JP5795157B2 - Scrubber - Google Patents

Description

  The present invention relates to a scrubber, and more particularly, to a scrubber suitably used in a semiconductor device manufacturing process.

  As an apparatus for removing soluble gases in air, Patent Document 1 discloses an apparatus having a structure in which a spray nozzle is installed in a chamber through which air flows and water is sprayed into the chamber from the spray nozzle.

  In addition, a microbubble generator is used to generate microbubbles in the water stream, and the water stream containing the microbubbles is sprayed as water fine particles in the airflow with a spray nozzle, thereby removing a volatile organic compound contained in the airflow. Is disclosed in Patent Document 2.

Japanese Patent Laid-Open No. 10-309432 JP 2009-297698 A

  In the apparatus of Patent Document 1, since the spray is a water droplet, and air passes between the water droplets, the removal efficiency of the soluble gas in the air is not good. Further, it is not sufficient to increase the contact probability as in Patent Document 1.

  A main object of the present invention is to provide a scrubber that has a high contact probability between a gas to be processed and a liquid and can improve the removal rate of the object to be processed in the gas to be processed by the liquid.

According to the present invention,
A chamber;
A gas inlet means for introducing a gas to be processed including an object to be processed into the chamber from the first opening, the gas chamber having a first opening in the chamber;
A gas discharge means having a second opening in the chamber, and discharging the gas to be processed after processing from the chamber through the second opening;
A water supply port for supplying liquid into the chamber and storing the liquid in the chamber;
A drain port provided at a position higher than the water supply port to keep the liquid level of the liquid supplied into the chamber constant;
A continuous film made of a liquid capable of removing the object to be processed is formed in the chamber across the first opening and the second opening, and the gas to be processed is supplied to the chamber together with the film. A liquid film forming means that abuts against the liquid surface of the liquid stored in the liquid and stirs the liquid to be treated while foaming the gas to be treated;
Bei to give a,
A scrubber is provided in which the second opening is disposed in a space formed between the continuous film and the liquid surface .

  ADVANTAGE OF THE INVENTION According to this invention, the scrubber which has a high contact probability with to-be-processed gas and a liquid and can improve the removal rate by the liquid of the to-be-processed object in to-be-processed gas is provided.

FIG. 1 is a schematic configuration diagram for explaining an organic peeling facility according to a preferred embodiment of the present invention. FIG. 2 is a schematic vertical cross-sectional view for explaining a scrubber of an organic peeling facility according to a preferred embodiment of the present invention. 3 is a schematic cross-sectional view taken along line AA of FIG.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  Referring to FIG. 1, an organic peeling apparatus 1 according to a preferred embodiment of the present invention includes a processing chamber 10 for processing a semiconductor wafer, a cooling trap 20, and a scrubber 100. The processing chamber 10 and the cooling trap 20 are connected by a pipe 12, and the cooling trap 20 and the scrubber 100 are connected by a pipe 131. Waste liquid pipes 14 and 16 are connected to the processing chamber 10 and the cooling trap 20, respectively.

  For example, a semiconductor wafer coated with a resist is carried into the processing chamber 10, a stripping solution such as a strong alkaline solution is introduced into the processing chamber 10, and the resist is stripped, used, and unused. The stripping solution is discarded via the waste solution pipe 14.

Thereafter, isopropyl alcohol (IPA) and nitrogen (N ₂ ) gas are introduced into the processing chamber 10 to clean and dry the semiconductor wafer. Since the inside of the processing chamber 10 is maintained at about 50 to 60 ° C., the IPA is vaporized, and the exhaust gas containing the vaporized IPA is sent to the cooling trap 20 via the pipe 12.

  The cooling trap 20 is a water-cooled trap, and has a structure in which vaporized IPA is attached to the pipe when exhaust gas containing IPA comes into contact with the pipe through which the cooling water has flowed. The IPA adhering to the pipe is discarded through the waste liquid pipe 16. After processing with this cooling trap, about 500 PPM of IPA is contained in the exhaust gas containing IPA.

  The exhaust gas containing IPA is then sent to the scrubber 100 via the pipe 13, and the scrubber 100 performs IPA removal processing.

Next, the scrubber 100 will be described with reference to FIGS.
The scrubber 100 includes a chamber 110, a pump 141, a sealed chiller 151, and an ozone generator 160.

