Hatsudoki Kabushiki Kaisha | Druckvorrichtung |
CN109572165B (zh) * | 2018-11-23 | 2021-09-24 | 安徽翔胜科技有限公司 | 一种芯片电阻印刷装置 |
JP7195299B2 (ja) * | 2020-12-01 | 2022-12-23 | 株式会社Fuji | スクリーン印刷機 |
CN112677638A (zh) * | 2020-12-25 | 2021-04-20 | 东莞市凯格精机股份有限公司 | 一种锡膏回收装置及印刷装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05338112A (ja) * | 1992-06-10 | 1993-12-21 | Tokuyama Soda Co Ltd | 印刷用マスク |
JP2001315304A (ja) * | 2000-05-02 | 2001-11-13 | Noritake Co Ltd | スクリーン印刷のペースト返し方法 |
JP2006062209A (ja) * | 2004-08-27 | 2006-03-09 | Hitachi Industries Co Ltd | スクリーン印刷機 |
JP3129095U (ja) * | 2006-11-23 | 2007-02-01 | 株式会社プロセス・ラボ・ミクロン | 逆エンボススキージ |
JP2007106103A (ja) * | 2005-09-16 | 2007-04-26 | Nippon Paint Co Ltd | 印刷方法およびそのための装置 |
JP2011000757A (ja) * | 2009-06-17 | 2011-01-06 | Bonmaaku:Kk | スクリーン印刷用スキージ及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3845712A (en) * | 1970-11-27 | 1974-11-05 | Armstrong Cork Co | Screen printing method |
CN85107665A (zh) * | 1984-10-06 | 1986-06-10 | 鲁道夫·奥古斯特·屈尔登 | 丝网印刷机用压头 |
FR2722138B1 (fr) * | 1994-07-07 | 1996-09-20 | Bourrieres Francis | Pochoir de serigraphie et procede pour le realiser |
US5809608A (en) * | 1995-02-10 | 1998-09-22 | Zadro; Zlatko | Adjustable length squeegee |
DE19624442C2 (de) * | 1996-06-19 | 1999-08-05 | Leipold Xaver F Gmbh & Co Kg | Verfahren zum Herstellen von Druckgut mittels Durchdruck, insbesondere Siebdruck und Durchdruck-, insbesondere Siebdruckmaschine |
US6066206A (en) | 1997-02-21 | 2000-05-23 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
-
2012
- 2012-08-29 EP EP12883458.7A patent/EP2873526B1/en active Active
- 2012-08-29 JP JP2014532637A patent/JP5842063B2/ja active Active
- 2012-08-29 WO PCT/JP2012/071880 patent/WO2014033861A1/ja active Application Filing
- 2012-08-29 CN CN201280074127.7A patent/CN104411498B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05338112A (ja) * | 1992-06-10 | 1993-12-21 | Tokuyama Soda Co Ltd | 印刷用マスク |
JP2001315304A (ja) * | 2000-05-02 | 2001-11-13 | Noritake Co Ltd | スクリーン印刷のペースト返し方法 |
JP2006062209A (ja) * | 2004-08-27 | 2006-03-09 | Hitachi Industries Co Ltd | スクリーン印刷機 |
JP2007106103A (ja) * | 2005-09-16 | 2007-04-26 | Nippon Paint Co Ltd | 印刷方法およびそのための装置 |
JP3129095U (ja) * | 2006-11-23 | 2007-02-01 | 株式会社プロセス・ラボ・ミクロン | 逆エンボススキージ |
JP2011000757A (ja) * | 2009-06-17 | 2011-01-06 | Bonmaaku:Kk | スクリーン印刷用スキージ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2873526A4 (en) | 2015-08-26 |
EP2873526A1 (en) | 2015-05-20 |
CN104411498A (zh) | 2015-03-11 |
WO2014033861A1 (ja) | 2014-03-06 |
CN104411498B (zh) | 2016-08-24 |
JPWO2014033861A1 (ja) | 2016-08-08 |
EP2873526B1 (en) | 2017-04-19 |
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