WO2021132131A1 - Lampe - Google Patents

Lampe Download PDF

Info

Publication number
WO2021132131A1
WO2021132131A1 PCT/JP2020/047625 JP2020047625W WO2021132131A1 WO 2021132131 A1 WO2021132131 A1 WO 2021132131A1 JP 2020047625 W JP2020047625 W JP 2020047625W WO 2021132131 A1 WO2021132131 A1 WO 2021132131A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
light
phosphor
substrate
led
Prior art date
Application number
PCT/JP2020/047625
Other languages
English (en)
Japanese (ja)
Inventor
正宏 小西
Original Assignee
デンカ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デンカ株式会社 filed Critical デンカ株式会社
Priority to CN202080090138.9A priority Critical patent/CN115135923A/zh
Priority to KR1020227025210A priority patent/KR20220119119A/ko
Priority to JP2021567428A priority patent/JP7437419B2/ja
Publication of WO2021132131A1 publication Critical patent/WO2021132131A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp.
  • Patent Document 1 discloses a light bulb type lighting device including an LED as a light emitting element. Specifically, a plurality of LEDs are arranged in an annular shape on the substrate, and the light emitted from the LEDs is output to the outside via the cover member.
  • An object of the present invention is to provide a lamp capable of adjusting the light emitted from a phosphor substrate when a light emitting element is mounted to a light having an emission color different from the light emitted by the light emitting element.
  • the lamp of the present invention includes a substrate and The light emitting element mounted on the substrate and A drive circuit that supplies electric power to the light emitting element to drive the light emitting element,
  • the substrate is Insulating base material and A phosphor layer which is arranged on one surface of the insulating base material and whose emission peak wavelength is in the visible light region when the emission of the light emitting element is used as excitation light, and a phosphor layer containing an organic resin. To be equipped.
  • the substrate on which the light emitting element is mounted is configured as a phosphor substrate, and the light emitted from the phosphor substrate can be adjusted to light having a different emission color from the light emitted by the light emitting element.
  • FIG. 1 is a perspective view of the LED bulb 100 of the present embodiment.
  • FIG. 2 is an exploded perspective view of the LED bulb 100.
  • the cover member 110 side will be described as the upper side
  • the base 132 side will be described as the lower side.
  • the LED bulb 100 includes a cover member 110, an LED module 120, a body 130, and a drive circuit 140.
  • the LED module 120 includes a phosphor substrate 122 and an LED chip 121.
  • the phosphor substrate 122 has a substantially circular shape when viewed from above.
  • one LED chip 121 is mounted in the center of the phosphor substrate 122.
  • the LED chip 121 is, for example, a CSP (Chip Scale Package) in which a flip chip LED is incorporated.
  • the phosphor substrate 122 As an example of the phosphor substrate 122, a substantially circular shape is shown in the top view, but a rectangle or other appropriate shape is selected according to the shape of the LED bulb 100, the number of mounted LED chips 121, the mounting position, the arrangement, and the like.
  • the LED module 120b has a configuration in which one LED chip 121 is arranged in the center of a rectangular (square) phosphor substrate 122b.
  • a plurality of LED chips 221 may be arranged in a grid pattern on a rectangular phosphor substrate 222.
  • a plurality of LED chips 321 may be arranged in an annular shape on the circular phosphor substrate 322.
  • the phosphor substrate 122 has a configuration in which a phosphor layer is provided on one surface of the insulating substrate.
  • the LED chip 121 is mounted on the phosphor substrate 122. The specific structures and features of the phosphor substrate 122 and the LED chip 121 will be described later in FIGS. 5 to 9.
  • the body portion 130 is formed of, for example, aluminum die-cast.
  • a heat radiation fin 131 is formed in a slit shape on the surface of the body portion 130 as a heat radiation means. Further, the surface of the body 130 is coated with a heat radiating paint and electrically insulated. An internal space is formed in the body portion 130, and a base 132 is attached to the lower portion of the body portion 130.
  • the heat radiating fin 131 is exemplified as the heat radiating means, there are also a heat radiating fan, a heat radiating opening, and a heat radiating slit. Based on the required heat dissipation performance, noise performance, etc., the optimum heat dissipation means is appropriately used.
  • a power supply drive circuit 140 is arranged in the internal space of the body 130, and the above-mentioned LED module 120 is mounted on the power supply drive circuit 140 so as to cover the internal space.
  • a heat radiating fan is provided, a temperature sensor is provided in the LED light bulb 100, and the drive circuit 140 controls the driving of the heat radiating fan, so that the inside of the LED light bulb 100 can be controlled to a desired temperature range.
  • the cover member 110 is made of, for example, a thermoplastic resin or glass, has a spherical shape as shown in the figure, and the lower side in the figure (that is, the body portion 130 side) is open.
  • the cover member 110 is attached at an open portion so as to cover the upper portion of the body portion 130 to which the LED module 120 and the drive circuit 140 are attached.
  • the cover member 110 may contain a diffusing material.
  • the drive circuit 140 includes an LED driver IC, a capacitor, and the like, and controls the on-duty (off-duty) of the drive element Q by PWM (Pulse Width Modulation) by switching operation to bring the current flowing through the LED chip 121 to a desired value. Control.
  • PWM Pulse Width Modulation
  • FIG. 4 is a circuit example focusing on the LED drive circuit for the drive circuit 140.
  • the drive circuit 140 includes a drive element Q of the LED chip 121, an LED driver 141 that PWM-controls the drive element Q, a rectifier circuit 142 that rectifies the power of a commercial AC power supply AC, a step-down chopper circuit 143, and a current detection resistor. It is equipped with 144.
  • This circuit configuration is an example.
