JP5793662B2 - Light source for illumination - Google Patents

Description

  The present invention relates to an illumination light source using a semiconductor light emitting element, and more particularly to an illumination light source that controls lighting by receiving a radio signal from the outside.

  In recent years, as an alternative to an incandescent bulb, a bulb-shaped illumination light source using a semiconductor light emitting element such as an LED (Light Emitting Diode) is becoming widespread. Further, some illumination light sources have a function of receiving lighting control by receiving a wireless signal from the outside (for example, Patent Document 1).

JP 2011-9717 A

  By the way, in such an illumination light source, an antenna unit for transmitting and receiving a radio signal is provided in the illumination light source. However, it is desirable that the antenna unit is arranged at a position where the radio signal can be transmitted and received with high sensitivity. . In particular, when used as a light source for a lighting fixture embedded in an opening provided in the ceiling, so-called downlight lighting fixture, the illumination light source itself must be located in a recessed area in the opening provided in the ceiling. Therefore, it is difficult for the wireless signal to reach the illumination light source in the opening. In such a case, it is desired that radio signals can be transmitted and received with higher sensitivity. At the same time, it is desirable that the light distribution characteristics of the illumination light source are not impaired as much as possible.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination light source that can transmit and receive wireless signals with high sensitivity and suppresses adverse effects on light distribution characteristics as much as possible.

  In order to achieve the above object, an illumination light source according to the present invention is an illumination light source that controls lighting by receiving a wireless signal from the outside, and a light-emitting portion including one or more light-emitting elements is provided on the front surface of the mounting substrate. Each of the main emission directions are arranged in a plane, the globe covers the front of the mounting board, and an antenna unit that transmits and receives the radio signal is located in a region in front of the mounting board in the globe. In addition, the mounting board is supported by a support tool so as not to come into contact with the globe from an area where the light emitting part is present when the mounting substrate is viewed in plan.

  According to the configuration of the illumination light source according to the present invention, the antenna unit for transmitting and receiving radio signals is arranged in a region in front of the mounting substrate in the globe, so that the antenna unit is arranged behind the mounting substrate. Compared with the case where it is, the radio signal can be transmitted and received with high sensitivity.

  In addition, the antenna unit is arranged in an inner region from a region where the light emitting unit exists when the mounting substrate is viewed in plan. In such a region, since the amount of light emitted from the light emitting unit is larger than that in the region outside the region where the light emitting unit exists, the adverse effect on the light distribution characteristics is not a problem. Furthermore, since the antenna part is arranged so as not to contact the globe, the antenna part is in contact with the globe, especially compared to the case where the antenna part is arranged so as to contact the globe corresponding to the front end of the illumination light source. Thus, adverse effects on the light distribution characteristics can be suppressed.

  Here, the “region forward from the front surface of the mounting substrate” includes the front surface of the mounting substrate. In addition, the “region inside the region where the light emitting part exists” includes the boundary between the region where the light emitting unit exists and the region where the light emitting unit does not exist.

  As described above, according to the present invention, it is possible to provide an illumination light source that can transmit and receive a radio signal with high sensitivity and suppress an adverse effect on light distribution characteristics as much as possible.

It is a partially broken perspective view which shows the structure of the light source 1 for illumination which concerns on 1st Embodiment. It is a cross-sectional arrow view along the AA line shown in FIG. It is a top view which shows the structure of the semiconductor light-emitting module 2 which concerns on 1st Embodiment. It is a figure for demonstrating the position of the antenna part 14 in the globe 5. FIG. It is a circuit diagram which shows the circuit structure of the circuit unit 6 which concerns on 1st Embodiment. It is a top view which shows the layout of a circuit unit typically. It is a partially broken perspective view which shows the structure of the light sources 1A and 1B for illumination which concern on the modification of 1st Embodiment. It is a partially broken perspective view which shows the light source 1C for illumination which concerns on the modification of 1st Embodiment. It is a cross-sectional arrow view along the AA line shown in FIG. It is a partially broken perspective view which shows the structure of the light source 40 for illumination which concerns on 2nd Embodiment. It is a cross-sectional arrow view along the AA line shown in FIG. It is an expanded sectional view which shows the part enclosed with the dashed-two dotted line in FIG. It is a partial cross section arrow view along the BB line shown in FIG. It is a partially broken perspective view which shows the light source 60 for illumination which concerns on 3rd Embodiment. It is sectional drawing which shows the structure of the light source 60 for illumination which concerns on 3rd Embodiment. It is an expanded sectional view which shows the part enclosed with the dashed-two dotted line in FIG. It is sectional drawing which shows the structure of the light source 70 for illumination which concerns on 4th Embodiment. It is a partial cross section figure which shows the structure of illumination light source 70A, 70B which concerns on the modification of 4th Embodiment. It is the schematic which shows the structure of the illuminating device 501 provided with the light source for illumination which concerns on this invention. It is sectional drawing which shows the structure of the light source for illumination which concerns on a modification. It is sectional drawing which shows the structure of the light source for illumination which concerns on a modification. It is sectional drawing which shows the structure of the light source for illumination which concerns on a modification.

DESCRIPTION OF EMBODIMENTS Embodiments for carrying out the present invention will be described in detail with reference to the drawings.
<< First Embodiment >>
[Outline]
FIG. 1 is a partially broken perspective view showing the structure of an illumination light source 1 according to the first embodiment. FIG. 2 is a cross-sectional arrow view taken along the line AA shown in FIG. In FIG. 2, the alternate long and short dash line drawn in the vertical direction of the drawing shows the lamp axis J of the illumination light source, the upper side of the drawing being the front of the illumination light source 1 and the lower side of the drawing being the rear of the illumination light source 1. It is. In FIG. 2, the circuit unit 6 is not a cross-sectional view.

As shown in FIGS. 1 and 2, the illumination light source 1 includes a semiconductor light emitting module 2, a base 3, a case 4, a globe 5, a circuit unit 6, a circuit holder 7, and a base 8 as main components.
FIG. 3 is a plan view showing the structure of the semiconductor light emitting module 2 according to the first embodiment. The AA line in FIG. 3 corresponds to the AA line shown in FIG. Hereinafter, the configuration of the illumination light source 1 will be described with reference to FIGS.

<Semiconductor light emitting module>
As shown in FIG. 3, the semiconductor light emitting module 2 includes a semiconductor light emitting element 9, a mounting substrate 10 on which the semiconductor light emitting element 9 is mounted, and a sealing body 11 that covers the semiconductor light emitting element 9 on the mounting substrate 10. The semiconductor light emitting element 9 is planarly arranged in a state in which the main emission direction is directed to the front of the illumination light source 1 (above the paper). The light emitting part of the illumination light source 1 is composed of a semiconductor light emitting element 9 and a sealing body 11. In the present embodiment, the semiconductor light emitting element is described as an LED, but the semiconductor light emitting element may be, for example, an LD (laser diode) or an EL element (electric luminescence element).

  As shown in FIG. 3, the mounting substrate 10 includes a substantially annular element mounting portion 10 c having a substantially circular hole 10 a at the center, and from one place on the inner periphery of the element mounting portion 10 c toward the center of the hole 10 a. And a tongue piece portion 10d extending. A connector 17 to which the wiring 16 (FIG. 2) of the circuit unit 6 is connected is provided on the rear surface of the tongue piece 10d. By connecting the wiring 16 to the connector 17, the semiconductor light emitting module 2 and the circuit unit 6 are connected. Are electrically connected.

  For example, 32 semiconductor light emitting elements 9 are annularly mounted on the front surface of the element mounting portion 10c. Specifically, two semiconductor light emitting elements 9 arranged along the radial direction of the element mounting portion 10c are set as one set, and 16 sets are arranged at equal intervals along the circumferential direction of the element mounting portion 10c. It is arranged in a ring. In the present application, the term “annular” includes not only a circular ring but also a polygonal ring such as a triangle, a quadrangle, and a pentagon. Therefore, the semiconductor light emitting element 9 may be mounted in an elliptical or polygonal annular shape, for example. Further, the semiconductor light emitting element 9 does not have to be oriented so that all of the semiconductor light emitting elements 9 have their main emission direction directed to the front of the illumination light source 1, and a part of the semiconductor light emitting element 9 is inclined with respect to the lamp axis J. It may be mounted in a posture toward Thereby, controllability of light distribution is further improved, and more preferable light distribution can be obtained.

