JP5816749B2 - プローブカード固定装置、プローブ検査装置 - Google Patents

プローブカード固定装置、プローブ検査装置 Download PDF

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Publication number
JP5816749B2
JP5816749B2 JP2014520958A JP2014520958A JP5816749B2 JP 5816749 B2 JP5816749 B2 JP 5816749B2 JP 2014520958 A JP2014520958 A JP 2014520958A JP 2014520958 A JP2014520958 A JP 2014520958A JP 5816749 B2 JP5816749 B2 JP 5816749B2
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Japan
Prior art keywords
probe card
probe
support
support column
connection ring
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2014520958A
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English (en)
Japanese (ja)
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JPWO2013190844A1 (ja
Inventor
山崎　俊彦
俊彦 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei EMD Corp
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Asahi Kasei EMD Corp
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Priority to JP2014520958A priority Critical patent/JP5816749B2/ja
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Publication of JP5816749B2 publication Critical patent/JP5816749B2/ja
Publication of JPWO2013190844A1 publication Critical patent/JPWO2013190844A1/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
JP2014520958A 2012-06-22 2013-06-20 プローブカード固定装置、プローブ検査装置 Active JP5816749B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014520958A JP5816749B2 (ja) 2012-06-22 2013-06-20 プローブカード固定装置、プローブ検査装置

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2012140685 2012-06-22
JP2012140685 2012-06-22
JP2012224932 2012-10-10
JP2012224932 2012-10-10
JP2014520958A JP5816749B2 (ja) 2012-06-22 2013-06-20 プローブカード固定装置、プローブ検査装置
PCT/JP2013/003865 WO2013190844A1 (ja) 2012-06-22 2013-06-20 プローブカード固定装置、プローブ検査装置、プローブ検査方法及びプローブカード

Publications (2)

Publication Number Publication Date
JP5816749B2 true JP5816749B2 (ja) 2015-11-18
JPWO2013190844A1 JPWO2013190844A1 (ja) 2016-02-08

Family

ID=49768457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014520958A Active JP5816749B2 (ja) 2012-06-22 2013-06-20 プローブカード固定装置、プローブ検査装置

Country Status (4)

Country Link
JP (1) JP5816749B2 (zh)
KR (1) KR101569303B1 (zh)
TW (1) TWI513984B (zh)
WO (1) WO2013190844A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106338625B (zh) * 2015-07-06 2019-07-26 创意电子股份有限公司 探针卡
US11280827B2 (en) * 2016-02-29 2022-03-22 Teradyne, Inc. Thermal control of a probe card assembly
TWI597503B (zh) * 2016-08-24 2017-09-01 美亞國際電子有限公司 探針卡
TWI747553B (zh) * 2020-10-15 2021-11-21 華邦電子股份有限公司 晶圓檢測裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004205487A (ja) * 2002-11-01 2004-07-22 Tokyo Electron Ltd プローブカードの固定機構
JP2006108456A (ja) * 2004-10-07 2006-04-20 Japan Electronic Materials Corp プローブ装置
JP2007294489A (ja) * 2006-04-20 2007-11-08 Mitsumi Electric Co Ltd 半導体装置の検査方法
JP2008082912A (ja) * 2006-09-28 2008-04-10 Micronics Japan Co Ltd 電気的接続装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009133722A (ja) * 2007-11-30 2009-06-18 Tokyo Electron Ltd プローブ装置
TWI414793B (zh) * 2009-09-15 2013-11-11 Mpi Corp High frequency probe card

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004205487A (ja) * 2002-11-01 2004-07-22 Tokyo Electron Ltd プローブカードの固定機構
JP2006108456A (ja) * 2004-10-07 2006-04-20 Japan Electronic Materials Corp プローブ装置
JP2007294489A (ja) * 2006-04-20 2007-11-08 Mitsumi Electric Co Ltd 半導体装置の検査方法
JP2008082912A (ja) * 2006-09-28 2008-04-10 Micronics Japan Co Ltd 電気的接続装置

Also Published As

Publication number Publication date
KR20140054380A (ko) 2014-05-08
KR101569303B1 (ko) 2015-11-13
JPWO2013190844A1 (ja) 2016-02-08
WO2013190844A1 (ja) 2013-12-27
TWI513984B (zh) 2015-12-21
TW201405131A (zh) 2014-02-01

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