WO2014045474A1

WO2014045474A1 - Lamp

Info

Publication number: WO2014045474A1
Application number: PCT/JP2013/001602
Authority: WO
Inventors: 仕田　智; 豊西田; 隆在植本
Original assignee: パナソニック株式会社
Priority date: 2012-09-20
Filing date: 2013-03-12
Publication date: 2014-03-27
Also published as: CN204805983U

Abstract

This lamp is provided with: a light-emitting unit that results from a plurality of semiconductor light-emitting elements being disposed on a mounting substrate; an electricity reception unit that receives electrical power from the outside; a circuit unit having a plurality of electronic components and a circuit board to which same are mounted; and a cylindrical or bowl-shaped case that houses the circuit unit. The circuit unit is housed in the case in a manner such that the circuit board is along the inner peripheral surface of the case.

Description

lamp

The present invention relates to a lamp using a semiconductor light emitting element, and more particularly to miniaturization of a case.

In recent years, light bulb shaped lamps using semiconductor light emitting elements such as LEDs (Light Emitting Diodes) are becoming popular as an alternative to incandescent light bulbs.

Such a lamp is generally a case in which a large number of LEDs are mounted on one mounting board and between the back side of the mounting board and a base as a power receiving unit that receives power from the outside (in Patent Document 1). "Outer member 2") A circuit unit for lighting the LED is housed in the internal space, and the light emitted from the LED is emitted to the outside through a globe as a translucent cover member. .

In order to conduct heat generated in the LED to the base and not accumulate in the case, a case in which the case is formed of a metal that is a good heat conductive material is widely used. A circuit unit having an electronic component is accommodated in an insulating circuit holder made of resin or the like (“insulating member 26” in Patent Document 1) in order to ensure electrical insulation with a metal case. It is stored in the case. (See Patent Document 1, Non-Patent Document 1 (page 12)).

In addition, lamps using LEDs are not limited to light bulbs, and straight tube LED lamps such as fluorescent lamps are also becoming popular in recent years.

JP 2006-313717 A

By the way, conventionally, in a lamp using a semiconductor light emitting element, the circuit unit is housed inside the case, so the case part has to be large, and since the shape and size of the incandescent light bulb are different, The fitting compatibility rate with conventional lighting fixtures that have used incandescent bulbs is not 100%.

Therefore, there is an increasing demand for the development of a lamp using a semiconductor light emitting element having a shape closer to that of a conventional incandescent bulb by reducing the size of the case portion.

In a straight tube lamp, a case is attached to both ends of a light-transmitting bulb that covers the light-emitting part. However, since the case part is a non-light-emitting part, if the case size is large, the non-light-emitting part is There is a problem that the impression that it grows is bad.

Here, a circuit unit is usually housed inside the case. The circuit unit is configured by mounting various electric main components on a circuit board. Therefore, if the size of the case portion is reduced, the circuit unit needs to be reduced in size. For that purpose, a method of miniaturizing the circuit board and mounting various electronic components on the circuit board at high density is conceivable.

However, in addition to a space for mounting various electronic components on the circuit board, a space for forming a wiring pattern is also required, and there is a limit to downsizing the circuit board.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a lamp having a miniaturized case.

A lamp according to the present invention is a circuit having a light emitting unit in which a plurality of semiconductor light emitting elements are arranged on a mounting substrate, a power receiving unit that receives power from the outside, a plurality of electronic components, and a circuit board on which they are mounted. A lamp having a unit and a cylindrical or bowl-shaped case that accommodates the circuit unit, wherein the circuit unit is disposed in the case with the circuit board being along the inner peripheral surface of the case. It is housed.

In the lamp according to the present invention, since the circuit board is accommodated in the case along the inner peripheral surface of the case, the area of the circuit board can be made as large as possible with respect to the space inside the case. Thus, even when the case is downsized, the area of the circuit board necessary for mounting a plurality of electronic components can be ensured.

1 is a partially cutaway external perspective view showing a schematic configuration of a lamp according to Embodiment 1. FIG. 1 is a cross-sectional view illustrating a schematic configuration of a lamp according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view taken along the line A-A ′ in FIG. 2, showing a state where the circuit unit is housed in a case. It is a top view which shows schematic structure at the time of expand | deploying the circuit unit which concerns on Embodiment 1 on the plane. 6 is a cross-sectional view illustrating a schematic configuration of a lamp according to Embodiment 2. FIG. 6 is a partial cross-sectional view illustrating a schematic configuration of a lamp according to Embodiment 3. FIG. It is a figure which shows schematic structure of the lamp | ramp which concerns on Embodiment 4, Comprising: (a) is a side view, (b) is sectional drawing. It is a perspective view which shows schematic structure of the circuit unit of the lamp | ramp which concerns on Embodiment 4, and a light emission part. FIG. 6 is a cross-sectional view illustrating a schematic configuration of a lamp according to a first modification. FIG. 6 is a cross-sectional view showing a schematic configuration of a lamp according to Modification 2. 12 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification 3. FIG. FIG. 10 is a cross-sectional view illustrating a schematic configuration of a lamp according to modification example 4; 10 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 5. FIG. 12 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 7. FIG. 12 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 8. FIG. 12 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 9. FIG. It is a figure which shows schematic structure of the lamp | ramp which concerns on the modification 11, Comprising: (a) is a side view, (b) is sectional drawing. It is a side view which shows schematic structure of the lamp | ramp which concerns on the modification 12. 14 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 13. FIG. It is sectional drawing which shows schematic structure of the lamp | ramp which concerns on the modification 14. 16 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 15. FIG. 18 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 16. FIG. FIG. 22 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification 17; 22 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 18. FIG. 22 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification 20. FIG. It is sectional drawing which shows the state in which the circuit unit of the lamp | ramp which concerns on the modification 21 was accommodated in the case. It is sectional drawing which shows the state in which the circuit unit of the lamp | ramp which concerns on the modification 22 was accommodated in the case. It is sectional drawing which shows the state in which the circuit unit of the lamp | ramp which concerns on the modification 23 was accommodated in the case. FIG. 28 is a partially cutaway external perspective view showing a schematic configuration of a lamp according to Modification 24. FIG. 22 is a partial cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 24. FIG. 26 is a partially cutaway external perspective view showing a schematic configuration of a lamp according to Modification 25. FIG. 26 is a partial cross-sectional view illustrating a schematic configuration of a lamp according to Modification 25. 27 is a partial cross-sectional view showing a schematic configuration of a lamp according to Modification 26. FIG. 42 is a partial cross-sectional view showing a schematic configuration of a lamp according to Modification 27. FIG. FIG. 38 is a partially cutaway external perspective view showing a schematic configuration of a lamp according to Modification 28. 29 is a partial cross-sectional view illustrating a schematic configuration of a lamp according to Modification Example 28. FIG. It is a top view which shows the state which removed the glove | globe of the lamp | ramp which concerns on the modification 28. FIG. 32 is a cross-sectional view showing a schematic configuration of a lamp according to Modification 33. FIG. 32 is a cross-sectional view showing a schematic configuration of a lamp according to Modification 34. 42 is a cross-sectional view showing a schematic configuration of a lamp according to Modification 35. FIG. 42 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification 36. FIG. 42 is a cross-sectional view showing a schematic configuration of a lamp according to Modification 37. FIG. FIG. 38 is a plan view showing a schematic configuration when a circuit unit according to Modification 37 is developed on a plane. (A) is a top view which shows schematic structure at the time of developing the circuit unit which concerns on the modification 38 on a plane. (B) is a partially cutaway perspective view schematically showing a circuit unit according to a modified example 38 in a curved state when accommodated in a case. (A) is a perspective view of the lamp | ramp which concerns on the modification 39 seen from the back side. (B) is the perspective view of the lamp | ramp which concerns on the modification 39 seen from the front side. 42 is an exploded perspective view showing a schematic configuration of a lamp according to Modification 39. FIG. (A) is a perspective view showing a schematic configuration of a case according to Modification 39. FIG. (B) is a perspective view which shows typically the state by which the light emission part which concerns on the modification 39 was attached to the case shown to (a). 42 is a cross-sectional view showing a schematic configuration of a lamp according to Modification 39. FIG. 14 is a perspective view showing a schematic configuration of a circuit unit according to Modification 40. FIG. (A) is a perspective view showing a schematic configuration of a circuit unit according to Modification 41. FIG. (B) is a partially cutaway perspective view schematically showing a connection mode between a connector and a circuit board of a circuit unit according to Modification 41. FIG. FIG. 22 is a cross-sectional view illustrating a schematic configuration of a lamp according to Modification 42.

Hereinafter, a lamp according to an embodiment of the present invention will be described with reference to the drawings.

Note that the drawings are schematic diagrams, and the scale of the members in each drawing is not necessarily the same as the actual one. In the present application, the symbol “˜” used to indicate a numerical range includes numerical values at both ends. In addition, the materials, numerical values, and the like described in this embodiment are merely preferable examples, and are not limited thereto. In addition, changes can be made as appropriate without departing from the scope of the technical idea of the present invention. Further, some combinations of configurations with other embodiments are possible within a range where no contradiction occurs.

<Embodiment 1>
[Schematic configuration]
FIG. 1 is a partially cutaway external perspective view showing a schematic configuration of a lamp 1 according to the first embodiment. FIG. 2 is a cross-sectional view showing a schematic configuration of the lamp 1. 3 is a cross-sectional view taken along line AA ′ in FIG.

The lamp 1 includes a light emitting unit 10, a case 70, a power receiving unit 80, a globe 40, a circuit unit 50, and the like as main components. In FIG. 2, the alternate long and short dash line drawn along the vertical direction of the paper indicates the lamp axis J <b> 1 of the lamp 1, and the upper side of the paper is the front of the lamp 1 and the lower side of the paper is the rear of the lamp 1.

[Each component configuration]
<Light emitting part>
The light emitting unit 10 includes an LED 12 as a semiconductor light emitting element used as a light source, a mounting substrate 11 on which the LED 12 is mounted, and a sealing body 13 that covers the LED 12 on the mounting substrate 11. The light emitting unit 10 is disposed on the opposite side of the power receiving unit 80 via the circuit unit 50, and the main emission direction of light emitted from the LED 12 (hereinafter simply referred to as “main emission direction”) is in front of the lamp 1. It is arranged facing (upward on the page).

The sealing body 13 is mainly made of a translucent material, but when it is necessary to convert the wavelength of the light emitted from the LED 12 to a predetermined wavelength, the wavelength of the light is converted into the translucent material. Wavelength conversion material is mixed. As the translucent material, for example, a silicone resin can be used, and as the wavelength conversion material, for example, phosphor particles can be used. In this embodiment, LED12 which radiates | emits blue light, and the sealing body 13 formed with the translucent material mixed with the fluorescent substance particle | grains which wavelength-convert blue light into yellow light are employ | adopted. A part of the emitted blue light is wavelength-converted into yellow light by the sealing body 13, and white light generated by mixing the unconverted blue light and the converted yellow light is emitted from the light emitting unit 10.

The light emitting unit 10 may be, for example, a combination of an ultraviolet light emitting LED 12 and each color phosphor particle that emits light in three primary colors (red, green, and blue). Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.

<Case>
The case 70 is a cylindrical member made of a material having thermal conductivity, and includes a large diameter portion 71 and a small diameter portion 72. In the present embodiment, the case 70 is formed from a heat conductive resin. The large-diameter portion 71 and the small-diameter portion 72 have, for example, a substantially cylindrical shape that is open on both sides, and are integrally connected to each other in the axial direction so that the cylindrical shaft and the lamp shaft J1 coincide with each other. . The large-diameter portion 71 located on the front side has a substantially cylindrical shape with a diameter reduced from the front toward the rear, and the circuit unit 50 is accommodated in the large-diameter portion 71. On the other hand, a power receiving unit 80 is externally fitted to the small diameter portion 72 located on the rear side, and the rear side opening 75 of the case 70 is thereby blocked. The opening on the front side (the globe 40 side) of the case 70 is closed by the mounting substrate 11, and the case 70 and the mounting substrate 11 are integrally formed. As described above, since the case 70 and the mounting substrate 11 are integrally formed, it is possible to reduce the number of parts and the number of processes in assembling, which can improve productivity.

As a material having thermal conductivity for forming the case 70, for example, a thermal conductive resin can be used. By doing in this way, the heat generated from the circuit unit 50 and the light emitting unit 10 and propagated to the case 70 can be efficiently propagated and radiated to the power receiving unit 80 side.

<Power receiving unit>
The power receiving unit 80 is a member for receiving electric power from the socket of the lighting fixture when the lamp 1 is attached to the lighting fixture and turned on, and is a so-called base in the present embodiment. The type of the power receiving unit 80 is not particularly limited, but an Edison type E26 base is used in the present embodiment. The power receiving unit 80 includes a shell part 81 having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet part 83 attached to the shell part 81 via an insulating part 82.

<Glove>
The globe 40 is a member that covers the light emitting unit 10, and the opening-side end 41 of the globe 40 is fitted into a groove 74 provided in the front-side end 73 of the case 70 by press-fitting. The inner surface 42 of the globe 40 is subjected to a diffusion process for diffusing the light emitted from the light emitting unit 10, for example, a diffusion process using silica, white pigment, or the like. The light that has entered the inner surface 42 of the globe 40 passes through the globe 40 and is extracted outside the globe 40.

The globe 40 may be fixed to the case 70 by fitting the opening side end 41 of the globe 40 into the groove 74 after applying an adhesive or the like in the groove 74.

Further, in the present embodiment, the shape of the globe 40 is a shape imitating a bulb of an A-type bulb, but is not limited to this, and may be any shape.

<Circuit unit>
The circuit unit 50 is mainly for lighting the LED 12, and includes a circuit board 51 and various electronic components 52 arranged on the circuit board 51. The electronic component 52 is mainly for converting the power received from the outside via the power receiving unit 80 to cause the LED 12 to emit light. However, the present invention is not limited to this. For example, the electronic component 52 includes a sensor for detecting brightness, temperature, and the like, and a component for receiving and processing a signal related to dimming, turning on / off, etc. from the remote control. May be.

In addition, the electronic component 52a is the tall one among the electronic components 52. Further, the “back” of the electronic component 52 here refers to the electronic component from the main surface of the circuit board 51 on which the electronic component in the normal direction of the circuit board 51 is mounted at the position where the electronic component 52 is disposed. 52 means the distance to the tip. However, when there is no particular need to distinguish between a tall electronic component and a non-tall electronic component, they are simply referred to as an electronic component 52. In addition, in FIG. 2 and other drawings, not all of the illustrated electronic components are necessarily denoted by reference numerals. Some electronic components 52 may be omitted from the reference numerals.

The circuit unit 50 and the power receiving unit 80 are electrically connected by a wiring 53. Further, the circuit unit 50 and the light emitting unit 10 are electrically connected via the connector 16 by the wiring 15 arranged through the wiring hole 14 which is a through hole provided in the mounting substrate 11.

The circuit board 51 is made of, for example, a flexible resin such as a flexible board. As shown in FIG. 3, the circuit board 51 is curved with the outer peripheral surface 51a on the outer side and the inner peripheral surface 51b on the inner side. It is accommodated in the diameter portion 71. The circuit unit 50 is inserted into the case 70 from the rear opening 75 in a state where the circuit board 51 is bent. After being inserted into the case 70, the circuit board 51 tries to expand in the large diameter portion 71 due to its own elastic force, but contact with the inner peripheral surface 71 a of the large diameter portion 71 is stopped. And the circuit unit 50 is hold | maintained inside the large diameter part 71 by the frictional force between the circuit board 51 and the internal peripheral surface 71a.

With the configuration as described above, the circuit board 51 can be arranged along the inner peripheral surface 71a, so that the area of the circuit board can be increased as compared with the case of using a flat circuit board as in the prior art. it can. Thereby, even when the case 70 is downsized, the area of the circuit board 51 can be maximized. That is, the mounting area of the electronic component 52 can be maximized.