  • the drive element Q may be included in the LED driver 141, or the drive circuit 140 may be integrated with the LED module 120.
  • the function of converting the commercial AC power supply AC into direct current may be provided as a separate body (for example, a dedicated power supply).
  • FIG. 5 is a partial cross-sectional view of the light emitting substrate 10 which is a specific structure of the light emitting element 20 (LED module 120).
  • Each of the light emitting elements 20 is a CSP (Chip Scale Package) in which a flip chip LED 22 (hereinafter, simply referred to as “LED 22”) is incorporated as described above.
  • LED 22 a flip chip LED 22
  • One or more light emitting elements 20 are arranged on the surface 31 (an example of one surface) of the phosphor substrate 30.
  • the light emitting elements 20 are provided on the phosphor substrate 30 in a state of being regularly arranged over the entire surface 31.
  • the correlated color temperature of the light emitted by the light emitting element 20 is, for example, 3,018K.
  • the light emitting element 20 is radiated (cooled) so as to fall within the range of 50 ° C. to 100 ° C. from room temperature, taking the phosphor substrate 30 as an example, by using, for example, the above-mentioned heat radiating means during the light emitting operation.
  • the phosphor substrate 30 of the present embodiment includes an insulating layer 32 (an example of an insulating substrate), an electrode layer 34, a phosphor layer 36, and a back surface pattern layer (not shown).
  • the phosphor layer 36 is arranged on the surface 31 of the insulating layer 32 and the electrode layer 34, except for a plurality of electrode pairs 34A, which will be described later.
  • the phosphor substrate 30 of the present embodiment is manufactured by processing (etching or the like) a double-sided plate (hereinafter referred to as "motherboard MB") in which copper foil layers are provided on both sides of the insulating plate.
  • motherboard MB a double-sided plate
  • CS-3305A manufactured by Risho Kogyo Co., Ltd. is used.
  • the shape is circular or rectangular when viewed from the front surface 31 and the back surface 33 as an example.
  • the material is, for example, an insulating material containing a bismaleimide resin and a glass cloth.
  • the thickness is, for example, 100 ⁇ m to 200 ⁇ m.
  • the coefficient of thermal expansion (CTE) in the vertical direction and the horizontal direction is, for example, 10 ppm / ° C. or less in the range of 50 ° C. to 100 ° C., respectively. From another point of view, the coefficient of thermal expansion (CTE) in the vertical direction and the horizontal direction is 6 ppm / K, respectively, as an example.
  • the glass transition temperature for example, is higher than 300 ° C.
  • the storage elastic modulus is larger than 1.0 ⁇ 10 10 Pa and smaller than 1.0 ⁇ 10 11 Pa in the range of 100 ° C to 300 ° C.
  • the electrode layer 34 of the present embodiment is a metal layer provided on the surface 31 side of the insulating layer 32.
  • the electrode layer 34 of this embodiment is, for example, a copper foil layer (a layer made of Cu). In other words, the electrode layer 34 contains copper at least on its surface.
  • the electrode layer 34 has a pattern provided on the insulating layer 32, and is electrically connected to a terminal (not shown) to which a connector (not shown) is joined. Then, the electrode layer 34 supplies the electric power supplied from the external power source (drive circuit 140 in the first embodiment) to the light emitting element 20 at the time of configuring the light emitting substrate 10 by directly attaching the lead wire or through the connector. To do.
  • a part of the electrode layer 34 is a plurality of electrode pairs 34A to which the plurality of light emitting elements 20 are bonded. As shown in the figure, as an example, the plurality of electrode pairs 34A project outward from the wiring portion 34B in the thickness direction of the insulating layer 32 (fluorescent substrate 30).
  • the region on the surface 31 of the insulating layer 32 where the electrode layer 34 is arranged is, for example, a region of 60% or more of the surface 31 of the insulating layer 32.
  • the phosphor layer 36 of the present embodiment is arranged on a portion of the surface 31 of the insulating layer 32 and the electrode layer 34 other than the plurality of electrode pairs 34A.
  • the region where the phosphor layer 36 is arranged on the surface 31 of the insulating layer 32 is, for example, 80% or more of the region on the surface 31 of the insulating layer 32.
  • the phosphor layer 36 of the present embodiment is, for example, an insulating layer containing a phosphor and a binder, which will be described later.
  • the phosphor contained in the phosphor layer 36 is fine particles that are held in a state of being dispersed in a binder, and has a property of exciting the light emitted by each light emitting element 20 as excitation light.
  • the phosphor of the present embodiment has a property that the emission peak wavelength when the emission of the light emitting element 20 is used as excitation light is in the visible light region.
  • the binder may be, for example, an epoxy-based binder, an acrylate-based binder, a silicone-based binder, or the like, and may have an insulating property equivalent to that of the binder contained in the solder resist.
  • the phosphor contained in the phosphor layer 36 of the present embodiment is, for example, an ⁇ -type sialone phosphor containing Eu, a ⁇ -type sialon phosphor containing Eu, a CASN phosphor containing Eu, and Eu. It is considered to be at least one or more phosphors selected from the group consisting of SCASSN phosphors containing.
  • the above-mentioned phosphor is an example of the present embodiment, and may be a phosphor other than the above-mentioned phosphor, such as YAG, LuAG, BOS and other visible light-excited phosphors.
  • M is at least one element containing at least Ca selected from the group consisting of Li, Mg, Ca, Y and lanthanide elements (excluding La and Ce), and has a valence of M.
  • ax + 2y m
  • x is 0 ⁇ x ⁇ 1.5, 0.3 ⁇ m ⁇ 4.5, and 0 ⁇ n ⁇ 2.25.
  • examples of the nitride phosphor include a CASN phosphor containing Eu, a SCANS phosphor containing Eu, and the like.
  • the EU-containing CASN phosphor (an example of a nitride phosphor) is represented by, for example, the formula CaAlSiN 3 : Eu 2+ , using Eu 2+ as an activator and a crystal made of alkaline earth silicate as a base. Refers to a red phosphor.