  The semiconductor light emitting elements 9 are individually sealed by a substantially rectangular parallelepiped sealing body 11 for each set. Therefore, the total number of the sealing bodies 11 is 16. The longitudinal direction of each sealing body 11 coincides with the radial direction of the element mounting portion 10c, and is arranged radially about the lamp axis J when the mounting substrate 10 is viewed in plan. In this specification, “when the mounting substrate is viewed in plan” means that the mounting substrate is viewed from the front side along the lamp axis J.

  The sealing body 11 is mainly made of a translucent material, but when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 9 into a predetermined wavelength, the wavelength of light is added to the translucent material. A wavelength conversion material for converting is mixed. As the translucent material, for example, a silicone resin can be used, and as the wavelength conversion material, for example, phosphor particles can be used. In the present embodiment, a semiconductor light emitting element 9 that emits blue light and a sealing body 11 formed of a translucent material mixed with phosphor particles that convert the wavelength of blue light into yellow light are employed. Part of the blue light emitted from the semiconductor light emitting element 9 is wavelength-converted into yellow light by the sealing body 11, and white light generated by mixing the unconverted blue light and the converted yellow light is emitted from the semiconductor. The light is emitted from the module 2.

  When the illumination color of the illumination light source 1 is changed based on a radio signal, the semiconductor light emitting module 2 is, for example, a semiconductor light emitting element 9 that emits ultraviolet light and each color phosphor that emits light in three primary colors (red, green, and blue). This can be realized by using a combination of particles. Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.

<Base>
Returning to FIG. 2, the base 3 has, for example, a substantially cylindrical shape having a substantially columnar through-hole 18, and the cylinder axis is arranged in a posture that matches the lamp axis J. Accordingly, the through hole 18 penetrates in the front-rear direction, and the front surface 3a and the rear surface 3b of the base 3 shown in FIG. 2 are both substantially circular planes. Then, the semiconductor light emitting module 2 is mounted on the front surface 3a of the base 3, whereby the semiconductor light emitting elements 9 are arranged in a plane with their main emission directions facing forward. As described above, since all the semiconductor light emitting elements 9 are arranged in a plane on the front surface 3 a of the base 3, the semiconductor light emitting elements 9 can be easily mounted on the base 3. Simple.

  The front surface 3a is not limited to a substantially annular shape, and may have any shape. Further, the entire front surface 3a is not necessarily flat if the semiconductor light emitting element can be arranged in a plane. Furthermore, the rear surface 3b is not limited to a flat surface.

The semiconductor light emitting module 2 is fixed to the base 3 using screws, for example. The semiconductor light emitting module 2 may be fixed to the base 3 by adhesion or engagement.
The base 3 is made of a material having high thermal conductivity. Examples of such a material include Al, Ag, Au, Ni, Rh, Pd or an alloy made of two or more of them, or Cu and Ag. Metal materials such as alloys are conceivable. Since such a metal material has good thermal conductivity, heat generated in the semiconductor light emitting module 2 can be efficiently conducted to the case 4.

Furthermore, since the through hole 18 is provided in the base 3, the light source 1 for illumination can be reduced in weight by this.
<Case>
The case 4 has, for example, a cylindrical shape that is open at both ends and has a diameter reduced from the front to the rear. As shown in FIG. 2, the base 3 and the opening side end 5b of the globe 5 are accommodated in the front end 4b of the case 4, and the case 4 is fixed to the base 3 by caulking, for example. Yes. The case 4 may be fixed to the base 3 by pouring an adhesive into the space 38 surrounded by the case 4, the base 3 and the globe 5.

  The outer peripheral edge of the rear side end of the base 3 has a tapered shape in accordance with the shape of the inner peripheral surface 4 a of the case 4. Since the tapered surface 3 c is in surface contact with the inner peripheral surface 4 a of the case 4, the heat transmitted from the semiconductor light emitting module 2 to the base 3 is more easily conducted to the case 4. The heat generated in the semiconductor light emitting element 9 is conducted to the base 8 mainly through the base 3 and the case 4 and further through the small diameter portion 31 of the circuit holder 7, and from the base 8 to the lighting fixture (not shown) side. Heat is dissipated.

  The case 4 is a cylindrical member made of a material having high heat radiation, and the base 3 is provided on the globe 5 side. As the material having high thermal conductivity, for example, metal materials listed in the base 3 can be used. By doing in this way, the heat propagated to the case 4 can be efficiently propagated to the base 8 side. The material of the case 4 is not limited to a metal material, and may be a resin having high thermal conductivity, for example.

<Glove>
In the present embodiment, the globe 5 has a shape simulating a bulb of an A-type bulb that is a general bulb shape, and the opening side end portion 5 b of the globe 5 is press-fitted into the front side end portion 4 b of the case 4. Thus, the semiconductor light emitting module 2 is fixed to the case 4 in a state of covering the front of the mounting substrate 10. The envelope of the illumination light source 1 includes a globe 5 and a case 4.

  The shape of the globe 5 is not limited to the shape imitating a bulb of an A-type bulb, and may be any shape. The globe 5 may be fixed to the case 4 with an adhesive or the like.

  The inner surface 5a of the globe 5 is subjected to a diffusion treatment for diffusing light emitted from the semiconductor light emitting module 2, for example, a diffusion treatment using silica, white pigment, or the like. Light incident on the inner surface 5 a of the globe 5 passes through the globe 5 and is extracted to the outside of the globe 5.

<Circuit unit>
The circuit unit 6 transmits and receives a wireless signal from the outside, and controls lighting of the semiconductor light emitting element based on the wireless signal. Here, “lighting control” includes, for example, lighting, extinguishing, dimming, illumination color change, and the like.

  As shown in FIGS. 1 and 2, the circuit unit 6 includes a circuit board 12, various elements 13 arranged on the circuit board 12, an antenna unit 14, a rectifier circuit 20, a wireless control unit 21, and a light emitting element control unit. 37, a power source 84 for the wireless control unit, an oscillator 85 that generates a clock signal for controlling the wireless control unit 21, the light emitting element control unit 37, and the like. In FIGS. 1 and 2, only a part of the elements is denoted by “13”. The circuit unit 6 is accommodated in the circuit holder 7 and is fixed to the circuit holder 7 by, for example, screwing, adhesion, engagement, or the like.

  As shown in FIG. 2, the circuit unit 6 and the base 8 are electrically connected by wiring 15. Further, the circuit unit 6 and the semiconductor light emitting module 2 are electrically connected through a connector 17 by a wiring 16.

  Although not shown, a wiring pattern is formed on the circuit board 12 by patterning, for example, a copper foil, and this wiring pattern serves as a feeding path to the antenna unit 14. The circuit board 12 of the circuit unit 6 is long, and at least a part of the circuit board 12 from one end to the other end in the longitudinal direction is a hole (through hole) 10a of the mounting substrate 10 (FIG. 3). ). As a result, the circuit board 12 is arranged so that its main surface is parallel to the lamp axis J. By doing in this way, since the circuit unit 6 can be stored more compactly in the circuit holder 7, the diameter of the circuit holder 7 can be reduced. As a result, it is possible to reduce the size of the illumination light source 1. Further, a part of the circuit unit 6 is disposed in the through hole 18 of the base 3 and in the globe 5 through the through hole 18. By doing in this way, the space for accommodating the circuit unit 6 on the globe 5 side with respect to the base 3 can be reduced. Therefore, the distance between the base 3 and the base 8 can be shortened, which is advantageous for further miniaturization of the illumination light source 1.

  Further, in order to suppress a decrease in the amount of light caused by the light emitted from the semiconductor light emitting module 2 entering the circuit unit 6, the circuit unit 6 is subjected to a coating process of a high light reflectance material by dipping, spraying, brushing, or the like. Is desirable.

(Antenna part)
The antenna unit 14 has a function of transmitting and receiving external radio signals. As the antenna unit 14, for example, an antenna of a size that can be accommodated in the globe 5 such as a single type, a monopole type, a loop type, a diversity, a film antenna, or the like is used. Furthermore, it is desirable that the antenna directivity is omnidirectional.

