WO2021132131A1

WO2021132131A1 - Lamp

Info

Publication number: WO2021132131A1
Application number: PCT/JP2020/047625
Authority: WO
Inventors: 正宏小西
Original assignee: デンカ株式会社
Priority date: 2019-12-25
Filing date: 2020-12-21
Publication date: 2021-07-01
Also published as: TW202132719A; KR20220119119A; CN115135923A; JPWO2021132131A1; JP7437419B2

Abstract

An LED bulb (100) is provided with a cover member (110), an LED module (120), a barrel part (130), and a drive circuit (140). The LED module (120) is provided with a phosphor substrate (122), and an LED chip (121) mounted on the phosphor substrate (122). The drive circuit (140) supplies electric power to the LED module (120) to drive light emission of the LED chip (121). In the phosphor substrate (122), a phosphor layer is disposed on one surface of an insulating base material.

Description

Lamp

The present invention relates to a lamp.

Patent Document 1 discloses a light bulb type lighting device including an LED as a light emitting element. Specifically, a plurality of LEDs are arranged in an annular shape on the substrate, and the light emitted from the LEDs is output to the outside via the cover member.

Japanese Unexamined Patent Publication No. 2018-45850

In the configuration disclosed in Patent Document 1, there is a problem that the light output from the LED is output as it is. That is, it is not possible to adjust the light emitted from the substrate when the light emitting element is mounted to a light having an emission color different from the light emitted by the light emitting element, and in a lamp having such a configuration, the desired emission color can be obtained. There is a problem that it cannot be obtained and that the emission color may vary.

An object of the present invention is to provide a lamp capable of adjusting the light emitted from a phosphor substrate when a light emitting element is mounted to a light having an emission color different from the light emitted by the light emitting element.

The lamp of the present invention includes a substrate and
The light emitting element mounted on the substrate and
A drive circuit that supplies electric power to the light emitting element to drive the light emitting element,
With
The substrate is
Insulating base material and
A phosphor layer which is arranged on one surface of the insulating base material and whose emission peak wavelength is in the visible light region when the emission of the light emitting element is used as excitation light, and a phosphor layer containing an organic resin.
To be equipped.

In the lamp of the present invention, the substrate on which the light emitting element is mounted is configured as a phosphor substrate, and the light emitted from the phosphor substrate can be adjusted to light having a different emission color from the light emitted by the light emitting element.

It is a perspective view of the LED bulb of 1st Embodiment. It is an exploded perspective view of the LED bulb of 1st Embodiment. It is a figure which showed the other embodiment of the LED module of 1st Embodiment. It is a figure which showed the example of the drive circuit of the LED module of 1st Embodiment. It is a partial cross-sectional view of the light emitting substrate which is one form of the LED module of 1st Embodiment. It is a figure for demonstrating the light emitting operation of the light emitting substrate of 1st Embodiment. It is a figure for demonstrating the light emitting operation of the light emitting substrate of 1st Embodiment. It is a graph which shows the result of the 1st test of the correlation color temperature of the light emitting substrate of 1st Embodiment. It is a graph which shows the result of the 2nd test of the correlation color temperature of the light emitting substrate of 1st Embodiment. It is a figure explaining the positional relationship between the junction of LED and the phosphor layer in the light emitting substrate of 1st Embodiment. It is a figure explaining the positional relationship between the junction of LED and the phosphor layer in the light emitting substrate of 1st Embodiment. It is a figure explaining the positional relationship between the junction of LED and the phosphor layer in the light emitting substrate of 1st Embodiment. It is a top view of the LED lamp of the 2nd Embodiment. It is a top view of the LED bulb of the 3rd Embodiment. It is a figure which showed the form of the LED module of the 3rd Embodiment. It is a perspective view of the floodlight of the 4th Embodiment. It is a perspective view of the LED lamp main body used for the floodlight of 4th Embodiment.

<< First Embodiment >>
Hereinafter, the configuration and function of the LED bulb 100, which is one form of the lamp of the present embodiment, will be described with reference to FIGS. 1 to 4. Next, the configuration and function of the LED unit, which is the light emitting unit of the LED bulb 100, will be described with reference to FIG. 5, mainly focusing on the light emitting substrate 10. Next, the light emitting operation of the light emitting substrate 10 of the present embodiment will be described with reference to FIGS. 6 and 7. Further, the effects of this embodiment will be described with reference to FIGS. 8, 9, and the like. Further, with reference to FIGS. 10 to 12, the positional relationship between the LED junction and the phosphor layer on the light emitting substrate will be described. In all the drawings referred to in the following description, similar components are designated by the same reference numerals, and the description thereof will be omitted as appropriate.

<Structure and function of the LED bulb of the first embodiment>
FIG. 1 is a perspective view of the LED bulb 100 of the present embodiment. FIG. 2 is an exploded perspective view of the LED bulb 100. In addition, in FIGS. 1 and 2, for convenience, the cover member 110 side will be described as the upper side, and the base 132 side will be described as the lower side.

The LED bulb 100 includes a cover member 110, an LED module 120, a body 130, and a drive circuit 140.

The LED module 120 includes a phosphor substrate 122 and an LED chip 121. Here, the phosphor substrate 122 has a substantially circular shape when viewed from above. Further, one LED chip 121 is mounted in the center of the phosphor substrate 122. The LED chip 121 is, for example, a CSP (Chip Scale Package) in which a flip chip LED is incorporated.

As an example of the phosphor substrate 122, a substantially circular shape is shown in the top view, but a rectangle or other appropriate shape is selected according to the shape of the LED bulb 100, the number of mounted LED chips 121, the mounting position, the arrangement, and the like. For example, in the example of FIG. 3, the LED module 120b has a configuration in which one LED chip 121 is arranged in the center of a rectangular (square) phosphor substrate 122b. Further, as in the second embodiment (see FIG. 13) described later, a plurality of LED chips 221 may be arranged in a grid pattern on a rectangular phosphor substrate 222. Further, as in the third embodiment (see FIG. 15) described later, a plurality of LED chips 321 may be arranged in an annular shape on the circular phosphor substrate 322.

Returning to FIGS. 1 and 2, the phosphor substrate 122 has a configuration in which a phosphor layer is provided on one surface of the insulating substrate. The LED chip 121 is mounted on the phosphor substrate 122. The specific structures and features of the phosphor substrate 122 and the LED chip 121 will be described later in FIGS. 5 to 9.

