JP5827342B2 - 中央コンタクトを備え、グラウンド又は電源分配が改善された改良版積層型マイクロ電子アセンブリ - Google Patents

中央コンタクトを備え、グラウンド又は電源分配が改善された改良版積層型マイクロ電子アセンブリ Download PDF

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JP5827342B2
JP5827342B2 JP2013544471A JP2013544471A JP5827342B2 JP 5827342 B2 JP5827342 B2 JP 5827342B2 JP 2013544471 A JP2013544471 A JP 2013544471A JP 2013544471 A JP2013544471 A JP 2013544471A JP 5827342 B2 JP5827342 B2 JP 5827342B2
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microelectronic
opening
plane
assembly
conductive
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JP2013546199A (ja
JP2013546199A5 (enExample
Inventor
ハーバ，ベルガセム
ゾーニ，ワエル
クリスプ，リチャード・デューイット
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テッセラ，インコーポレイテッド
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H10W70/68—
    • H10W72/00—
    • H10W90/00—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H10W70/681—
    • H10W72/30—
    • H10W72/534—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/5445—
    • H10W72/547—
    • H10W72/5475—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/865—
    • H10W72/9445—
    • H10W74/00—
    • H10W74/117—
    • H10W90/231—
    • H10W90/24—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
JP2013544471A 2010-12-17 2011-10-21 中央コンタクトを備え、グラウンド又は電源分配が改善された改良版積層型マイクロ電子アセンブリ Expired - Fee Related JP5827342B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2010-0129888 2010-12-17
KR1020100129888A KR101061531B1 (ko) 2010-12-17 2010-12-17 중앙 콘택을 구비하며 접지 또는 배전을 개선한 적층형 마이크로전자 조립체
PCT/US2011/057294 WO2012082227A2 (en) 2010-12-17 2011-10-21 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution

Publications (3)

Publication Number Publication Date
JP2013546199A JP2013546199A (ja) 2013-12-26
JP2013546199A5 JP2013546199A5 (enExample) 2014-12-04
JP5827342B2 true JP5827342B2 (ja) 2015-12-02

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JP2013544471A Expired - Fee Related JP5827342B2 (ja) 2010-12-17 2011-10-21 中央コンタクトを備え、グラウンド又は電源分配が改善された改良版積層型マイクロ電子アセンブリ

Country Status (7)

Country Link
US (3) US8885356B2 (enExample)
JP (1) JP5827342B2 (enExample)
KR (1) KR101061531B1 (enExample)
CN (1) CN103384913A (enExample)
BR (1) BR112013015117A2 (enExample)
TW (1) TWI528522B (enExample)
WO (1) WO2012082227A2 (enExample)

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Also Published As

Publication number Publication date
US8885356B2 (en) 2014-11-11
CN103384913A (zh) 2013-11-06
US20120155042A1 (en) 2012-06-21
WO2012082227A3 (en) 2012-10-04
WO2012082227A2 (en) 2012-06-21
JP2013546199A (ja) 2013-12-26
TW201234556A (en) 2012-08-16
US20120153435A1 (en) 2012-06-21
US8466564B2 (en) 2013-06-18
US20150043181A1 (en) 2015-02-12
TWI528522B (zh) 2016-04-01
BR112013015117A2 (pt) 2016-09-20
KR101061531B1 (ko) 2011-09-01

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