JP5551552B2 - lamp - Google Patents

Description

  The present invention relates to a lamp, and more particularly to a lamp having a base and incorporating a circuit unit.

As one of lamps using a semiconductor light emitting element as a light emitter, a light bulb shaped LED lamp is becoming widespread.
The LED lamp is generally mounted with a plurality of LEDs on one mounting board, and a circuit unit for lighting the LED is housed in a housing space between the back side of the mounting board and the base, It has the structure which radiate | emits the light emitted from LED outside through a glove (patent document 1).

  In addition, there is a case in which the housing is formed of a metal that is a good heat conductive material, and heat generated in the LED is conducted to the base so that heat is not accumulated in the housing (Non-patent Document 1). See page 12)).

JP 2006-313717 A

Published “Lamp General Catalog 2010”: Panasonic Corporation Lighting Co., Ltd.

  By the way, the heat conducted through the metal casing is also radiated to the inside of the metal casing, and the circuit unit is affected by the heat. Some electronic parts constituting the circuit unit have a life greatly influenced by the influence of heat.

  Therefore, the inventors of the present application have increased the amount of current supplied to the LED without reducing the life of the circuit unit, and as a light bulb-shaped LED lamp that can further improve the luminance, is opposite to the base with the mounting substrate interposed therebetween. Invented an invention in which the circuit unit is housed in the side glove. According to this, since there is no circuit unit in the heat conduction path from the LED to the base, there is no restriction of the circuit unit, and the energization amount to the LED can be increased. It was also confirmed that the adverse effect on the light distribution characteristics due to the circuit unit being located on the light emission side of the LED does not matter so much.

  However, although it does not matter so much, by arranging the circuit unit on the light emitting side, a part of the light emitted from the LED is blocked by the circuit unit, and the amount of light in the light emitting direction is small. Will be reduced.

  Therefore, an object of the present invention is to provide a lamp having a configuration in which a circuit unit is arranged in a globe, in which a reduction in light amount due to the presence of the circuit unit is suppressed as much as possible.

  The LED lamp which concerns on this invention stores the semiconductor light-emitting device and the circuit unit which converts the electric power received from the said nozzle | cap | die, and makes the said semiconductor light-emitting device light-emit in the envelope containing a globe and a nozzle | cap | die. The semiconductor light emitting element is arranged in a posture in which the light emission direction is directed in the direction opposite to the base, and the light guide includes an incident portion for allowing the light of the semiconductor light emitting element to enter the globe. The member is provided in a state where the incident portion faces the light emitting portion of the semiconductor light emitting element, and the circuit unit is disposed on the outer peripheral portion of the light guide member.

  According to the lamp having the above-described configuration, the light emitted from the semiconductor light emitting element is guided while being repeatedly reflected at the boundary surface between the light guide member and the air layer. When the light travels through the optical member and the incident angle with respect to the boundary surface is equal to or smaller than the critical angle, light corresponding to the incident angle is emitted to the outside of the light guide member. And the light which advances the inside of a light guide member is finally radiate | emitted from the part (emission part) on the opposite side to the said incident part in a light guide member. Since a part of the light emitted from the emission part is light that has been repeatedly reflected in the light guide member, it is emitted radially from the emission part.

  If the light guide member is not provided, the light from the semiconductor light emitting element toward the circuit unit is blocked by the circuit unit. Accordingly, the amount of light reaching the inner surface of the globe that is shaded by the circuit unit is reduced. Therefore, due to this, the amount of light in front of the light emission direction is slightly reduced.

  On the other hand, in the present invention, since light is emitted radially from the emitting part, light is emitted also in the direction of the inner surface of the globe that is shaded by the circuit unit when the light guide member is not provided. It is possible to suppress the reduction in the amount of light generated ahead in the light emitting direction as much as possible.

  It is also possible to adopt a configuration in which the circuit unit is stored inside the light guide member by making the light guide member cylindrical or providing a hollow portion in the light guide member. In this case, when the lamp is in use, heat may be generated from the circuit unit, although the amount of heat generated by the semiconductor light emitting element is small compared with the amount of heat generated. If it does so, in the structure which stores a circuit unit in the inside of a light guide member, there exists a possibility that heat may go up to the space in which the circuit unit is stored. However, in the present invention, since the circuit unit is disposed on the outer peripheral portion of the light guide member, heat from the circuit unit is hardly generated, which is advantageous in terms of heat dissipation of the circuit unit.