The body portion 130 is formed of, for example, aluminum die-cast. A heat radiation fin 131 is formed in a slit shape on the surface of the body portion 130 as a heat radiation means. Further, the surface of the body 130 is coated with a heat radiating paint and electrically insulated. An internal space is formed in the body portion 130, and a base 132 is attached to the lower portion of the body portion 130.
Although the heat radiating fin 131 is exemplified as the heat radiating means, there are also a heat radiating fan, a heat radiating opening, and a heat radiating slit. Based on the required heat dissipation performance, noise performance, etc., the optimum heat dissipation means is appropriately used.

A power supply drive circuit 140 is arranged in the internal space of the body 130, and the above-mentioned LED module 120 is mounted on the power supply drive circuit 140 so as to cover the internal space. When a heat radiating fan is provided, a temperature sensor is provided in the LED light bulb 100, and the drive circuit 140 controls the driving of the heat radiating fan, so that the inside of the LED light bulb 100 can be controlled to a desired temperature range.

The cover member 110 is made of, for example, a thermoplastic resin or glass, has a spherical shape as shown in the figure, and the lower side in the figure (that is, the body portion 130 side) is open. The cover member 110 is attached at an open portion so as to cover the upper portion of the body portion 130 to which the LED module 120 and the drive circuit 140 are attached. The cover member 110 may contain a diffusing material.

The drive circuit 140 includes an LED driver IC, a capacitor, and the like, and controls the on-duty (off-duty) of the drive element Q by PWM (Pulse Width Modulation) by switching operation to bring the current flowing through the LED chip 121 to a desired value. Control.

<Example of LED drive circuit>
FIG. 4 is a circuit example focusing on the LED drive circuit for the drive circuit 140. As shown in the figure, the drive circuit 140 includes a drive element Q of the LED chip 121, an LED driver 141 that PWM-controls the drive element Q, a rectifier circuit 142 that rectifies the power of a commercial AC power supply AC, a step-down chopper circuit 143, and a current detection resistor. It is equipped with 144. This circuit configuration is an example. For example, the drive element Q may be included in the LED driver 141, or the drive circuit 140 may be integrated with the LED module 120. Further, the function of converting the commercial AC power supply AC into direct current (for example, the rectifier circuit 142, the step-down chopper circuit 143, etc.) may be provided as a separate body (for example, a dedicated power supply).

<Structure and function of the light emitting substrate of this embodiment>
Subsequently, a specific structure of the light emitting element 20 will be described with reference to FIGS. 5 to 9. The light emitting element 20 described below corresponds to the LED module 120 described above. FIG. 5 is a partial cross-sectional view of the light emitting substrate 10 which is a specific structure of the light emitting element 20 (LED module 120).

<Light emitting element>
Each of the light emitting elements 20 is a CSP (Chip Scale Package) in which a flip chip LED 22 (hereinafter, simply referred to as “LED 22”) is incorporated as described above. One or more light emitting elements 20 are arranged on the surface 31 (an example of one surface) of the phosphor substrate 30. In the case of a plurality of light emitting elements 20, for example, the light emitting elements 20 are provided on the phosphor substrate 30 in a state of being regularly arranged over the entire surface 31. The correlated color temperature of the light emitted by the light emitting element 20 is, for example, 3,018K.

Further, the light emitting element 20 is radiated (cooled) so as to fall within the range of 50 ° C. to 100 ° C. from room temperature, taking the phosphor substrate 30 as an example, by using, for example, the above-mentioned heat radiating means during the light emitting operation.

Here, supplementing the meaning of "-" used in the numerical range in this specification, for example, "50 ° C to 100 ° C" means "50 ° C or more and 100 ° C or less". And, "-" used in the numerical range in this specification means "more than the description part before"- "and less than the description part after"- "".

<Fluorescent substrate>
The phosphor substrate 30 of the present embodiment includes an insulating layer 32 (an example of an insulating substrate), an electrode layer 34, a phosphor layer 36, and a back surface pattern layer (not shown). As an example, the phosphor layer 36 is arranged on the surface 31 of the insulating layer 32 and the electrode layer 34, except for a plurality of electrode pairs 34A, which will be described later.

The phosphor substrate 30 of the present embodiment is manufactured by processing (etching or the like) a double-sided plate (hereinafter referred to as "motherboard MB") in which copper foil layers are provided on both sides of the insulating plate. As an example, CS-3305A manufactured by Risho Kogyo Co., Ltd. is used.

<Insulation layer>
Hereinafter, the main features of the insulating layer 32 of the present embodiment will be described.
As described above, the shape is circular or rectangular when viewed from the front surface 31 and the back surface 33 as an example.
The material is, for example, an insulating material containing a bismaleimide resin and a glass cloth.
The thickness is, for example, 100 μm to 200 μm.
The coefficient of thermal expansion (CTE) in the vertical direction and the horizontal direction is, for example, 10 ppm / ° C. or less in the range of 50 ° C. to 100 ° C., respectively. From another point of view, the coefficient of thermal expansion (CTE) in the vertical direction and the horizontal direction is 6 ppm / K, respectively, as an example. This value is substantially the same as that of the light emitting device 20 of the present embodiment (90% to 110%, that is, within ± 10%).
The glass transition temperature, for example, is higher than 300 ° C.
^{As an example, the storage elastic modulus is larger than 1.0 × 10 10} Pa and smaller than 1.0 × 10 ¹¹ Pa in the range of 100 ° C to 300 ° C.

<Electrode layer>
The electrode layer 34 of the present embodiment is a metal layer provided on the surface 31 side of the insulating layer 32. The electrode layer 34 of this embodiment is, for example, a copper foil layer (a layer made of Cu). In other words, the electrode layer 34 contains copper at least on its surface.

The electrode layer 34 has a pattern provided on the insulating layer 32, and is electrically connected to a terminal (not shown) to which a connector (not shown) is joined. Then, the electrode layer 34 supplies the electric power supplied from the external power source (drive circuit 140 in the first embodiment) to the light emitting element 20 at the time of configuring the light emitting substrate 10 by directly attaching the lead wire or through the connector. To do. When there are a plurality of light emitting elements 20, a part of the electrode layer 34 is a plurality of electrode pairs 34A to which the plurality of light emitting elements 20 are bonded. As shown in the figure, as an example, the plurality of electrode pairs 34A project outward from the wiring portion 34B in the thickness direction of the insulating layer 32 (fluorescent substrate 30).