  As shown in FIGS. 1 and 2, the antenna unit 14 is supported by a support tool in a region in front of the front surface 10 e of the mounting substrate 10 of the semiconductor light emitting module 2 in the globe 5. The antenna unit 14 is supported by being mounted on the circuit board 12, and the support tool in the present embodiment is the circuit board 12. According to such a configuration, when the antenna unit 14 is arranged behind the mounting substrate 10, for example, compared with the case where the antenna unit 14 is arranged in the case 4 or the circuit holder 7, radio signals are transmitted and received with high sensitivity. it can. Therefore, even when the illumination light source 1 is used as a light source of a downlight luminaire, a wireless signal can be efficiently transmitted and received. The “region in front of the front surface 10 e of the mounting substrate 10” includes the front surface 10 e of the mounting substrate 10.

  FIG. 4 is a diagram for explaining the position of the antenna unit 14 in the globe 5. 4A is a part of a cross-sectional view taken along the line AA of the illumination light source 1, and FIG. 4B is a plan view showing the structure of the semiconductor light emitting module 2. In each figure, the position of the semiconductor light emitting module 2 is shown correspondingly. The position of the antenna unit 14 will be described in more detail with reference to FIG. In FIG. 4, the components (element 13, wireless control unit 21, wireless control unit power supply 84, light emitting element control unit 37, oscillator 85, etc.) other than the antenna unit 14 mounted on the circuit board 12 are illustrated. Is omitted.

  As shown in FIG. 4B, when the mounting substrate 10 is viewed in plan, the antenna unit 14 is located in an inner region from the region 39 where the light emitting unit exists. That is, this region corresponds to the region (X) in the globe 5 indicated by dot hatching, as described with reference to FIG. In the region (X) in the globe 5, the amount of light emitted from the semiconductor light emitting module 2 compared to the region (region outside the region 39 in FIG. 4B) excluding the region (X) in the globe 5. Therefore, the shadow due to the presence of the antenna unit 14 does not occur so much, and the light distribution characteristics of the illumination light source 1 are not so badly affected.

  In the present embodiment, the antenna unit 14 is arranged so as not to contact the globe 5. If the antenna unit 14 is in contact with the globe 5, a shadow due to the presence of the antenna unit 14 is reflected on the globe 5. In particular, when it comes into contact with the globe 5 in the region (Y) corresponding to the front end of the illumination light source 1 (the vicinity of the globe 5 through which the lamp axis J passes), the adverse effect on the light distribution characteristics is increased. However, in this embodiment, since the antenna unit 14 is arranged so as not to contact the globe 5, the adverse effect on the light distribution characteristics is suppressed as compared with the case where the antenna unit 14 contacts the globe 5. Can do.

  Here, the above-mentioned “region where the light emitting part exists” means the mounting substrate 10 in the light emitting part (consisting of the semiconductor light emitting element 9 and the sealing body 11) when the mounting substrate 10 of the semiconductor light emitting module 2 is viewed in plan. This refers to the area that is formed by connecting the parts near the outer periphery. When a plurality of light emitting portions are arranged in a ring shape as in this embodiment, a region 39 formed by connecting the radially outer portions of the sealing body 11 corresponds to a “region where the light emitting portion exists”. It should be noted that the “inner area from the area where the light emitting part exists” includes the boundary between the area where the light emitting part exists and the area where the light emitting part does not exist.

  In this section, the outline of the external configuration of the circuit unit 6 has been mainly described. Items not described in this section, such as the circuit configuration of the circuit unit 6 (antenna unit 14, rectifier circuit 20, wireless control unit 21, light emitting element control unit 37, wireless control unit power supply 84), circuit board 12 layout, etc. Will be described in detail later.

<Circuit holder>
Returning to FIG. 2, the circuit holder 7 has, for example, a substantially cylindrical shape opened on both sides, and includes a large diameter portion 30 and a small diameter portion 31. The large diameter portion 30 located on the front side accommodates the circuit unit 6 on the base 8 side from the antenna portion 14. On the other hand, the base 8 is fitted on the small diameter portion 31 located on the base 8 side, and the opening 32 on the base 8 side of the circuit holder 7 is thereby closed. The circuit holder 7 is preferably formed of an insulating material such as resin, for example. As the insulating material, for example, a synthetic resin (specifically, polybutylene terephthalate (PBT)) can be used.

  The large diameter portion 30 of the circuit holder 7 is inserted into the through hole 18 of the base 3, and a part of the circuit unit 6 is also inserted into the through hole 18 of the base 3 while being accommodated in the circuit holder 7. Has been. It is desirable to arrange the circuit holder 7 in the illumination light source 1 so as not to contact the base 3 and the mounting substrate 10. By doing in this way, since the heat generated in the semiconductor light emitting module 2 is difficult to propagate to the circuit holder 7 and the circuit holder 7 is unlikely to reach a high temperature, the circuit unit 6 is hardly thermally destroyed.

  The circuit holder 7 is provided with a through hole 53 at a position corresponding to the tongue piece 10 d of the mounting substrate 10. The tip of the tongue piece 10 d is inserted into the circuit holder 7 through the through hole 53, and the connector 17 provided on the tongue piece 10 d is located in the circuit holder 7.

<Base>
The base 8 is a member for receiving electric power from the socket of the lighting fixture when the lighting light source 1 is attached to the lighting fixture. The type of the base 8 is not particularly limited, but an E26 base that is an Edison type is used in this embodiment. The base 8 includes a shell portion 33 having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet portion 35 attached to the shell portion 33 via an insulating portion 34. An insulating member 36 is interposed between the shell portion 33 and the case 4.

[Circuit unit]
<Circuit configuration>
FIG. 5 is a circuit diagram showing a circuit configuration of the circuit unit 6 according to the first embodiment.

As described with reference to FIG. 1, the illumination light source 1 includes the semiconductor light emitting module 2 and a circuit unit 6 that transmits and receives a radio signal and controls the lighting of an LED based on the radio signal.
The semiconductor light emitting module 2 is formed, for example, by connecting four sets of serially connected bodies in which eight LEDs are connected in series in parallel. The semiconductor light emitting module 2 is supplied with electric power from the AC power source 19 via the switching circuit 22 and turns on the LED.

  The circuit unit 6 includes a rectifier circuit 20, a smoothing capacitor C1, a switching circuit 22, a control circuit 23, an antenna unit 14, a radio control unit 21, a radio control unit power supply 84, and a lighting control signal detection unit 24 as main components. Prepare. The input side of the circuit unit 6 is connected to the AC power source 19 via input terminals 26 and 27, and the output side is connected to the semiconductor light emitting module 2 via output terminals 28 and 29.

  When the function of the circuit unit 6 is outlined, the first circuit (lighting circuit) including the rectifier circuit 20, the smoothing capacitor C1, the switching circuit 22, the control circuit 23, and the lighting control signal detector 24 is supplied from the AC power source 19. The AC power is converted into power for lighting the semiconductor light emitting element, and the converted power is output to the semiconductor light emitting element. The second circuit including the antenna unit 14, the radio control unit 21, and the radio control unit power supply 84 performs transmission / reception of radio signals, conversion of radio signals into electric signals, and input / output of the electric signals.

The rectifier circuit 20 full-wave rectifies the AC voltage supplied from the AC power source 19, and the smoothing capacitor C1 smoothes the AC voltage into a DC current.
The switching circuit 22 is a so-called step-down DC-DC converter that converts DC power supplied from the smoothing capacitor C1 into power for lighting the semiconductor light emitting element 9, and includes a switching element 25, a diode D1, and an inductor L1. , Capacitor C2. The semiconductor light emitting module 2 is lit by supplying power from the switching circuit 22.

  The DC-DC converter includes a single forward method, a flyback method, a push-pull method, a half bridge method, a full bridge method, a mag amplifier method, a step-down chopper method, a step-up chopper method, a step-up / step-down chopper method, and the like. In the present embodiment, the step-down chopper method is adopted, but other methods may be adopted.

  The control circuit 23 is connected to the control terminal 25g of the switching element 25. The control circuit 23 performs on / off control of the switching element 25 by giving a signal to the control terminal 25g, and steps down the DC voltage supplied from the smoothing capacitor C1 to a desired voltage. In the present embodiment, a field effect transistor (FET) is used as the switching element 25, the control terminal 25g corresponds to the gate of the FET, and the signal applied to the control terminal 25g corresponds to the gate voltage.