1 is a cross-sectional view illustrating a schematic configuration of an LED lamp according to Embodiment 1. FIG. It is a perspective view which shows a circuit board, a base, an LED module, and a light guide member among the structural members of the said LED lamp. 6 is a cross-sectional view showing a schematic configuration of an LED lamp according to Embodiment 2. FIG. (A)-(d) is sectional drawing which shows schematic structure of the LED lamp which concerns on a modification. (A)-(b) is sectional drawing which shows schematic structure of the LED lamp which concerns on a modification. (A)-(b) is sectional drawing which shows schematic structure of the LED lamp which concerns on a modification. It is a figure which shows schematic structure of the LED lamp which concerns on a modification. It is a figure which shows schematic structure of the LED lamp which concerns on a modification.

  Hereinafter, although the form which utilizes LED as a semiconductor light emitting element is demonstrated, LD (laser diode) and EL element (electric luminescence element) may be sufficient as a semiconductor light emitting element, for example.

<Embodiment 1>
FIG. 1 is a cross-sectional view illustrating a schematic configuration of a light bulb-shaped LED lamp 10 according to Embodiment 1, and FIG. 2 illustrates a pedestal 30, an LED module 40, and a light guide member 56 (first member 70) described later. FIG. In FIG. 1, a circuit unit 82 to be described later is not cut. Moreover, the scale between each member is not unified in all figures including FIG. 1 and FIG.

  As shown in FIG. 1, the LED lamp 10 has a holder 12 made of aluminum or other metal material. Note that the holder 12 is not limited to a metal material, and may be formed of other heat conductive materials. The cross section of the holder 12 is substantially circular, and has a shape in which a small cylindrical portion 14 and a large cylindrical portion 18 are connected by a tapered cylindrical portion 16.

  A base 20 is attached to the small cylindrical portion 14 of the holder 12. The base 20 conforms to the standard of E26 base specified in JIS (Japanese Industrial Standard), for example, and is used by being attached to a socket (not shown) for a general incandescent lamp.

  The base 20 has a shell 22, also called a cylindrical body, and an eyelet 24 having a circular dish shape. The shell 22 and the eyelet 24 are integrated with each other through a first insulator 26 made of a glass material. The integrated body is fitted into a cylindrical second insulator 28. The second insulator 28 is formed of an insulating material having good thermal conductivity, such as aluminum nitride (AlN). The second insulator 28 is provided with a through hole 28A for leading a second lead wire 90 described later to the outside.

As shown in FIG. 1, the base 20 has a second insulator 28 externally attached to the small cylindrical portion 14 and is fixed to the small cylindrical portion 14 with a heat-resistant adhesive (not shown).
A pedestal 30 having a disk shape as a whole is fitted into the large cylindrical portion 18 of the holder 12. The base 30 is made of aluminum or other metal material.

  The pedestal 30 has a large-diameter portion 30A and a small-diameter portion 30B, and a step portion 30C is formed. As shown in FIG. 2, an inner groove 32 and an outer groove 34 are formed concentrically on the surface (surface) opposite to the base 20 of the pedestal 30, and a through hole is formed outside the outer groove 34. 36 have been established.

The LED module 40 is mounted on a surface portion (hereinafter referred to as “module mounting surface 38”) sandwiched between the inner groove 32 and the outer groove 34 of the pedestal 30.
As shown in FIG. 2, the LED module 40 includes a mounting board 42 made of an annular printed wiring board and a plurality (six in this example) of LEDs 44, 46, 48, 50, 52 mounted thereon. , 54. On the mounting substrate 42, LEDs 44,..., 54 are mounted at equiangular intervals (60 degree intervals in this example) around the center axis of the ring. That is, LEDs 44,..., 54 are arranged in an annular shape (in this example, an annular shape). Each of the LEDs 44,..., 54 is composed of a blue LED chip and a yellow phosphor covering the LED chip and emits white light (white LED).