The region on the surface 31 of the insulating layer 32 where the electrode layer 34 is arranged (occupied area of the electrode layer 34) is, for example, a region of 60% or more of the surface 31 of the insulating layer 32.

<Fluorescent layer>
As an example, the phosphor layer 36 of the present embodiment is arranged on a portion of the surface 31 of the insulating layer 32 and the electrode layer 34 other than the plurality of electrode pairs 34A. In the present embodiment, the region where the phosphor layer 36 is arranged on the surface 31 of the insulating layer 32 is, for example, 80% or more of the region on the surface 31 of the insulating layer 32.

The phosphor layer 36 of the present embodiment is, for example, an insulating layer containing a phosphor and a binder, which will be described later. The phosphor contained in the phosphor layer 36 is fine particles that are held in a state of being dispersed in a binder, and has a property of exciting the light emitted by each light emitting element 20 as excitation light. Specifically, the phosphor of the present embodiment has a property that the emission peak wavelength when the emission of the light emitting element 20 is used as excitation light is in the visible light region. The binder may be, for example, an epoxy-based binder, an acrylate-based binder, a silicone-based binder, or the like, and may have an insulating property equivalent to that of the binder contained in the solder resist.

(Specific example of phosphor)
Here, the phosphor contained in the phosphor layer 36 of the present embodiment is, for example, an α-type sialone phosphor containing Eu, a β-type sialon phosphor containing Eu, a CASN phosphor containing Eu, and Eu. It is considered to be at least one or more phosphors selected from the group consisting of SCASSN phosphors containing. The above-mentioned phosphor is an example of the present embodiment, and may be a phosphor other than the above-mentioned phosphor, such as YAG, LuAG, BOS and other visible light-excited phosphors.

Α-sialon phosphor containing Eu, the general _formula: represented by _{_{_{M x Eu y Si 12- (m}}} + n) Al (m + n) O n N 16-n. In the above general formula, M is at least one element containing at least Ca selected from the group consisting of Li, Mg, Ca, Y and lanthanide elements (excluding La and Ce), and has a valence of M. When a is set, ax + 2y = m, x is 0 <x ≦ 1.5, 0.3 ≦ m <4.5, and 0 <n <2.25.

The β-type sialone phosphor containing Eu is a β-type sialon represented by the general formula: Si _6-z Al _z _Oz N _8-z (z = 0.005 to 1) and has a divalent europium as a light emitting center. It is a phosphor in which (Eu ^{2+) is dissolved.}

Further, examples of the nitride phosphor include a CASN phosphor containing Eu, a SCANS phosphor containing Eu, and the like.

The EU-containing CASN phosphor (an example of a nitride phosphor) is represented by, _{for example, the formula CaAlSiN 3} : Eu ²⁺ ^{, using Eu 2+} as an activator and a crystal made of alkaline earth silicate as a base. Refers to a red phosphor. In addition, in the definition of the CASN phosphor containing Eu in this specification, the SCASN phosphor containing Eu is excluded.

The Eu-containing SCASSN phosphor (an example of a nitride phosphor) is represented by, for example, the formula (Sr, Ca) AlSiN ₃ : Eu ²⁺ , which comprises Eu ²⁺ as an activator and is composed of an alkaline earth silicate nitride. A red phosphor whose parent is a crystal.
The above is the description of the configuration of the light emitting substrate 10 and the phosphor substrate 30 of the present embodiment.

<Light emitting operation of the light emitting substrate of this embodiment>
Next, the light emitting operation of the light emitting substrate 10 of the present embodiment will be described with reference to FIG. Here, FIG. 6 is a diagram for explaining the light emitting operation of the light emitting substrate 10, and illustrates the light emitting operation of the plurality of light emitting elements 20. The light emitting element 20 of FIG. 6 corresponds to the LED module 120 of FIGS. 1 and 2.

First, when the operation switch for operating the light emitting element 20 (for example, the function of the drive circuit 140 in FIGS. 1 and 2) is turned on, power supply from the commercial AC power supply AC to the electrode layer 34 via the drive circuit 140 is started. The plurality of light emitting elements 20 radiate and emit light L. A part of the light L reaches the surface 31 of the phosphor substrate 30. Hereinafter, the behavior of the light L will be described separately according to the traveling direction of the emitted light L.

A part of the light L emitted from each light emitting element 20 is emitted to the outside without being incident on the phosphor layer 36. In this case, the wavelength of the light L remains the same as the wavelength of the light L when emitted from each light emitting element 20.

Further, the light of the LED 22 itself in a part of the light L emitted from each light emitting element 20 is incident on the phosphor layer 36. Here, the above-mentioned "light of the LED 22 itself in a part of the light L" is the light of the emitted light L that has not been color-converted by the phosphor of each light emitting element 20 (CSP itself), that is, the LED 22. It means its own light (as an example, light having a blue color (wavelength near 470 nm)).

Then, when the light L of the LED 22 itself collides with the phosphor dispersed in the phosphor layer 36, the phosphor excites and emits excitation light. Here, the reason why the phosphor is excited is that the phosphor dispersed in the phosphor layer 36 uses a phosphor (visible light excited phosphor) having an excitation peak in blue light. Along with this, a part of the energy of the light L is used for exciting the phosphor, so that the light L loses a part of the energy. As a result, the wavelength of the light L is converted (wavelength conversion is performed). For example, depending on the type of phosphor in the phosphor layer 36 (for example, when a red CASN is used as the phosphor), the wavelength of light L becomes longer (for example, 650 nm).

Further, the excitation light in the phosphor layer 36 may be emitted from the phosphor layer 36 as it is, but some of the excitation light goes to the lower electrode layer 34. Then, a part of the excitation light is emitted to the outside by reflection at the electrode layer 34. As described above, when the wavelength of the excitation light by the phosphor is 600 nm or more, the reflection effect can be expected even if the electrode layer 34 is Cu. The wavelength of the light L differs from the above example depending on the type of the phosphor in the phosphor layer 36, but in any case, the wavelength conversion of the light L is performed. For example, when the wavelength of the excitation light is less than 600 nm, a reflection effect can be expected if the electrode layer 34 or its surface is made of, for example, Ag (plating). Further, a reflective layer may be provided on the lower side (insulating layer 32 side) of the phosphor layer 36. The reflective layer is provided with, for example, a white paint such as a titanium oxide filler.