  The antenna unit 14 has a standard corresponding to the radio signal to be used. The radio signal includes a command for controlling lighting of the illumination light source 1, but the frequency of the signal used as the radio signal is not particularly limited. For example, it is possible to use a radio signal in a 2.4 [GHz] frequency band that can be used in the world and is used in a communication device that conforms to the IEEE (Institut of Electrical and Electronics Engineers) 802.15.4 standard. . In addition, there are frequency bands according to regions, in Europe 433.35-434.79 [MHz] and 863-870 [MHz], in Japan 426-429 [MHz], 950-956 [MHz], and in the United States 260-470. Use bands such as [MHz] and 902 to 928 [MHz] are separately secured. IEEE 802.15.4 is a name of a short-range wireless network standard called PAN (Personal Area Network) or W (Wireless) PAN.

  Wireless communication using wireless signals in the above frequency band has a shorter wavelength than conventional infrared communication. Therefore, good communication can be performed even when the line of sight between the transmitter side and the transmitter / receiver side (antenna unit side) of the radio signal is poor.

  Furthermore, in the above-mentioned standard, illumination light sources belonging to a group having the same address and paired with a wireless signal transmitter can communicate with each other without using a transmitter. Therefore, even if the wireless signal cannot be transmitted / received from the transmitter, the transmitted / received illumination light source in the same group can transmit the same command as the wireless signal from the transmitter to the untransmitted / transmitted illumination light source. As a result, the illumination light sources in the group paired with the transmitter are completely controlled. Such a function is effective when it is desired to uniformly control the lighting light source provided over a very wide range, such as when lighting control of a bulky lighting fixture such as a chandelier.

  The wireless control unit 21 generates a lighting control signal for controlling power feeding to the semiconductor light emitting element 9 based on the wireless signal transmitted and received by the antenna unit 14, and outputs the lighting control signal to the control circuit 23 of the light emitting element control unit 37. As the wireless control unit 21, for example, JN5142 or JN5148 manufactured by NXP can be used. The wireless control unit 21 receives power from the wireless control unit power supply 84.

  A radio signal transmitted and received by the antenna unit 14 is input to the first pin of the radio control unit 21. The radio signal input to the first pin of the radio control unit 21 is amplified in the radio control unit 21 and then converted into an electric signal, and finally output from the fourth pin as a lighting control signal. The second pin of the wireless control unit 21 is the ground terminal of the antenna unit 14, the third pin is the ground terminal, the fifth pin is the VDD input terminal, the sixth pin is the high voltage input terminal, the seventh pin and the eighth pin are This is an input / output terminal of the inductor L2.

The lighting control signal detection unit 24 detects the level of the lighting control signal output from the wireless control unit 21, and outputs a signal corresponding to the detected level to the third pin of the light emitting element control unit 37.
An LED driver (corresponding to the light emitting element control unit 37) in which the control circuit 23 and the switching element 25 are sealed in one package can also be used. As such an LED driver, for example, MIP551 manufactured by Panasonic Corporation or SSL2108 manufactured by NXP Corporation can be used.

  The first pin of the light emitting element control unit 37 is a power input terminal. The second pin of the light emitting element control unit 37 is a VDD supply terminal, which is used for operating voltages of the wireless control unit 21 and peripheral elements. A signal corresponding to the level detected by the lighting control signal detector 24 is input to the third pin of the light emitting element controller 37. The light emitting element control unit 37 has a specification that decreases the LED current of the internal oscillation circuit as the level decreases.

  The fourth pin of the light emitting element control unit 37 is connected to the source of the switching element 25 and the ground. The 5th and 6th pins of the light emitting element control unit 37 are the source and drain of the switching element 25, respectively.

<Circuit board layout>
As described with reference to FIGS. 1 and 2, in this embodiment, in order to reduce the size of the illumination light source 1, the circuit board 12 of the circuit unit 6 is arranged so that its main surface is parallel to the lamp axis J. ing. In the above description, it has been described that the heat generated in the semiconductor light emitting module 2 is transmitted to the base 8 side through the case 4. However, since the heat from the semiconductor light emitting module 2 is also conducted to the circuit holder 7, The air is heated. In many cases, since the illumination light source is used with the base 8 side on the upper side (ceiling side), the heated air in the circuit holder 7 moves to the base 8 side by convection.

  Here, among the elements arranged on the circuit board 12, elements that are vulnerable to heat, in particular, the wireless control unit 21 whose operation may be unstable due to heat, are in a region where the temperature in the circuit holder 7 does not increase so much. It is desirable to be arranged. Therefore, it is desirable that the wireless control unit 21 be disposed on the globe 5 side (semiconductor light emitting module 2 side) as much as possible on the circuit board 12. In view of this point, in the present embodiment, various elements 13, a wireless control unit 21, a wireless control unit power supply 84, and a light emitting element control unit 37 are arranged on the circuit board 12 in a layout as shown in FIG. 6. doing.

  FIG. 6 is a plan view schematically showing the layout of the circuit unit. 6A and 6B, the lower side of the paper is the globe 5 side, and the upper side of the paper is the base 8 side. In FIG. 6, only a part of the elements is labeled with “13”.

  In the circuit unit 6 shown in FIG. 6A, the wireless control unit 21 is disposed at the end of the circuit board 12 on the globe 5 side. With such a layout, the thermal load on the wireless control unit 21 can be reduced.

  Further, as shown in FIG. 6A, the first circuit and the second circuit constituting the circuit unit 6 shown in FIG. 5 are all provided on one circuit board. By doing so, the volume occupied by the circuit unit 6 in the illumination light source 1 can be reduced, and the illumination light source can be reduced in size.

  Further, a chip antenna is used for the antenna portion 14 shown in FIG. 6A. However, like the circuit unit 6A shown in FIG. 6B, the antenna portion 14A is formed by patterning a copper foil or the like. It can also be a patterned antenna. By doing in this way, since the antenna part 14A can be formed during the patterning process of the wiring pattern formed on the circuit board 12, the process of mounting the antenna part can be omitted. In addition, since no separate parts are used as the antenna portion, the cost for providing the antenna portion can be reduced.

<< Modification of First Embodiment >>
FIGS. 7A and 7B are partially broken perspective views showing the structures of the illumination light sources 1A and 1B according to the modification of the first embodiment. In the illumination light sources 1A and 1B of the present modification, the difference from the first embodiment is the shape of the sealing body.

  In the first embodiment, as shown in FIG. 3, two semiconductor light emitting elements 9 arranged along the radial direction of the mounting substrate 10 are made into one set, and each set is individually sealed with a sealing body 11. It was stopped. In this modification, for example, all 32 semiconductor light emitting elements are sealed with one sealing body.

  The sealing body 11A shown in FIG. 7A has an annular shape, and the sealing body 11B shown in FIG. 7B has a quadrangular annular shape. In this modification, when the mounting substrate 10 is viewed in plan, the region where the light emitting portion is present is a region on the inner side from the outermost periphery of the sealing bodies 11A and 11B.

  FIG. 8 is a partially broken perspective view showing the structure of an illumination light source 1C according to a modification of the first embodiment. FIG. 9 is a sectional view taken along the line AA shown in FIG. 8 and 9, the same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted. In FIG. 9, the circuit unit 58 is not a cross-sectional view.

  The illumination light source 1C according to this modification includes a semiconductor light emitting module 57, a base 73, a globe 5, a circuit unit 58, a circuit holder 59, a case 4, and a base 8 as main components. In the illumination light source 1C of the present modification, the main differences from the illumination light source 1 according to the first embodiment are the configurations of a semiconductor light emitting module 57, a base 73, a circuit unit 58, and a circuit holder 59.

  As shown in FIGS. 8 and 9, the semiconductor light emitting module 57 includes a mounting substrate 61, a semiconductor light emitting element 9, and a sealing body 62. The semiconductor light emitting module 57 is provided with a through hole 65 for arranging the antenna unit 14 in a space in the globe 5 from the front side to the rear side of the mounting substrate 61 and the sealing body 62. The through hole 65 is also formed over the rear side of the base 73.