  • the SCASN phosphor containing Eu is excluded.
  • the Eu-containing SCASSN phosphor (an example of a nitride phosphor) is represented by, for example, the formula (Sr, Ca) AlSiN 3 : Eu 2+ , which comprises Eu 2+ as an activator and is composed of an alkaline earth silicate nitride.
  • a red phosphor whose parent is a crystal. The above is the description of the configuration of the light emitting substrate 10 and the phosphor substrate 30 of the present embodiment.
  • FIG. 6 is a diagram for explaining the light emitting operation of the light emitting substrate 10, and illustrates the light emitting operation of the plurality of light emitting elements 20.
  • the light emitting element 20 of FIG. 6 corresponds to the LED module 120 of FIGS. 1 and 2.
  • the operation switch for operating the light emitting element 20 for example, the function of the drive circuit 140 in FIGS. 1 and 2
  • power supply from the commercial AC power supply AC to the electrode layer 34 via the drive circuit 140 is started.
  • the plurality of light emitting elements 20 radiate and emit light L. A part of the light L reaches the surface 31 of the phosphor substrate 30.
  • the behavior of the light L will be described separately according to the traveling direction of the emitted light L.
  • a part of the light L emitted from each light emitting element 20 is emitted to the outside without being incident on the phosphor layer 36.
  • the wavelength of the light L remains the same as the wavelength of the light L when emitted from each light emitting element 20.
  • the light of the LED 22 itself in a part of the light L emitted from each light emitting element 20 is incident on the phosphor layer 36.
  • the above-mentioned "light of the LED 22 itself in a part of the light L” is the light of the emitted light L that has not been color-converted by the phosphor of each light emitting element 20 (CSP itself), that is, the LED 22. It means its own light (as an example, light having a blue color (wavelength near 470 nm)).
  • the phosphor excites and emits excitation light.
  • the reason why the phosphor is excited is that the phosphor dispersed in the phosphor layer 36 uses a phosphor (visible light excited phosphor) having an excitation peak in blue light.
  • a part of the energy of the light L is used for exciting the phosphor, so that the light L loses a part of the energy.
  • the wavelength of the light L is converted (wavelength conversion is performed). For example, depending on the type of phosphor in the phosphor layer 36 (for example, when a red CASN is used as the phosphor), the wavelength of light L becomes longer (for example, 650 nm).
  • the excitation light in the phosphor layer 36 may be emitted from the phosphor layer 36 as it is, but some of the excitation light goes to the lower electrode layer 34. Then, a part of the excitation light is emitted to the outside by reflection at the electrode layer 34.
  • the wavelength of the excitation light by the phosphor is 600 nm or more, the reflection effect can be expected even if the electrode layer 34 is Cu.
  • the wavelength of the light L differs from the above example depending on the type of the phosphor in the phosphor layer 36, but in any case, the wavelength conversion of the light L is performed.
  • a reflection effect can be expected if the electrode layer 34 or its surface is made of, for example, Ag (plating).
  • a reflective layer may be provided on the lower side (insulating layer 32 side) of the phosphor layer 36.
  • the reflective layer is provided with, for example, a white paint such as a titanium oxide filler.
  • each light emitting element 20 the light L emitted radially by each light emitting element 20
  • the light emitting substrate 10 of the present embodiment is used.
  • the bundle of light L when each light emitting element 20 emits is irradiated together with the excitation light as a bundle of light L containing light L having a wavelength different from the wavelength of light L when each light emitting element 20 emits.
  • the light emitting substrate 10 of the present embodiment includes light L having a wavelength longer than the wavelength of light L when each light emitting element 20 emits a bundle of light L when each light emitting element 20 emits light L. Is irradiated with the above-mentioned excitation light as a bundle of.
  • the emission wavelength of the phosphor contained in the phosphor layer 36 and the emission wavelength of the phosphor that seals (or covers) the LED 22 in the light emitting element 20 (CSP) are the same (at the same correlated color temperature).
  • the light emitting substrate 10 of the present embodiment contains a bundle of light L when each light emitting element 20 emits light L having the same wavelength as the wavelength of light L when each light emitting element 20 emits light L. Is irradiated with the above-mentioned excitation light as a bundle of. The above is the description of the light emitting operation of the light emitting substrate 10 of the present embodiment.
  • FIG. 7 is a diagram for explaining the light emitting operation of the light emitting substrate 10A in the comparative form.
  • the light emitting substrate 10A of the comparative embodiment (the substrate 30A on which the plurality of light emitting elements 20 are mounted) has the same configuration as the light emitting substrate 10 (fluorescent substrate 30) of the present embodiment except that the phosphor layer 36 is not provided. ing.
  • the light L emitted from each light emitting element 20 and incident on the surface 31 of the substrate 30A is reflected or scattered without converting the wavelength.
  • the surface 31 has a structure in which a white reflective paint portion is formed, or a structure in which an electrode portion is exposed as an Ag-plated portion, and is reflected and scattered by such a structure. Therefore, in the case of the substrate 30A of the comparative form, it is not possible to adjust the light to a light emission color different from the light emitted by the light emitting element 20 when the light emitting element 20 is mounted.
  • the light emitting substrate 10A of the comparative form it is not possible to adjust the light to emit light having a different emission color from the light emitted by the light emitting element 20. That is, with the conventional LED bulb, the emission color (chromaticity) varies, and it is difficult to control the chromaticity.