As described above, the light L emitted by each light emitting element 20 (the light L emitted radially by each light emitting element 20) is irradiated to the outside together with the excitation light via the plurality of optical paths as described above. .. Therefore, when the emission wavelength of the phosphor contained in the phosphor layer 36 and the emission wavelength of the phosphor that seals (or covers) the LED 22 in the light emitting element 20 (CSP) are different, the light emitting substrate 10 of the present embodiment is used. The bundle of light L when each light emitting element 20 emits is irradiated together with the excitation light as a bundle of light L containing light L having a wavelength different from the wavelength of light L when each light emitting element 20 emits. For example, the light emitting substrate 10 of the present embodiment includes light L having a wavelength longer than the wavelength of light L when each light emitting element 20 emits a bundle of light L when each light emitting element 20 emits light L. Is irradiated with the above-mentioned excitation light as a bundle of.
On the other hand, when the emission wavelength of the phosphor contained in the phosphor layer 36 and the emission wavelength of the phosphor that seals (or covers) the LED 22 in the light emitting element 20 (CSP) are the same (at the same correlated color temperature). In the case), the light emitting substrate 10 of the present embodiment contains a bundle of light L when each light emitting element 20 emits light L having the same wavelength as the wavelength of light L when each light emitting element 20 emits light L. Is irradiated with the above-mentioned excitation light as a bundle of.
The above is the description of the light emitting operation of the light emitting substrate 10 of the present embodiment.

<Effect of the first embodiment>
Next, the effect of this embodiment will be described with reference to the drawings.
<First effect>
The first effect will be described by comparing the present embodiment with a comparative embodiment (see FIG. 7) described below. Here, in the description of the comparative embodiment, when the same components and the like as in the present embodiment are used, the same names, symbols and the like as in the case of the present embodiment are used for the components and the like. FIG. 7 is a diagram for explaining the light emitting operation of the light emitting substrate 10A in the comparative form. The light emitting substrate 10A of the comparative embodiment (the substrate 30A on which the plurality of light emitting elements 20 are mounted) has the same configuration as the light emitting substrate 10 (fluorescent substrate 30) of the present embodiment except that the phosphor layer 36 is not provided. ing.

In the case of the light emitting substrate 10A of the comparative form, the light L emitted from each light emitting element 20 and incident on the surface 31 of the substrate 30A is reflected or scattered without converting the wavelength. More specifically, the surface 31 has a structure in which a white reflective paint portion is formed, or a structure in which an electrode portion is exposed as an Ag-plated portion, and is reflected and scattered by such a structure. Therefore, in the case of the substrate 30A of the comparative form, it is not possible to adjust the light to a light emission color different from the light emitted by the light emitting element 20 when the light emitting element 20 is mounted. In other words, in the case of the light emitting substrate 10A of the comparative form, it is not possible to adjust the light to emit light having a different emission color from the light emitted by the light emitting element 20. That is, with the conventional LED bulb, the emission color (chromaticity) varies, and it is difficult to control the chromaticity.

On the other hand, in the case of the present embodiment, as shown in FIGS. 5 and 6, the phosphor layer 36 is provided on the surface 31 of the insulating layer 32. Therefore, a part of the light L emitted from each light emitting element 20 is incident on the phosphor layer 36, is wavelength-converted by the phosphor layer 36, and is irradiated to the outside. In this case, a part of the light L radially emitted from each light emitting element 20 is incident on the phosphor layer 36 to excite the phosphor contained in the phosphor layer 36 and generate the excitation light.

Here, FIG. 8 is a graph showing the result of the first test of the correlated color temperature of the light emitting substrate 10 of the present embodiment. Further, FIG. 9 is a graph showing the result of the second test of the correlated color temperature of the light emitting substrate 10 of the present embodiment.

In the first test, when a light emitting substrate 10 having a plurality of light emitting elements 20 having a correlated color temperature equivalent to 2200 K to 2300 K is fed to emit light, the plurality of light emitting elements 20 are subjected to a current (mA) and a correlated color. This is the result of investigating the relationship with the temperature (K). Here, HE (1) and HE (2) indicate a case where the structure of the electrode layer 34 is the same as that of the present embodiment, and FLT (1) and FLT (2) are a pair of electrode pairs 34A in the electrode layer 34. The case where the thickness of the wiring portion 34B is the same as that of the wiring portion 34B (modification example) is shown. As shown in the result of FIG. 8, in any case, the correlated color temperature of the light L emitted by the light emitting substrate 10 is lower than the correlated color temperature of the plurality of light emitting elements 20. That is, in the case of the present embodiment (including the above-mentioned modification), the correlated color temperature could be shifted by providing the phosphor layer 36.

Further, in the second test, a current (mA) was applied to the plurality of light emitting elements 20 when the light emitting substrate 10 provided with the plurality of light emitting elements 20 having a correlated color temperature equivalent to 2900K to 3000K was fed to emit light. This is the result of investigating the relationship with the correlated color temperature (K). Here, HE (1) shows a case where the structure of the electrode layer 34 is the same as that of the present embodiment, and FLT (1) and FLT (2) include a pair of electrode pairs 34A and a wiring portion 34B in the electrode layer 34. The case where the thickness of is the same (modification example) is shown. As shown in the result of FIG. 9, in any case, the correlated color temperature of the light L emitted by the light emitting substrate 10 is lower than the correlated color temperature of the plurality of light emitting elements 20. That is, in the case of the present embodiment (including the above-mentioned modification), the correlated color temperature could be shifted by providing the phosphor layer 36.

Therefore, according to the phosphor substrate 30 of the present embodiment, when the light emitting element 20 is mounted, the light L emitted from the phosphor substrate 30 is changed to light having a different emission color from the light L emitted by the light emitting element 20. Can be adjusted. Along with this, according to the light emitting substrate 10 of the present embodiment, the light L emitted from the phosphor substrate 30 can be adjusted to the light L having a light emitting color different from the light L emitted by the light emitting element 20. From another point of view, according to the light emitting substrate 10 of the present embodiment, it is possible to irradiate the outside with light L having a light emitting color different from the light L emitted by the light emitting element 20.