Here, in the lamp 1 according to the first embodiment, all the electronic components 52 are mounted on the inner peripheral surface 51b of the circuit board 51 and are not mounted on the outer peripheral surface 51a side. Therefore, even when the case 70 is formed of a conductive material such as metal, the electronic component 52 does not contact the inner peripheral surface 71a of the case 70, and a problem such as a short circuit does not occur. However, even in such a case, a part of the lead wire of the electronic component 52 may protrude to the outer peripheral surface 51a side of the circuit board 51 or a process such as soldering may be performed on the outer peripheral surface 51a. Conceivable. In that case, an insulating resin is coated on the outer peripheral surface 51 a of the circuit board 51 to form a protective film, or an insulating protective film is similarly formed on the inner peripheral surface 71 a of the case 70. May be.

Note that an adhesive member may be disposed on the bottom surface 77 of the large-diameter portion 71 to fix the rear end 51c of the circuit board 51. Alternatively, an adhesive or the like may be applied to the rear side end portion 51 c and adhered to the bottom surface 77. Thereby, the circuit unit 50 can be stably held in the large-diameter portion 71.

FIG. 4 is a plan view of the circuit unit 50 in a state where the circuit board 51 is spread on the plane, as viewed from the inner peripheral surface 51b side of the circuit board 51. In FIG. 4, only some electronic components are denoted by reference numerals. As shown in FIG. 4, in the expanded state, the circuit board 51 has a shape in which a fan-shaped central portion is cut out by a smaller fan having the same central angle. In other words, the shape of the ring is cut out by two straight lines passing through the center. Thereby, in the state in which the circuit board 51 is accommodated in the large diameter portion 71, the shape expands on the front side and decreases as it goes to the rear side, so that the shape fits the shape of the inner peripheral surface 71 a of the large diameter portion 71. Can be taken.

As described above, in the lamp 1 according to the first embodiment, since the circuit board 51 is arranged in a curved shape along the inner peripheral surface 71 a of the case 70, a circuit that can be accommodated in the internal space of the case 70. The area of the substrate 51 can be increased. Thereby, even when the case 70 is reduced in size, a space for mounting the electronic component 52 and forming a wiring pattern can be secured on the circuit board 51. That is, the case 70 can be reduced in size.

In addition, even when the number of electronic components included in the circuit unit is increased due to a higher function of the lamp or the like, an increase in the case size can be suppressed by increasing the mounting area by curving the circuit board.

Furthermore, in the case of the lamp 1 according to the present embodiment, by using an insulating resin for the case 70, there is no need to provide a circuit holder as in the conventional case, so that the space inside the case 70 is used widely. Thus, the effect of increasing the area of the circuit board 51 can be further increased.

In the first embodiment, the circuit board is made of a flexible resin such as a flexible board, but is not limited thereto. For example, you may use the circuit board formed in the curved shape which does not have flexibility using resin, a ceramic, etc.

<Embodiment 2>
FIG. 5 is a cross-sectional view illustrating a schematic configuration of the lamp 100 according to the second embodiment. In addition, in order to avoid duplication of description, about the same component as Embodiment 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

As shown in FIG. 5, the lamp 100 according to the second embodiment includes a globe 40, a circuit unit 50, a power receiving unit 80, a light emitting unit 110, and a case 170 as main components. In the lamp 100, the light emitting unit 110 is provided apart from the case 170.

The case 170 is made of an insulating material having thermal conductivity such as a resin like the case 70 in the first embodiment, and the basic configuration is the same as the case 70 except for the points described below. The large-diameter portion 171 and the small-diameter portion 172. In the case 170, the LED 12 is not mounted on the front surface 178 that closes the opening on the front side of the large-diameter portion 171, and the opening 179 is provided in the center of the front surface 178. The opening 179 is formed into a cylindrical heat pipe. 20 penetrates. Further, the diameter of the heat pipe 20 and the diameter of the opening 179 are substantially equal to each other, and there is substantially no gap between the heat pipe 20 and the opening 179. Thereby, the wobble of the heat pipe 20 is suppressed.

A support pedestal portion 21 made of an insulating material such as a resin is fixedly provided in the recess formed by the insulating portion 82 and the eyelet portion 83 of the power receiving unit 80, and a columnar shape is formed on the support pedestal portion 21. The heat pipe 20 is erected so as to extend in a direction substantially parallel to the lamp axis J1. The end of the heat pipe 20 opposite to the side erected on the support pedestal 21 passes through an opening provided in the front surface 178 of the large-diameter portion 171 of the case 170 and is located inside the globe 40. The mounting substrate 111 of the light emitting unit 110 is fixed to the end by an adhesive or the like. Accordingly, the light emitting unit 110 is supported by the heat pipe 20 and is disposed in the globe 40 in the air.

The light emitting unit 110 includes an LED 12 as a semiconductor light emitting element used as a light source, a mounting substrate 111 on which the LED 12 is mounted, and a sealing body 13 that covers the LED 12 on the mounting substrate 111. The light emitting unit 110 and the circuit unit 50 are electrically connected by the wiring 15 and the connector 16 arranged through the wiring hole 114 provided in the front surface 178 of the case 170.

A transparent substrate is used as the mounting substrate 111. As the transparent substrate, for example, a sapphire substrate, a glass substrate, a ceramic substrate, a light-transmitting resin substrate, or the like is used. A part of the light emitted from the LED 12 to the rear side of the LED 12 passes through the mounting substrate 111 and is emitted to the rear side of the light emitting unit 110. As a result, the light distribution angle of the lamp 100 can be widened to obtain good light distribution characteristics.

The heat pipe 20 is made of, for example, a metal material. As the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, or an alloy made of two or more of them, or an alloy of Cu and Ag can be considered. . Since such a metal material has good thermal conductivity, the heat generated in the light emitting unit 110 is efficiently conducted to the power receiving unit 80 and radiated from the power receiving unit 80 to the lighting fixture (not shown). be able to.

In the second embodiment, the heat pipe 20 serves as a support member that supports the light emitting unit 110 with respect to the power receiving unit 80 and the case 170, and serves as a heat conduction member that transfers heat from the light emitting unit 110 to the power receiving unit 80. Plays both roles.

In addition, although it is possible that the electronic component 52 and the heat pipe 20 contact, in order to ensure the insulation between the electronic component 52 and the heat pipe 20, the heat pipe 20 is covered with an insulating resin thin film or the like. May be.

As described above, also in the lamp 100 according to the second embodiment, the circuit board 51 is arranged in a curved shape along the inner peripheral surface 171a of the case 170, similarly to the lamp 1 according to the first embodiment. The area of the circuit board 51 can be increased. Thereby, even when the case 170 is reduced in size, a space for mounting the electronic component 52 and forming a wiring pattern can be secured on the circuit board 51. That is, the case 170 can be reduced in size.

In addition, in the configuration of the second embodiment, the heat radiation of the light emitting unit 110 can be improved by conducting the heat of the light emitting unit 110 to the power receiving unit 80 by the heat pipe 20 to dissipate the heat.

Furthermore, since the light emitting unit 110 is disposed in the air in the globe 40 and a transparent substrate is used for the mounting substrate 111, a part of the light emitted to the rear side of the LED 12 is emitted to the rear side of the light emitting unit 110. Thus, the light distribution angle of the lamp 100 can be widened to obtain good light distribution characteristics.

<Embodiment 3>
In the first embodiment and the second embodiment, the case where the structure which is one embodiment of the present invention is applied to a light bulb type lamp has been described as an example.

In Embodiment 3, an example in which the structure which is one embodiment of the present invention is applied to a halogen lamp type lamp will be described. In addition, in order to avoid duplication of description, about the same component as Embodiment 1 and Embodiment 2, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

FIG. 6 is a partially cutaway view showing a schematic configuration of the lamp 200 according to the third embodiment. The lamp 200 includes a case 270, a light emitting unit 210, a circuit unit 250, and a cover unit 240 as main components.

As with the case 70, the case 270 is made of an insulating material having thermal conductivity such as resin, and is configured by a bowl-shaped first case portion 271 and a second case portion 272. The first case portion 271 and the second case portion 272 are connected to each other in the axial direction so that the two shafts substantially coincide with the lamp shaft J2.

The circuit unit 250 is accommodated in the internal space of the first case portion 271. The circuit unit 250 is different from the circuit board 51 in the size and ratio of the fan-shaped side and the arc shape of the circuit board 251 so that the circuit unit 250 fits in the internal space of the first case portion 271. The basic configuration is the same as that of the circuit unit 50 except that the arrangement of the electronic components 52 to be mounted is different.

The center of the bottom part of the first case part 271 extends rearward to form a protruding part 273. A metal shell portion 281 is provided on the outer peripheral surface of the protruding portion 273, and a metal eyelet portion 283 is provided at the distal end portion of the protruding portion 273. Each of the shell portion 281 and the eyelet portion 283 is connected to the circuit unit 250 by a wiring 53 and serves as a power supply terminal that receives supply of electric power from an external power source.

The second case portion 272 is formed in a bowl shape by a mounting substrate 211 as a bottom portion and a side surface portion 272b extending from the periphery of the mounting substrate 211.

The light emitting unit 210 includes a mounting substrate 211, an LED 12, a sealing body 13, and a lens 214.

The mounting substrate 211 is not the front end portion of the case 270, but the bottom portion of the second case portion 272, that is, the central portion in the front-rear direction of the case 270 that is a portion where the first case portion and the second case portion are connected. The basic configuration is the same as that of the mounting board 11 except that the mounting board 11 is different from the mounting board 11 in the first embodiment.

The lens 214 is made of a translucent material such as resin and is provided so as to enclose the sealing body 13. The light emitting unit 210 is disposed so that the optical axis of the light emitting unit 210 and the saddle axis of the second case unit 272 coincide.

The cover part 240 includes a front cover 241 that closes the opening of the second case part 272 and a metal fitting 242 that fixes the front cover 241 to the second case part 272.

As shown in FIG. 6, a plurality of window portions 272 a that are openings are provided at substantially equal intervals in the circumferential direction on the side surface portion 272 b of the second case portion 272.

The lamp 200 is used by being mounted on a socket provided in a commercial facility or the like. The light emitted from the light emitting part 210 is emitted as a spotlight from the opening of the second case part 272 through the front cover 241 as well as from the side face part 272b of the second case part 272 as leaked light through the window part 272a. Is done. As a result, it is possible to produce a “brightness feeling” and a “glittering feeling” of the entire space using leakage light in a commercial facility or the like.

In FIG. 6, the window portions 272a are arranged in one row in the circumferential direction of the side surface portion 272b. However, the present invention is not limited to this, and the window portions 272a may be arranged in two or more rows.

Further, the shape of the window portion 272a is not limited to a circle or an ellipse as shown in FIG. 6, and may be a polygon such as a rhombus or a triangle, or a heart shape.

The size of the window portion 272a is not limited to the same size, and the size may be different. In this case, for example, when a plurality of windows are arranged as described above, the front window 272a may be larger than the rear window 272a. Thereby, a lot of light can be leaked at an angle close to the emission direction of the spotlight, and the illuminance around the main irradiation region can be further increased.

Further, the window portion 272a may be a hollow through hole, but may be sealed with a translucent member such as resin, glass, ceramics, or the like. By sealing the through hole with a translucent member, foreign matter such as moisture and dust can be prevented from entering the second case portion 272. The color of the translucent member may be colorless or colored. When colored, the translucent member functions as a color filter. Some conventional halogen light bulbs use a dichroic filter as a reflecting mirror, and when this is turned on, the color of leakage light may be a specific color (for example, red). Therefore, by substituting the translucent member so as to reproduce this specific color, the substitutability of the lamp 200 for the halogen bulb can be further enhanced.

As described above, also in the lamp 200 according to the third embodiment, the circuit board 251 is disposed on the inner peripheral surface 271a of the first case portion 271 in the same manner as the lamp 1 according to the first embodiment and the lamp 100 according to the second embodiment. Accordingly, the area of the circuit board 251 can be increased. Thereby, even when the first case portion 271 is downsized, a space for mounting the electronic component 52 and forming a wiring pattern can be secured on the circuit board 251. That is, the first case portion 271 can be reduced in size.

In addition, in the configuration of the third embodiment, a part of the light from the light emitting unit 210 is emitted as leaked light through the window 272a. It can produce a “feel” and a “feel”.

<Embodiment 4>
Embodiments of the present invention are not limited to bulb-type lamps and halogen lamp-type lamps, but can also be applied to straight tube fluorescent lamp-type lamps. In Embodiment 4, a case where the structure of one embodiment of the present invention is applied to a straight tube lamp will be described as an example. In addition, in order to avoid duplication of description, about the same component as

Embodiment

1, 2, 3, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

FIG. 7 is a diagram illustrating a schematic configuration of a lamp 300 according to the fourth embodiment. FIG. 7A is a side view of the lamp 300. FIG. 7B is a cross-sectional view of the lamp 300. As shown in FIG. 7A and FIG. 7B, the lamp 300 is a so-called straight tube type LED lamp, and includes a light emitting unit 310, a bulb 340, a circuit unit 350, a case 370, as main components. And a power receiving unit 380.

FIG. 8 is a perspective view showing only the light emitting unit 310 and the circuit unit 350 with the bulb 340, the case 370, and the power receiving unit 380 removed from the lamp 300. FIG.

<Light emitting part>
The light emitting unit 310 includes a plurality of LEDs 312 arranged in a line along the longitudinal direction of the mounting substrate 311 on a long rectangular and flat mounting substrate 311.

A wiring pattern is formed of a metal thin film or the like on the main surface of the mounting substrate 311 on the side where the LEDs 312 are mounted. In addition, screw holes 311 a for fixing the mounting substrate 311 to the case 370 are formed at both ends in the longitudinal direction of the mounting substrate 311.

In the present embodiment, the LED 312 is an SMD (Surface Mount Device) type.

The LED 312 is obtained by packaging an LED as a semiconductor light emitting element and a sealing body covering the LED as one chip. The light emission color of the LED, the material configuration of the sealing body, and the wavelength conversion characteristics are the same as those of the LED 12 and the sealing body 13, respectively.

In the present embodiment, the SMD type LED 312 is used. However, the present invention is not limited to this, and like the LED 12 in the first to third embodiments, the LED 312 is sealed on the type LED directly formed on the mounting substrate. What formed the stop 13 may be used.

<Valve>
The valve 340 is formed in a long cylindrical shape. The bulb 340 is formed from a resin material such as an acrylic resin having translucency. The valve 340 is not limited to a resin material, but may be a light-transmitting material, and may be formed from, for example, glass or ceramics.

Furthermore, the entire bulb 340 may not have translucency. For example, only the portion located on the main emission direction side (in this embodiment, the side on which the LED 312 of the mounting substrate 311 is mounted) has translucency, and the portion located on the side opposite to the main emission direction. May not have translucency. Further, for example, a heat pipe (heat sink) or the like may be provided in a portion located on the side opposite to the main emission direction.

Further, the inner peripheral surface of the bulb 340 may be subjected to light diffusion treatment with silica or the like. In this case, the entire inner peripheral surface of the bulb 340 may not be subjected to light diffusion processing, and at least the inner peripheral surface of the bulb 340 located on the main emission direction side of the light emitting unit 310 is subjected to light diffusion processing. It only has to be.

Furthermore, the valve 340 is not necessarily cylindrical. For example, a polygonal cylinder shape or a semi-cylindrical shape may be used, and any shape that covers at least the main emission direction side of the light emitting unit 310 may be used.

<Case>
Case 370 includes a first case portion 371 and a second case portion 372. The first case portion 371 and the second case portion 372 are both bottomed cylindrical members made of an insulating material such as resin. The first case portion 371 includes a side wall portion 371a and a bottom portion 371b. The second case portion 372 includes a side wall portion 372a and a bottom portion 372b.

The first case portion 371 and the second case portion 372 are respectively fitted to both end portions of the valve 340.

Side wall portions

371 a and 372 a of the first case portion 371 and the second case portion 372 are notched in the main emission direction side portion of the opening end side portion which is the end portion on the side fitted to the bulb 340, respectively. It has become a shape. The shortest length in the tube axis direction of the side wall portion 371a and the side wall portion 372a is W1, and the longest length is W2. Specifically, the lengths W1 and W2 are, for example, W1 is 10 mm to 29 mm and W2 is about 80 mm to 90 mm. In the state where the first case portion 371 and the second case portion 372 are fitted to the valve 340, the

side portions

371a and 372a have the shortest length portion (the length W1 portion) located on the emission direction side. ing. In the present embodiment, when the lamp 300 is viewed from the side, the opening side end portions of the first case portion 371 and the second case portion 372 are notched linearly obliquely with respect to the cylinder axis. It has a shape.