  • the phosphor layer 36 is provided on the surface 31 of the insulating layer 32. Therefore, a part of the light L emitted from each light emitting element 20 is incident on the phosphor layer 36, is wavelength-converted by the phosphor layer 36, and is irradiated to the outside. In this case, a part of the light L radially emitted from each light emitting element 20 is incident on the phosphor layer 36 to excite the phosphor contained in the phosphor layer 36 and generate the excitation light.
  • FIG. 8 is a graph showing the result of the first test of the correlated color temperature of the light emitting substrate 10 of the present embodiment.
  • FIG. 9 is a graph showing the result of the second test of the correlated color temperature of the light emitting substrate 10 of the present embodiment.
  • HE (1) and HE (2) indicate a case where the structure of the electrode layer 34 is the same as that of the present embodiment, and FLT (1) and FLT (2) are a pair of electrode pairs 34A in the electrode layer 34.
  • the correlated color temperature of the light L emitted by the light emitting substrate 10 is lower than the correlated color temperature of the plurality of light emitting elements 20. That is, in the case of the present embodiment (including the above-mentioned modification), the correlated color temperature could be shifted by providing the phosphor layer 36.
  • HE (1) shows a case where the structure of the electrode layer 34 is the same as that of the present embodiment
  • FLT (1) and FLT (2) include a pair of electrode pairs 34A and a wiring portion 34B in the electrode layer 34.
  • the case where the thickness of is the same (modification example) is shown. As shown in the result of FIG.
  • the correlated color temperature of the light L emitted by the light emitting substrate 10 is lower than the correlated color temperature of the plurality of light emitting elements 20. That is, in the case of the present embodiment (including the above-mentioned modification), the correlated color temperature could be shifted by providing the phosphor layer 36.
  • the light L emitted from the phosphor substrate 30 is changed to light having a different emission color from the light L emitted by the light emitting element 20. Can be adjusted.
  • the light L emitted from the phosphor substrate 30 can be adjusted to the light L having a light emitting color different from the light L emitted by the light emitting element 20. From another point of view, according to the light emitting substrate 10 of the present embodiment, it is possible to irradiate the outside with light L having a light emitting color different from the light L emitted by the light emitting element 20.
  • the bundle of light L when each light emitting element 20 emits is used as a bundle of light L containing light L having the same wavelength as the wavelength of light L when each light emitting element 20 emits. Irradiate with the above excitation light. In this case, the effect of alleviating the chromaticity variation of the mounted light emitting element 20 by the phosphor layer 36 can also be exhibited.
  • the lighting equipment having the LED module 120 having such a configuration (the LED lamp 100 described above, the LED lamp 200 described below, the LED lamp 300, and the floodlight 400), high-quality color reproducibility with reduced chromaticity variation. Can be realized. In addition, the color temperature can be adjusted with high accuracy.
  • the region on the surface 31 of the insulating layer 32 where the phosphor layer 36 is arranged is the surface 13. It is effective in the case of 80% or more of the area.
  • the phosphor layer 36 is provided between the adjacent light emitting elements 20 (see FIG. 6). Further, the binder of the phosphor layer 36 has an insulating property equivalent to that of the binder contained in, for example, a solder resist. That is, in the case of the present embodiment, the phosphor layer 36 functions as a solder resist.
  • the phosphor contained in the phosphor layer 36 is a CASN phosphor containing Eu, and the phosphor layer 36 is provided on the wiring portion 34B made of Cu. Therefore, for example, when each light emitting element 20 emits white light L, the excitation light from the CASN phosphor contained in the phosphor layer 36 has a luminous efficiency due to reflection by Cu constituting the lower layer electrode. It is improved (in the configuration of this embodiment, there is a light reflection effect of Cu). Then, in the present embodiment, the white light L can be adjusted to a warmer color light (a color in which the correlated color temperature is shifted to the lower temperature side) by the effect (see FIGS. 8 and 9). In this case, warm color light can be added to the white light of the light emitting element 20, and the special color rendering index R9 value can be increased. This effect is particularly effective for pseudo-white using YAG-based white light (yellow phosphor).
  • the plurality of light emitting elements 20 use a heat radiating means such as the heat radiating fin 131 of FIG. 1 and the cooling fan (heat radiating fan 335 described later in FIG. 11) during the light emitting operation, thereby forming a phosphor substrate.
  • a heat radiating means such as the heat radiating fin 131 of FIG. 1 and the cooling fan (heat radiating fan 335 described later in FIG. 11) during the light emitting operation, thereby forming a phosphor substrate.
  • heat radiating means such as the heat radiating fin 131 of FIG. 1 and the cooling fan (heat radiating fan 335 described later in FIG. 11) during the light emitting operation, thereby forming a phosphor substrate.
  • heat radiating means such as the heat radiating fin 131 of FIG. 1 and the cooling fan (heat radiating fan 335 described later in FIG. 11) during the light emitting operation, thereby forming a phosphor substrate.
  • heat radiating fan 335 heat radiating fan 335 described later in FIG
  • the region (occupied area of the electrode layer 34) on the surface 31 of the insulating layer 32 where the electrode layer 34 is arranged is, for example, a region of 60% or more of the surface 31 of the insulating layer 32 (the area occupied by the electrode layer 34). Area). Therefore, the electrode layer 34 (wiring portion 34B) of the present embodiment functions as a heat radiating plate for heat generated from the plurality of light emitting elements 20 in addition to the function as an electric path for feeding power. Therefore, the light emitting element 20 (LED 22) can stably emit light L in a situation where it is not easily affected by heat.