When the emission wavelength of the phosphor contained in the phosphor layer 36 and the emission wavelength of the phosphor that seals (or covers) the LED 22 in the light emitting element 20 (CSP) are the same (in the case of the same correlated color temperature), In the light emitting substrate 10 of the present embodiment, the bundle of light L when each light emitting element 20 emits is used as a bundle of light L containing light L having the same wavelength as the wavelength of light L when each light emitting element 20 emits. Irradiate with the above excitation light. In this case, the effect of alleviating the chromaticity variation of the mounted light emitting element 20 by the phosphor layer 36 can also be exhibited. That is, according to the lighting equipment having the LED module 120 having such a configuration (the LED lamp 100 described above, the LED lamp 200 described below, the LED lamp 300, and the floodlight 400), high-quality color reproducibility with reduced chromaticity variation. Can be realized. In addition, the color temperature can be adjusted with high accuracy.

<Second effect>
In the case of the comparative form, as shown in FIG. 7, spots are generated in the light L irradiated to the outside due to the arrangement interval of each light emitting element 20. Here, it is said that the larger the spot of light L, the larger the glare.
On the other hand, in the case of the present embodiment, the phosphor layer 36 is provided between the adjacent light emitting elements 20. Therefore, the excitation light is also emitted from the phosphor layer 36.
Therefore, according to the present embodiment, the glare can be reduced as compared with the comparative embodiment. That is, it is possible to realize a lamp with reduced glare (the LED bulb 100 described above, the LED lamp 200 described below, the LED bulb 300, and the floodlight 400).
In particular, in this effect, when the phosphor layer 36 is provided over the entire surface of the insulating layer 32, specifically, the region on the surface 31 of the insulating layer 32 where the phosphor layer 36 is arranged is the surface 13. It is effective in the case of 80% or more of the area.

<Third effect>
Further, in the present embodiment, as described above, the phosphor layer 36 is provided between the adjacent light emitting elements 20 (see FIG. 6). Further, the binder of the phosphor layer 36 has an insulating property equivalent to that of the binder contained in, for example, a solder resist. That is, in the case of the present embodiment, the phosphor layer 36 functions as a solder resist.

<Fourth effect>
Further, in the case of the present embodiment, for example, the phosphor contained in the phosphor layer 36 is a CASN phosphor containing Eu, and the phosphor layer 36 is provided on the wiring portion 34B made of Cu. Therefore, for example, when each light emitting element 20 emits white light L, the excitation light from the CASN phosphor contained in the phosphor layer 36 has a luminous efficiency due to reflection by Cu constituting the lower layer electrode. It is improved (in the configuration of this embodiment, there is a light reflection effect of Cu). Then, in the present embodiment, the white light L can be adjusted to a warmer color light (a color in which the correlated color temperature is shifted to the lower temperature side) by the effect (see FIGS. 8 and 9). In this case, warm color light can be added to the white light of the light emitting element 20, and the special color rendering index R9 value can be increased. This effect is particularly effective for pseudo-white using YAG-based white light (yellow phosphor).

<Fifth effect>
Further, as described above, the plurality of light emitting elements 20 use a heat radiating means such as the heat radiating fin 131 of FIG. 1 and the cooling fan (heat radiating fan 335 described later in FIG. 11) during the light emitting operation, thereby forming a phosphor substrate. Taking 30 as an example, heat is dissipated (cooled) so as to be within 50 ° C. to 100 ° C. from room temperature. Therefore, the heat generated when the LED 22 emits light is diffused over the entire substrate to enhance the heat drawing effect on the housing. In the case of the present embodiment, the region (occupied area of the electrode layer 34) on the surface 31 of the insulating layer 32 where the electrode layer 34 is arranged is, for example, a region of 60% or more of the surface 31 of the insulating layer 32 (the area occupied by the electrode layer 34). Area).
Therefore, the electrode layer 34 (wiring portion 34B) of the present embodiment functions as a heat radiating plate for heat generated from the plurality of light emitting elements 20 in addition to the function as an electric path for feeding power. Therefore, the light emitting element 20 (LED 22) can stably emit light L in a situation where it is not easily affected by heat.
The above is the description of the effect of the first embodiment.

<Relationship between LED junction and phosphor layer>
Here, with reference to FIGS. 10 to 12, suitable examples and unsuitable examples of the positional relationship between the LED 22 (particularly the position of the junction portion) and the phosphor layer 36 in the substrate thickness direction will be described. 10 and 11 show suitable examples. FIG. 12 shows an unsuitable example.

The light emitting element 20 includes an LED 22, a chip electrode 23, and a phosphor sealing layer 24, and is provided on the insulating layer 32. The chip electrode 23 is arranged so as to cover the upper surface of the electrode pair 34A as described above, but is shown here as a diagram for arranging the chip electrode 23 on the insulating layer 32 for simplification and not shown.
The LED 22 is formed on the chip electrode 23. The LED 22 is composed of N-type and P-type semiconductors, and the boundary portion thereof serves as a light emitting layer called a junction portion. Hereinafter, the position on the lowermost side (that is, the insulating layer 32 side) of the light emitting layer is referred to as a junction level 28 for convenience. In the illustrated example, the position of the junction level 28 is illustrated as the same position as the boundary between the LED 22 and the chip electrode 23, but the position is different depending on the position and orientation of the light emitting layer.
The phosphor sealing layer 24 is formed so as to cover the structure in which the chip electrode 23 and the LED 22 are integrated from above. In the figure, the side surface portion of the junction level 28 is covered with the fluorescent material sealing layer 24.

