JP5825380B2 - 銅／セラミックス接合体、及び、パワーモジュール用基板 - Google Patents

銅／セラミックス接合体、及び、パワーモジュール用基板 Download PDF

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Publication number
JP5825380B2
JP5825380B2 JP2014052594A JP2014052594A JP5825380B2 JP 5825380 B2 JP5825380 B2 JP 5825380B2 JP 2014052594 A JP2014052594 A JP 2014052594A JP 2014052594 A JP2014052594 A JP 2014052594A JP 5825380 B2 JP5825380 B2 JP 5825380B2
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JP
Japan
Prior art keywords
copper
ceramic
active element
power module
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014052594A
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English (en)
Japanese (ja)
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JP2015177045A (ja
JP2015177045A5 (enExample
Inventor
伸幸 寺▲崎▼
伸幸 寺▲崎▼
長友　義幸
義幸 長友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014052594A priority Critical patent/JP5825380B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to US15/117,935 priority patent/US10103035B2/en
Priority to EP15749540.9A priority patent/EP3106447B1/en
Priority to TW104104739A priority patent/TWI567047B/zh
Priority to CN201580008014.0A priority patent/CN105980334B/zh
Priority to PCT/JP2015/053792 priority patent/WO2015122446A1/ja
Priority to KR1020167021843A priority patent/KR101758586B1/ko
Publication of JP2015177045A publication Critical patent/JP2015177045A/ja
Publication of JP2015177045A5 publication Critical patent/JP2015177045A5/ja
Application granted granted Critical
Publication of JP5825380B2 publication Critical patent/JP5825380B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2014052594A 2014-02-12 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板 Active JP5825380B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014052594A JP5825380B2 (ja) 2014-03-14 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板
EP15749540.9A EP3106447B1 (en) 2014-02-12 2015-02-12 Copper-ceramic bonded body and power module substrate
TW104104739A TWI567047B (zh) 2014-02-12 2015-02-12 銅／陶瓷接合體及電源模組用基板
CN201580008014.0A CN105980334B (zh) 2014-02-12 2015-02-12 铜‑陶瓷接合体及功率模块用基板
US15/117,935 US10103035B2 (en) 2014-02-12 2015-02-12 Copper-ceramic bonded body and power module substrate
PCT/JP2015/053792 WO2015122446A1 (ja) 2014-02-12 2015-02-12 銅／セラミックス接合体、及び、パワーモジュール用基板
KR1020167021843A KR101758586B1 (ko) 2014-02-12 2015-02-12 구리/세라믹스 접합체 및 파워 모듈용 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014052594A JP5825380B2 (ja) 2014-03-14 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板

Publications (3)

Publication Number Publication Date
JP2015177045A JP2015177045A (ja) 2015-10-05
JP2015177045A5 JP2015177045A5 (enExample) 2015-11-12
JP5825380B2 true JP5825380B2 (ja) 2015-12-02

Family

ID=54255954

Family Applications (1)

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JP2014052594A Active JP5825380B2 (ja) 2014-02-12 2014-03-14 銅／セラミックス接合体、及び、パワーモジュール用基板

Country Status (1)

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JP (1) JP5825380B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645368B2 (ja) * 2016-06-23 2020-02-14 三菱マテリアル株式会社 接合体、パワーモジュール用基板、接合体の製造方法、及び、パワーモジュール用基板の製造方法
JP6939596B2 (ja) * 2018-01-24 2021-09-22 三菱マテリアル株式会社 パワーモジュール用基板の製造方法及びセラミックス‐銅接合体
EP3569370A1 (en) * 2018-05-18 2019-11-20 SUPSI (Scuola Universitaria Professionale Della Svizzera Italiana) Device for gripping and welding electronic components and associated actuating head, robot and method
JP7196799B2 (ja) 2019-08-21 2022-12-27 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
JP7370222B2 (ja) * 2019-11-05 2023-10-27 Ｄｏｗａメタルテック株式会社 金属－セラミックス接合基板およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63239166A (ja) * 1987-03-27 1988-10-05 株式会社東芝 セラミツクス接合体
JPH04295065A (ja) * 1991-03-22 1992-10-20 Murata Mfg Co Ltd セラミック−金属接合体の製造方法
JP2013049589A (ja) * 2011-08-30 2013-03-14 Kyocera Corp セラミック体と金属体との接合体
JP5935292B2 (ja) * 2011-11-01 2016-06-15 三菱マテリアル株式会社 パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板の製造方法

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Publication number Publication date
JP2015177045A (ja) 2015-10-05

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