The LEDs 44,..., 54 are electrically connected in series by a wiring pattern (not shown) of the mounting substrate 42.
A light guide member 56 is erected on the surface of the pedestal 30. The light guide member 56 is made of, for example, an acrylic resin. The light guide member 56 is not limited to acrylic resin, and may be formed of other light transmissive materials. The light guide member 56 has a main body portion 58 and leg portions 60.

  The main body 58 has a bottomed cylindrical shape. The leg portion 60 includes an inner leg portion 64 and an outer leg portion 66 which are extended from the inner periphery and the outer periphery of the annular opening side end portion of the main body portion 58 and have an L-shaped cross section. Yes. As shown in FIG. 2, the outer leg portion 66 has a cutout portion 64 </ b> A that is partially cut away.

As shown in FIG. 1, a reflective film 68 is formed on the inner surface of the light guide member 56. The reflection film 68 is made of, for example, an aluminum deposition film.
The light guide member 56 is configured by combining two plane-symmetric members (first member 70 and second member 72). FIG. 2 shows the first member 70. The first member 70 has a mating surface 70 </ b> A with the second member 72.

  When the first member 70 and the second member 72 are combined and their mating surfaces are combined, the light guide member 56 has a bottomed cylindrical shape as described above. In this case, the opening-side end surface of the bottomed cylindrical main body 58 of the light guide member 56 has an annular shape as described above, and the arrangement mode of the LEDs 44,. It is consistent with. FIG. 1 is a cross section cut along a plane including a line segment connecting the LED 46 and the LED 52.

As shown in FIG. 2, the light guide member 56 has an inner leg portion 64 fitted into the inner groove 32 and an outer leg portion 66 fitted into the outer groove 34, and is attached to the pedestal 30 with an adhesive (not shown).
The circuit unit 82 includes a circuit board 84 and an electronic component 86 mounted on the circuit board 84. As shown in FIG. 2, the circuit board 84 is a ring-shaped board. As shown in FIG. 1, the circuit board 84 is supported by an adhesive 74 on the outer surface of the light guide member 56. That is, the entire circuit unit 82 is housed in a space formed by the outer peripheral portion of the bottomed cylindrical light guide member 56 and a globe 96 described later.

  The circuit unit 82 and the eyelet 24 are electrically connected by a first lead wire 88, and the circuit unit 82 and the shell 22 are electrically connected by a second lead wire 90, respectively. The circuit unit 82 causes the LEDs 44,..., 54 to emit AC power (power received from the base 20) supplied through the eyelet 24, the shell 22, the first lead wire 88, and the second lead wire 90. The power is supplied to the LEDs 44,.

  The circuit board 84 and the mounting board 42 are electrically connected via internal wirings 92 and 94 inserted through the notch 64A (FIG. 2) (connection between the internal wirings 92 and 94 and the mounting board 42). (The part is not shown).

  As the first lead wire 88, the second lead wire 90, and the internal wirings 92 and 94, for example, generally used insulating coated lead wires can be used. The internal wirings 92 and 94 are connected and fixed to the circuit unit 82 and the LED module 40 by soldering, and the first lead wire 88 and the second lead wire 90 are similarly connected to the circuit unit 82 and the base 20 by soldering or the like.・ It is fixed.

  The LED lamp 10 has a globe 96 that covers the light guide member 56. The globe 96 is made of a translucent material such as a synthetic resin material or a glass material. The globe 96 is frosted or blasted to obtain a light diffusion function, wiped with silica or other fine particles, or coated with a white pigment. Alternatively, the globe 96 itself may be formed of a milky white material.

The globe 96 has a substantially oval shape with one end cut off, and includes a first member 96A having a cylindrical shape and a second member 96B swelled in a spherical shape.
The inner diameter of the cylindrical first member 96A on the upper end side is larger than the entire width of the circuit unit 82. After fixing the circuit unit 82 to the light guide member 56, the opening peripheral edge located on the lower end side of the first member 96 </ b> A of the globe 96 is fitted into the stepped portion 30 </ b> C existing in the large cylindrical portion 18 of the holder 12. The member 96A and the second member 96B are fixed with an adhesive or the like. By doing so, the light guide member 56 integrated with the circuit unit 82 can be stored in the globe 96. Further, the step portion 30 </ b> C is filled with a heat-resistant adhesive 98, whereby the pedestal 30 and the globe 96 are fixed to the holder 12.