  • the above is the description of the effect of the first embodiment.
  • the light emitting element 20 includes an LED 22, a chip electrode 23, and a phosphor sealing layer 24, and is provided on the insulating layer 32.
  • the chip electrode 23 is arranged so as to cover the upper surface of the electrode pair 34A as described above, but is shown here as a diagram for arranging the chip electrode 23 on the insulating layer 32 for simplification and not shown.
  • the LED 22 is formed on the chip electrode 23.
  • the LED 22 is composed of N-type and P-type semiconductors, and the boundary portion thereof serves as a light emitting layer called a junction portion.
  • the position on the lowermost side (that is, the insulating layer 32 side) of the light emitting layer is referred to as a junction level 28 for convenience.
  • the position of the junction level 28 is illustrated as the same position as the boundary between the LED 22 and the chip electrode 23, but the position is different depending on the position and orientation of the light emitting layer.
  • the phosphor sealing layer 24 is formed so as to cover the structure in which the chip electrode 23 and the LED 22 are integrated from above. In the figure, the side surface portion of the junction level 28 is covered with the fluorescent material sealing layer 24.
  • the phosphor layer 36 is formed on the insulating layer 32 side from the junction level 28 of the LED 22 which is a light emitting element. More specifically, when the level of the junction level 28 and the level of the upper surface 36a of the phosphor layer 36 are compared, the position in the height direction (board stacking direction) with respect to the upper surface of the insulating layer 32 is the level of the junction level 28. Is higher. For example, in FIG. 10, the height h1 from the insulating layer 32 to the junction level 28 is higher than the height h2 from the insulating layer 32 to the top surface 36a of the phosphor layer.
  • the light emitted from the junction level 28 at an angle of at least upward enters the phosphor layer 36 when it passes through the phosphor sealing layer 24 and is emitted to the outside. There is nothing to do. For example, even the light on the left side in the figure does not hit the phosphor layer 36. Although it depends on the formation position of the phosphor sealing layer 24, the light incident on the phosphor layer 36 is only the light emitted from the junction level 28 at an angle downward.
  • the level of the top surface 36a of the phosphor layer 36 of the phosphor layer 36 (that is, the height h3 from the chip electrode 23) is higher than the junction level 28 and is the same as the position of the top surface of the light emitting element 20. It has become.
  • the level of the upper surface 36a of the phosphor layer is not limited to the same position as the upper surface of the light emitting element 20. Therefore, a part of the light emitted from the junction level 28 through the phosphor sealing layer 24 at an upward angle (for example, the light output from the side surface of the light emitting element 20 like the light on the left side in the drawing). Is incident on the phosphor layer 36. This configuration is suitable when it is desired to incorporate the light output from the side surface side of the light emitting element 20 into the phosphor layer 36.
  • a raised layer 37 is provided between the phosphor layer 36 and the chip electrode 23.
  • the level of the lower surface 36b of the phosphor layer 36 of the phosphor layer 36 (that is, the thickness h4 of the raised layer 37) is higher than the junction level 28. Therefore, a part of the light emitted from the junction level 28 through the phosphor sealing layer 24 at an upward angle (for example, the light on the left side in the figure) is disturbed by the raised layer 37 and fluoresces. Cannot enter the body layer 36. This is because the function of the phosphor layer 36 is not fully exhibited. Therefore, when the raised layer 37 is provided, it is desirable that the level of the lower surface 36b of the phosphor layer is lower than the junction level 28.
  • the light incident on the phosphor layer 36 can be adjusted.
  • the configuration shown in FIG. 12 (the level of the lower surface 36b of the phosphor layer is higher than the junction level 28) is avoided, and the lower surface 36b of the phosphor layer is avoided.
  • FIG. 13 is a diagram showing a schematic configuration of the LED lamp 200 according to the present embodiment.
  • the LED lamp 200 is a so-called horizontal LED lamp, and has a structure of irradiating the lower surface with light by mounting the LED lamp 200 in a horizontal state.
  • the LED lamp 200 includes a tubular housing 210, an LED module 220, a body 230, and a drive circuit (not shown).
  • a transparent cover 211 is attached to the housing 210.
  • the cover 211 may be made of translucent, opalescent, or smoked as well as transparent.
  • the LED module 220 is mounted inside the housing 210.
  • the body portion 230 includes a heat radiation fin 231 and a base 132.
  • a heat radiating fan, a heat radiating opening, and a heat radiating slit may be provided as the heat radiating means.
  • a plurality of LED chips 221 are arranged in a grid pattern on a rectangular phosphor substrate 222.
  • 12 LED chips 221 are provided in a 4 ⁇ 3 arrangement.
  • the basic structure of the phosphor substrate 222 is the same as that of the phosphor substrate 122 of the first embodiment, and the description thereof will be omitted. The difference is that a plurality of LED chips 221 are provided.
  • the plurality of LED chips 221 emit light independently for each row. That is, four LED chips 221 are configured as one series, and three series are arranged in parallel in three rows.
  • the drive circuit has three drive outputs corresponding to the three series bodies, so that each series body can be driven independently. With such a configuration, even if any row (that is, a series) of the LED chips 221 is turned off due to a failure, the entire LED chip 221 is not turned off.