Here, as shown in a preferred example of FIG. 10, the phosphor layer 36 is formed on the insulating layer 32 side from the junction level 28 of the LED 22 which is a light emitting element. More specifically, when the level of the junction level 28 and the level of the upper surface 36a of the phosphor layer 36 are compared, the position in the height direction (board stacking direction) with respect to the upper surface of the insulating layer 32 is the level of the junction level 28. Is higher. For example, in FIG. 10, the height h1 from the insulating layer 32 to the junction level 28 is higher than the height h2 from the insulating layer 32 to the top surface 36a of the phosphor layer. Therefore, the light emitted from the junction level 28 at an angle of at least upward (indicated by the thick arrow in the figure) enters the phosphor layer 36 when it passes through the phosphor sealing layer 24 and is emitted to the outside. There is nothing to do. For example, even the light on the left side in the figure does not hit the phosphor layer 36. Although it depends on the formation position of the phosphor sealing layer 24, the light incident on the phosphor layer 36 is only the light emitted from the junction level 28 at an angle downward.

In a preferred example of FIG. 11, the level of the top surface 36a of the phosphor layer 36 of the phosphor layer 36 (that is, the height h3 from the chip electrode 23) is higher than the junction level 28 and is the same as the position of the top surface of the light emitting element 20. It has become. The level of the upper surface 36a of the phosphor layer is not limited to the same position as the upper surface of the light emitting element 20. Therefore, a part of the light emitted from the junction level 28 through the phosphor sealing layer 24 at an upward angle (for example, the light output from the side surface of the light emitting element 20 like the light on the left side in the drawing). Is incident on the phosphor layer 36. This configuration is suitable when it is desired to incorporate the light output from the side surface side of the light emitting element 20 into the phosphor layer 36.

In an unsuitable example of FIG. 12, a raised layer 37 is provided between the phosphor layer 36 and the chip electrode 23. The level of the lower surface 36b of the phosphor layer 36 of the phosphor layer 36 (that is, the thickness h4 of the raised layer 37) is higher than the junction level 28. Therefore, a part of the light emitted from the junction level 28 through the phosphor sealing layer 24 at an upward angle (for example, the light on the left side in the figure) is disturbed by the raised layer 37 and fluoresces. Cannot enter the body layer 36. This is because the function of the phosphor layer 36 is not fully exhibited. Therefore, when the raised layer 37 is provided, it is desirable that the level of the lower surface 36b of the phosphor layer is lower than the junction level 28.

As described above, as shown in FIGS. 10 and 11, by adjusting the thickness of the phosphor layer 36, the light incident on the phosphor layer 36 can be adjusted. When the raised layer 37 is provided under the phosphor layer 36, the configuration shown in FIG. 12 (the level of the lower surface 36b of the phosphor layer is higher than the junction level 28) is avoided, and the lower surface 36b of the phosphor layer is avoided. By lowering the level of the above to the junction level 28, the light of the light emitting element 20 can be incident on the phosphor layer 36 without being disturbed by the raised layer 37.

<< Second Embodiment >>
Next, the LED lamp 200 of the second embodiment will be described.

<Configuration of LED lamp 200>
FIG. 13 is a diagram showing a schematic configuration of the LED lamp 200 according to the present embodiment. The LED lamp 200 is a so-called horizontal LED lamp, and has a structure of irradiating the lower surface with light by mounting the LED lamp 200 in a horizontal state. Specifically, the LED lamp 200 includes a tubular housing 210, an LED module 220, a body 230, and a drive circuit (not shown). A transparent cover 211 is attached to the housing 210. The cover 211 may be made of translucent, opalescent, or smoked as well as transparent. The LED module 220 is mounted inside the housing 210. The body portion 230 includes a heat radiation fin 231 and a base 132. In addition to the heat radiating fins 231, a heat radiating fan, a heat radiating opening, and a heat radiating slit may be provided as the heat radiating means.

In the LED module 220, a plurality of LED chips 221 are arranged in a grid pattern on a rectangular phosphor substrate 222. Here, 12 LED chips 221 are provided in a 4 × 3 arrangement. The basic structure of the phosphor substrate 222 is the same as that of the phosphor substrate 122 of the first embodiment, and the description thereof will be omitted. The difference is that a plurality of LED chips 221 are provided.

Specifically, the plurality of LED chips 221 emit light independently for each row. That is, four LED chips 221 are configured as one series, and three series are arranged in parallel in three rows. The drive circuit has three drive outputs corresponding to the three series bodies, so that each series body can be driven independently. With such a configuration, even if any row (that is, a series) of the LED chips 221 is turned off due to a failure, the entire LED chip 221 is not turned off. The number of LED chips 221 connected to one series is determined by the voltage drop and supply voltage of the LED chips 221.

<Effect of the second embodiment>
Also in this embodiment, the same effect as that of the first embodiment can be obtained.

<< Third Embodiment >>
Next, the LED bulb 300 of the third embodiment will be described.

<Configuration of LED bulb 300>
FIG. 14 is a diagram showing a schematic configuration of the LED bulb 300 according to the present embodiment. FIG. 15 shows the LED module 320.
The difference from the LED bulb 100 of the first embodiment is that the LED bulb 300 of the present embodiment has a heat dissipation fan 335 and the LED module 320 has a plurality of LED chips 321.

Specifically, the LED bulb 300 includes a cover member 310, an LED module 320, a body portion 330, and a drive circuit (not shown).

As shown in FIG. 15, the LED module 320 includes a phosphor substrate 322 that is substantially circular in top view and a plurality of (here, eight) LED chips 321. The plurality of LED chips 321 are provided in an annular shape on the phosphor substrate 322.

The body portion 330 is formed of, for example, aluminum die-cast.
The body portion 330 includes a heat radiation fin 333, a body portion main body portion 331, and a base 332 from the upper side (that is, the cover member 310 side).

The heat radiation fin 333 includes, for example, a disk-shaped plate provided on the upper side (cover member 310 side) in the drawing, and a plurality of fins extending from the lower side surface of the plate toward the lower side in the drawing at a predetermined height. Each fin extends radially outward, for example in bottom view. Further, the plurality of fins are provided side by side in an annular shape along the radial direction.

A region in which the heights of the plurality of fins are shortened is formed in a range of a predetermined diameter from the bottom view center (axis center) of the heat radiation fins 333. A heat dissipation fan 335 is attached to the area. The heat dissipation fan 335 is, for example, a DC fan driven by a brushless motor.

The outermost (that is, the outer peripheral edge) of the plurality of fins constituting the heat dissipation fan 335 are not connected and have an open shape. The air flow that cooled the fins is discharged to the outside from the open portion.

The LED module 320 (fluorescent substrate 322) is attached to the upper side surface (upper surface of the disk-shaped plate) of the heat radiation fin 333.