Support portions

331 and 332 to which the mounting substrate 311 is attached are formed on the inner peripheral surfaces of the first case portion 371 and the second case portion 372 opposite to the main emission direction side, respectively.

Screw holes

331a and 332a, which are through holes, are formed in the

support portions

331 and 332, respectively. Then, in a state where the light emitting unit 310 is supported in the bulb 340 by the

support portions

331 and 332, both ends of the mounting substrate 311 are fixed to the

support portions

331 and 332 by screws 333, respectively.

In the present embodiment, the support portion 331 is formed integrally with the first case portion 371, and the support portion 332 is formed integrally with the second case portion 372, but is not limited thereto. . The support part may be formed as a separate member and attached to the case part.

<Power receiving unit>
The bottom portion 371b of the first case portion 371 is provided with a bar-like pin 381 in an opposing manner. A rod-like pin 382 is provided opposite to the bottom portion 372 b of the second case portion 372. The

pins

381 and 382 constitute a power receiving unit 380. The

pins

381 and 382 are made of a metal such as aluminum or copper, and are connected to a pair of sockets provided in a lighting apparatus for a straight tube fluorescent lamp.

In FIGS. 7A and 7B, of the pair of pins 381, the back-side pin 381 is hidden behind the front-side pin 381 and cannot be seen, so only the front-side pin 381 is shown. . Similarly, out of the pair of pins 382, the back-side pin 382 is hidden behind the near-side pin 382 and cannot be seen, so only the near-side pin 381 is shown. Therefore, in FIGS. 7A and 7B, only one

381 and 382 are shown, but in actuality, a total of four pins are erected, two each. Yes.

In addition, a rod-like pin 382 provided upright on the bottom portion 372b of the second case portion 372 is for fixing the lamp 300 to a lighting fixture or the like, and receives power from outside and supplies power to the circuit unit 350. Has no function to do. However, the role of supplying power is not limited to the pin 381, and any one of the

pins

381 and 382 may play a role. Therefore, it is assumed that the power receiving unit 380 is configured by the pin 381 and the pin 382, and in FIG. For convenience, the reference numeral of the power receiving unit 380 is attached to the pin 381 side.

Further, both the pin 381 and the pin 382 may receive power from the outside and supply power to the circuit unit.

<Circuit unit>
The circuit unit 350 includes a first circuit unit part 350a and a second circuit unit part 350b. The first circuit unit portion 350a includes a circuit board 351a and various electronic components 52 mounted on the circuit board 351a. The second circuit unit portion 350b includes a circuit board 351b and various electronic components 52 mounted on the circuit board 351b. In FIG. 7B and FIG. 8 as well, only some of the electronic components 52 are denoted by reference numerals.

As shown in FIGS. 7B and 8, the

circuit boards

351a and 351b are housed inside the first case portion 371 and the second case portion 372, respectively, in a semi-cylindrical manner. And the electronic component 52 is mounted on the main surface inside the curve of the

circuit boards

351a and 351b. A wiring 353 led out from the circuit board 351a of the first circuit unit portion 350a is connected to a portion of the pin 381 exposed inside the first case portion 371 by a conductive bonding material such as solder. As a result, the first circuit unit 350a is electrically connected to the pin 381.

The first circuit unit portion 350a and the second circuit unit portion 350b are connected by a wire 354. Since the wiring 354 is arranged through the side of the mounting substrate 311 where the LED 312 is not mounted, the wiring 354 does not block the light emitted from the LED 312. In addition, the central portion 354a of the wiring 354 is a twisted line, and noise leakage to the outside due to a high-frequency current flowing through the wiring 354 can be suppressed.

A connector 356 is attached to the end of the wiring 355 led out from the circuit board 351b of the second circuit unit part 350b, and the connector 356 is connected to a socket 357 disposed on the mounting board 311. The second circuit unit part 350b and the light emitting part 310 are electrically connected.

The end of the circuit board 351b on the side close to the light emitting part 310 has a shape in which the main emission direction side is cut out in the same manner as the second case part 372. Thereby, it is possible to secure a slightly large area of the mounting substrate on which the electronic component 52 is mounted or wiring is connected. The circuit board 351a does not have a shape in which the main emission direction side is notched.

Here, as described above, since the main case direction side of the first case portion 371 and the second case portion 372 is cut out, the following effects can be obtained.

As the number of electronic components 52 mounted on the circuit boards increases, the area of the

circuit boards

351a and 351b constituting part of each of the first circuit unit part 350a and the second circuit unit part 350b increases. End up. Here, the cylindrical axis direction of the side wall portions of the first case portion 371 and the second case portion 372 according to the size of the circuit board so that the circuit board is accommodated in the first case portion 371 and the second case portion 372. It is conceivable to increase the length of. However, since the length of the lamp in the longitudinal direction is determined by the standard, if the length of the first case portion 371 and the second case portion 372 in the cylinder axis direction is increased, the first case portion 371 in the bulb 340 is correspondingly increased. The area not covered by the second case portion 372, that is, the area of the light emitting part of the lamp is reduced, and the area of the non-light emitting part is increased. When the area of the non-light emitting portion is increased, the appearance impression is deteriorated.

On the other hand, according to this configuration, even if the areas of the

circuit boards

351a and 351b are increased, the main emission direction side is notched as described above, so that a part of the light emitted from the LED 12 is cut off. Since the notch part is reached and the notch part shines dimly, deterioration of the visual impression can be suppressed.

Note that the circuit board 351a may have a shape in which the main emission direction side is cut out in the same manner as the circuit board 351b. The circuit board 351b may have a shape in which the main emission direction side is not cut out.

In the present embodiment, the circuit unit 350 is divided into two parts, a first circuit unit part 350a and a second circuit unit part 350b, and accommodated in the first case part 371 and the second case part 372, respectively. Thereby, in order to accommodate a circuit unit, the increase in the length in the cylinder axis direction of a case can be suppressed. That is, when the circuit unit is accommodated in one of the case portions without being divided, the length of the case portion in the cylinder axis direction increases. When the case portion becomes long, the non-light-emitting portion of the lamp becomes longer correspondingly, and there is a risk of deteriorating the visual impression. Furthermore, if the length of the other non-light-emitting portion is longer than the non-light-emitting portion at one end of the lamp, the visual impression is further deteriorated. According to the configuration of the present embodiment, it is possible to suppress the deterioration of the appearance impression as described above.

However, the present invention is not limited to the configuration in which the circuit unit is divided into two parts and disposed at both ends of the lamp as in the lamp 300 according to the present embodiment. When the size of the circuit unit is sufficiently small, or when the appearance impression is not important, all the circuit units may be arranged at one end of the lamp.

As described above, even in the configuration of the lamp 300 according to the present embodiment, the area for mounting the electronic component 52 is increased by making the circuit board a curved shape along the inner peripheral surface of the case portion. be able to. Thereby, a case part can be reduced in size, ensuring the area of a circuit board required for mounting the electronic component 52. FIG. In addition, when the area of the circuit board is increased, such as when the number of electronic components is increased, an increase in the size of the case portion can be suppressed.

<Modification>
The configuration of the present invention has been described based on the first to fourth embodiments. However, the present invention is not limited to the above-described embodiments, and the following modifications can be implemented. In addition, in order to avoid duplication of description, the same components as those in Embodiments 1 to 4 are denoted by the same reference numerals and description thereof is omitted.

<Modification 1>
In the lamp 100 according to the second embodiment shown in FIG. 5, the heat pipe 20 serves as a heat conducting member that transfers heat from the light emitting unit 110 to the power receiving unit 80 to dissipate the heat, and the light emitting unit 110 is used as a globe. It also played a role as a support member disposed in the air 40. However, the present invention is not limited to this, and the heat pipe may serve only as a heat conducting member.

FIG. 9 is a cross-sectional view illustrating a schematic configuration of a lamp 400 according to the first modification. The lamp 400 includes a case 70, a light emitting unit 10, a circuit unit 50, and a globe 40 as main components. The basic configuration of the lamp 400 is the same as that of the lamp 100 except that the lamp 400 is different from the lamp 100 according to the second embodiment in the following points. The lamp 400 is arranged such that the light emitting unit 10 is connected to the front end portion of the large-diameter portion 71 in the same manner as the lamp 1 according to the first embodiment, instead of being disposed in the globe 40 in the air. It is different from 100. In the lamp 400, the heat pipe 420 does not extend into the globe 40, and the front end of the heat pipe 420 is fixed to the back surface (rear surface) of the mounting substrate 11 with an adhesive or the like. Is different from the lamp 100. That is, in other words, the lamp 400 is different from the lamp 1 according to the first embodiment in that the heat pipe 320 is provided, and the basic configuration is the same as that of the lamp 1. be able to.

Also in the configuration of the lamp 400 according to the first modification, the manner in which the circuit unit 50 is accommodated in the large-diameter portion 71 is the same as in the first and second embodiments, and thus is the same as in the first and second embodiments. In addition, the case 70 can be reduced in size.

Furthermore, the heat radiation of the light emitting unit 110 can be improved by conducting the heat of the light emitting unit 10 to the power receiving unit 80 by the heat pipe 420 to dissipate the heat.

<Modification 2>
FIG. 10 is a cross-sectional view illustrating a schematic configuration of a lamp 500 according to the second modification. The basic configuration of the lamp 500 is the same as that of the lamp 100 according to the second embodiment, except that the concave portion 521 is formed on the peripheral surface of the heat pipe 520.

The recess 521 is formed at a position corresponding to the electronic component 52 a, and a part of the electronic component 52 a is located in the recess 521. At this time, when the electronic component 52 a comes into contact with the recessed surface of the recess 521, heat generated in the electronic component 52 a is conducted to the heat pipe 520 and is radiated to the power receiving unit 80 via the heat pipe 520. In this case, a treatment such as forming an insulating film on the recessed surface of the recessed portion 521 may be performed.

In addition, since a part of the electronic component 52a is located in the recess 521, the electronic component 52a contacts the recess 521 even when the rear end 51c of the circuit board 51 is detached from the bottom surface 177. It is possible to suppress the unit 50 from moving inside the case 170. Thereby, it is possible to suppress the occurrence of problems such as disconnection of wiring or separation of the electronic component 52 from the circuit board 51.

<Modification 3>
FIG. 11 is a cross-sectional view showing a schematic configuration of a lamp 600 according to the third modification. As shown in FIG. 11, a continuous recess 621 may be formed on the outer peripheral surface of the heat pipe 620 over the entire circumference in the circumferential direction.

Also in the configuration of the lamp 600, as in the case of the lamp 500 according to the second modification, the heat generated in the electronic component 52a is transmitted from the concave portion 621 to the heat pipe 620, and is radiated from there to the power receiving unit 80. it can.

Further, even when the rear side end 51 c of the circuit board 51 is detached from the bottom surface 177, it is possible to suppress the circuit unit 50 from moving inside the case 170.

<Modification 4>
In the first embodiment and the first modification, the mounting substrate 11 is formed integrally with the case 70. However, it is not limited to this. FIG. 12 is a cross-sectional view illustrating a schematic configuration of a lamp 700 according to the fourth modification. As shown in FIG. 12, the lamp 700 is different from the lamp 1 in that the mounting substrate 711 is provided as a separate member independent of the case 770. Furthermore, the lamp 1 differs from the lamp 1 in that a projection 778 for fixing the mounting substrate 711 to the front end 773 of the large-diameter portion 771 protrudes in the direction toward the lamp axis J1. The lamp 700 has the same basic configuration as the lamp 1 except for the differences in the above two points. The large diameter portion 771, the small diameter portion 772, the front end portion 773, the groove portion 774, the rear opening 775, and the bottom surface 777 of the lamp 700 are respectively the large diameter portion 71, the small diameter portion 72, and the front end portion 73 in the lamp 1. , Corresponding to the groove 74, the rear opening 75, and the bottom surface 77. The mounting substrate 711, the LED 12, and the sealing body 13 constitute a light emitting unit 710.

According to the configuration of the lamp 700 according to this modification, the mounting substrate 711 is formed as a separate member from the case 770, and therefore, the case 770 is attached before the mounting substrate 711 is attached to the protrusion 778 of the case 770. The circuit unit 50 can be inserted into the large diameter portion 771 from the front opening 776. Since the front opening 776 is larger than the rear opening 775, the circuit unit 50 can be easily inserted into and fixed to the case 770. Moreover, since the circuit unit 50 can be inserted into the case 770 without being rounded down, the risk of damage to the electronic component 52 can be reduced. Furthermore, since the circuit unit 50 does not have to be rounded down, the mounting density of electronic components on the circuit board 51 can be increased, which is advantageous for downsizing.

<Modification 5>
In the lamp 700 according to the modified example 4, since the mounting substrate 711 is not integrally formed with the case 770, the mounting substrate 711 is protruded after the circuit unit 50 is accommodated in the large diameter portion 771 when assembled. 778. Thereby, the freedom degree about the method of fixing the circuit unit 50 inside the large diameter part 771 can be enlarged more.

FIG. 13 is a cross-sectional view illustrating a schematic configuration of a lamp 800 according to the fifth modification. On the bottom surface 877 of the case 870, a groove portion 877a for fixing the rear side end portion 51c of the circuit board 51 is formed. Since the mounting substrate 711 is a separate member from the case 870, the circuit unit 50 can be inserted into the case 870 from the front opening 876 of the case 870 before the mounting substrate 711 is attached to the case 870. At that time, the circuit unit 50 can be fixed to the case 870 by inserting the rear end 51c of the circuit board 51 into the groove 877a. Alternatively, after applying an adhesive or the like inside the groove portion 877a, the rear side end portion 51c of the circuit board 51 may be fitted to fix the circuit unit 50 inside the large diameter portion 871. Then, after mounting an adhesive or the like on the upper surface of the protruding portion 878, the mounting substrate 711 is placed, the mounting substrate 711 is fixedly attached to the case 870, and the front opening 876 is closed by the mounting substrate 711.

The basic configuration of the case 870 is the same as that of the case 770 except that the groove 877a is formed. The large diameter portion 871, the small diameter portion 872, the front side end portion 873, the groove portion 874, the rear side opening 875, the bottom surface 877, and the projection portion 878 in the lamp 800 are respectively the large diameter portion 771, the small diameter portion 772, and the front portion. It corresponds to the side end 773, the groove 774, the rear side opening 775, the bottom 777, and the protrusion 778.

<Modification 6>
Moreover, in the modification 5, the structure which fitted and fixed the circuit board in the groove part provided in the bottom face of the large diameter part was demonstrated. However, the location where the groove is provided is not limited to this, and may be any location as long as it is a surface inside the large diameter portion. For example, a circuit unit is formed by forming a groove in the longitudinal direction (front-rear direction) on the inner peripheral surface of the large-diameter portion, and press-fitting a side end portion (a portion corresponding to a fan-shaped side) of the circuit board 51 into the groove. 50 may be fixed inside the large diameter portion.

<Modification 7>
FIG. 14 is a cross-sectional view showing a schematic configuration of a lamp 900 according to Modification 7. As shown in FIG. As shown in the figure, the outer peripheral surface of the circuit board 951 is affixed to the inner peripheral surface 954 b of the cylindrical tubular member 954, and the rear side end portion 954 c of the cylindrical member 954 is formed on the bottom surface 877 of the case 870. The groove portion 877a is fitted and fixed.

The circuit unit 950 is different from the circuit board 51 in that the circuit board 951 is rectangular when deployed in a plane so that the circuit board 951 fits the inner peripheral surface 954b of the cylindrical tubular member 954. The basic configuration is the same as that of the circuit unit 50. On the circuit board 951, various electronic components 52 are mounted, and a wiring pattern (not shown) is formed.

<Modification 8>
In Embodiments 1 to 4 and Modifications 1 to 7, all electronic components are mounted on the inner peripheral surface of the circuit board. However, the present invention is not limited to this.