  • the number of LED chips 221 connected to one series is determined by the voltage drop and supply voltage of the LED chips 221.
  • FIG. 14 is a diagram showing a schematic configuration of the LED bulb 300 according to the present embodiment.
  • FIG. 15 shows the LED module 320.
  • the difference from the LED bulb 100 of the first embodiment is that the LED bulb 300 of the present embodiment has a heat dissipation fan 335 and the LED module 320 has a plurality of LED chips 321.
  • the LED bulb 300 includes a cover member 310, an LED module 320, a body portion 330, and a drive circuit (not shown).
  • the LED module 320 includes a phosphor substrate 322 that is substantially circular in top view and a plurality of (here, eight) LED chips 321.
  • the plurality of LED chips 321 are provided in an annular shape on the phosphor substrate 322.
  • the body portion 330 is formed of, for example, aluminum die-cast.
  • the body portion 330 includes a heat radiation fin 333, a body portion main body portion 331, and a base 332 from the upper side (that is, the cover member 310 side).
  • the heat radiation fin 333 includes, for example, a disk-shaped plate provided on the upper side (cover member 310 side) in the drawing, and a plurality of fins extending from the lower side surface of the plate toward the lower side in the drawing at a predetermined height. Each fin extends radially outward, for example in bottom view. Further, the plurality of fins are provided side by side in an annular shape along the radial direction.
  • a region in which the heights of the plurality of fins are shortened is formed in a range of a predetermined diameter from the bottom view center (axis center) of the heat radiation fins 333.
  • a heat dissipation fan 335 is attached to the area.
  • the heat dissipation fan 335 is, for example, a DC fan driven by a brushless motor.
  • the outermost (that is, the outer peripheral edge) of the plurality of fins constituting the heat dissipation fan 335 are not connected and have an open shape. The air flow that cooled the fins is discharged to the outside from the open portion.
  • the LED module 320 (fluorescent substrate 322) is attached to the upper side surface (upper surface of the disk-shaped plate) of the heat radiation fin 333.
  • a concentric body body 331 having a space formed inside is provided below the heat radiation fin 333.
  • the body portion 331 is formed of, for example, aluminum die-cast, and the surface thereof is coated with a heat radiating paint and electrically insulated.
  • the body portion main body portion 331 has an inverted conical trapezium shape that becomes smaller in diameter as it goes downward, and a plurality of slit portions 331a are formed on its side surface.
  • the slit portion 331a communicates the internal space of the body portion main body portion 331 with the outside.
  • a base 332 is provided on the lower side of the body portion 331 in the drawing.
  • a drive circuit (not shown) is arranged in the internal space of the body portion main body 331 as in the first embodiment, and the above-mentioned heat radiation fin 333 is attached on the drive circuit (not shown) so as to cover the internal space.
  • the LED bulb 300 of the present embodiment has the same effect as that of the first and second embodiments. Furthermore, it has the following actions and effects.
  • the heat radiating fan 335 By the action of the heat radiating fan 335, the cooling air flow is taken into the internal space of the body portion 331 from the slit portion 331a and supplied to the heat radiating fin 333.
  • the air flow that has cooled the heat radiating fins 333 is discharged from a portion of the heat radiating fins 333 that is open to the outside.
  • a large number of LED chips 321 are provided in the LED module 320 to provide the LED chip 321 and drive. Even when the heat generated by the circuit 340 is large, it can be effectively cooled (heat radiated). That is, the phosphor substrate 322 can be effectively dissipated (cooled) so as to be within 50 ° C. to 100 ° C. from room temperature as an example. As a result, the LED module 320 can stably emit light L in a situation where it is not easily affected by heat.
  • FIG. 16 is a perspective view of the floodlight 400.
  • FIG. 17 is a perspective view of the LED lamp main body 401, showing a state in which the housing 402 is removed from the floodlight 400 of FIG.
  • the floodlight 400 is used, for example, as lighting for large sports facilities, outdoor commercial facilities, and the like.
  • the floodlight 400 includes a substantially rectangular parallelepiped LED lamp main body 401, a housing 402 for accommodating the LED lamp main body 401, and a power supply device (not shown).
  • the light projection direction that is, the surface on the arrangement side of the LED module 420
  • a plurality of LED lamp main bodies 401 may be configured as one unit and may be integrally housed in the housing 402.
  • the LED lamp main body 401 includes a lamp module 410, a heat radiating plate 440, and a drive circuit (not shown).
  • the lamp module 410 includes a rectangular phosphor substrate 422 and a plurality of LED chips 421 in a plan view (here, when viewed from below).
  • the LED chip 421 is, for example, a CSP in which a flip chip LED is incorporated.
  • the plurality of LED chips 421 are arranged in a houndstooth pattern. More specifically, in the plurality of LED chips 421, a group of 10 LED chips arranged at a predetermined pitch in the longitudinal direction (horizontal direction in the drawing) is arranged in three rows in the lateral direction. Here, the group in the second row is shifted to the right by one LED chip 421 from the groups in the first and third rows in the drawing.
  • the arrangement of the LED chips 421 is not limited to the houndstooth pattern, and may be a regular lattice pattern, and various arrangements can be applied.
  • a heat radiating plate 440 is attached as a heat radiating means on the upper surface of the lamp module 410 (the surface opposite to the surface on which the LED chip 421 is arranged).
  • the heat radiating plate 440 is made of, for example, aluminum die-cast, and a plurality of fins are extended to the upper side in the drawing.
  • a heat dissipation fan may be further provided as the heat dissipation means.
  • the same effect as that of the first to third embodiments can be obtained.