  That is, the LED lamp 10 includes the holder 12, the base 20, and the globe 96, and the envelope 100 is configured. A plurality of LEDs 44,..., 54 and a circuit unit 82 are stored in the envelope 100. doing.

  According to the LED lamp 10 having the above configuration, the heat generated by the LEDs 44,..., 54 during lighting is conducted to the base 20 through the mounting substrate 42, the pedestal 30, and the holder 12, and the LED lamp 10 is mounted. The heat is radiated to other components of the lighting fixture, and for example, to the ceiling or wall to which the lighting fixture is attached, through the socket of the lighting fixture.

  In this case, in the LED lamp 10, the circuit unit 82 is stored in the globe 96 on the opposite side of the base 20 with the mounting substrate 42 interposed therebetween, and the circuit unit 82 is provided in the heat conduction path from the LED module 40 to the base 20. Since the configuration is not provided, there is no restriction due to the influence of heat applied to the circuit unit 82, so that the energization amount to the LED can be increased. Thereby, a brightness | luminance can be improved further.

  Furthermore, the space where the circuit unit 82 is disposed, that is, the space formed by the globe 96 and the light guide member 56 has a relatively large capacity. Therefore, the heat generated from the LEDs 44,..., 54 and the circuit unit 82 during use of the LED lamp 10 does not easily enter the space, and the circuit unit 82 is not easily affected by the heat. Also, since electronic components can be mounted on both sides of the circuit board 84, more electronic components can be mounted, or the diameter of the circuit board 84 can be reduced if the number of electronic components to be mounted does not increase. Is possible.

  Light emitted from each of the annularly arranged LEDs 44,..., 54 is incident from the open side end surface (incident part) of the bottomed cylindrical light guide member 56, and the light guide member 56 and the air layer The light travels through the light guide member 56 while repeating reflection at the boundary surface (the outer surface of the light guide member 56) and the reflective film 68 formed on the inner surface of the light guide member 56. And when the incident angle with respect to the said outer surface is below a critical angle, the light according to the said incident angle is radiate | emitted out of the light guide member 56. FIG. Here, the distance between the open end surface of the light guide member 56 and the upper surface of the LED module 40 (the upper surfaces of the LEDs 44,..., 54) is preferably in the range of about 5 to 10 [mm] as a linear distance. Not only this range but also the distance between the light guide member and the LED and the quantity of the light guide member and the LED can be adjusted according to desired characteristics.

  The light traveling in the light guide member 56 is finally emitted from the emission side end surface (emission part) opposite to the open side end surface. In the case of this example, the emission side end surface is an end surface having a bottomed cylindrical hemispherical shape.

  If the light guide member 56 is not provided, the light directed from the LEDs 44,... 54 to the circuit unit 82 is blocked by the circuit unit 82. Therefore, the amount of light reaching the central axis of the globe 96 and the inner surface portion in the vicinity thereof is reduced. Even though the globe 96 has a scattering function, the amount of light in front of the central axis is slightly reduced due to this.

  On the other hand, in this example, when the light guide member 56 is not provided, light is emitted from a region (back region) that is a shadow of the circuit unit 82, that is, from the emission side end surface of the light guide member 56. Therefore, it is possible to suppress the reduction in the amount of light generated in the forward direction in the central axis as much as possible.

  In this example, the reflective film 68 is formed on the inner surface of the light guide member 56, but the reflective film 68 is not necessarily provided. Even if it is not provided, part of the light traveling in the light guide member 56 is reflected on the inner surface and directed toward the emission side end surface, and some of the light emitted to the hollow portion of the light guide member 56 is also some. This is because the light enters the light guide member 56 again from the inner surface and proceeds in the light guide member 56.

<Embodiment 2>
FIG. 3 is a cross-sectional view showing a light bulb shaped LED lamp 102 according to the second embodiment.
The LED lamp 102 basically has the same configuration as that of the LED lamp 10 of Embodiment 1 except that the LED and the light guide member that mainly constitute the LED module are different. Therefore, in FIG. 3, the same components as those of the LED lamp 10 are denoted by the same reference numerals, and the description thereof is omitted. Hereinafter, different portions will be mainly described.