FIG. 15 is a cross-sectional view illustrating a schematic configuration of a lamp 1000 according to Modification 8. As shown in the figure, a part of the electronic component 52 is mounted on the outer peripheral surface 1051 a of the circuit board 1051. That is, the electronic component 52 is mounted on both the outer peripheral surface 1051a and the inner peripheral surface 1051b of the circuit board 1051.

When all electronic components are mounted on one main surface of the circuit board by arranging electronic components on both the outer peripheral surface 1051a and the inner peripheral surface 1051b of the circuit board 1051 as in the lamp 1000 according to this modification. Since the number of electronic components mounted on one main surface is reduced, the area of the circuit board can be reduced accordingly. That is, the length of the circuit board in the lamp axis J1 direction can be shortened, and the length of the case in the lamp axis J1 direction can be shortened.

At this time, as shown in FIG. 15, the relatively tall electronic component 52a is mounted on the inner peripheral surface 1051b of the circuit board 1051, and the relatively short electronic component 52 is mounted on the outer peripheral surface 1051a. Then, the circuit board 1051 can be disposed closer to the inner peripheral surface 1071a of the large-diameter portion 1071 of the case 1070, and the area of the circuit board 1051 can be made as large as possible.

The basic configuration of the case 1070 in the present modified example is the same as that of the case 770 of the lamp 700 according to the modified example 4 except that the length in the lamp axis J1 direction is relatively short. The large-diameter portion 1071, the small-diameter portion 1072, the front-side end portion 1073, the rear-side opening 1075, the front-side opening 1076, the bottom surface 1077, and the protrusion 1078 in the case 1070 are the large-diameter portion 771 and the small-diameter portion 772 in the lamp 700, respectively. , Corresponding to the front side end 773, the rear side opening 775, the front side opening 776, the bottom surface 777, and the protrusion 778.

<Modification 9>
Alternatively, a relatively tall electronic component 52a may be mounted on the outer peripheral surface of the circuit board. FIG. 16 is a cross-sectional view illustrating a schematic configuration of a lamp 1100 according to Modification 9. As shown in FIG. 16, in the lamp 1100, the electronic component 52 a is mounted on the outer peripheral surface 1151 a of the circuit board 1151. In this case, as shown in FIG. 16, the electronic component 52a may be disposed on the front side where the large-diameter portion 1071 has a large inner diameter. Since the electronic component 52a is disposed on the front side, the circuit board 1151 has a shape with a smaller diameter toward the front side in a state where the circuit board 1151 is curved and accommodated inside the large diameter portion 1071. In a state where the circuit board 1151 is developed in a plane, it has a fan-like shape like the circuit board 51 shown in FIG. 4, and inside the case, the shorter one of the arcs of the fan is in the front side. Contained. Further, all of the relatively short electronic components 52 may be mounted on the inner peripheral surface 1151b of the circuit board 1151, or a part thereof may be mounted on the outer peripheral surface 1151a.

<Modification 10>
Further, in the configurations of the modification examples 8 and 9, the circuit unit is fixed inside the large-diameter portion 1071 by providing a protrusion for locking the electronic component 52 and the circuit board 51 on the inner peripheral surface 1071a of the large-diameter portion 1071. May be.

<Modification 11>
Further, the opposing sides of the curved circuit board (end edges corresponding to the fan-shaped sides) may be connected to form a cylindrical shape. In the modification 11, a case where a circuit unit that is formed in a cylindrical shape by connecting two opposite sides of a circuit board is applied to a straight tube LED lamp will be described as an example.

FIG. 17 is a view showing a lamp 1200 according to the eleventh modification. FIG. 17A is a side view of the lamp 1200, and FIG. 17B is a cross-sectional view of the lamp 1200. In the lamp 1200, the first case portion 1271 includes a bottomed cylindrical portion 1271a and a bottomless cylindrical portion 1271b, and the second case portion 1272 includes a bottomed cylindrical portion 1272a and a bottomless cylindrical portion 1272b. It consists of and.

The first case unit 1271 accommodates a first circuit unit unit 1250a in which various electronic components 52 are mounted on the inner peripheral surface of a cylindrical circuit board 1251a. The second case unit 1272 houses a second circuit unit unit 1250b in which various electronic components 52 are mounted on the inner peripheral surface of a cylindrical circuit board 1251b. The first circuit unit portion 1250a and the second circuit unit portion 1250b constitute a circuit unit 1250.

The movement of the end portion of the circuit board 1251a on the light emitting unit 310 side in the direction of approaching the light emitting unit 310 is restricted by the support unit 1231. Further, the movement of the end portion of the circuit board 1251b on the light emitting unit 310 side in the direction of approaching the light emitting unit 310 is restricted by the support unit 1232.

Further, the inner diameter of the internal space of the first case portion 1271 corresponds to the outer diameter of the circuit board 1251a. The inner diameter of the internal space of the second case portion 1272 corresponds to the outer diameter of the circuit board 1251b.

As a result, when the lamp 1200 is transported, damage to circuit components or wiring caused by the movement of the first circuit unit 1250a and the second circuit unit 1250b inside the first case 1271 and the second case 1272 Can be suppressed.

In addition, since the first case portion 1271 and the second case portion 1272 are each composed of a bottomed cylindrical portion and a bottomless cylindrical portion, the first circuit unit portion 1250a and the second circuit unit portion 1250b are It is easy to accommodate the first case portion 1271 and the second case portion 1272 respectively. Specifically, after the first circuit unit portion 1250a is inserted into the bottomless cylindrical portion 1271b, the bottomed cylindrical portion 1271a is covered and the bottomed cylindrical portion 1271a is attached to the bottomless cylindrical portion 1271b. Thus, the first circuit unit portion 1250a is accommodated in the first case portion 1271. Attachment of the bottomed cylindrical portion 1271a to the bottomless cylindrical portion 1271b may be performed using an adhesive, or an engagement structure such as a claw-shaped member may be used. The housing of the second circuit unit portion 1250b in the second case portion 1272 and the attachment of the bottomed tubular portion 1272a to the bottomless tubular portion 1272b are performed in the same manner as described above.

In addition, the circuit board may be fixed to the inner peripheral surface of the case using an adhesive or an adhesive.

<Modification 12>
In the case where one aspect of the present invention is applied to a straight tube lamp like the lamp 300 according to the fourth embodiment and the lamp 1200 according to the modification 11, the cutouts of the first case portion and the second case portion are side surfaces. It may not be cut out linearly in view.

FIG. 18 is a side view of a lamp 1300 according to Modification 12. As shown in the figure, in the lamp 1300, the main emission direction side portions of the side surfaces of the first case portion 1371 and the second case portion 1372 are cut out in a curved manner. The first case portion 1371 and the second case portion 1372 form a case 1370.

<Modification 13>
In the lamp 100 according to the second embodiment, the mounting substrate 111 has a flat plate shape, but is not limited thereto.

FIG. 19 is a cross-sectional view showing a schematic configuration of a lamp 1400 according to Modification 13. The lamp 1400 is integrally formed with a base portion 1422 having a quadrangular pyramid shape at the front end portion of the heat pipe 1420. Further, a light emitting unit 1410 in which an LED 312 is mounted on a mounting substrate 1411 is attached to the upper surface and side surfaces of the base unit 1422. The basic configuration of the lamp 1400 is the same as that of the lamp 100 except that the lamp 1400 is different from the lamp 100 according to the second embodiment in the above two points.

Here, the heat pipe 1420 and the base part 1422 serve as a support member that supports the light emitting part 1410 in the globe 40. The heat pipe 1420 is a support main body portion that is fixed to the power receiving unit 80.

<Modification 14>
FIG. 20 is a cross-sectional view illustrating a schematic configuration of a lamp 1500 according to Modification Example 14. As in the lamp 1500 shown in FIG. 20, the base portion 1522 may be formed as a separate member from the heat pipe 20. Further, like the lamp 1500, the LED 312 may be directly mounted on the base portion 1522 instead of on the mounting substrate. In this case, the base portion 1522 is preferably formed from a material such as resin or ceramic. A wiring pattern (not shown) is also directly formed on the base portion 1522.

In the case of the lamp 1500 according to the modified example 14, since the base portion 1522 also serves as a mounting substrate in addition to the role as a support member, the light emitting portion 1510 is configured by the LED 312 and the base portion 1522. Can be seen as doing. Further, the base portion 1522 may be formed using a heat conductive resin or the like, and the base portion 1522 may further function as a heat conductive member.

<Modification 15>
FIG. 21 is a cross-sectional view showing a schematic configuration of a lamp 1600 according to Modification 15. As shown in FIG. As shown in FIG. 21, the base portion 1622 may have an inverted quadrangular pyramid shape. When the base portion 1622 has an inverted quadrangular pyramid shape like the lamp 1600, the light from the LED 312 mounted on the side surface of the base portion 1622 is emitted to the rear side of the lamp 1600. It is possible to improve the light distribution characteristics.

In the lamp 1600, the LED 312 is directly mounted on the surface of the base portion 1622. Accordingly, the base portion 1622 also functions as a mounting substrate, and it can be considered that the light emitting portion 1610 is configured by the LED 312 and the base portion 1622. In this case, since the base portion 1622 is formed of a material such as resin or ceramic, and the heat pipe 1620 and the base portion 1622 are integrally formed, the heat pipe 1620 is also made of resin, ceramic, or the like. Manufacturing from the material is easy. In that case, a material having good thermal conductivity may be used.

In the lamp 1600, the base portion 1622 is integrally formed at the front end portion of the heat pipe 1620. However, the base portion 1622 is not limited to this and is attached to the heat pipe 1620 as a separate member. It may be.

In the lamp 1600, the LED 312 is directly mounted on the surface of the base portion 1622. However, the present invention is not limited to this. For example, a mounting board made of a flexible board or the like on which LEDs are mounted may be attached to the surface of the base portion 1622.

<Modification 16>
In the case where the LED has a light emitting part mounted directly or via a mounting substrate on the surface of the base part having a quadrangular pyramid shape like the

lamps

1400, 1500, 1600 according to the modified examples 13, 14, 15 Since the LED mounted on the side surface of the pedestal is close to the globe, it can be considered that when the user looks at the lamp from the side, the light from the LED appears glaring. In order to suppress such glare, for example, the thickness of the glove may be changed.

FIG. 22 is a cross-sectional view showing a schematic configuration of a lamp 1700 according to Modification 16. As shown in FIG. 22, in the lamp 1700, the thickness of the side portion 1743 that is a portion close to the LED 312 a mounted on the side surface 1422 a of the base portion 1422 of the globe 1740 is increased, and the top surface portion 1744 is increased. The thickness decreases as it goes to. Thereby, the light emitted from the LED 312a to the side is weakened or diffused while passing through the side portion 1743 of the globe 1740, thereby reducing glare.

Note that the LED 312a is given a different reference for the sake of convenience in order to distinguish the LED mounted on the side surface 1422a from the other LEDs, and the LED 312 and the LED 312a are mounted on the base portion. Except for the difference in the upper position, it is exactly the same. The same applies to the modified examples 17 and 18 below.

<Modification 17>
Furthermore, in order to reduce glare of the LED, a light diffusion process may be performed on the inner surface of the side portion of the globe.

FIG. 23 is a cross-sectional view showing a schematic configuration of a lamp 1800 according to Modification 17. As shown in FIG. 23, in the globe 1840 of the lamp 1800, a light diffusion process is performed on the side inner surface 1843a that is the inner surface of the side portion 1843. Specifically, the side inner surface 1843a is subjected to so-called frost processing in which a large number of minute depressions (or irregularities) are formed.

In addition, it is good also as a structure by which many fine dents were further formed in the recessed surface of each said fine dent.

<Modification 18>
FIG. 24 is a cross-sectional view showing a schematic configuration of a lamp 1900 according to Modification 18. As shown in FIG. 24, a light diffusion layer 1944 may be formed on the side inner surface 43 a of the side portion 43 of the globe 40. The light diffusion layer 1944 may be formed, for example, by applying a turbid liquid in which a colorless transparent polymer is made turbid with silica or the like to the side inner surface 43a.

Further, a film-like member having translucency, light diffusibility, and flexibility may be attached to the side inner surface 43a. Furthermore, a translucent cylindrical member having a light diffusion treatment applied to the surface or the inside may be disposed inside the side portion 43 of the globe 40.

<Modification 19>
In the modified examples 13, 16, 17, and 18, the mounting substrate 1411 is made of a flexible material such as a flexible substrate, but is not limited thereto. The mounting substrate may be formed from a material such as resin or ceramic that does not have flexibility. Further, the mounting substrate may be configured by combining a plurality of parts.

<Modification 20>
FIG. 25 is a cross-sectional view showing a schematic configuration of a lamp 2000 according to Modification 20. The lamp 2000 is different from the lamp 700 according to the modification 4 in that a circular or partly C-shaped groove 2011a is formed on the back surface of the mounting substrate 2011. Except for the difference from the lamp 700 in the above points, the lamp 2000 has the same basic configuration as the lamp 700.

As shown in FIG. 25, the front end 51d of the circuit board 51 is press-fitted into the groove 2011a provided on the back surface of the mounting board 2011, whereby the circuit unit 50 is fixed inside the large-diameter part 771. ing. In addition, after applying adhesive etc. inside the groove part 2011a, the front side end part 51d may be fitted and the circuit unit 50 may be fixed inside the large diameter part 771.

The light emitting unit 2010 of the lamp 2000 according to this modification has the same configuration as the light emitting unit 710 of the lamp 700 according to modification 4 except that a groove 2011a is formed on the back surface of the mounting substrate 2011. Have. A light emitting unit 2010 is configured by the mounting substrate 2011, the LED 12, and the sealing body 13.

Further, the rear side end of the circuit board is fitted into the groove provided on the bottom surface of the case, and the front side end of the circuit board is fitted into the groove on the back surface of the mounting board, so that the front side of the circuit board is fitted. Further, both end portions on the rear side may be fixed by groove portions.

When the mounting substrate is independent from the case as in the

lamps

700, 800, and 2000 according to the fourth modification, the fifth modification, and the twenty modification 20, the circuit unit is stored in advance. Since it is possible to place the circuit unit in a large-diameter part or to arrange a circuit unit divided into multiple parts in a predetermined shape within the large-diameter part, the degree of freedom in circuit board material and shape, and circuit unit shape and arrangement There is an advantage that it can be designed large.

<Modification 21>
For example, a cylindrical shape in which the circuit board 2151 is closed may be used like a circuit unit 2150 of the lamp 2100 according to the modified example 21 shown in FIG. FIG. 26 is a cross-sectional view of the lamp 2100 and corresponds to a cross-sectional view taken along the line AA ′ in FIG.

Since the circuit unit 2150 does not need to be inserted into the large-diameter portion 71 from the rear side opening 75 in a state of being rounded and reduced like the circuit unit 50 in the first embodiment, as a material used for the circuit board 2151, The material is not limited to a flexible material used for a flexible substrate such as polyimide, and a material having rigidity such as a resin or ceramic may be used as long as it is an insulating material. In the case where the circuit board 2151 is made of a flexible material, a wiring pattern is formed on a flat circuit board and an electronic component is mounted, and then the two opposite sides are curved using an adhesive or the like. To form a cylindrical shape.

Note that, since the circuit board 2151 has a cylindrical shape with a closed peripheral surface, unlike the circuit board 51 in the first embodiment, the force to spread by its own elastic force does not work. Therefore, as a fixing method inside the large-diameter portion 771 of the circuit unit 2150, an adhesive tape is applied to the bottom surface 777 of the large-diameter portion 771, and the rear side end portion of the circuit board 2151 is fixed, or an adhesive is used to The side end portion may be fixed to the bottom surface 777.

Further, like the lamp 800 according to the modified example 5 shown in FIG. 13, a circular groove portion is provided on the bottom surface 777, and the rear end portion of the circuit board 2151 is fitted into the groove portion so that the circuit unit 2150 has a large diameter portion. 771 may be fixed inside.

Further, like the lamp 2000 according to the modified example 20 (see FIG. 25), a groove is provided on the back surface of the mounting substrate, and the front end of the circuit board 2151 is fitted into the groove so that the circuit unit 2150 has a large diameter portion. 771 may be fixed inside.

