JP5841600B2 - Ｌｅｄへの分路層の配置 - Google Patents

Ｌｅｄへの分路層の配置 Download PDF

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JP5841600B2
JP5841600B2 JP2013523683A JP2013523683A JP5841600B2 JP 5841600 B2 JP5841600 B2 JP 5841600B2 JP 2013523683 A JP2013523683 A JP 2013523683A JP 2013523683 A JP2013523683 A JP 2013523683A JP 5841600 B2 JP5841600 B2 JP 5841600B2
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contacts
metal
shunt
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current
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Japanese (ja)
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JP2013533643A5 (enExample
JP2013533643A (ja
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トニ ロペス
トニ ロペス
ラファエル イグナチオ アルダズ
ラファエル イグナチオ アルダズ
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8316—Multi-layer electrodes comprising at least one discontinuous layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
JP2013523683A 2010-08-10 2011-07-25 Ｌｅｄへの分路層の配置 Active JP5841600B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37194410P 2010-08-10 2010-08-10
US61/371,944 2010-08-10
PCT/IB2011/053304 WO2012020346A1 (en) 2010-08-10 2011-07-25 Shunting layer arrangement for leds

Publications (3)

Publication Number Publication Date
JP2013533643A JP2013533643A (ja) 2013-08-22
JP2013533643A5 JP2013533643A5 (enExample) 2014-08-28
JP5841600B2 true JP5841600B2 (ja) 2016-01-13

Family

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Family Applications (1)

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JP2013523683A Active JP5841600B2 (ja) 2010-08-10 2011-07-25 Ｌｅｄへの分路層の配置

Country Status (6)

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US (1) US8975658B2 (enExample)
EP (1) EP2603936B1 (enExample)
JP (1) JP5841600B2 (enExample)
CN (1) CN103201859B (enExample)
RU (1) RU2566403C2 (enExample)
WO (1) WO2012020346A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011111919B4 (de) * 2011-08-30 2023-03-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US20150060799A1 (en) * 2012-03-13 2015-03-05 Panasonic Corporation Organic electroluminescent element
CN105609596A (zh) * 2015-09-11 2016-05-25 映瑞光电科技(上海)有限公司 具有电流阻挡结构的led垂直芯片及其制备方法
CN105322068B (zh) * 2015-11-17 2017-12-26 天津三安光电有限公司 发光二极管芯片及其制作方法
CN106972090A (zh) * 2017-04-14 2017-07-21 华南理工大学 一种弧线形n电极及垂直结构led芯片
KR102345618B1 (ko) 2017-09-01 2021-12-31 삼성전자주식회사 발광 다이오드 및 그의 제조 방법
TWI640075B (zh) * 2017-10-31 2018-11-01 友達光電股份有限公司 像素發光裝置
US11196230B2 (en) * 2017-12-27 2021-12-07 Lumentum Operations Llc Impedance compensation along a channel of emitters
DE102018127201A1 (de) 2018-10-31 2020-04-30 Osram Opto Semiconductors Gmbh Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips
US20210074880A1 (en) * 2018-12-18 2021-03-11 Bolb Inc. Light-output-power self-awareness light-emitting device
TWI855134B (zh) * 2020-08-19 2024-09-11 晶元光電股份有限公司 化合物半導體元件及化合物半導體裝置
CN112002789B (zh) * 2020-10-30 2021-01-15 华引芯（武汉）科技有限公司 一种大功率发光芯片及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3260358B2 (ja) * 1990-08-20 2002-02-25 株式会社東芝 半導体発光装置
DE69831860T2 (de) * 1998-07-04 2006-07-20 Au Optronics Corp. Elektrode zur verwendung in elektrooptischen bauelementen
US7193245B2 (en) * 2003-09-04 2007-03-20 Lumei Optoelectronics Corporation High power, high luminous flux light emitting diode and method of making same
JP2004047504A (ja) * 2002-07-08 2004-02-12 Korai Kagi Kofun Yugenkoshi 発光効率を高めた発光ダイオード
JP2004047662A (ja) 2002-07-11 2004-02-12 Rohm Co Ltd 半導体発光素子
JP2005019695A (ja) * 2003-06-26 2005-01-20 Toshiba Corp 半導体発光装置
JP2006120927A (ja) * 2004-10-22 2006-05-11 Sharp Corp 発光ダイオード及びその製造方法
WO2006050372A2 (en) * 2004-11-01 2006-05-11 The Regents Of The University Of California Interdigitated multi-pixel arrays for the fabrication of light-emitting devices with very low series-resistances and improved heat-sinking
DE102005025416A1 (de) * 2005-06-02 2006-12-14 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip mit einer Kontaktstruktur
TWI331816B (en) * 2007-04-03 2010-10-11 Advanced Optoelectronic Tech Semiconductor light-emitting device
FI121902B (fi) * 2007-06-20 2011-05-31 Optogan Oy Valoa säteilevä diodi
JP4985260B2 (ja) * 2007-09-18 2012-07-25 日立電線株式会社 発光装置
US20100140656A1 (en) * 2008-12-04 2010-06-10 Epivalley Co., Ltd. Semiconductor Light-Emitting Device
EP2259329A1 (en) * 2009-05-26 2010-12-08 Institut de Ciències Fotòniques, Fundació Privada Metal transparent conductors with low sheet resistance

Also Published As

Publication number Publication date
JP2013533643A (ja) 2013-08-22
RU2566403C2 (ru) 2015-10-27
CN103201859A (zh) 2013-07-10
WO2012020346A1 (en) 2012-02-16
US8975658B2 (en) 2015-03-10
CN103201859B (zh) 2016-03-02
EP2603936A1 (en) 2013-06-19
RU2013110304A (ru) 2014-09-20
EP2603936B1 (en) 2016-05-11
US20130187193A1 (en) 2013-07-25

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