Below the heat radiation fin 333, a concentric body body 331 having a space formed inside is provided. Specifically, the body portion 331 is formed of, for example, aluminum die-cast, and the surface thereof is coated with a heat radiating paint and electrically insulated.

The body portion main body portion 331 has an inverted conical trapezium shape that becomes smaller in diameter as it goes downward, and a plurality of slit portions 331a are formed on its side surface. The slit portion 331a communicates the internal space of the body portion main body portion 331 with the outside. A base 332 is provided on the lower side of the body portion 331 in the drawing.

A drive circuit (not shown) is arranged in the internal space of the body portion main body 331 as in the first embodiment, and the above-mentioned heat radiation fin 333 is attached on the drive circuit (not shown) so as to cover the internal space.

<Effect of the third embodiment>
The LED bulb 300 of the present embodiment has the same effect as that of the first and second embodiments. Furthermore, it has the following actions and effects.
By the action of the heat radiating fan 335, the cooling air flow is taken into the internal space of the body portion 331 from the slit portion 331a and supplied to the heat radiating fin 333. The air flow that has cooled the heat radiating fins 333 is discharged from a portion of the heat radiating fins 333 that is open to the outside.
By providing a heat radiating means (heat radiating device) that combines a heat radiating fin 333, a heat radiating fan 335, and a heat radiating slit 331a as in the present embodiment, a large number of LED chips 321 are provided in the LED module 320 to provide the LED chip 321 and drive. Even when the heat generated by the circuit 340 is large, it can be effectively cooled (heat radiated). That is, the phosphor substrate 322 can be effectively dissipated (cooled) so as to be within 50 ° C. to 100 ° C. from room temperature as an example. As a result, the LED module 320 can stably emit light L in a situation where it is not easily affected by heat.

<< Fourth Embodiment >>
Subsequently, the floodlight 400 of the fourth embodiment will be described with reference to FIGS. 16 and 17. FIG. 16 is a perspective view of the floodlight 400. FIG. 17 is a perspective view of the LED lamp main body 401, showing a state in which the housing 402 is removed from the floodlight 400 of FIG.

<Structure of floodlight 400>
The floodlight 400 is used, for example, as lighting for large sports facilities, outdoor commercial facilities, and the like. The floodlight 400 includes a substantially rectangular parallelepiped LED lamp main body 401, a housing 402 for accommodating the LED lamp main body 401, and a power supply device (not shown). In the figure, the light projection direction (that is, the surface on the arrangement side of the LED module 420) is shown as the lower side. As the floodlight 400, a plurality of LED lamp main bodies 401 may be configured as one unit and may be integrally housed in the housing 402.

The LED lamp main body 401 includes a lamp module 410, a heat radiating plate 440, and a drive circuit (not shown).

The lamp module 410 includes a rectangular phosphor substrate 422 and a plurality of LED chips 421 in a plan view (here, when viewed from below). The LED chip 421 is, for example, a CSP in which a flip chip LED is incorporated.

The plurality of LED chips 421 are arranged in a houndstooth pattern. More specifically, in the plurality of LED chips 421, a group of 10 LED chips arranged at a predetermined pitch in the longitudinal direction (horizontal direction in the drawing) is arranged in three rows in the lateral direction. Here, the group in the second row is shifted to the right by one LED chip 421 from the groups in the first and third rows in the drawing. The arrangement of the LED chips 421 is not limited to the houndstooth pattern, and may be a regular lattice pattern, and various arrangements can be applied.

A heat radiating plate 440 is attached as a heat radiating means on the upper surface of the lamp module 410 (the surface opposite to the surface on which the LED chip 421 is arranged). The heat radiating plate 440 is made of, for example, aluminum die-cast, and a plurality of fins are extended to the upper side in the drawing. A heat dissipation fan may be further provided as the heat dissipation means.

<Effect of Fourth Embodiment>
According to the fourth embodiment, the same effect as that of the first to third embodiments can be obtained. Further, when the floodlight 400 is installed in a large sports facility, the light emitted from the floodlight 400 is strong, so that it is required to provide a safe environment without adversely affecting the competition of athletes and the like. That is, it is necessary to prevent the competition from being interrupted or injured due to dazzling. In the floodlight 400 of the present embodiment, the light projected via the phosphor substrate 422 can alleviate the glare of the light directly projected from the LED chip 421, realizing a safe activity environment. it can.

<< Modified example of the embodiment >>
As described above, the present invention has been described with reference to the first to fourth embodiments as examples, but the present invention is not limited to the above-described embodiments. The technical scope of the present invention also includes, for example, the following forms (modifications).

For example, in the description of this embodiment, an example of the light emitting element 20 is a CSP. However, an example of the light emitting element 20 may be other than the CSP. For example, it may simply be equipped with a flip chip. It can also be applied to the substrate itself of a COB device. Further, in the light emitting substrate 10 of FIG. 5, the phosphor layer 36 has a configuration formed on the electrode layer 34 laminated on the insulating layer 32, but the present invention is not limited to this configuration, and the phosphor layer 36 and the electrode layer 34 are not limited to this configuration. An intervening layer (layer of insulating material) may be provided between the two. By adjusting the thickness and shape of the intervening layer (insulating material layer), the amount of the phosphor layer 36 and the characteristics (direction, amount of fluorescence, etc.) of the light output from the phosphor layer 36 can be adjusted.

<< Summary of features and effects of the embodiment >>
The features and effects of the embodiments of the invention are summarized as follows.
<1> The lamps (100, 200, 300, 400) according to the embodiment of the present invention are
With the substrate (122, 222, 222, 422),
The light emitting element (20) mounted on the substrate (122, 222, 222, 422) and
A drive circuit (140, 340) that supplies electric power to the light emitting elements (20, 121, 221, 321 and 421) to drive the light emitting element.
With
The substrate (122, 222, 222, 422) is
Insulating base material (32) and
A phosphor layer composed of phosphor particles arranged on one surface of the insulating base material (32) and having a emission peak wavelength in the visible light region when the emission of the light emitting element (20) is used as excitation light, and an organic resin. (36) and
To be equipped.
Thereby, the light emitted from the substrate (122, 222, 222, 422) can be adjusted to the light having an emission color different from the light emitted by the light emitting element (20, 121, 222, 222). From another viewpoint, the phosphor layer (36) alleviates the chromaticity variation of the light emitting elements (20, 121, 221, 321 and 421).