  For example, the mounting substrate 10 has a substantially square plate shape in plan view, and is mounted on the front surface of the base 73. As shown in FIG. 9, the semiconductor light emitting elements 9 are mounted on the front surface 61e of the mounting substrate 61 excluding the through holes 65, for example, in a matrix. Each of the semiconductor light emitting elements 9 is arranged in a plane so as to be point symmetric about the lamp axis J. In the present modification, the “region where the light emitting portion is present” when the mounting substrate 61 is viewed in plan is a region indicated by W1 in FIG.

The number of semiconductor light emitting elements 9 is not particularly limited. Furthermore, the arrangement of the semiconductor light emitting elements 9 is not limited to a matrix, and may be arranged in an annular shape such as an annular shape.
As shown in FIG. 9, the base 73 is provided with a through hole 65 for inserting the circuit unit 58 and a through hole 64 for inserting the wiring 16 connecting the circuit unit 58 and the semiconductor light emitting module 57. It has been.

  The circuit configuration of the circuit unit 58 is the same as that of the circuit unit 6 in the first embodiment, but the shape of the circuit board 63 is different. That is, the width of the portion of the circuit board 63 that is inserted through the through hole 65 is smaller than the diameter of the through hole 65. Further, the large-diameter portion 30 of the circuit holder 59 is increased in diameter from the rear to the front as the through-hole 64 is provided in the base 73.

  In the embodiment and the modification described above, the antenna unit 14, the wireless control unit 21, and the wireless control unit power supply 84 are arranged in the space inside the globe 5, but in the present modified example, only the antenna unit 14 is located in the globe 5. It is arranged in the space. By doing in this way, the elements (for example, the radio control unit 21 and the radio control unit power supply 84) provided on the circuit board 63 of the circuit unit 58 do not hinder the transmission and reception of radio signals in the antenna unit 14.

<< Second Embodiment >>
In the present embodiment, an illumination light source capable of obtaining good light distribution characteristics by compensating for the narrow irradiation angle of the LED will be described.

  FIG. 10 is a partially broken perspective view showing the structure of the illumination light source 40 according to the second embodiment. 11 is a cross-sectional view taken along line AA shown in FIG. 12 is an enlarged cross-sectional view showing a portion surrounded by a two-dot chain line in FIG. 13 is a partial cross-sectional arrow view taken along line BB shown in FIG. 10-13, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment, and description is abbreviate | omitted. In FIG. 11, the circuit unit 6 is not a cross-sectional view.

  The illumination light source 40 according to the present embodiment mainly includes a semiconductor light emitting module 2, a base 3, a globe 5, a circuit unit 6, a circuit holder 7, a case 4, a base 8, and light emitted from the semiconductor light emitting module 2. The reflection member 41 for diffusing is provided. The illumination light source 40 is greatly different from the illumination light source 1 according to the first embodiment in that a reflection member 41 is provided.

<Reflection member>
As shown in FIGS. 10 to 12, the reflection member 41 includes a main body portion 42 and an attachment portion 43.
The reflection member 41 has, for example, a bottomed cylindrical shape, and includes a substantially cylindrical main body portion 42 that is open on both sides, and a substantially disc-shaped attachment portion 43 that closes the rear side opening of the main body portion 42. As a material of the reflecting member 41, for example, a resin such as polycarbonate, a metal such as aluminum, glass, ceramic, and the like are conceivable. In this embodiment, polycarbonate is used. Since resin such as polycarbonate is light, it is suitable for reducing the weight of the illumination light source 40.

  As shown in FIG. 13, the reflection member 41 is provided with a hole 55, and the hole 55 is mounted in a state where the outer peripheral edge of the mounting portion 43 is placed on the inner peripheral edge of the mounting substrate 10 of the semiconductor light emitting module 2. The reflection member 41 and the mounting substrate 10 are fastened together with the base 3 by screwing the screws 54 inserted into the screw holes 56 into the base 3. As shown in FIG. 10, the hole portions 55 are provided at, for example, three locations near the boundary between the main body portion 42 and the attachment portion 43.

  As shown in FIG. 3, a cutout portion 10 b is provided at one location on the inner peripheral edge of the element mounting portion 10 c of the mounting substrate 10. Further, as shown in FIG. 12, a protrusion 44 is provided at one position on the rear surface of the attachment portion 43. The use of these notches 10b and protrusions 44 makes it possible to position the reflecting member 41 at an appropriate position corresponding to the position of the semiconductor light emitting element 9 by a simple operation of fitting the protrusions 44 into the notches 10b. .

  Further, as shown in FIG. 12, the attachment portion 43 is provided with a substantially circular hole (through hole) 47 having a size similar to that of the hole 10a (FIG. 3) of the mounting substrate 10 at the approximate center thereof. ing. The circuit board 12 of the circuit unit 6 is inserted through the hole 10 a of the mounting board 10 and the hole 47 of the attachment part 43. As a result, the circuit board 12 is arranged so that its main surface is parallel to the lamp axis J.

  The main body 42 has a substantially cylindrical shape with a larger outer diameter on the front side than on the rear side, and floats from the semiconductor light emitting module 2 in such a posture that the cylinder axis and the front surface 3a of the base 3 are orthogonal to each other. In this state, it is disposed in front of the semiconductor light emitting element 9, and the cylinder axis of the main body 42 coincides with the lamp axis J. The reflection surface 45 of the main body 42 is substantially annular when viewed from the rear side along the lamp axis J, and includes a plurality of groups of semiconductor light emitting elements 9 arranged in an annular shape on the mounting substrate 10. Is opposed to the semiconductor light emitting element 9.

  The reflection member 41 has a plurality of openings 46 across the main body 42 and the mounting portion 43 at intervals along the circumferential direction of the reflection surface 45 of the main body 42 around the cylindrical axis of the main body 42. Is provided. Specifically, along the circumferential direction of the reflective surface 45, the 16 openings 46, which are the same as the number of the sealing bodies 11 of the semiconductor light emitting module 2, face the sealing body 11 in a one-to-one relationship. The main body portion 42 is provided at equal intervals.

  In the present embodiment, the opening 46 is a through-hole and nothing is fitted therein. However, the opening 46 may have any structure that allows light to leak forward, for example, an opening. A translucent member may be fitted into all or part of the portion 46, and light may leak forward through the translucent member. Further, the number of the openings 46 is not necessarily the same as that of the sealing body 11, and may be larger or smaller than the number of the sealing bodies 11, or may be one or plural. .

  In plan view, each opening 46 has a substantially square shape, and a portion on the cylinder axis side that is about half of the sealing body 11 is located in the opening 46, and is opposite to the cylinder axis that is the other half. The side portion faces the reflecting surface 45 of the main body 42. In other words, about half of the sealing body 11 is exposed from the opening 46, and the remaining half is hidden by the main body 42. This will be described in relation to the semiconductor light emitting element 9. Of the two semiconductor light emitting elements 9 sealed in one sealing body 11, the semiconductor light emitting element 9 a on the side close to the cylinder axis is in the opening 46. The semiconductor light emitting element 9b located and far from the cylinder axis faces the reflecting surface 45 of the main body 42.

  The main emission direction of the semiconductor light emitting element 9 b is directed to the reflecting surface 45, and the reflecting surface 45 is the reflecting surface of the reflecting member 41. In the present embodiment, in order to increase the reflectance of the reflecting surface 45, the reflecting member 41 is formed of white polycarbonate. Forming the main body 42 with a white material is suitable for increasing the reflectance of the reflecting surface 45. Note that, as another example of a method for increasing the reflectance of the reflecting surface 45, it is conceivable that the reflecting surface 45 of the main body 42 is subjected to a mirror treatment. As a method for performing the mirror surface treatment, for example, methods such as polishing, painting, thermal vapor deposition, electron beam vapor deposition, sputtering, and plating are conceivable.

  The reflecting surface 45 of the main body portion 42 has a concave curved surface shape that is recessed on the cylinder axis side of the main body portion 42. More specifically, on the cut surface (hereinafter referred to as “longitudinal section”) when the main body 42 is cut along a virtual plane including the lamp axis J (coincided with the tube axis), the shape of the reflective surface 45 is the lamp. It has a substantially arc shape that swells toward the axis J. In other words, it has a substantially arc shape that is recessed toward the lamp axis J from the straight line connecting the rear side edge and the front side edge of the reflecting surface 45 in the cut surface. Specifically, in the case of the present embodiment, the arc shape of the reflecting surface 45 in the longitudinal section is a substantially elliptic arc shape.