<Modification 22>
Further, for example, like the circuit unit 2250 of the lamp 2200 according to the modified example 22 shown in FIG. 27, the circuit board 2251 has a plurality of circuit boards 2251 along the inner peripheral surface 771a of the large-diameter portion 771. It is good also as a structure which is arrange | positioned and the electronic component 52 is each mounted in the internal peripheral surface 2251b of each circuit board 2251. FIG. FIG. 27 is a cross-sectional view of the lamp 2200 and corresponds to a cross-sectional view taken along the line AA ′ in FIG.

In the circuit unit 2250, the circuit boards 2251 are connected to each other by wiring 2254. The electronic components 52 mounted on the separate circuit boards 2251 are electrically connected to each other through the wiring 2254, so that the electronic components 52 can operate in cooperation with each other.

As for the fixing method of the circuit unit 2250 in the large-diameter portion 771 in the lamp 2200 according to the modified example 22, it may be fixed using an adhesive tape, an adhesive, a groove or the like.

Further, each circuit board 2251 is not limited to the arc shape as shown in FIG. 27 as viewed from the front side along the lamp axis J1, but is linear or bent at one or more places. It may be. In the case of a shape bent at a plurality of locations, it is preferable to bend in a direction protruding outward (side toward the inner peripheral surface 771a) at all the bent locations.

Furthermore, a plurality of circuit boards 2251 having different shapes may be used in combination.

<Modification 23>
Further, like the circuit unit 2350 of the lamp 2300 according to the modified example 23 shown in FIG. 28, the circuit board 2351 is bent instead of curving, and the shape of the end portion when viewed from the front side or the rear side is You may have a shape which lacked one side of the polygon. FIG. 28 is a cross-sectional view of the lamp 2300 and corresponds to a cross-sectional view taken along the line AA ′ in FIG.

The member used for the circuit board 2351 may be a flexible member such as a flexible substrate, or may be a rigid member such as a resin or ceramic as long as it is an insulating member. When using a member having rigidity, the circuit unit 2350 may be fixed inside the large-diameter portion 771 by using an adhesive tape, an adhesive, a groove, or the like.

When a member having flexibility is used, although it depends on the degree of bending, the circuit board 2351 usually tries to spread by its own elastic force even if it is bent. Therefore, like the circuit unit 50 in the first embodiment, The circuit unit 2350 is held inside the large-diameter portion 771 by the frictional force between the outer peripheral surface 2351a of the circuit board 2351 and the inner peripheral surface 771a of the large-diameter portion 771. Also in this case, of course, the circuit unit 2350 may be fixed using an adhesive tape, an adhesive, a groove or the like.

In the lamp 100 according to the second embodiment, the light emitting unit 110 using a transparent substrate as the mounting substrate 111 is disposed in the air in the globe 40, and a part of the light emitted to the rear side of the LED 12 passes through the mounting substrate 111. The light transmission characteristics were improved by transmitting and illuminating the rear side of the globe 40. However, the configuration for improving the light distribution characteristics is not limited to this, and the following modifications may be considered.

<Modification 24>
FIG. 29 is a partially cutaway perspective view showing a schematic configuration of a main part of a lamp 2400 according to Modification 24. FIG. FIG. 30 is a partially cutaway cross-sectional view illustrating a schematic configuration of a main part of a lamp 2400 according to Modification Example 24. As shown in FIGS. 29 and 30, the lamp 2400 is supported so that the light emitting portion 2410 is disposed in the globe 40 by the support 2420 attached on the front surface 2478 of the large diameter portion 2471 of the case 2470. Has been. The lamp 2400 includes an optical member 2490 that transmits part of the light emitted from the light emitting unit 2410 and reflects part of the light backward. The support 2420 is a heat sink made of aluminum or the like, for example, and supports the light emitting unit 2410 and also improves the heat dissipation of the light emitting unit 2410.

The optical member 2490 is a beam splitter and has a bottomed cylindrical shape including a substantially cylindrical main body portion 2491 that is open on both sides and a substantially annular mounting portion 2492 that closes the rear-side opening of the main body portion 2491. The outer diameter of the front end portion of the main body portion 2491 (the maximum outer diameter of the main body portion 2491) is large enough to cover the LED 12 and the sealing body 13. The optical member 2490 is positioned at a position centered on the lamp axis J1, and is fixed to the mounting substrate 2411 and the support 2420 with screws 3.

The optical member 2490 is made of a translucent material, and the outer peripheral surface 2491a of the main body portion 2491 is subjected to a mirror surface treatment. In addition, as a translucent material, resin materials, such as a polycarbonate, glass, a ceramic, etc. can be considered, for example. In addition, as a method of applying a mirror finish to the outer peripheral surface 2491a, for example, a reflective film such as a metal thin film or a dielectric multilayer film is formed by a method such as a thermal evaporation method, an electron beam evaporation method, a sputtering method, or a plating method. Can be considered.

As shown in FIG. 30, a part of the main emitted light emitted from the LED 12 and incident on the outer peripheral surface 2491a of the main body 2491 is reflected obliquely rearward from the mounting substrate 2411 by the outer peripheral surface 2491a (optical path L1). The other part passes through the main body 2491 and travels forward (optical path L3).

The lamp 2400 includes a main body 2491 that directs a part of the main emitted light of the LED 12 obliquely rearward away from the mounting substrate 2411. Therefore, the light distribution characteristic is good even when the irradiation angle of the LED 12 is narrow. Further, the main body 2491 not only reflects a part of the main emitted light but also transmits the other part forward, so that the shadow by the optical member 2490 hardly occurs, and the lamp 2400 can be viewed from the front when it is lit. The design properties are good.

In this modification, the outer peripheral surface 2491a is such that the reflectance of the optical member 2490 (the reflectance of the outer peripheral surface 2491a) is 50% and the transmittance of the optical member 2490 (the transmittance of the outer peripheral surface 2491a) is 50%. The mirror finish is applied. In order to keep the light distribution characteristics of the lamp 2400 good, the reflectance is preferably 50% or more. Further, in order to maintain a good design when the lamp 2400 is turned on, the transmittance is preferably 40% or more. In summary, assuming that light absorption by the main body 2491 is 0%, the reflectance is preferably 50% to 60%, and the transmittance is preferably 40% to 50%. Note that the reflectance and transmittance do not need to be uniform over the entire outer peripheral surface 2491a, and may be configured such that they vary depending on the region.

The basic structure of the lamp 2400 according to the modified example 24 is the same as that of the case 70 except that the front surface 2478 of the case 2470 is not a mounting substrate, and includes a large diameter portion 2471 and the like. A wiring hole 2414 that is a through hole is formed in the front surface 2478. The wiring hole 2414 corresponds to the wiring hole 14 in the lamp 1.

<Modification 25>
FIG. 31 is a partially cutaway perspective view showing a schematic configuration of a main part of a lamp 2500 according to Modification 25. FIG. FIG. 32 is a cross-sectional view illustrating a schematic configuration of a main part of a lamp 2500 according to Modification Example 25. As shown in FIG. 31 and FIG. 32, the lamp 2500 according to the modified example 25 is the lamp according to the modified example 24 in that the optical member 2590 is a reflecting mirror and an opening 2594 is provided in the main body 2591 thereof. Different from 2400. Other points are basically the same as those of the lamp 2400 according to the modified example 24.

The optical member 2590 has, for example, a bottomed cylindrical shape including the main body portion 2591 and the attachment portion 2592, which is the same shape as the optical member 2490 according to the modified example 24 except that the opening 2594 is provided. The outer diameter of the front end portion of the main body portion 2591 (the maximum outer diameter of the main body portion 2591) is large enough to cover the LED 12 and the sealing body 13. The optical member 2590 is positioned at a position centering on the lamp axis J1, and is fixed to the mounting substrate 2411 and the support 2420 with the screw 3. The support 2420 is a heat sink and supports the light emitting unit 2410 and also serves to enhance the heat dissipation of the light emitting unit 2410.

The main body 2591 is provided with a plurality of openings 2594 that are elongated along the circumferential direction of the main body 2591. Specifically, each opening 2594 is a substantially arc-shaped slit that is obtained by dividing an annular ring around the cylinder axis of the main body 2591 into four equal parts, and is formed by four substantially arc-shaped slits. A substantially annular slit with a concentric circle about the cylinder axis is provided. Since the opening 2594 is provided along the circumferential direction of the main body 2591, positioning of the opening 2594 and the sealing body 13 in the circumferential direction is easy.

The sealing body 13 of the light emitting unit 2410 is partially exposed from each opening 2594 when viewed from the front side along the lamp axis J1. Therefore, as shown in FIG. 32, a part of the main emitted light from the LED 12 is reflected by the outer peripheral surface 2591a and heads obliquely backward avoiding the mounting substrate 2411 (optical path L4), but the main emitted light from the LED 12 The other part passes through the opening 2594 and leaks forward (optical path L5).

The lamp 2500 includes an optical member 2590 that directs a part of the main emitted light of the LED 12 obliquely backward avoiding the mounting substrate 2411. Therefore, the light distribution characteristic is good even when the irradiation angle of the LED 12 is narrow. Further, since the optical member 2590 is provided with an opening 2594 that leaks the other part of the main emitted light forward, the optical member 2590 is less likely to be shaded by the optical member 2590, and when the lamp 2500 is viewed from the front during lighting. Good designability.

In addition, the shape, size, number, and arrangement of the opening 2594 are not necessarily limited to the above, and are arbitrary. Note that the opening 2594 is not limited to the slit as in the present modification, and any opening that can leak the other part of the main emitted light of the LED 12 forward, such as a hole or a notch, may be used. Further, in this modification, the opening 2594 is a through-hole and nothing is fitted therein. However, the opening 2594 may have a configuration in which light leaks forward without being configured in this way. A translucent member may be fitted into all or a part of 2594, and light may leak forward through the translucent member.

<Modification 26>
FIG. 33 is a partially cutaway cross-sectional view illustrating a schematic configuration of a main part of a lamp 2600 according to Modification 26. As shown in FIG. 33, in the lamp 2600, the mounting substrate 2611 of the light emitting unit 2610 is a transparent substrate, the support 2620 that supports the light emitting unit 2610 with respect to the front surface 2478 is a light guide member, and the optical member. Is different from the lamp 2400 according to Modification Example 24 and the lamp 2500 according to Modification Example 25.

The support 2620 is made of a light-transmitting member such as a resin such as acrylic or glass. For example, the diameter of the front end surface to which the mounting board 2611 is attached is substantially equal to the diameter of the mounting board 2611, and the front to the rear. It has a substantially cylindrical shape (inverted truncated cone shape) that has a diameter reduced toward.

Light emitted from the LED 12 of the light emitting unit 2610 to the rear side passes through the mounting substrate 2611 that is a transparent substrate and enters the support 2626 that is a light guide member, and from the side surface (circumferential surface) of the support 2620 to the outside. And the rear side of the globe 40 is illuminated. Thereby, a favorable light distribution characteristic can be obtained even when the irradiation angle of the LED 12 is narrow.

Note that the shape of the support 2620 is not limited to the substantially cylindrical shape having a diameter reduced from the front to the rear as described above. For example, a cylindrical shape whose diameter does not change from the front to the rear may be used, and the shape is not limited to a cylindrical shape, and may be a polygonal column such as a pentagonal column or a hexagonal column. Furthermore, for example, a dome-shaped space may be provided inside the support 2620, and the light emitted from the LED 12 to the rear side and incident on the support tool 2620 can be emitted to the rear side of the globe 40. Any shape can be used.

<Modification 27>
Moreover, it is good also as a structure with which the support tool which consists of a light guide member is equipped with a heat sink. FIG. 34 is a partially cutaway cross-sectional view showing a schematic configuration of a main part of a lamp 2700 according to Modification 27. The lamp 2700 according to the modification 27 is different from the lamp 2600 according to the modification 26 in that the support 2720 has a heat sink 2721 therein.

The support 2720 made of a light guide member has a cylindrical through hole at the center, and a cylindrical heat sink 2721 is inserted into the through hole.

The heat sink 2721 is made of, for example, a metal such as aluminum, and the front surface thereof is attached to the back surface, which is the rear main surface of the mounting substrate 2611 that is a transparent substrate.

Light emitted from the LED 12 of the light emitting unit 2610 to the rear side is transmitted through the mounting substrate 2611 that is a transparent substrate and enters the support 2720 that is a light guide member, and from the side surface (circumferential surface) of the support 2720 to the outside. And the rear side of the globe 40 is illuminated. Thereby, a favorable light distribution characteristic can be obtained even when the irradiation angle of the LED 12 is narrow.

Further, the heat dissipation of the light emitting portion 2610 can be enhanced by the heat sink 2721.

The shape of the heat sink 2721 is not limited to the cylindrical shape as described above, and may be, for example, a polygonal column.

Furthermore, the heat sink 2721 may have a shape in which a cylinder protrudes from the center of the disk, and the cylinder may be inserted into the through hole of the support 2720. In this case, the disk portion of the heat sink may be attached on the front surface 2478 (front side).

Still further, a through hole is provided in the center of the front surface 2478 so that the cylindrical portion of the heat sink is inserted into the through hole from the back surface side (rear side) of the front surface 2478 and protrudes from the through hole of the front surface 2478. A support 2720 may be fitted. In this case, the disk portion of the heat sink may be fixed to the back surface of the front surface 2478 using an adhesive or the like. For example, another member such as an engaging claw may be provided to connect the disk portion to the front surface 2478 or the large diameter portion 2471. You may fix to the surrounding surface.

<Modification 28>
As an optical member that transmits a part of the main emitted light of the LED forward and reflects the remaining part obliquely rearward, the following modifications can be considered.

FIG. 35 is a partially cutaway perspective view showing a schematic configuration of a main part of a lamp 2800 according to Modification 28. FIG. FIG. 36 is a partially cutaway cross-sectional view showing a schematic configuration of a main part of the lamp 2800. FIG. 37 is a plan view of the lamp 2800 with the globe 40 removed, as viewed from the front side.

The optical member 2890 includes a support column 2895 erected at the center of the mounting substrate 11 and a star-shaped member 2891 attached to the front end of the support column 2895. The star-shaped member 2891 is made of a light-transmitting member such as glass or acrylic, and when viewed in plan, as shown in FIG. 37, eight rectangular blades extend radially from the center at substantially equal intervals. It has the shape of a star or asterisk. The sealing body 13 of the light emitting unit 10 is partially exposed from the gap 2894 between the blades when viewed from the front side along the lamp axis J1. Further, the front surface (front side main surface) and / or the back surface (rear side main surface) of the star-shaped member 2891 is frosted. Thus, as shown in FIG. 36, a part of the main emitted light of the LED 12 passes forward through the gap 2894 (optical path L6), and the remaining part is diffused and reflected by the star-shaped member 2891. A part of the light is reflected obliquely backward avoiding the mounting substrate 11 (optical path L7).

In FIG. 36, a cross-section is displayed at the central portion where the wings of the star-shaped member 2891 overlap, but the wings do not overlap and a gap 2894 is formed outside.

As described above, the lamp 2800 according to the modified example 28 includes the optical member 2890 that diffuses and reflects a part of the main emitted light of the LED 12 obliquely rearward away from the mounting substrate 11. The light distribution characteristics are good even when N is narrow. Further, since the optical member 2890 is provided with a gap 2894 that allows other part of the main emitted light to pass forward, shadows due to the optical member 2890 hardly occur, and when the lamp 2800 is viewed from the front during lighting. Good designability.

In addition, the shape and number of the blades of the star-shaped member 2891 and the shape of the gap are not necessarily limited to the above, and are arbitrary. Further, the star-shaped member 2891 and the support column 2895 may be integrally formed. Furthermore, the blades of the star-shaped member 2891 may have a shape whose cross section is curved like the cross section of the optical member 2490 shown in FIG. Further, in place of the frost processing, the back surface of the blades of the star-shaped member 2891 is mirror-finished, and like the optical member 2490, a part of the main emitted light of the LED 12 is transmitted to the front side, and the remaining part is mounted on the mounting substrate. You may make it reflect in the diagonally backward which avoided 11.