  The chamber 110 includes a top plate 101, a side wall 102, and a bottom plate 103, and has a sealed structure.

  An exhaust gas inlet 131 is provided at the upper part of the side wall 102 of the chamber 110, and exhaust gas containing IPA sent from the cooling trap 20 through the pipe 13 is introduced into the chamber 110 from the exhaust gas inlet 131. Is done. An opening 132 at the tip of the exhaust gas inlet 131 opens into the chamber 110.

  An ozone ejection port 133 is provided below the exhaust gas introduction port 131 at the upper part of the side wall 102 of the chamber 110, and ozone generated by the ozone generator 160 is introduced into the chamber 110 from the ozone ejection port 133. .

  A water supply port 105 is provided at the lower part of the side wall 102 of the chamber 110, and a drain port 106 is provided in the middle of the side wall 102 of the chamber 110. Water 108 introduced into the chamber 110 from the water supply port 105 is drained. It is stored in the chamber 110 up to the height of the mouth 106, and when it becomes higher than the height of the drainage port 106, it is drained from the drainage port 106 to the outside of the chamber 110.

  Pipes 153 and 157 connected to the sealed chiller 151 are connected to the bottom plate 103 of the chamber 110. The water 108 stored in the chamber 110 is sent to the sealed chiller 151 via the pipe 153 and cooled by the sealed chiller 151, and the cooled water 108 is returned to the chamber 110 via the pipe 157. The water 108 stored in the chamber 110 circulates between the chamber 110 and the closed chiller 151.

  A jet nozzle 111 is vertically provided in the bottom plate 103 of the chamber 110 so as to penetrate the bottom plate 103. The tip of the jet nozzle 111 is located at a position higher than the drain outlet 106, that is, at a position higher than the water surface of the stored water 108. The jet nozzle 111 is provided through the central portion of the bottom plate 103.

  A pipe 143 connected to the pump 141 is connected to the side wall 102 of the chamber 110. The pipe 143 is connected to the side wall 102 of the chamber 110 at a height position higher than the water supply port 105 and lower than the drain port 106. The pump 141 is connected to the lower end of the jet nozzle 111 via a pipe 145. The water 108 stored in the chamber 110 is sent to the pump 141 via the pipe 143, pressurized by the pump 141, sent to the jet nozzle 111, and ejected vertically upward from the tip of the jet nozzle 111.

  A reflective plate 121 is attached to the top plate 101 of the chamber 110. The reflector 121 is conical and has an opening at the bottom. The top of the conical reflector 121 is attached to the central portion of the top plate 101 of the chamber 110. The top of the conical reflector 121 is located directly above the jet nozzle 111. The squirting water 123 ejected vertically upward from the tip of the jet nozzle 111 hits the top of the conical reflector 121 and moves along the inner side surface of the conical reflector 121, thereby forming a conical water curtain 125. To do. The tip of the water curtain 125 forms a continuous water film until it hits the surface of the water 108 stored in the chamber 110. The conical reflector 121 functions as a guide member that guides the formation direction of the water curtain 125.

  An exhaust pipe 113 is provided through the side wall 102 of the chamber 110. The exhaust pipe 113 is provided through the side wall 102 of the chamber 110 at a height higher than the water supply port 105 and lower than the drain port 106. The front end portion 115 of the exhaust pipe 113 is located at a position higher than the drain outlet 106, that is, a position higher than the water surface of the stored water 108. The distal end portion 115 of the exhaust pipe 113 is provided so as to be inside the water curtain 125. The distal end of the distal end portion 115 of the exhaust pipe 113 is bent downward (bottom plate 103 side), and the opening 116 at the distal end of the distal end portion 115 of the exhaust pipe 113 faces downward (bottom plate 103 side). Yes. An opening 116 at the distal end of the distal end portion 115 of the exhaust pipe 113 opens into the chamber 110. The opening 116 at the distal end of the distal end portion 115 of the exhaust pipe 113 opens into a space formed between the water curtain 125 and the water surface of the stored water 108. The opening 132 at the tip of the exhaust gas inlet 131 opens into a space separated by a water curtain 125 from a space formed between the water curtain 125 and the water surface of the stored water 108.