  The concave curved surface shape recessed on the tube axis side is suitable for reflecting the light emitted from the semiconductor light emitting element 9 obliquely rearward closer to the rear (more parallel to the lamp axis J). It is effective for widening the light distribution angle. It is also advantageous to concentrate the reflected light in a specific direction.

  In the present embodiment, the entire reflection surface 45 of the main body 42 is a reflection surface, but the entire reflection surface 45 is not necessarily a reflection surface, and only a part of the reflection surface 45 is a reflection surface. It may be.

  Further, the shape of the reflecting surface 45 of the main body 42 of the reflecting member 41 is not limited to a substantially arc shape that swells to the lamp axis J side in the longitudinal section, but a substantially arc that swells to the opposite side of the lamp axis J in the longitudinal section. The shape may be sufficient, and a linear shape may be sufficient in a longitudinal cross section.

Moreover, although the reflection member 41 of this Embodiment was a bottomed cylindrical shape, a substantially plate shape may be sufficient as a reflection member.
As shown by the optical path L1 in FIGS. 12 and 13, most of the main emitted light emitted from the semiconductor light emitting element 9b and incident on the reflecting surface 45 of the main body 42 is incident on the reflecting surface 45, and the incident light is reflected. Reflected by the surface 45, the reflected light passes through an annular region surrounding the base 3 from the side, and is reflected obliquely backward so as to avoid the front surface 3a of the base 3. On the other hand, as shown by the optical path L2 in FIG. 12, most of the main emitted light of the semiconductor light emitting element 9a passes through the opening 46 and leaks forward. However, not all of the main emitted light emitted from the semiconductor light emitting element 9b is reflected obliquely backward by the reflecting surface 45, and a part of the main emitted light leaks forward through the opening 46. Further, not all of the main emitted light emitted from the semiconductor light emitting element 9 a passes through the opening 46 and leaks forward, and a part of the main emitted light avoids the front surface 3 a of the base 3 by the reflecting surface 45. Reflected diagonally backward. Thus, the reflection member 41 exhibits a diffusion function for diffusing the emitted light of the semiconductor light emitting element 9.

  Since the illumination light source 40 includes the reflection surface 45 that reflects a part of the main emitted light of the semiconductor light emitting element 9 obliquely backward avoiding the front surface 3a of the base 3, the semiconductor light emitting element 9 having a narrow irradiation angle is provided. Even if it is used, the light distribution characteristics of the illumination light source 40 are good. Further, since the semiconductor light emitting element 9 is arranged in a ring shape and the reflection surface 45 is also arranged in a ring shape corresponding thereto, the reflection to the oblique rear side avoiding the front surface 3a of the base 3 is It occurs all around the outside. Therefore, the light distribution characteristic is good over the entire circumference around the lamp axis J.

<< Third Embodiment >>
In the present embodiment, as in the second embodiment, an illumination light source capable of obtaining good light distribution characteristics by compensating for the narrow irradiation angle of the LED will be described.

  FIG. 14 is a partially broken perspective view showing an illumination light source 60 according to the third embodiment. FIG. 15 is a cross-sectional view showing the structure of the illumination light source 60 according to the present embodiment. 16 is an enlarged cross-sectional view showing a portion surrounded by a two-dot chain line in FIG. 14-16, the same code | symbol is attached | subjected to the structure similar to 1st, 2nd embodiment, and description is abbreviate | omitted. In FIG. 15, the circuit unit 6 is not a cross-sectional view.

  The illumination light source 40 according to the present embodiment mainly includes a semiconductor light emitting module 2, a base 3, a globe 5, a circuit unit 6, a circuit holder 7, a case 4, a base 8, and light emitted from the semiconductor light emitting module 2. A reflecting member 41 and an auxiliary reflecting member 48 are provided. The illumination light source 60 is greatly different from the illumination light source 40 according to the second embodiment in that an auxiliary reflection member 48 is provided.

As shown in FIG. 14, the auxiliary reflecting member 48 includes a substantially cylindrical main body 49 and a cap-shaped lid 50 that closes the front opening of the main body 49.
Here, as shown in FIG. 15, the entire circuit unit 6 is accommodated in a space formed by the circuit holder 7, the attachment portion 43, and the auxiliary reflecting member 48. Therefore, the circuit unit 6 including the antenna unit 14 does not block the emitted light from the semiconductor light emitting module 2. Further, since the antenna portion 14 is covered with the auxiliary reflecting member 48 in this way, the auxiliary reflecting member 48 needs to be formed of a material that can transmit a radio signal. Examples of such materials include glass fiber reinforced epoxy resins and fiber reinforced polyimide resins (resins formed by combining inorganic fibers or organic fibers and synthetic resins).

  As shown in FIGS. 15 and 16, the inner diameter of the main body 49 is constant, but the outer diameter gradually increases from the rear to the front on the front side. The entire outer peripheral surface of the main body 49 is a reflecting surface, and the reflecting surface is composed of an outer peripheral surface of a portion having a constant outer diameter of the main body 49, and has a linear shape parallel to the lamp axis J in the longitudinal section. A first reflecting surface 51 and an outer peripheral surface of a portion where the outer diameter of the main body 49 is increased, and a second reflecting surface 52 having a substantially arc shape swelled toward the lamp axis J in the longitudinal section. It consists of.

  As shown by an optical path L1 in FIG. 16, most of the main emitted light emitted from the semiconductor light emitting element 9b and incident on the reflecting surface 45 of the main body 42 is incident on the reflecting surface 45, and the incident light is reflected on the reflecting surface 45. The reflected light passes through an annular region surrounding the base 3 from the side, and is reflected obliquely backward so as to avoid the front surface 3 a of the base 3. On the other hand, as shown by the optical path L2 in FIG. 16, most of the main emitted light of the semiconductor light emitting element 9a passes through the opening 46 and leaks forward. However, not all of the main emitted light emitted from the semiconductor light emitting element 9b is reflected obliquely backward by the reflecting surface 45, and a part of the main emitted light leaks forward through the opening 46. Further, not all of the main emitted light emitted from the semiconductor light emitting element 9 a passes through the opening 46 and leaks forward, and a part of the main emitted light avoids the front surface 3 a of the base 3 by the reflecting surface 45. Reflected diagonally backward. Thus, the reflection member 41 exhibits a diffusion function for diffusing the emitted light of the semiconductor light emitting element 9.

  As shown by the optical path L3 in FIG. 16, a part of the light emitted from the semiconductor light emitting module 2 and passing through the opening 46 of the reflecting member 41 is incident on the first reflecting surface 51 of the auxiliary reflecting member 48 and obliquely forward. The other part is incident on the second reflecting surface 52 of the auxiliary reflecting member 48 and is reflected laterally. In this way, the light that travels forward through the opening 46 of the reflection member 41 and the light that is reflected by the reflection surface 45 of the reflection member 41 and that travels obliquely backward is generated in the intermediate direction. Therefore, the light distribution characteristic of the illumination light source 40 is particularly good. Furthermore, a part of the light emitted from the semiconductor light emitting module 2 and passing through the opening 46 of the reflecting member 41 goes forward without entering the first and second reflecting surfaces 51 and 52 of the auxiliary reflecting member 48. The design property when the illumination light source 40 is turned on is good.

<< Fourth Embodiment >>
In the present embodiment, as in the second and third embodiments, an illumination light source capable of obtaining good light distribution characteristics by compensating for the narrow irradiation angle of the LED will be described.

  FIG. 17 is a cross-sectional view showing an illumination light source 70 according to the fourth embodiment. In FIG. 17, the same components as those in the first embodiment (FIG. 1) and its modification (FIG. 8) are denoted by the same reference numerals, and the description thereof is omitted. In FIG. 17, the lighting unit 66 and the wireless unit 67 are not cross-sectional views.

  The illumination light source 70 according to the present embodiment mainly includes a semiconductor light emitting module 78, a base 74, a globe 5, a lighting unit 66, a wireless unit 67, a circuit holder 59, a case 4, a base 8, and a semiconductor light emitting module 57. The optical member 80 for diffusing the emitted light from is provided. The illumination light source 70 differs greatly from the illumination light source 40 according to the second embodiment in that the configuration corresponding to the circuit unit in the above embodiment is divided into two parts, a lighting unit 66 and a wireless unit 67. And an optical member 80.