Furthermore, the star-shaped member 2891 may be provided with a frosting process in a star shape (asterisk shape) on the surface of a disk made of a light-transmitting member such as glass without providing a blade or a gap.

Still further, instead of frost processing, an inclined surface having an angle for reflecting the emitted light from the LED 12 to an oblique rear side avoiding the mounting substrate 11 is formed on the back surface of the star-shaped member 2891, and the inclined surface is mirror-finished. May be applied. In this case, the inclined surface may be formed over almost the entire surface of the blade, one for each blade, or a large number of fine inclined surfaces may be formed on each blade. In the latter case, the angle of the inclined surface and the direction of inclination formed on each blade may be aligned, but by combining the inclined surfaces with different angles and inclination directions, the light diffusibility is improved and the lamp is turned on at the time of lighting. Since unevenness in brightness is less likely to occur on the back side of the globe 40 of 2800, better design properties can be realized.

<Modification 29>
In each said embodiment and each modification, although the case was formed from resin, it is not restricted to this. As a material for forming the case, a metal or ceramic may be used in addition to the resin. When the case is formed of metal, an insulating film coating may be applied to the inner peripheral surface of the case (larger diameter inner peripheral surface).

<Modification 30>
In Embodiment 4, Modification Example 11, and Modification Example 12, the side portions of the first case portion and the second case portion on the emission direction side are notched, but the present invention is not limited to this. The side wall portions of the first case portion and the second case portion are not cut out, and the shape of the light emitting portion side end portions of the first case portion and the second case portion is a straight line that is substantially orthogonal to the cylinder axis in a side view. There may be.

<Modification 31>
In the modified examples 13 to 18, the base part is a quadrangular pyramid, but the invention is not limited to this. The base part may be another polygonal frustum or a truncated cone. Furthermore, the base part may be a rectangular parallelepiped, a rectangular parallelepiped, or a polyhedron.

<Modification 32>
In each of the above embodiments and modifications, the case where an LED is used as the semiconductor light emitting element has been described as an example, but the semiconductor light emitting element is not limited to the LED. The semiconductor light emitting element may be, for example, an LD (laser diode) or an EL element (electric luminescence element).

<Modification 33>
A heat conductive member may be arranged between the circuit board and the case, and the heat generated in the circuit unit may be more actively conducted to the case and radiated from the case to the outside through the base. Here, the case where a heat conductive member is applied to the structure of the lamp 700 according to the modification 4 shown in FIG. 12 will be described below with reference to the drawings.

38 is a cross-sectional view showing a schematic configuration of a lamp 2900 according to Modification 33. FIG. As shown in the drawing, in the lamp 2900, a heat conductive member 2960 is disposed between the outer peripheral surface 51 a of the circuit board 51 and the inner peripheral surface 771 a of the large diameter portion 771 of the case 770. The basic structure of the lamp 2900 is the same as that of the lamp 700 according to the modification 4 except that the heat conductive member 2960 is provided.

As the heat conductive member 2960, for example, a heat conductive resin can be used. In this case, after applying paste-like thermally conductive resin to the inner peripheral surface 771a, the circuit unit 50 is inserted into the large-diameter portion 771. The circuit board 51 spreads by its own elastic force, so that the outer peripheral surface 51a of the circuit board 51 is in close contact with the thermally conductive resin. In this state, the heat conductive resin is solidified to form a heat conductive member 2960. The thermally conductive member 2960 plays a role of an adhesive that fixes the circuit board 51 to the large diameter portion 771 in addition to the role of conducting the heat generated in the circuit unit 50 to the case 770. That is, in addition to the effect of improving the heat dissipation of the circuit unit 50, the effect of stably holding the circuit unit 50 by holding the shape of the circuit board 51 can be obtained. As a result, the thermal load received by the various electronic components 52 and physical damage due to vibration or the like can be reduced, which contributes to a longer life.

Further, as described above, in addition to the case where the paste-like heat conductive resin is solidified, as a heat conductive member, a heat conductive adhesive was applied to both surfaces of a sheet made of a heat conductive material. An adhesive sheet may be used. In this case, as the heat conductive material forming the sheet, a heat conductive resin, metal, ceramic, or the like can be used.

38. In the lamp 2900 according to this modification shown in FIG. 38, the mounting substrate 711 is a separate member independent of the case 770. Therefore, the heat conductive resin can be easily applied to the inner peripheral surface 771a of the large diameter portion 771 in a state where the mounting substrate 711 is removed from the case 770. For example, when the thermally conductive resin is applied in a configuration in which the mounting substrate and the case are integrally formed as in the lamp 1 according to the first embodiment shown in FIG. A method of applying a heat conductive resin by inserting a nozzle or the like for applying a resin into the large-diameter portion 71 can be considered.

<Modification 34>
In the lamp 2900 according to the modification 33, the heat conductive member 2960 is disposed so that the substantially entire outer peripheral surface 51a of the circuit board 51 is in contact with the lamp 2900. However, the present invention is not limited to this. FIG. 39 is a cross-sectional view of a lamp 3000 according to the modified example 34. As shown in the figure, in the lamp 3000, a portion of the outer peripheral surface 51a of the circuit board 51 corresponding to a location where the electronic component 52 is mounted (a portion on the back side of the location where the electronic component 52 is mounted). Only) is provided with a heat conductive member 3060. The basic structure of the lamp 3000 is the same as that of the lamp 700 according to the modification 4 except that the heat conductive member 3060 is provided.

Also with the configuration of the present modification, the heat generated in the electronic component 52 can be conducted to the case 770 via the heat conductive member 3060, so that the heat dissipation of the circuit unit 50 can be improved. In addition, when a heat conductive resin is used for the heat conductive member 3060, the heat conductive member 3060 also functions as an adhesive in the same manner as the heat conductive member 2960 of the modified example 33. And the circuit unit 50 can be stably held. As a result, thermal damage received by various electronic components and physical damage due to vibration or the like can be reduced, which contributes to a longer life. Moreover, since the usage-amount of a heat conductive member is few compared with the lamp | ramp 2900 which concerns on the modification 33, it can contribute to resource saving and weight reduction.

Also in the lamp 3000 according to this modification, the mounting substrate 711 is a separate member independent of the case 770. Therefore, the case 770 in which the mounting substrate 711 is removed from the circuit unit 50 in a state where the heat conductive resin is applied to the portion corresponding to the portion where the electronic component is mounted on the outer peripheral surface 51a of the circuit board 51. Can be easily inserted into the large-diameter portion 771. When the circuit board 51 spreads by its own elastic force, the heat conductive resin is pressed against the inner peripheral surface 771a of the large diameter portion 771 and solidifies as it is to become the heat conductive member 3060.

Also in the present modified example, as in the modified example 33, as the thermally conductive member 3060, an adhesive sheet in which an adhesive having thermal conductivity is applied to both surfaces of a sheet made of a thermally conductive material may be used. In this case, as the heat conductive material forming the sheet, a heat conductive resin, metal, ceramic, or the like can be used.

<Modification 35>
In the modification 33 and the modification 34, the configuration has been described in which a heat conductive member is disposed between the outer peripheral surface of the circuit board and the inner peripheral surface of the large-diameter portion to improve the heat dissipation of the circuit unit. However, the structure which improves the heat dissipation of a circuit unit is not restricted to this. For example, the circuit board and the heat pipe may be thermally coupled using a heat conductive member. Here, the case where a heat conductive member is applied to the configuration of the lamp 100 according to the second embodiment having a heat pipe will be described below with reference to the drawings.

FIG. 40 is a cross-sectional view showing a schematic configuration of a lamp 3100 according to Modification 35. As shown in the figure, in the lamp 3100, the heat conductive member 3160 is filled up to the inside of the small diameter portion 172 of the case 170 and the rear side end portion of the large diameter portion 171 beyond the bottom surface 177. The basic configuration of the lamp 3100 is the same as that of the lamp 100 according to the second embodiment except that the lamp 3100 includes a heat conductive member 3160.

As shown in FIG. 40, the heat conductive member 3160 reaches the rear side end portion 51 c of the circuit board 51, and the bottom portion 20 a that is the rear side portion of the heat pipe 20 is in the heat conductive member 3160. Buried in Accordingly, the rear side end portion 51 c of the circuit board 51 and the bottom portion 20 a of the heat pipe 20 are thermally connected by the heat conductive member 3160. Thereby, the heat generated in the electronic component 52 is transmitted from the rear side end portion 51c of the circuit board 51 to the heat pipe 20 via the heat conductive member 3160, and from the heat pipe 20 via the support base portion 21 and the power receiving portion 80. To dissipate heat to the outside.

Further, according to the configuration of this modification, when heat generated in the electronic component 52 is transmitted from the rear end 51c of the circuit board 51 to the small diameter portion 172, in addition to the path transmitted through the bottom surface 177, the heat conduction It can be transmitted to the small diameter portion 172 through the sex member 3160. Thereby, heat is more easily transmitted from the circuit board 51 to the small diameter portion 172, and the heat dissipation of the circuit unit 50 can be further improved.

As the heat conductive member 3160, a heat conductive resin can be used. In this case, you may form the support base part 21 and the heat conductive member 3160 integrally using the same material. In this case, for example, the following method can be considered. After the circuit unit 50 is inserted into the large diameter portion 171 from the rear opening 175, the power receiving unit 80 is fitted to the small diameter portion 172. Then, a nozzle or the like for filling the resin from the opening 179 is inserted, and the heat conductive resin is filled in the concave portion and the small diameter portion 172 formed by the insulating portion 82 and the eyelet portion 83. Thereafter, the heat pipe 20 is inserted into the case 170 from the opening 179 until the rear end 20b of the heat pipe 20 reaches the insulating portion 82, and the heat conductive resin is solidified in that state. Thereby, the support base part 21 and the heat conductive member 3160 are integrally formed from the same heat conductive resin material.

When filling the heat conductive resin, it is preferable to fill the heat conductive resin in an amount that does not reach the bottom surface 177 slightly. Then, when the heat pipe 20 is inserted, the heat conductive resin is pushed up, enters the large diameter portion 171 beyond the bottom surface 177, and can reach the rear side end portion 51 c of the circuit board 51.

In this case, the heat conductive resin may reach the front side further than the rear side end portion 51 c of the circuit board 51. However, since the volume of the heat conductive resin to be filled increases and the weight of the lamp increases, it is preferable to fill the heat conductive resin to such an extent that the lamp weight does not become too heavy. Moreover, since the support base part 21 needs to be provided with electrical insulation, it is necessary to use a heat conductive resin provided with electrical insulation.

When the support pedestal 21 and the heat conductive member 3160 are formed of different materials, for example, the following method can be employed. After the circuit unit 50 is inserted into the large-diameter portion 171 from the rear-side opening 175, the power receiving portion 80 on which the support pedestal portion 21 in which the concave portion into which the rear-side end portion 20b of the heat pipe 20 is inserted is formed is mounted in advance. Is fitted to the small diameter portion 172. Then, the heat pipe 20 is inserted into the case 170 from the opening 179, and the rear side end portion 20 b is inserted into the concave portion of the support base portion 21. Thereafter, a nozzle or the like for filling the heat conductive resin is inserted from the wiring hole 114 and filled with the heat conductive resin until reaching the rear end 51c of the circuit board 51. Note that a part of the periphery of the opening 179 may be cut out to form a gap with the heat pipe 20, and a nozzle may be inserted through the gap to fill the thermally conductive resin. Further, a through hole for inserting a nozzle or the like for filling a heat conductive resin may be formed separately. In these cases, after filling the heat conductive resin, the gaps and through holes may be closed with a resin or the like.

<Modification 36>
Moreover, you may apply a heat conductive member to the structure of the lamp | ramp 400 which concerns on the modification 1 shown in FIG. FIG. 41 is a cross-sectional view showing a schematic configuration of a lamp 3200 according to Modification 36. As shown in FIG. As shown in the figure, the lamp 3200 has a heat conductive member 3160. Similar to the lamp 3100 according to the modified example 35, the heat conductive member 3160 reaches the rear side end portion 51c of the circuit board 51, and the bottom portion 20a of the heat pipe 20 is buried in the heat conductive member 3160. is doing. The rear end 51 c of the circuit board 51 and the bottom 20 a of the heat pipe 20, and the rear end 51 c and the small diameter portion 72 are thermally connected by a heat conductive member 3160. Thereby, also in the lamp 3200 according to the present modification, the heat dissipation of the circuit unit 50 can be improved as in the lamp 3100 according to the modification 35.

<Modification 37>
In each said embodiment and each modification, although the circuit unit was accommodated only in the large diameter part of a case, it is not restricted to this. For example, a part of the circuit unit may be accommodated in the small diameter portion.

42 is a cross-sectional view showing a schematic configuration of a lamp 3300 according to Modification 37. FIG. FIG. 43 is a plan view of a circuit unit 3350 according to this modification, and is a plan view seen from the inner peripheral surface side of the circuit board 3351 in a state where the circuit board 3351 is spread on a plane. Also in this modification, the circuit board 3351 is a flexible board made of an insulating material such as polyimide.

As shown in FIG. 43, the circuit board 3351 includes a front circuit board part 3351A and a rear circuit board part 3351B connected to the rear side of the front circuit board part 3351A. Similarly to the circuit board 51 according to the first embodiment shown in FIG. 4, the front circuit board portion 3351A has a shape in which a fan-shaped central portion is cut out by a smaller fan having the same central angle.

The rear circuit board part 3351B is connected to the rear side from the center part of the rear arc part 3351Ac corresponding to the arc of the fan-cut part of the front circuit board part 3351A. In the present modification, the rear circuit board portion 3351B is connected to the rear side from the central portion of the rear arc portion 3351Ac, but is not limited thereto. It is not limited to the central part as long as it is connected to the rear side from a part of the rear arc part 3351Ac. For example, it may be connected from a position close to the side, or a part corresponding to a fan-shaped side. You may continue from the side edge part containing a certain side edge.

Most of the electronic components 52 are mounted on the inner peripheral surface 3351Ab of the front circuit board portion 3351A, but some of the electronic components 52 are also mounted on the inner peripheral surface 3351Bb of the rear circuit substrate portion 3351B. ing.

42, the front circuit board portion 3351A and the electronic component 52 mounted on the front circuit board portion 3351A are accommodated in a large diameter portion 3371 of the case 3370. In addition, the electronic component 52 mounted on the rear circuit board portion 3351B and the rear circuit board portion 3351B is accommodated in the small diameter portion 3372 of the case 3370. Accordingly, a part of the electronic component 52 can be arranged in the small diameter portion 3372, and the number of the electronic components 52 arranged in the large diameter portion 3371 can be reduced accordingly. Can be planned.

Further, the electronic component 52 having a short height and the surface mounting type may be mounted on the outer peripheral surface 3351Aa of the front circuit board portion 3351A and the outer peripheral surface 3351Ba of the rear circuit board portion 3351B. Here, as shown in FIG. 42, the cross section of the circuit board 3351 passing through the portion where the front circuit board part 3351A and the rear circuit board part 3351B are connected to each other is rearward from the front side edge of the circuit board 3351. It is linear up to the side edge. The continuous portion is in contact with the inner peripheral edge of the bottom surface 3377, and on the front side of the contacting portion, the outer peripheral surface 3351Aa of the front circuit board portion 3351A and the inner peripheral surface 3371a of the large diameter portion 3371. There is a relatively large gap between the two. In addition, a relatively large gap exists between the outer peripheral surface 3351Ba of the rear circuit board portion 3351B and the inner peripheral surface of the small diameter portion 3372 on the rear side of the contacting portion. Therefore, it is preferable to arrange the electronic component 52 in these relatively large gaps.

42, in the present modification, the portion of the inner peripheral surface on the front side of the small diameter portion 3372 that is in contact with the outer peripheral surface 3351Ba of the rear circuit board portion 3351B is cut obliquely. Accordingly, the gap between the outer peripheral surface 3351Aa of the front circuit board portion 3351A and the inner peripheral surface 3371a of the large diameter portion 3371 can be reduced, and the front circuit board portion 3351A is larger in the large diameter portion 3371. Can spread. Thereby, compared with the case where the inner peripheral surface of the front side of the small diameter portion 3372 is not cut obliquely, the area of the front circuit board portion 3351A can be increased.

