JP5817907B2 - 金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法 - Google Patents

金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法 Download PDF

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Publication number
JP5817907B2
JP5817907B2 JP2014500933A JP2014500933A JP5817907B2 JP 5817907 B2 JP5817907 B2 JP 5817907B2 JP 2014500933 A JP2014500933 A JP 2014500933A JP 2014500933 A JP2014500933 A JP 2014500933A JP 5817907 B2 JP5817907 B2 JP 5817907B2
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Prior art keywords
metal material
cathode electrode
treated
anode electrode
voltage
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JP2014500933A
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Japanese (ja)
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JPWO2013125658A1 (ja
Inventor
名越　正泰
正泰 名越
佐藤　馨
馨 佐藤
野呂　寿人
寿人 野呂
馬場　和彦
和彦 馬場
精一 渡辺
精一 渡辺
壮貴 吉田
壮貴 吉田
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JFE Steel Corp
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JFE Steel Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/06—Etching of iron or steel

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electrolytic Production Of Metals (AREA)
JP2014500933A 2012-02-24 2013-02-21 金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法 Active JP5817907B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014500933A JP5817907B2 (ja) 2012-02-24 2013-02-21 金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2012038555 2012-02-24
JP2012038553 2012-02-24
JP2012038557 2012-02-24
JP2012038553 2012-02-24
JP2012038555 2012-02-24
JP2012038557 2012-02-24
JP2014500933A JP5817907B2 (ja) 2012-02-24 2013-02-21 金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法
PCT/JP2013/054413 WO2013125658A1 (ja) 2012-02-24 2013-02-21 金属材料、表面処理方法及び装置

Publications (2)

Publication Number Publication Date
JPWO2013125658A1 JPWO2013125658A1 (ja) 2015-07-30
JP5817907B2 true JP5817907B2 (ja) 2015-11-18

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JP2014500933A Active JP5817907B2 (ja) 2012-02-24 2013-02-21 金属材料、金属材料の製造方法、金属材料を基材とした撥水材料の製造方法、金属材料の製造装置、および金属材料の製造方法

Country Status (7)

Country Link
EP (1) EP2818579A4 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP5817907B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR101687462B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN104114747A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IN (1) IN2014KN01697A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWI472424B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2013125658A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6498091B2 (ja) * 2015-09-25 2019-04-10 Ｊｘ金属株式会社 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
US11541516B2 (en) * 2019-09-25 2023-01-03 Snap-On Incorporated Fastener retention and anti-camout tool bit
CN111805022A (zh) * 2020-06-04 2020-10-23 南方科技大学 等离子体辅助电解加工方法及实施装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227241A (ja) * 1983-06-09 1984-12-20 Taishi Shokuhin Kogyo Kk 乳酸発酵豆乳の製造法
JPH04136198A (ja) * 1990-09-26 1992-05-11 Nau Chem:Yugen 電気めっき方法
JPH06297252A (ja) * 1993-04-09 1994-10-25 Sony Corp 微細加工方法及びその装置
JPH09241865A (ja) * 1996-03-01 1997-09-16 Kawasaki Steel Corp フィルム密着性、耐食性に優れたラミネート鋼板
KR20030040394A (ko) * 2000-08-10 2003-05-22 누툴 인코포레이티드 외부 영향을 이용하여 작업물의 최상면과 공동면상에놓여진 첨가제 사이의 차이를 형성하는 도금방법 및 장치
AUPR129900A0 (en) * 2000-11-08 2000-11-30 Chang, Chak Man Thomas Plasma electroplating
US7115193B2 (en) * 2001-03-14 2006-10-03 Nippon Mining & Metals Co., Ltd. Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining
JP2005329451A (ja) * 2004-05-21 2005-12-02 Fuji Photo Film Co Ltd アルミニウム板の表面加工方法及び平版印刷版用支持体並びに平版印刷版
JP5010966B2 (ja) * 2006-08-21 2012-08-29 株式会社神戸製鋼所 撥水性塗料および撥水金属板
US8343253B2 (en) * 2007-02-15 2013-01-01 Kankyou Engineering Co., Ltd. Method for producing conductor fine particles
JP5323677B2 (ja) * 2007-03-02 2013-10-23 古河電気工業株式会社 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板
JP2010287648A (ja) * 2009-06-10 2010-12-24 Seiko Epson Corp 半導体装置の製造方法
JP5569259B2 (ja) * 2010-08-26 2014-08-13 Ｊｆｅスチール株式会社 表面改質された導電性材料の製造方法
CN102041540A (zh) * 2011-01-13 2011-05-04 中国科学院苏州纳米技术与纳米仿生研究所 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法

Also Published As

Publication number Publication date
KR101687462B1 (ko) 2016-12-16
JPWO2013125658A1 (ja) 2015-07-30
TW201341176A (zh) 2013-10-16
EP2818579A4 (en) 2015-11-11
EP2818579A1 (en) 2014-12-31
TWI472424B (zh) 2015-02-11
CN104114747A (zh) 2014-10-22
KR20140112559A (ko) 2014-09-23
IN2014KN01697A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-10-23
WO2013125658A1 (ja) 2013-08-29

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