JP5800258B2 - 素子製造方法および素子製造装置 - Google Patents

素子製造方法および素子製造装置 Download PDF

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Publication number
JP5800258B2
JP5800258B2 JP2014156551A JP2014156551A JP5800258B2 JP 5800258 B2 JP5800258 B2 JP 5800258B2 JP 2014156551 A JP2014156551 A JP 2014156551A JP 2014156551 A JP2014156551 A JP 2014156551A JP 5800258 B2 JP5800258 B2 JP 5800258B2
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lid member
intermediate product
pair
film
lid
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JP2014156551A
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Japanese (ja)
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JP2015062171A (ja
JP2015062171A5 (cg-RX-API-DMAC10.html
Inventor
隆 佳 二連木
隆 佳 二連木
田 利 彦 武
田 利 彦 武
島 宏 佳 中
島 宏 佳 中
村 祐 行 西
村 祐 行 西
幡 勝 也 小
幡 勝 也 小
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Priority to JP2014156551A priority Critical patent/JP5800258B2/ja
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Publication of JP2015062171A5 publication Critical patent/JP2015062171A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Electromagnetism (AREA)
JP2014156551A 2013-08-20 2014-07-31 素子製造方法および素子製造装置 Expired - Fee Related JP5800258B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014156551A JP5800258B2 (ja) 2013-08-20 2014-07-31 素子製造方法および素子製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013170723 2013-08-20
JP2013170723 2013-08-20
JP2014156551A JP5800258B2 (ja) 2013-08-20 2014-07-31 素子製造方法および素子製造装置

Related Child Applications (1)

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JP2015170580A Division JP2016027571A (ja) 2013-08-20 2015-08-31 素子製造方法および素子製造装置

Publications (3)

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JP2015062171A JP2015062171A (ja) 2015-04-02
JP2015062171A5 JP2015062171A5 (cg-RX-API-DMAC10.html) 2015-05-14
JP5800258B2 true JP5800258B2 (ja) 2015-10-28

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JP2014156551A Expired - Fee Related JP5800258B2 (ja) 2013-08-20 2014-07-31 素子製造方法および素子製造装置
JP2015170580A Pending JP2016027571A (ja) 2013-08-20 2015-08-31 素子製造方法および素子製造装置

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JP2015170580A Pending JP2016027571A (ja) 2013-08-20 2015-08-31 素子製造方法および素子製造装置

Country Status (5)

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US (1) US9592572B2 (cg-RX-API-DMAC10.html)
JP (2) JP5800258B2 (cg-RX-API-DMAC10.html)
KR (1) KR20160044463A (cg-RX-API-DMAC10.html)
CN (1) CN105409329B (cg-RX-API-DMAC10.html)
WO (1) WO2015025692A1 (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012210484B4 (de) * 2012-06-21 2017-02-02 Osram Oled Gmbh Verfahren für ein schlüssiges Verbinden eines organischen optoelektronischen Bauelementes mit einem Verbindungsstück, Verbindungsstruktur für ein kraftschlüssiges Verbinden und optoelektronische Bauelementevorrichtung
TWI634685B (zh) * 2017-05-25 2018-09-01 機光科技股份有限公司 有機發光裝置
FR3073324B1 (fr) * 2017-11-08 2019-10-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede utilisant un laser pour le soudage entre deux materiaux metalliques ou pour le frittage de poudre(s), application a la realisation de plaques bipolaires pour piles pemfc
JP7520486B2 (ja) * 2019-04-25 2024-07-23 大日本印刷株式会社 有機エレクトロルミネッセンス表示装置及びその製造方法
CN110571361B (zh) 2019-09-17 2022-09-30 合肥鑫晟光电科技有限公司 有机发光显示面板及制作方法、显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004079325A (ja) * 2002-08-16 2004-03-11 Fuji Photo Film Co Ltd 有機電界発光素子の製造方法及び転写材料
JP4151421B2 (ja) * 2003-01-23 2008-09-17 セイコーエプソン株式会社 デバイスの製造方法
KR100635579B1 (ko) * 2004-12-20 2006-10-17 삼성에스디아이 주식회사 레이저 열 전사장치, 상기 장치를 사용하는 레이저 열전사법 및 상기 장치를 사용하는 유기전계발광표시장치제조방법
JP4340982B2 (ja) * 2007-05-18 2009-10-07 ソニー株式会社 表示装置の製造方法
CN101803008B (zh) * 2007-09-07 2012-11-28 株式会社半导体能源研究所 半导体装置及其制造方法
JP2009087996A (ja) 2007-09-27 2009-04-23 Dainippon Printing Co Ltd 有機半導体素子、有機半導体素子の製造方法、有機トランジスタアレイ、およびディスプレイ
JP2011009498A (ja) 2009-06-26 2011-01-13 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子
JP2011113936A (ja) * 2009-11-30 2011-06-09 Fujifilm Corp 光熱変換シート及び有機電界発光装置の製造方法
JP2011151195A (ja) 2010-01-21 2011-08-04 Dainippon Printing Co Ltd 有機薄膜太陽電池およびその製造方法
WO2014157658A1 (ja) * 2013-03-29 2014-10-02 大日本印刷株式会社 素子製造方法および素子製造装置
JP6164529B2 (ja) * 2013-03-29 2017-07-19 大日本印刷株式会社 素子製造方法および素子製造装置

Also Published As

Publication number Publication date
KR20160044463A (ko) 2016-04-25
WO2015025692A1 (ja) 2015-02-26
JP2015062171A (ja) 2015-04-02
CN105409329B (zh) 2017-10-24
CN105409329A (zh) 2016-03-16
US9592572B2 (en) 2017-03-14
US20160207146A1 (en) 2016-07-21
JP2016027571A (ja) 2016-02-18

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