In this modification, the circuit unit 3350 is inserted into the case 3370 from the rear side opening 3375 of the case 3370, but is not limited thereto. For example, when the circuit unit 3350 according to this modification is applied to the lamp 700 according to the modification 4 shown in FIG. 12, the circuit unit 3350 is opened to the front side before the mounting substrate 711 is attached to the case 770. 776 may be inserted into case 770.

<Modification 38>
In the configuration in which a part of the circuit board is arranged in the small diameter portion, the shape of the circuit board is not limited to the shape of the circuit board 3351 according to the modified example 37. For example, the following modifications may be implemented. FIGS. 44A and 44B are views schematically showing a schematic configuration of a circuit board 3450 according to the modified example 38. FIG. FIG. 44A is a plan view of the circuit unit 3450 when the circuit board 3451 is developed on a plane, as viewed from the inner peripheral surface 3451Ab and the inner peripheral surface 3451Bb side. FIG. 44B is a partially cutaway perspective view schematically showing an aspect of the circuit unit 3450 in a state of being accommodated in the case. In FIG. 44B, the case is not shown for the sake of clarity, but here, the circuit unit 3450 is accommodated in the case 770 according to the fourth modification, for example. Also in this modification, the circuit board 3351 is a flexible board made of a material having insulating properties and flexibility such as polyimide.

44 (a) and 44 (b), the circuit board 3451 has a configuration in which a front circuit board part 3451A and a rear circuit board part 3451B are connected via a bridge part 3451C. The front circuit board portion 3451A has a shape in which a fan-shaped center portion is cut out by a smaller fan shape having the same central angle. The rear circuit board portion 3451B has a shape in which the central portion on the front side is excluded from the shape in which the central portion of the sector is cut out with a smaller sector having the same central angle. The excluded portion is a bridge portion 3451C.

The front circuit board part 3451A and the rear circuit board part 3451B are both accommodated in the large-diameter part and the small-diameter part in a state of being bent into a cylindrical shape. The bridge portion 3451C is a portion placed on the bottom surface of the case, and the length of the bridge portion 3451C corresponds to the width of the bottom surface of the case.

Here, the length of the front arc portion 3451Bc of the rear circuit board portion 3451B is set shorter than the length of the rear arc portion 3451Ac of the front circuit board portion 3451A. Thereby, when bent into a cylindrical shape, the outer diameter of the cylinder at the front end of the rear circuit board 3451B is smaller than the inner diameter of the cylinder at the rear end of the front circuit board 3451A. Accordingly, the portion of the rear circuit board portion 3451B that is located in front of the bridge portion 3451C is disposed in the cylinder of the front circuit board portion 3451A without interfering with the front circuit board portion 3451A.

As described above, since the bridge portion 3451C is provided, the size of the gap between the front circuit board portion 3451A and the inner peripheral surface of the large-diameter portion can be reduced in the case of the circuit unit 3350 according to the modified example 43. It can be made smaller than Thereby, compared with the circuit unit 3350, the area of the front circuit board part 3451A can be made larger.

In addition, the size of the gap between the rear circuit board part 3451B and the inner peripheral surface of the small diameter part can be reduced as compared with the case of the circuit board 3351 according to the modified example 43, and the rear part of the small diameter part can be rearward. The side circuit board portion 3451B can be arranged in a cylindrical shape. Thereby, compared with the circuit unit 3350, the area of the back side circuit board part 3451B can be enlarged more. Therefore, since more electronic components 52 can be mounted on the rear circuit board portion 3451B, the number of electronic components mounted on the front circuit board portion 3451A can be reduced, and the case can be reduced in size.

As described above, according to the configuration of the circuit unit 3450 according to this modification, the areas of the front circuit board portion 3451A and the rear circuit board portion 3451B can be further increased. As a result, even when the case is downsized, the area of the circuit board necessary for mounting the electronic component can be ensured to contribute to downsizing of the lamp.

<Modification 39>
In each of the above-described embodiments and modifications, the case where one aspect of the present invention is applied to a light bulb-type lamp and a straight tube fluorescent lamp-type lamp has been described as an example, but the present invention is not limited thereto.

45 (a) and 45 (b) are perspective views showing a schematic configuration of a lamp 3500 according to Modification 39. FIG. 45A is a perspective view of the lamp 3500 viewed from the rear side, and FIG. 45B is a perspective view of the lamp 3500 viewed from the front side. FIG. 46 is an exploded perspective view of the lamp 3500. In FIG. 46, the lower side of the drawing is the front and the upper side of the drawing is the rear.

45 (a) and 45 (b), the lamp 3500 has a disk shape or a flat columnar shape as a whole, and is a so-called light engine type lamp. For example, the lamp 3500 has an outer diameter of 50 mm to 100 mm and a height of 30 mm to 50 mm.

As shown in FIG. 46, the lamp 3500 includes a heat conductive sheet 3520, a support 3560, a filling member 3530, a light emitting unit 3510, a case 3570, a power receiving unit 3580, a circuit unit 3550, a reflecting mirror 3590, and a cover as main components. Part 3540 and the like.

47 (a) is a perspective view of the case 3570 as viewed from the front side. FIG. 47B is a perspective view schematically showing a state where the light emitting unit 3510 is attached to the case 3570. FIG. 48 is a cross-sectional view showing a schematic configuration of the lamp 3500. In FIG. 48, the lower side of the drawing is the front and the upper side of the drawing is the rear.

Hereinafter, each component will be described in more detail.

<Light emitting part>
The light emitting unit 3510 includes a mounting substrate 3511, a plurality of LEDs 12 mounted on the mounting substrate 3511, and a sealing body 13 that covers the plurality of LEDs 12. The mounting substrate 3511 is preferably formed using a material having electrical insulation and good thermal conductivity. Examples of the material having electrical insulation and good thermal conductivity include ceramics such as alumina and aluminum nitride. Alternatively, a metal core substrate having a laminated structure of a metal substrate such as aluminum or copper and a resin substrate may be used.

In FIGS. 45 (b), 46 and 47 (b), only the sealing body 13 is shown because the LED 12 is covered with the sealing body 13 and cannot be seen.

<Support stand>
The support 3560 is a member that serves as a base on which the light emitting unit 3510 is attached via the filling member 3530. Moreover, the support stand 3560 is a member connected to a lighting fixture. Specifically, a base structure of, for example, GH76p type is formed on the upper portion of the support base 3560, and is attached and fixed to the lighting fixture. The support base 3560 also plays a role of transferring heat generated in the light emitting unit 3510 to the lighting fixture side, and thus is preferably formed from a material having good thermal conductivity. Examples of the material having good thermal conductivity include metal materials such as aluminum.

<Heat conduction sheet>
The heat conductive sheet 3520 is a heat conductive sheet for conducting heat transferred from the light emitting portion 3510 to the support base 3560 through the filling member 3530 to the lighting fixture side and radiating it. Specifically, the heat conductive sheet 3520 is a rubber or resin sheet, for example, a silicon sheet or an acrylic sheet. Moreover, you may use what mixed metal filler etc. in rubber | gum or resin and improved thermal conductivity.

<Case>
The case 3570 is a cylindrical member formed of a material such as an insulating resin, and includes a large diameter portion 3571 and a small diameter portion 3572. As the insulating resin material, for example, PBT (polybutylene terephthalate) or the like can be used.

The large-diameter portion 3571 and the small-diameter portion 3572 are, for example, substantially cylindrical shapes that are open on both sides, and are connected to each other in a manner in which the cylinder axes substantially coincide with each other, and are integrally formed. The large diameter portion 3571 has openings at both ends, but the end on the rear side is not an opening as a whole, and is part of the bottom of the bottomed cylindrical member having an opening at the front end. Further, the shape is such that an opening is provided. That is, an opening 3577 a is formed in the central portion of the bottom 3577 of the large diameter portion 3571. A fixing portion 3573 extending rearward is formed on a peripheral portion of the opening 3577a that is a portion that defines the opening 3577a of the bottom portion 3577.

A plurality of screw holes 3577 b are formed in the bottom portion 3577, and the case 3570 is fixed to the support base 3560 with fixing screws 3503. At this time, the mounting substrate 3511 of the light emitting unit 3510 is sandwiched between the fixing unit 3573 and the support base 3560, whereby the light emitting unit 3510 is attached to the rear side of the case 3570. At this time, the light emitting unit 3510 is attached to the case 3570 in a state where the LED 12 and the sealing body 13 are positioned in the opening 3577a. Further, the opening 3577a is closed by the mounting substrate 3511. In FIG. 47B, the LED 12 is covered with the sealing body 13 and cannot be seen.

A circuit unit 3550 and a reflecting mirror 3590 are accommodated in the large diameter portion 3571. And the cover part 3540 is attached to the front side edge part of the large diameter part 3571 in the state accommodated in the inside of the large diameter part 3571. That is, the front side opening 3571a is closed by the cover portion 3540.

A plurality of recesses 3571b1 are formed on the front side of the inner peripheral surface 3571b of the large-diameter portion 3571 of the case 3570 at intervals in the circumferential direction.

<Filling member>
The filling member 3530 is disposed between the support base 3560 and the mounting substrate 3511. When the mounting substrate 3511 is sandwiched between the support base 3560 and the fixing portion 3573 of the case 3570, the filling member 3530 serves as a buffer. It is a sheet-like member. Therefore, the filling member 3530 may be made of a material that has elasticity to some extent and can allow deformation to some extent.

In addition, the filling member 3530 is formed of a material having thermal conductivity in order to thermally connect the mounting substrate 3511 and the support base 3560 and smoothly conduct heat from the light emitting unit 3510 to the support base 3560. It is good to be done. Furthermore, the filling member 3530 is more preferably formed of a material having electrical insulation properties in order to ensure electrical insulation properties between the mounting substrate 3511 and the support base 3560. As a specific material for forming the filling member 3530, rubber, resin, or the like can be used. For example, silicone rubber or butyl rubber can be used as the rubber. As the resin, for example, a silicone resin or an acrylic resin can be used.

<Reflector>
The reflecting mirror 3590 is an optical member that is housed in the large-diameter portion 3571, reflects the light emitted from the light emitting portion 3510, and emits the light to the front side of the lamp 3500 via the cover portion 3540. The reflecting mirror 3590 is a circular plate in a plan view that is connected to a cylindrical reflecting mirror main body 3591 that gradually increases in diameter from the rear side toward the front side, and a front end 3591a of the reflecting mirror main body 3591. It is comprised from the flange part 3592 which is a shape member.

The rear end 3591b of the reflector main body 3591 is inserted into the small diameter portion 3572 from the opening 3577a of the large diameter portion 3571. The LED 12 sealed by the sealing body 13 of the light emitting unit 3510 is located in the rear side opening of the reflecting mirror main body 3591. Thereby, the light emitted from the LED 12 is emitted to the in-cylinder space of the reflecting mirror main body 3591 through the rear opening of the reflecting mirror main body 3591.

The reflecting mirror 3590 is formed of an insulating resin material such as polycarbonate. In order to improve the reflectance of the reflecting mirror 3590, at least the reflecting mirror main body 3591 is formed of a white resin material. Accordingly, light emitted from the light emitting unit 3510 to the in-cylinder space of the reflecting mirror main body 3591 is reflected to the front side by the inner peripheral surface 3591c of the reflecting mirror main body 3591.

Further, the rear side end of the reflector main body 3591 is in contact with the mounting board 3511 and plays a role of fixing the mounting board 3511 between the support base 3560 and the fixing part 3573. The outer diameter of the flange portion 3592 is set to be approximately equal to or slightly smaller than the inner diameter of the large diameter portion 3571. Further, the flange portion 3592 is in contact with the cover portion 3540. Thereby, the reflecting mirror 3590 is stably held and accommodated in the large diameter portion 3571 without rattling.

Note that a reflective film made of a metal thin film or the like may be formed on the inner peripheral surface 3591c of the reflector main body 3591 by vapor deposition, coating, or the like to improve the reflectance.

<Circuit unit>
The circuit unit 3550 is mainly for turning on the LED 12, and includes a circuit board 3551 and various electronic components 52 arranged on the circuit board 3551. The circuit board 3551 is made of, for example, a resin such as polyimide having electrical insulation and flexibility. As shown in FIGS. 46 and 48, the circuit board 3551 has an inner peripheral surface 3551b which is a main surface on which the electronic component 52 is mounted on the inner side, and an inner peripheral surface 3571b of the large diameter portion 3571 of the case 3570. It is housed in a space between the reflecting mirror 3590 and the inner peripheral surface 3571b of the large-diameter portion 3571 in the large-diameter portion 3571 in a curved manner along the line. Thereby, the circuit board is formed as a flat plate member having an annular shape in plan view, and compared with the case where the circuit board is attached to the bottom 3577 of the large-diameter portion 3571 in a posture orthogonal to the cylindrical axis of the case, the area of the circuit board is reduced. Can be increased. Therefore, even when the case 3570 is miniaturized as the lamp 3500 is miniaturized, a circuit board mounting area sufficient to mount necessary electronic components can be secured. Thereby, it can contribute to size reduction of a lamp.

Here, as shown in FIG. 48, the reflecting mirror main body 3591 has a shape that increases in diameter from the rear side toward the front side, and therefore, the reflecting mirror main body portion 3591 and the inner peripheral surface 3571b of the large diameter portion 3571 The space between is larger on the rear side. Therefore, it is preferable to arrange the tall electronic component 52 a among the electronic components 52 on the rear side of the circuit board 3551.

Even in the case of this modification, not all electronic components 52 may be arranged on the inner peripheral surface 3551b of the circuit board 3551. For example, some of the electronic components 52 are outer peripheral surfaces 3551a of the circuit board 3551. It may be arranged above. In that case, the short electronic component 52 may be disposed on the outer peripheral surface 3551a. The electronic component 52 to be mounted on the outer peripheral surface 3551a is more preferably a surface-mount type electronic component 52.

<Power receiving unit>
The power receiving unit 3580 includes a pair of electrical connection pins 3581. As shown in FIG. 45 (a), the electrical connection pin 3581 extends from a through hole 3577 c provided in a portion located outside the small diameter portion 3572 at the bottom 3577 of the large diameter portion 3571 toward the outside of the large diameter portion 3571. It protrudes. When the lamp 3500 is attached to the lighting fixture, the rear side end 3581a, which is the protruding portion of the electrical connection pin 3581, contacts an electrode provided in the socket of the lighting fixture, Receive power from outside.

One end of the wiring 53 is connected to the front end 3581b which is the end opposite to the rear end 3581a of the electrical connection pin 3581 and is the end accommodated in the large diameter portion 3571. The other end of the wiring 53 is connected to an electrode (not shown) formed on the circuit board 3551. Thereby, the electrical connection pin 3581 and the circuit unit 3550 are electrically connected.

<Translucent cover>
The cover portion 3540 is a flat bottomed cylindrical member attached to the front side of the case 3570 in order to protect the member disposed inside the case 3570. The cover part 3540 includes a front cover 3541 corresponding to the bottom part of the cylinder, a side wall part 3542 corresponding to the side wall part of the cylinder, a claw-like part 3543 extending from the side wall part 3542 to the rear side, and the like.

The side wall portion 3542 is fitted into the large diameter portion 3571 from the front opening 3571a of the large diameter portion 3571, and the claw-shaped portion 3543 is engaged with the concave portion 3571b1 provided on the inner peripheral surface 3571b of the large diameter portion 3571. Thus, the cover portion 3540 is attached to the case 3570. Note that the attachment of the cover portion 3540 to the case 3570 is not limited to the above engagement structure, and for example, an adhesive, a rivet, a screw, or the like may be used.

The cover portion 3540 is formed using a resin material having a high light transmittance such as polycarbonate. Accordingly, the light emitted from the light emitting unit 3510 and the light reflected by the inner peripheral surface 3591c of the reflector main body 3591 are transmitted through the cover 3540 and emitted to the front of the lamp 3500.

Note that a paint containing silica or the like may be applied to the inner surface of the cover portion 3540 in order to improve light diffusibility. Further, the light diffusibility may be improved by forming a large number of minute recesses (dimples) on the inner surface of the cover portion 3540 or performing frost processing.