<2> A heat radiating means (131, 231, 331, 333, 335, 440) that dissipates heat generated by the light emitting drive of the light emitting element (20, 121, 221, 321, 421) is provided.
Thereby, the substrate (122, 222, 222, 422) can be effectively dissipated (cooled) so as to be within 50 ° C. to 100 ° C. from room temperature as an example.
Further, a substrate (122, 222, 222, 422) or a drive circuit in which a large number of light emitting elements (20, 121, 221, 321, 421) are provided and the light emitting elements (20, 121, 222, 222) are mounted is provided. Even when the heat generation is large, it can be effectively cooled (heat radiated). As a result, the light L can be stably emitted in a situation where it is not easily affected by heat.

<3> The light emitting element (20, 121, 221, 321, 421) is a CSP (121, 221, 321, 421) in which an LED (22) is incorporated and packaged in a chip size.
By using CSP, board mounting can be realized stably and at low cost.

<4> A plurality of the light emitting elements (20, 120, 220, 320, 420) are provided.
When there are a plurality of light emitting elements (20, 120, 220, 320, 420), a phosphor layer (36) is provided between adjacent light emitting elements (20, 120, 220, 320). Therefore, the excitation light is also emitted from the phosphor layer (36).
Therefore, the glare can be reduced as compared with the form without the phosphor layer (36). That is, it is possible to realize a lamp with reduced glare.

<5> The plurality of light emitting elements (20, 220, 320, 420) are arranged in a grid pattern on the substrate (222, 422). As a result, it is possible to realize a lamp with suppressed variation in light emission.

<6> The plurality of light emitting elements (20, 120, 320) are arranged in an annular shape on the substrate (122, 222). As a result, it is possible to realize a lamp with suppressed variation in light emission.

<7> The drive circuit (140) independently drives the plurality of light emitting elements (20, 120, 220, 320) to emit light. Even if one of the light emitting elements is turned off, the influence on the light emission of the other light emitting element can be eliminated. That is, it is possible to suppress the deterioration of the light emission intensity and the quality of the lamp due to the non-lighting of a certain light emitting element to the minimum necessary.

<8> The insulating base material (32) is at least one selected from the group consisting of an organic resin substrate, a ceramic substrate, and a plastic molded product.
The coefficients of thermal expansion (CTE) in the longitudinal direction and the lateral direction of these materials are almost the same as those in the case of the light emitting element (20), respectively, and the influence of the thermal stress acting on the light emitting element (20) can be suppressed. That is, it is possible to realize a lamp with high reliability.

<9> The phosphor particles include _{at least one selected from the group consisting of CASN, SCANSN, LaSiN, Sr 2} Si ₅ N ₈ , Ba ₂ Si ₅ N ₈ , α-type sialon, β-type sialon, and LuAG.
By combining a light emitting element (light source) and a wavelength converter containing phosphor particles, it is possible to emit light having high emission intensity.

<10> The organic resin contained in the phosphor layer (36) includes any of a silicone resin, an acrylic resin, and an epoxy resin. In the case of the present embodiment, the phosphor layer 36 functions as a solder resist, and desired insulating properties can be obtained. Thereby, the reliability of the phosphor layer (36), that is, the reliability of the lamp can be improved.

twenty five
<11> The surface of the phosphor layer (36) on the insulating base material side is closer to the insulating base material (32) than the junction level (28) of the LED 22 when the light emitting element is the LED 22. It is formed.
Light emitted from the junction level (28), which is the light emitting layer, with an upward angular component may enter the phosphor layer 36 without being disturbed by other configurations (for example, the raised layer 37). it can.

This application claims priority based on Japanese Application Japanese Patent Application No. 2019-233867 filed on December 25, 2019, and incorporates all of its disclosures herein.

28

Junction level

100, 300

LED bulb

110, 310

Cover member

120, 220, 320, 420

LED module

121, 221, 321, 421

LED chip

122, 222, 322, 422

Fluorescent substrate

130, 230, 330

Body

131, 231 and 333

Heat dissipation fins

132, 232, 332 Bases 140, 240, 340 Drive circuit 200 LED lamp 210 Housing 211 Cover 331 Body body 331a Body top 331b Heat dissipation slit 331c Body bottom 440 Radiation plate 400 Floodlight 401 LED lamp body

Claims

With the board
The light emitting element mounted on the substrate and
A drive circuit that supplies electric power to the light emitting element to drive the light emitting element,
With
The substrate is
Insulating base material and
A phosphor layer which is arranged on one surface of the insulating base material and whose emission peak wavelength is in the visible light region when the emission of the light emitting element is used as excitation light, and a phosphor layer containing an organic resin.
Equipped with a lamp.
The lamp according to claim 1, further comprising a heat radiating means for radiating heat generated by driving the light emitting element.
The lamp according to claim 1 or 2, wherein the light emitting element comprises a CSP in which an LED is incorporated and packaged in a chip size.
The lamp according to any one of claims 1 to 3, wherein a plurality of the light emitting elements are provided.
The lamp according to claim 4, wherein the plurality of light emitting elements are arranged in a grid pattern on the substrate.
The lamp according to claim 4, wherein the plurality of light emitting elements are arranged in an annular shape on the substrate.
The lamp according to any one of claims 4 to 6, wherein the drive circuit drives the plurality of light emitting elements independently to emit light.
The lamp according to any one of claims 1 to 7, wherein the insulating base material is at least one selected from the group consisting of an organic resin substrate, a ceramic substrate, and a plastic molded body.
The phosphor particles comprise CASN, SCASN, LaSiN, Sr 2 Si 5 N 8, Ba 2 Si 5 N 8, α -sialon, at least one selected from the group consisting of β-type sialon and LuAG, claim 1 The lamp according to any one of items 1 to 8.
The lighting tool according to any one of claims 1 to 9, wherein the organic resin contained in the phosphor layer contains any one of a silicone resin, an acrylic resin and an epoxy resin.
Any of claims 1 to 10, wherein the surface of the phosphor layer on the insulating base material side is formed on the insulating base material side from the level of the junction of the LED when the light emitting element is an LED. The lighting equipment described in item 1.