  • the floodlight 400 when the floodlight 400 is installed in a large sports facility, the light emitted from the floodlight 400 is strong, so that it is required to provide a safe environment without adversely affecting the competition of athletes and the like. That is, it is necessary to prevent the competition from being interrupted or injured due to dazzling.
  • the light projected via the phosphor substrate 422 can alleviate the glare of the light directly projected from the LED chip 421, realizing a safe activity environment. it can.
  • an example of the light emitting element 20 is a CSP.
  • an example of the light emitting element 20 may be other than the CSP.
  • it may simply be equipped with a flip chip. It can also be applied to the substrate itself of a COB device.
  • the phosphor layer 36 has a configuration formed on the electrode layer 34 laminated on the insulating layer 32, but the present invention is not limited to this configuration, and the phosphor layer 36 and the electrode layer 34 are not limited to this configuration.
  • An intervening layer layer of insulating material
  • the intervening layer may be provided between the two. By adjusting the thickness and shape of the intervening layer (insulating material layer), the amount of the phosphor layer 36 and the characteristics (direction, amount of fluorescence, etc.) of the light output from the phosphor layer 36 can be adjusted.
  • the lamps (100, 200, 300, 400) according to the embodiment of the present invention are With the substrate (122, 222, 222, 422), The light emitting element (20) mounted on the substrate (122, 222, 222, 422) and A drive circuit (140, 340) that supplies electric power to the light emitting elements (20, 121, 221, 321 and 421) to drive the light emitting element.
  • the substrate (122, 222, 222, 422) is Insulating base material (32) and A phosphor layer composed of phosphor particles arranged on one surface of the insulating base material (32) and having a emission peak wavelength in the visible light region when the emission of the light emitting element (20) is used as excitation light, and an organic resin. (36) and To be equipped. Thereby, the light emitted from the substrate (122, 222, 222, 422) can be adjusted to the light having an emission color different from the light emitted by the light emitting element (20, 121, 222, 222). From another viewpoint, the phosphor layer (36) alleviates the chromaticity variation of the light emitting elements (20, 121, 221, 321 and 421).
  • a heat radiating means (131, 231, 331, 333, 335, 440) that dissipates heat generated by the light emitting drive of the light emitting element (20, 121, 221, 321, 421) is provided.
  • the substrate (122, 222, 222, 422) can be effectively dissipated (cooled) so as to be within 50 ° C. to 100 ° C. from room temperature as an example.
  • a substrate (122, 222, 222, 422) or a drive circuit in which a large number of light emitting elements (20, 121, 221, 321, 421) are provided and the light emitting elements (20, 121, 222, 222) are mounted is provided. Even when the heat generation is large, it can be effectively cooled (heat radiated). As a result, the light L can be stably emitted in a situation where it is not easily affected by heat.
  • the light emitting element (20, 121, 221, 321, 421) is a CSP (121, 221, 321, 421) in which an LED (22) is incorporated and packaged in a chip size.
  • CSP 121, 221, 321, 421
  • board mounting can be realized stably and at low cost.
  • a plurality of the light emitting elements (20, 120, 220, 320, 420) are provided.
  • a phosphor layer (36) is provided between adjacent light emitting elements (20, 120, 220, 320). Therefore, the excitation light is also emitted from the phosphor layer (36). Therefore, the glare can be reduced as compared with the form without the phosphor layer (36). That is, it is possible to realize a lamp with reduced glare.
  • the plurality of light emitting elements (20, 220, 320, 420) are arranged in a grid pattern on the substrate (222, 422). As a result, it is possible to realize a lamp with suppressed variation in light emission.
  • the plurality of light emitting elements (20, 120, 320) are arranged in an annular shape on the substrate (122, 222). As a result, it is possible to realize a lamp with suppressed variation in light emission.
  • the drive circuit (140) independently drives the plurality of light emitting elements (20, 120, 220, 320) to emit light. Even if one of the light emitting elements is turned off, the influence on the light emission of the other light emitting element can be eliminated. That is, it is possible to suppress the deterioration of the light emission intensity and the quality of the lamp due to the non-lighting of a certain light emitting element to the minimum necessary.
  • the insulating base material (32) is at least one selected from the group consisting of an organic resin substrate, a ceramic substrate, and a plastic molded product.
  • the coefficients of thermal expansion (CTE) in the longitudinal direction and the lateral direction of these materials are almost the same as those in the case of the light emitting element (20), respectively, and the influence of the thermal stress acting on the light emitting element (20) can be suppressed. That is, it is possible to realize a lamp with high reliability.
  • the phosphor particles include at least one selected from the group consisting of CASN, SCANSN, LaSiN, Sr 2 Si 5 N 8 , Ba 2 Si 5 N 8 , ⁇ -type sialon, ⁇ -type sialon, and LuAG.
  • the organic resin contained in the phosphor layer (36) includes any of a silicone resin, an acrylic resin, and an epoxy resin.
  • the phosphor layer 36 functions as a solder resist, and desired insulating properties can be obtained. Thereby, the reliability of the phosphor layer (36), that is, the reliability of the lamp can be improved.
  • the surface of the phosphor layer (36) on the insulating base material side is closer to the insulating base material (32) than the junction level (28) of the LED 22 when the light emitting element is the LED 22. It is formed. Light emitted from the junction level (28), which is the light emitting layer, with an upward angular component may enter the phosphor layer 36 without being disturbed by other configurations (for example, the raised layer 37). it can.
  • LED lamp 210 Housing 211 Cover 331 Body body 331a Body top 331b Heat dissipation slit 331c Body bottom 440 Radiation plate 400 Floodlight 401 LED lamp body