  The semiconductor light emitting module 78 has substantially the same configuration as that of the semiconductor light emitting module 57 in the modification of the first embodiment (FIG. 8), except that the through hole 65 (FIG. 8) is not provided. In the present embodiment, the “region where the light emitting portion is present” when the mounting substrate 61 is viewed in plan is a region indicated by W2 in FIG.

  The circuit board 72 of the lighting unit 66 is formed with a first circuit (consisting of a rectifier circuit, a smoothing capacitor, a switching circuit, a control circuit, and a lighting control signal detector) in the circuit unit 6 of the first embodiment. . On the circuit board 68 of the wireless unit 67, a second circuit (consisting of an antenna unit, a wireless control unit, and a power supply for the wireless control unit) is formed. The lighting unit 66 and the base 8 are connected by a wiring 76, and the lighting unit 66 and the semiconductor light emitting module 78 are connected by a wiring 77. Further, the lighting unit 66 and the wireless unit 67 are connected via a wiring 71.

  In FIG. 17, the angle formed between the main surface of the circuit board 72 of the lighting unit 66 and the main surface of the circuit board 68 of the wireless unit 67 is approximately 90 [°] (the circuit board 72 of the lighting unit 66 has The arrangement is such that the main surface and the main surface of the circuit board 68 of the wireless unit 67 are orthogonal to each other), but this angle is not particularly limited.

  The base 74 is provided with a through hole 79 through which the wiring 77 is inserted. Further, the base 74 is provided with a through-hole 69, and the two legs 75 of the circuit board 68 are inserted into the through-hole 69, and then fixed with an adhesive or the like, whereby the wireless unit 67 is obtained. Is supported in the globe 5.

<Optical member>
The optical member 80 is a member for diffusing light emitted from the semiconductor light emitting module 78 and is disposed on the front side of the semiconductor light emitting module 78.

  The optical member 80 is, for example, substantially columnar and is disposed on the lamp axis J, and the column axis of the optical member 80 and the lamp axis J coincide with each other. The column axis of the optical member 80 is not necessarily coincident with the lamp axis J. However, in order to obtain a uniform light distribution over the entire circumference around the lamp axis J, the column axis is used as the lamp axis. The axis J is preferably parallel to the axis J, and the column axis and the lamp axis J are more preferably aligned.

  The optical member 80 is formed of, for example, a cylindrical outer portion 81 having a cylindrical axis parallel to the lamp axis J, and a columnar inner portion 82 packed in the outer portion 81. More specifically, the optical member 80 has a columnar shape, the outer side portion 81 has a cylindrical shape having a cylinder axis that coincides with the lamp axis J, and the inner side portion 82 is packed in the cylinder of the outer side portion 81 without a gap. Cylindrical shape.

  The outer part 81 and the inner part 82 are each made of a translucent material. However, the material of the inner portion 82 has a lower refractive index than the material of the outer portion 81. Examples of the translucent material constituting the outer portion 81 and the inner portion 82 include resin materials such as silicone and polycarbonate, glass, and ceramic, respectively. For example, it is conceivable that the outer portion 81 is made of glass and the inner portion 82 is made of silicone.

  The light emitted from the sealing body 62 of the semiconductor light emitting module 78 and incident on the outer portion 81 is repeatedly reflected in the outer portion 81 and emitted from the front surface 81 a of the outer portion 81 to the outside of the optical member 80. The reason why the light is reflected on the outer peripheral surface of the outer portion 81 is that the material of the outer portion 81 has a refractive index higher than that of air, and the light is reflected on the inner peripheral surface of the outer portion 81. This is because the material 81 has a higher refractive index than the material of the inner portion 82. As described above, the light that has once entered the outer portion 81 is less likely to leak out from the outer peripheral surface or inner peripheral surface of the outer portion 81, and therefore is guided to the front surface 81a and emitted from the front surface 81a.

  On the other hand, the light emitted from the sealing body 62 of the semiconductor light emitting module 78 and incident on the inner portion 82 is repeatedly reflected between the outer peripheral surfaces facing the inner portion 82, and part of the light is optically transmitted from the front surface 82 a of the inner portion 82. The light is emitted out of the member 80, but the remaining light passes through the outer peripheral surface of the inner portion 82 (the inner peripheral surface of the outer portion 81) and enters the outer portion 81. The reason why the light is not reflected by the outer peripheral surface of the inner portion 82 but is transmitted through the outer peripheral surface is that the material of the inner portion 82 is lower than the refractive index of the material of the outer portion 81.

  Light that has entered the outer portion 81 from the inner portion 82 is repeatedly reflected between the outer peripheral surface of the outer portion 81 and the inner peripheral surface, and is emitted from the front surface 81 a of the outer portion 81 to the outside of the optical member 80. In this way, the light incident on the optical member 80 gathers at the outer portion 81 formed of a material having a higher refractive index and is emitted mainly from the front surface 81 a of the outer portion 81.

  Further, when the emission angle is defined as 0 [°] on the front side along the lamp axis J and 180 [°] on the rear side along the lamp axis J, light emitted from the front surface 81a of the outer portion 81 is mainly a lamp. Rather than being emitted forward along the axis J, it is emitted mainly at an emission angle in the range of 30 to 60 [°] with respect to the lamp axis J.

  The emitted light from the semiconductor light emitting module 78 is diffused by the optical member 80 so as to reach the inner surface 5a of the globe 5 with the maximum luminous intensity within the range of the emission angle of 30 to 60 [°]. Therefore, more light reaches the rearward region of the inner surface 5a of the globe 5, and the light distribution angle of the illumination light source 70 is widened. The light that reaches the globe 5 is further diffused by the globe 5.

  From the above, the illumination light source 70 has good light distribution characteristics because the irradiation angle can be widened by the optical member 80 even if the semiconductor light emitting module 78 with a narrow irradiation angle is arranged in a plane. Further, since the outer portion 81 is cylindrical and exists over the entire outer periphery of the optical member 80, the irradiation angle can be widened over the entire circumference around the lamp axis J. Good light distribution characteristics.

<< Modification of Fourth Embodiment >>
FIGS. 18A and 18B are partial cross-sectional views illustrating configurations of illumination light sources 70A and 70B according to the modification of the fourth embodiment, respectively.

  The illumination light source 70 </ b> A shown in FIG. 18A has one leg portion 75 </ b> A of the circuit board 68 that supports the wireless unit 67. Therefore, there is one through hole 69 provided in the base 74A. Compared with the illumination light source 70 shown in FIG. 17, the illumination light source 70 </ b> A of the present modification is emitted directly toward the globe 5 without entering the optical member 80 out of the light emitted from the semiconductor light emitting module 78. It is hard to block the light.

  The illumination light source 70B shown in FIG. 18B has one leg portion 75B of the circuit board 68 that supports the wireless unit 67, like the illumination light source 70A. However, the leg portion 75B in this modification is provided so as to be inserted into the base 74B, the inner portion 82B of the optical member 80B, and the through hole 83 formed from the front side to the rear side of the semiconductor light emitting module 78B. ing. As described above, the light emitted from the semiconductor light emitting module 78B and incident on the optical member 80B is emitted mainly from the front surface of the outer portion 81B. Therefore, it is possible to suppress the light emitted from the outer portion 81B of the optical member 80B from being blocked by the leg portion 75B of the circuit board 68.

≪Lighting device≫
FIG. 19 is a schematic view showing a structure of an illumination device 501 including an illumination light source according to the present invention.

  The illumination device 501 includes the illumination light source 1 and the illumination fixture 503 according to the first embodiment, and the illumination fixture 503 here is a so-called downlight illumination fixture. Here, although the example provided with the illumination light source 1 which concerns on 1st Embodiment is shown, it cannot be overemphasized that the illumination light source which concerns on other embodiment and a modification can be employ | adopted as a light source.

  The luminaire 503 includes a socket 505 that is electrically connected to the illumination light source 1 and holds the illumination light source, a bowl-shaped reflector 507 that reflects light emitted from the illumination light source 1 in a predetermined direction, And a connection portion 509 connected to an external commercial power source.