Further, the cover portion 3540 may include a light wavelength conversion member such as a phosphor. In this case, the wavelength of the light emitted from the light emitting unit by the cover unit 3540 can be converted to convert the light color.

As described above, the circuit board 3551 is a flexible flexible board even in the configuration of this modification, and thus the circuit board 3551 is curved along the inner peripheral surface of the large-diameter portion 3571 of the case 3570. Thus, the circuit unit 3550 is accommodated in the large diameter portion 3571. As a result, when the circuit board is accommodated in the case in a posture orthogonal to the cylindrical axis of the case, the rigid flat circuit board is slightly inclined with respect to the cylindrical axis (or slightly inclined with respect to the cylindrical axis). The following effects can be obtained as compared with the case of being housed in the case in the posture). That is, the area of the circuit board 3551 can be made larger than the space inside the case 3570 (here, the space inside the large diameter portion 3571). Thus, even when the case 3570 is downsized, the area of the circuit board 3551 necessary for mounting the plurality of electronic components 52 can be secured, and the lamp 3500 can be downsized.

<Modification 40>
In the modified example 11 and the modified example 21, the case where the circuit board is curved and the two opposing sides are bonded with an adhesive or the like to make the circuit board cylindrical has been described. However, the method of making the circuit board cylindrical is not limited to this. For example, a connecting member such as a connector may be used.

FIG. 49 is a perspective view showing a schematic configuration of a circuit unit 3650 according to Modification 40. FIG. Also in this modification, the circuit unit 3650 includes a flexible insulating circuit board 3651 and various electronic components 52 mounted on the inner peripheral surface 3651b of the circuit board 3651.

A connecting member 3658 is provided on the outer peripheral surface 3651a of the circuit board 3651. The connecting member 3658 includes a connector 3658a and a socket 3658b to which the connector 3658a is connected. The connector 3658a is connected to the base 3658a1 attached on the outer peripheral surface 3651a at the side end portion corresponding to the fan-shaped side of the circuit board 3651, so as to protrude from the base 3658a1 to the outside of the circuit board 3651. Claw-shaped portion 3658a2. The base 3658a1 and the claw-like portion 3658a2 are integrally formed.

A pair of connectors 3658 a are provided on the outer peripheral surface 3651 a at one side end of the circuit board 3651. A pair of sockets 3658b are provided at positions corresponding to the connectors 3658a on the outer peripheral surface 3651a at the other side end of the circuit board 3651. Both the connector 3658a and the socket 3658b are formed of resin or the like.

49, the claw-like portion 3658a2 of the connector 3658a is inserted into the insertion hole 3658b1 of the socket 3658b in a state where the circuit board 3651 is curved with the inner peripheral surface 3651b facing inward. Then, the claw head portion 3658a2a of the claw-like portion 3658a2 fits into the engagement hole 3658b2 of the socket 3658b and engages with each other. As a result, both end portions of the circuit board 3651 are coupled to hold the circuit board 3651 in a cylindrical shape.

<Modification 41>
About the connection member for making a circuit board into a cylindrical shape, the following modifications can also be implemented.

FIG. 50A is a perspective view showing a schematic configuration of a circuit unit 3750 according to the modified example 41. FIG. As shown in FIG. 50 (a), the circuit board 3751 of the circuit unit 3750 is connected by a connecting member 3758 with a gap between both end portions, and is held in a cylindrical shape. The connecting member 3758 is formed by attaching connector heads 3758b to both ends of a long string-like member 3758a.

FIG. 50B is an enlarged perspective view of a main part showing a mode in which the connector head 3758b is connected to the circuit board 3751. The connector head 3758b includes a rectangular parallelepiped head base 3758b1 and a claw-shaped portion 3758b2 connected to the head base 3758b1. A total of four through-holes 3751e are formed at both end portions of the circuit board 3751, one pair each. FIG. 50 (b) shows only one of the four through holes 3751e. Then, as shown in FIG. 50 (b), the claw-like portion 3758 b 2 is inserted into the through hole 3751 e and the both engage with each other, whereby the connector head 3758 b is attached to the circuit board 3751. Thereby, as shown in FIG. 50A, the shape of the circuit board 3751 is held in a cylindrical shape.

According to the connecting member 3758 according to the present modification, the mating partner of the connector head 3758b is a through-hole provided in the circuit board 3751. Therefore, another member such as a socket of the connecting member 3658 according to the modified example 40 is used. It does not have to be. Thereby, it can contribute to resource saving and cost control.

Further, in the present modification, a gap is opened between both end portions of the circuit board 3751. Thereby, for example, when the rear side circuit board part 3451B of the circuit board 3451 according to the modification 38 is held in a cylindrical shape using the connecting member 3758, the following advantages are obtained. That is, since the wiring 53 for electrically connecting the circuit board 3451 and the shell portion 81 of the power receiving unit 80 (see FIG. 12) can be passed through the gaps between both side ends of the circuit board, wiring is easy. The wiring can be prevented from becoming long.

<Modification 42>
In each of the above-described embodiments and modifications, the configuration in which the rear side end of the circuit board is fixed to the bottom surface of the case using an adhesive or an adhesive has been described. Further, like the lamp 800 according to the modified example 5 shown in FIG. 13, the rear side end portion 51 c of the circuit board 51 is inserted into and fixed to the groove portion 877 a formed so as to be recessed into the bottom surface 877 of the case 870. The configuration has been described. However, the fixing of the circuit board in the case is not limited to these.

FIG. 51 is a cross-sectional view showing a schematic configuration of a lamp 3800 according to the modified example 42. As shown in the figure, the case 3870 of the lamp 3800 has a plurality of fixing protrusions 3877 b protruding forward from the bottom surface 3877 of the large diameter portion 3871. The fixing projection 3877b is a rod-like projection, and the tip has a claw shape. The distance between the fixing protrusion 3877 b and the inner peripheral surface 3871 a of the large diameter portion 3871 is substantially the same as the thickness of the circuit board 51. The fixing protrusions 3877b are arranged in an annular shape with a space therebetween in the circumferential direction when viewed in plan.

Prior to the mounting substrate 711 being fixed to the protrusion 3878, the circuit unit 50 is inserted into the large-diameter portion 3871 from the front opening 3876. Then, the rear end 51c of the circuit board 51 is inserted between the fixing projection 3877b and the inner peripheral surface 3871a of the large diameter part 3871, and the circuit board 51 is fixed in the large diameter part 3871.

Here, since the fixing protrusion 3877b has a claw-like tip, it is caught by the rear end 51c of the circuit board 51, and the circuit board 51 is difficult to come off.

Note that the electronic component 52 is not disposed in a portion of the inner peripheral surface 51b of the circuit board 51 that is in contact with the claw of the fixing projection 3877b. Further, it is preferable that no wiring pattern is formed in the portion.

The fixing protrusion 3877b is not limited to the form having a claw-like tip, and may be a columnar protrusion.

In the present modification, the plurality of fixing protrusions 3877b are arranged in a ring shape with a space in the circumferential direction in a plan view, but the present invention is not limited to this. For example, it may be a continuous annular protrusion in plan view. Furthermore, the annular projecting portion may not be continuous, but a part thereof may be lost and a gap may be opened.

It should be noted that the lamp may be a combination of the partial configuration of the lamp according to each of the above embodiments and the configuration according to each of the above modifications as appropriate. In addition, the materials, numerical values, and the like described in the description of each of the above embodiments and modifications are merely preferable examples, and are not limited thereto. Moreover, each drawing is a schematic diagram, and the dimensions and ratios of the members are given as examples, and do not necessarily match the actual dimensions and ratios of the lamps. Furthermore, it is possible to appropriately change the configuration of the lamp without departing from the scope of the technical idea of the present invention.

1,100,200,300,400,500,600,700,800,900,1000,1100,1200,1300,1400,1500,1600,1700,1800,1900,2000,2100,2200,2300,2400, 2500, 2600, 2700, 2800, 2900, 3000, 3100, 3200, 3300, 3500, 3800

Lamp

10, 110, 210, 710, 1410, 1510, 1610, 2010, 2410, 2610, 3510

Light emitting part

11, 111, 211 , 311, 711, 1411, 2011, 2141, 2611, 3511

Mounting substrate

12, 312, 312 a LED (semiconductor light emitting element)
13 Sealed body 20,320,420,520,620,1420,1620

Heat pipe

40,1740,1840 Globe 50,250,350,950,1050,1250,2150,2250,2350,3350,3450,35503650,3750 Circuit unit 51,251,351a, 351b, 951,1051,1151,1251a, 1251b, 2151,2251,2351,3351,3451,3551,3651,3751

Circuit board

52,52a Electronic component 70,170,270,770, 870, 1070, 1370, 2470, 3370, 3570, 3870

Case

71, 171, 771, 871, 1071, 2471, 3371, 3571, 3871

Large diameter part

80, 380, 3580 Power receiving part 78, 2478

Front surface

240, 3540

Cover portion

241, 3541

Front cover

271, 371, 1271, 1371

First case portion

272, 371, 1271, 1372 Second case portion 272a Window portion 340

Valve

521, 621 Recessed portion 954 Cylindrical member 1250a 1st circuit unit part 1250b 2nd

circuit unit part

2420, 2620, 2720

Support tool

2490, 2590, 2890 Optical member 2721 Heat sink 2891 Star-shaped member

Claims

A light emitting unit in which a plurality of semiconductor light emitting elements are arranged on a mounting substrate; a power receiving unit that receives power from outside; a circuit unit having a plurality of electronic components and a circuit board on which they are mounted; and the circuit unit A cylindrical or bowl-shaped case to be housed,
The lamp is characterized in that the circuit unit is housed in the case such that the circuit board is along the inner peripheral surface of the case.
The plurality of electronic components include ones having different heights from the circuit board,
The electronic component having the highest height from at least the circuit board among the plurality of electronic components is mounted on a main surface of the circuit board far from the inner peripheral surface of the case. The lamp according to claim 1.
The lamp according to claim 1, wherein the circuit board is made of a plate-like member having flexibility.
The lamp according to any one of claims 1 to 3, wherein the circuit board is fixed to an inner peripheral surface or a bottom surface of the case.
The lamp according to any one of claims 1 to 4, wherein the power reception unit is attached to the case.
The lamp according to any one of claims 1 to 5, wherein the circuit board is formed in a cylindrical shape.
It further has a cylindrical member fixed inside the case,
The lamp according to claim 6, wherein the circuit board is fixed to a peripheral surface of the cylindrical member.
The circuit board is formed in a cylindrical shape by bonding two opposing sides of a flexible plate-shaped member that is rectangular when deployed on a plane. The lamp described.
The lamp according to any one of claims 1 to 5, wherein the circuit board has a shape lacking one side of a polygon when viewed in plan.
6. The circuit unit according to claim 1, wherein the circuit unit includes a plurality of circuit boards, and the plurality of circuit boards are arranged side by side along an inner peripheral surface of the case. The lamp described.
The lamp according to any one of claims 1 to 5, wherein the circuit board has a fan shape when deployed in a planar shape.
The lamp according to any one of claims 1 to 11, wherein the case and the mounting substrate are integrally formed.
The lamp according to any one of claims 1 to 12, further comprising a heat conductive member that thermally connects the light emitting unit and the power receiving unit or the case.
The lamp according to claim 13, wherein the heat conducting member has a concave portion formed on an outer peripheral surface, and a part of the electronic component is located in the concave portion.
The lamp according to claim 14, wherein the recess is continuously formed around the lamp axis on the outer peripheral surface of the heat conducting member.
The lamp according to claim 1, wherein the circuit board is fixed to the mounting board.
A translucent glove arranged in a state of covering the main emission direction side of the light emitted from the light emitting unit of the light emitting unit;
The lamp according to any one of claims 1 to 16, further comprising: a support member that supports the light emitting unit with respect to the power receiving unit or the case so as to be positioned in the globe.
The lamp according to claim 17, wherein the mounting substrate is made of a translucent member.
The lamp according to claim 17 or 18, wherein an optical member for directing at least a part of light emitted from the semiconductor light emitting element obliquely rearward away from the mounting substrate is disposed.
The plurality of semiconductor light emitting elements are arranged in an annular shape on the mounting substrate,
The optical member has a ring-shaped reflecting surface facing the semiconductor light emitting element, and directs at least part of the light emitted from the semiconductor light emitting element by the reflecting surface obliquely backward avoiding the mounting substrate. The lamp according to claim 19, characterized in that:
The optical member is a beam splitter, and directs a part of the light incident on the reflecting surface obliquely backward avoiding the mounting substrate, and forwards another part of the light incident on the reflecting surface forward. The lamp according to claim 19, wherein the lamp is transmitted toward the lamp.
The optical member is provided with an opening for leaking forward another part of the light emitted from the semiconductor light emitting element at a location facing the semiconductor light emitting element. The lamp according to 19 or 20.
The lamp according to any one of claims 17 to 22, wherein the support member also serves as the heat conducting member.
The lamp according to claim 18, wherein the support member is a light guide member, and emits light rearward from the semiconductor light emitting element and passes through the mounting substrate obliquely rearward.
The lamp according to claim 17, wherein the support member includes a base portion to which the light emitting portion is fixed, and a support main body portion fixed to the power receiving portion or the case.
The lamp according to claim 25, wherein the support base part and the support main body part are integrally formed.
The lamp according to claim 25 or 26, wherein the mounting substrate has flexibility and is attached to a surface of the base portion.
The lamp according to claim 25 or 26, wherein the base portion also serves as the mounting substrate, and the plurality of semiconductor light emitting elements are disposed on the base portion.
The lamp according to any one of claims 25 to 28, wherein the base portion has a polygonal frustum shape.
The lamp according to any one of claims 25 to 28, wherein the base portion has a truncated cone shape.
The lamp according to any one of claims 25 to 28, wherein the base portion has a polyhedral shape.
The lamp according to any one of claims 25 to 31, wherein the globe is thicker in a portion adjacent to the light emitting unit than in other portions.
The lamp according to any one of claims 25 to 31, wherein the globe is subjected to a light diffusion process on an inner peripheral surface of a portion close to the light emitting unit.
34. The lamp according to claim 33, wherein the light diffusion treatment is performed by forming a plurality of recesses recessed in the thickness direction of the globe.
The lamp according to claim 33, wherein the light diffusion treatment is performed by forming a light diffusion layer on an inner peripheral surface of a portion of the globe that is close to the light emitting portion. .
34. The lamp according to claim 33, wherein the light diffusion treatment is performed by attaching a light diffusion member to an inner peripheral surface of a portion of the globe that is close to the light emitting portion. .
The lamp according to any one of claims 1 to 10, wherein the case includes a first case portion and a second case portion.
The first case portion accommodates the lighting circuit unit,
The second case portion is disposed on a main emission direction side of light emitted from the light emitting portion of the first case portion and accommodates the light emitting portion, and a side surface of the second case portion is formed from the semiconductor light emitting element. The lamp according to claim 37, wherein one or a plurality of window portions for leaking the emitted light from the second case portion are provided.
The mounting substrate has a long shape,
The plurality of semiconductor light emitting elements are arranged in a row along the longitudinal direction of the mounting substrate,
The first case portion and the second case portion are arranged at both ends in the longitudinal direction of the mounting substrate,
The lamp according to claim 37, wherein the circuit unit is accommodated in at least one of the first case part and the second case part.
The circuit unit includes a first circuit unit part and a second circuit unit part,
40. The lamp according to claim 39, wherein the first circuit unit part and the second circuit unit part are accommodated in the first case part and the second case part, respectively.
The light emitting unit is housed inside, and includes a long cylindrical bulb in which at least a portion located on the main emission direction side of light emitted from the light emitting unit is formed of a translucent material,
The lamp according to claim 39 or 40, wherein the first case portion and the second case portion are fitted to both end portions in a longitudinal direction of the bulb.
The said 1st case part and the said 2nd case part are notched in the part by the side of the said main output direction in the edge part by which the said valve | bulb is fitted. 42. lamp.
The lamp according to claim 41 or 42, wherein a light diffusion process is applied to an inner peripheral surface of at least a portion of the bulb located on the main emission direction side.