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention porte sur une ampoule à diodes électroluminescentes (DEL) (100) qui est pourvue d'un élément couvercle (110), d'un module de DEL (120), d'une partie cylindre (130) et d'un circuit d'attaque (140). Le module de DEL (120) est pourvu d'un substrat de luminophore (122), et d'une puce de DEL (121) montée sur le substrat de luminophore (122). Le circuit d'attaque (140) fournit de l'énergie électrique au module de DEL (120) de façon à commander l'émission de lumière de la puce de DEL (121). Dans le substrat de luminophore (122), une couche de luminophore est disposée sur une surface d'un matériau de base isolant.
PCT/JP2020/047625 2019-12-25 2020-12-21 Lampe WO2021132131A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202080090138.9A CN115135923A (zh) 2019-12-25 2020-12-21 灯具
KR1020227025210A KR20220119119A (ko) 2019-12-25 2020-12-21 램프
JP2021567428A JP7437419B2 (ja) 2019-12-25 2020-12-21 灯具

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-233867 2019-12-25
JP2019233867 2019-12-25

Publications (1)

Publication Number Publication Date
WO2021132131A1 true WO2021132131A1 (fr) 2021-07-01

Family

ID=76576089

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/047625 WO2021132131A1 (fr) 2019-12-25 2020-12-21 Lampe

Country Status (5)

Country Link
JP (1) JP7437419B2 (fr)
KR (1) KR20220119119A (fr)
CN (1) CN115135923A (fr)
TW (1) TW202132719A (fr)
WO (1) WO2021132131A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012227021A (ja) * 2011-04-20 2012-11-15 Panasonic Corp 照明用光源
JP2015195156A (ja) * 2013-06-04 2015-11-05 三菱化学株式会社 照明器具及び光学部材
JP2019009108A (ja) * 2017-06-21 2019-01-17 三菱電機株式会社 照明装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5219331B2 (ja) * 2005-09-13 2013-06-26 株式会社住田光学ガラス 固体素子デバイスの製造方法
JP4905009B2 (ja) * 2006-09-12 2012-03-28 豊田合成株式会社 発光装置の製造方法
JP5345363B2 (ja) * 2008-06-24 2013-11-20 シャープ株式会社 発光装置
JP2010103019A (ja) 2008-10-24 2010-05-06 Toshiba Lighting & Technology Corp 照明装置
US8858032B2 (en) * 2008-10-24 2014-10-14 Cree, Inc. Lighting device, heat transfer structure and heat transfer element
JP5703997B2 (ja) * 2011-06-29 2015-04-22 豊田合成株式会社 発光装置
KR20130104975A (ko) * 2012-03-16 2013-09-25 삼성전자주식회사 발광장치
CN104282819B (zh) * 2013-07-08 2018-08-28 光宝电子(广州)有限公司 倒装式发光二极管封装模块及其制造方法
CN107148685B (zh) * 2014-10-28 2019-12-06 夏普株式会社 基板、发光装置以及照明装置
JP2017059493A (ja) * 2015-09-18 2017-03-23 東芝ライテック株式会社 発光装置
CN206401316U (zh) * 2015-12-29 2017-08-11 中山市圣上光电科技有限公司 Csp led灯
JP2018045850A (ja) 2016-09-14 2018-03-22 日立アプライアンス株式会社 電球型照明装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012227021A (ja) * 2011-04-20 2012-11-15 Panasonic Corp 照明用光源
JP2015195156A (ja) * 2013-06-04 2015-11-05 三菱化学株式会社 照明器具及び光学部材
JP2019009108A (ja) * 2017-06-21 2019-01-17 三菱電機株式会社 照明装置

Also Published As

Publication number Publication date
CN115135923A (zh) 2022-09-30
JPWO2021132131A1 (fr) 2021-07-01
JP7437419B2 (ja) 2024-02-22
TW202132719A (zh) 2021-09-01
KR20220119119A (ko) 2022-08-26

Similar Documents

Publication Publication Date Title
US8022626B2 (en) Lighting module
US8803201B2 (en) Solid state lighting component package with reflective layer
WO2010033341A2 (fr) Disque optique pour module d'éclairage
WO2015145855A1 (fr) Appareil d'éclairage d'éclairage ponctuel
CA2735508A1 (fr) Module d'eclairage
US20100067240A1 (en) Optical Cup For Lighting Module
JP2016171147A (ja) 発光装置および照明装置
JP4508034B2 (ja) 白色ｌｅｄを用いた照明器具
JPWO2020137762A1 (ja) 蛍光体基板、発光基板及び照明装置
JP2011175950A (ja) 半導体発光装置を搭載するための回路基板、発光モジュール、及び照明装置
WO2021132131A1 (fr) Lampe
JP7470257B2 (ja) 灯具
EP3905348B1 (fr) Substrat électroluminescent et dispositif d'éclairage
JP2013211456A (ja) 半導体発光装置及び照明装置
JPWO2020137761A1 (ja) 蛍光体基板、発光基板及び照明装置
JP7511090B2 (ja) 灯具
WO2023276774A1 (fr) Lampe
JP2020061521A (ja) 発光装置
US20230313973A1 (en) Light-emitting device
WO2022025065A1 (fr) Dispositif électroluminescent et dispositif d'éclairage

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20907488

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021567428

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20227025210

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20907488

Country of ref document: EP

Kind code of ref document: A1