  In the scrubber 100 described above, the water 108 stored in the scrubber 100 is pressurized with the pump 141, and the water 123 ejected vertically upward from the tip of the jet nozzle 111 is applied to the top of the conical reflector 121, A conical water curtain 125 is formed. Since the tip of the water curtain 125 forms a continuous water film until it hits the surface of the water 108 stored in the chamber 110, the exhaust gas containing IPA introduced from the exhaust gas inlet 131 is 100% water curtain 125 is poured into the water flow, stirred while foaming in the stored water 108, and further touches the water spray generated in the water curtain 125, so that IPA in the exhaust gas can be easily dissolved in water. it can. Note that the water curtain 125 without a cut cannot be formed by sucking the foamed air from the pump 141, so care must be taken in the mounting height of the drain port 106 and the pipe 143 connected to the pump 141.

  In addition, ozone generated by the ozone generator 160 is taken into the chamber 110 through the ozone outlet 133 to react with and decompose organic components in the chamber 110 (including IPA once dissolved). Further, the water 108 stored in the sealed chiller 151 is set to a temperature lower than the temperature of the exhaust gas introduced from the exhaust gas inlet 131 so as not to volatilize the IPA component in the stored water 108. Adjust the temperature and circulate.

  The exhaust gas containing IPA introduced from the exhaust gas inlet 131 by the water curtain 125 is located at a location where the front end portion 115 of the exhaust pipe 113 is cut off, so that the exhaust gas after the IPA is removed. Is discharged from the exhaust pipe 113.

  In the present embodiment, the water curtain 125 forms a continuous water film until the tip of the water curtain 125 hits the water surface of the water 108 stored in the chamber 110, and the exhaust gas containing IPA is exhausted. Since it is introduced from the gas inlet 131 to the outside of the water curtain 125 and the front end portion 115 of the exhaust pipe 113 is provided inside the water curtain 125, the contact probability between the exhaust gas containing IPA and water. The removal rate of IPA in exhaust gas by water can be improved.

  In the above, the removal target by the scrubber is IPA in the exhaust gas, and the IPA is removed using water. However, the removal target is not limited to IPA, and the removal liquid is not limited to water. Any gas can be used as long as it is removed by dissolving it in the solution.

  While various typical embodiments of the present invention have been described above, the present invention is not limited to these embodiments. Accordingly, the scope of the invention is limited only by the following claims.

DESCRIPTION OF SYMBOLS 100 Scrubber 101 Top plate 102 Side wall 103 Bottom plate 105 Water supply port 106 Drainage port 108 Water 110 Chamber 111 Jet nozzle 113 Exhaust pipe 115 End part 116 Opening 121 Reflector 123 Spout water 125 Water curtain 131 Exhaust gas introduction port 132 Opening 133 Ozone ejection Port 141 Pumps 143, 145, 153, 157 Piping 151 Sealed chiller 160 Ozone generator

Claims (5)

A chamber;
A gas inlet means for introducing a gas to be processed including an object to be processed into the chamber from the first opening, the gas chamber having a first opening in the chamber;
A gas discharge means having a second opening in the chamber, and discharging the gas to be processed after processing from the chamber through the second opening;
A water supply port for supplying liquid into the chamber and storing the liquid in the chamber;
A drain port provided at a position higher than the water supply port to keep the liquid level of the liquid supplied into the chamber constant;
A continuous film made of a liquid capable of removing the object to be processed is formed in the chamber across the first opening and the second opening, and the gas to be processed is supplied to the chamber together with the film. A liquid film forming means that abuts against the liquid surface of the liquid stored in the liquid and stirs the liquid to be treated while foaming the gas to be treated;
Bei to give a,
A scrubber in which the second opening is disposed in a space formed between the continuous film and the liquid surface .   The liquid film forming means includes a pressurizing means for pressurizing the liquid, an ejecting means for ejecting the pressurized liquid, and a continuous film of the liquid applied by the liquid ejected by the ejecting means. The scrubber according to claim 1, further comprising a guide member that guides a forming direction to be formed.   3. The scrubber according to claim 2, wherein the guide member is a guide member that guides a liquid forming direction so that a continuous film of the liquid hits a liquid surface of the liquid stored in the chamber. The second opening of the processing gas discharge means opens to a first space formed between the continuous film of the liquid and the liquid level of the liquid stored in the chamber,
4. The scrubber according to claim 3, wherein the first opening of the gas to be treated introducing means opens into a second space separated from the first space by a continuous film of the liquid.   The scrubber according to any one of claims 1 to 4, wherein the object to be processed is a substance that is soluble in the liquid.