Here, the reflector 507 is attached to the ceiling 511 through the opening 513 of the ceiling 511 so that the socket 505 side is located on the back side of the ceiling 511.
Note that the structure of the illumination device shown in FIG. 19 is merely an example, and the illumination device including the illumination light source according to the present invention is not limited to the above-described downlight. Further, in the lighting device 501, the lamp axis of the illumination light source 1 is arranged so as to coincide with the axis of the bowl-shaped reflector 507, but the lamp axis of the illumination light source 1 is the axis of the reflector 507. It is good also as arrange | positioning so that it may become diagonal with respect to. Furthermore, it is good also as providing the part which concerns on the 1st circuit formed in the circuit unit of the light source 1 for illumination not in the light source 1 for illumination but in the lighting fixture side.

Although the first to third embodiments have been described above, the present invention is not limited to these embodiments. For example, the following modifications can be considered.
[Modification]
(1) In the circuit unit 6 in the first to third embodiments, the first circuit and the second circuit are provided on one circuit board, but the present invention is not limited to this. As shown in the sectional view of the illumination light source shown in FIG. 20, a circuit unit 92 including a lighting unit 93 in which a first circuit is formed and a wireless unit 94 in which a second circuit is formed is included in the illumination light source. It is also possible to adopt a configuration for accommodating. The lighting unit 93 and the wireless unit 94 are electrically connected by a contact 95.

  (2) As described above, single antenna, monopole antenna, loop antenna, diversity, film antenna and the like can be cited as antennas that can be used as the antenna section. For example, when a monopole antenna is employed as the antenna portion, the monopole antenna is installed in the globe 5 using the circuit board 12 of the circuit unit 86 as a support, as shown in the sectional view of the illumination light source shown in FIG. Part 89 can be accommodated.

  Further, when a film antenna is employed as the antenna portion, as shown in FIG. 22A, for example, a film antenna 88 can be provided so as to lie over the inner surface 5a of the globe 5. In this case, it is desirable to use a transparent film antenna so as not to impair the transparency of light emitted from the LED module in the film antenna 88.

  (3) In the above embodiment, the number of antenna units is one. However, in the present invention, the number of antenna units is not particularly limited, and may be plural. As shown in the plan view of the circuit unit shown in FIG. 22B, for example, two antenna portions 87 may be provided to form a diversity antenna.

  (4) As shown in FIGS. 2 and 6, the light emitting element controller 37 is disposed on the base 8 side of the circuit board 12. When the light emitting element control unit 37 or the wireless control unit power supply 84 includes a heat-sensitive element, similarly to the wireless control unit 21, the light emitting element control unit 37 and the wireless control unit power supply 84 are also provided on the circuit board 12. It is good also as arranging on the glove 5 side.

  (5) In the above embodiment, the case where the illumination light source is used with the base side on the upper side (ceiling side) has been described. On the contrary, the globe side is on the upper side (ceiling side). It is also possible to use it. In this case, as a circuit board layout, it is desirable to provide the wireless control unit 21 on the base side. In the modification (4), it is desirable that the light emitting element control unit 37 and the wireless control unit power supply 84 are also provided on the base side.

  (6) In the above embodiment, product names are specifically mentioned as the light emitting element control unit (LED driver) and the wireless control unit, but the present invention is not limited to this. It is also possible to use another LED driver and a wireless control unit.

  (7) “The circuit board has a long shape” means that the circuit board has a shape having a long side and a short side, and is not necessarily a rectangular shape, and may be an elliptical shape, for example. . More preferably, the shape can be arranged parallel to the lamp axis in the case of the illumination light source. By doing in this way, the diameter of the light source for illumination can be reduced as mentioned above, and size reduction can be achieved.

  (8) As a switching element included in the switching circuit, in addition to the FET described in the embodiment, an electrostatic induction transistor (Static Induction Transistor, SIT), a gate injection transistor (Gate Injection Transistor, GIT) Insulated Gate Bipolar Transistor (IGBT), Si-based bipolar transistors, and the like. When the switching element is an IGBT, “source” and “drain” in the above description may be read as “emitter” and “collector”, respectively. When the switching element is a bipolar transistor, the “source”, “drain”, and “gate” in the above description may be read as “emitter”, “collector”, and “base”, respectively.

  (9) In the above-described embodiment, the antenna unit is supported in the globe using the circuit board as a support, but the present invention is not limited to this. For example, it may be supported by wiring, a transparent tube made of glass or the like into which the wiring is inserted, and the like.

  (10) When the power is turned on, the LED is turned on and activated, that is, the second circuit (wireless signal transmission / reception circuit) is activated via the first circuit (LED lighting circuit). However, the present invention is not limited to this. For example, when the power is turned on, the LED is turned off to start, that is, the second circuit (wireless signal transmission / reception circuit) is independently activated without going through the first circuit (LED lighting circuit). It may be activated.

  The present invention can be widely used in general lighting.

1, 1A, 1B, 1C, 40, 60, 70, 70A, 70B Illumination light source 2, 2A, 2B, 57, 78, 78B Semiconductor light emitting module 3, 73, 74, 74A, 74B Base 3a Front 3b Rear 3c Tapered surface 4 Case 4a Inner peripheral surface 4b Front side end 5 Globe 5a Inner surface 5b Open side end 6, 6A, 58, 86, 92 Circuit unit 7, 59 Circuit holder 8 Base 9 Semiconductor light emitting element 10, 61 Mounting substrate 10a Hole 10b Notch 10c Element mounting part 10d Tongue piece 10e, 61e Front surface 11, 62 Sealed body 12, 63, 68, 72 Circuit board 13 Element 14, 14A, 87, 89 Antenna part 15, 16, 71, 76 , 77 Wiring 17 Connector 18, 53, 64, 65, 69, 79, 83 Through hole 19 AC power supply 20 Rectifier circuit 21 Wireless control unit 22 switching circuit 23 control circuit 24 lighting control signal detection part 25 switching element 25g control terminal 26, 27 input terminal 28, 29 output terminal 30 large diameter part 31 small diameter part 32 opening 33 shell part 34 insulating part 35 eyelet part 36 insulating member 37 Light emitting element control part 38 Space 39 Area where light emitting part exists 41 Reflective member 42, 49 Main body part 43 Mounting part 44 Projection 45 Reflective surface 46 Opening part 47, 55 Hole part 48 Auxiliary reflective member 50 Lid part 51 First reflective surface 52 First reflection surface 54 Screw 56 Screw hole 66, 93 Lighting unit 67, 94 Radio unit 75, 75A, 75B Leg 80, 80B Optical member 81, 81B Outer part 81a Front part 82, 82B Inner part 82a Front part 84 Wireless control Power supply for parts 85 Oscillator 88 Film antenna 95 Contour DOO 501 illumination device 503 luminaires 505 socket 507 reflector 509 connection portion 511 ceiling 513 opening GND Ground

Claims (4)

An illumination light source that controls lighting by receiving a wireless signal from the outside,
A light emitting unit composed of one or more light emitting elements is arranged in a plane on the front surface of the mounting substrate with each main emission direction facing forward,
A globe covers the front of the mounting board,
The antenna unit for transmitting and receiving the radio signal is a region in front of the front surface of the mounting substrate in the globe, and an inner region from the region where the light emitting unit is present when the mounting substrate is viewed in plan view. , Is supported by a support so as not to contact the globe ,
The antenna unit is formed on a circuit board that serves as a power feeding path to the antenna unit,
The antenna unit is supported in the globe using the circuit board as a support,
The circuit board is provided with a wireless control unit that generates a lighting control signal for controlling power feeding to the light emitting element based on a wireless signal transmitted and received by the antenna unit.
The mounting board is provided with a through hole,
The circuit board is elongated,
The circuit board is arranged in parallel to the lamp axis by inserting at least a part from one end to the other end in the longitudinal direction of the circuit board through the through hole of the mounting board. Light source for illumination. The illumination light source according to claim 1 , wherein the wireless control unit is provided at a front end portion of the circuit board. The circuit board further includes:
A lighting circuit is provided for converting AC power supplied from an AC power source into power for lighting the one or more light-emitting elements, and outputting the converted power to the one or more light-emitting elements. The illumination light source according to claim 1 . The illumination light source according to claim 3 , wherein the antenna unit and the wireless control unit receive power supply via the lighting circuit.

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