  The LED 106 constituting the LED module 104 of Embodiment 2 is only a blue LED, and a yellow phosphor for obtaining white light is formed on the light guide member 108 as described later. In this example, all the LEDs constituting the LED module 104 are denoted by the same reference numerals.

  Whereas the light guide member 56 (FIG. 1) in the first embodiment has a bottomed cylindrical shape, the light guide member 108 constituting the LED lamp 102 in the second embodiment has a cylindrical shape with both ends open. I am doing.

  A reflective film 110 is formed on the inner surface of the light guide member 108. On the other hand, a yellow phosphor layer 112 which is a wavelength conversion layer is formed on the outer surface area of the light guide member 108 and the light emission side end face.

  According to the LED lamp 102 having the above-described configuration, the blue light emitted from each of the six LEDs 106 arranged in an annular shape is an end face of the cylindrical light guide member 108 facing the light emitting portion of the LED 106. Reflection formed on the boundary surface between the light guide member 108 and the phosphor layer 112 (the outer surface of the light guide member 108) and the inner surface of the light guide member 108. The light guide member 108 travels while repeating reflection with the film 110. When the incident angle with respect to the outer surface is equal to or smaller than the critical angle, blue light corresponding to the incident angle is emitted to the outside of the light guide member 108. At this time, part of the blue light is converted into yellow light while passing through the phosphor layer 112, and is mixed with the blue light that has not been converted into white light and emitted from the globe 96 to the outside of the LED lamp 102. The

The light traveling in the light guide member 108 is finally emitted from the end surface (exit side surface) opposite to the side where the base 20 exists. In the case of this example, the emission side end surface is an annular end surface.
In this case, since a part of the light emitted from the emission side end face is light that has repeatedly propagated through the light guide member 108, the central axis of the cylindrical light guide member 108 is used. On the other hand, it is emitted at an angle. As a result, the light is also emitted toward the central axis of the globe 96 and the inner surface portion in the vicinity thereof, and the globe 96 is compared with the case where the light guide member 108 is not provided as in the case of the first embodiment. Reduction of the amount of light generated in the front in the central axis direction can be suppressed as much as possible.
<Modification>
4 (a) and 4 (b) show a modification of the first embodiment, and FIGS. 4 (c) and 4 (d) show a modification of the second embodiment. In FIG. 4, reference numerals are given to constituent members that are exclusively used to explain the differences from the respective embodiments. In addition, the same reference numerals are given to the same components as the corresponding embodiments.

  In the example shown in FIG. 4A, a blue LED 114 is used as the LED constituting the LED module. And the yellow fluorescent substance layer 116 which is a wavelength conversion layer for converting the emitted light of the blue LED 114 into yellow light is formed in the outer surface of the light guide member 56.

  In the example shown in FIG. 4B, a blue LED 114 is used as the LED constituting the LED module. And the yellow fluorescent substance layer 118 which is a wavelength conversion layer for converting the emitted light of the blue LED 114 into yellow light is formed in the inner surface of the globe 96.

In the example shown in FIG.4 (c), white LED120 is used for LED which comprises an LED module. The light guide member 108 is not formed with a phosphor layer.
In the example shown in FIG. 4D, as in the second embodiment, the blue LED 106 is used for the LED constituting the LED module, and the yellow phosphor layer 122 is formed on the inner surface of the globe 96.

  It should be noted that the wavelength conversion efficiency of the phosphor particles contained in the phosphor layer 118 decreases when the temperature becomes high. Therefore, by forming the phosphor layer 118 on the inner peripheral surface of the globe 96, it is less affected by heat at the time of LED emission than when the phosphor particles are mixed in the LED, and the wavelength conversion efficiency of the phosphor particles is improved. The decrease can be suppressed.

Subsequently, FIG. 5A and FIG. 5B show a modification common to the first embodiment and the second embodiment. FIG. 5 shows only a modification to the first embodiment.
FIG. 5A is a modified example regarding the configuration of the circuit unit 82. In the first embodiment, the circuit unit 82 is composed of one circuit board 84 and an electronic component 86 mounted thereon. The circuit unit 82 of this example includes two circuit boards 84 and an electronic component 86 mounted thereon. Of course, a circuit unit can also be constituted by two or more circuit boards.

  FIG. 5B is a modification regarding the method of supporting the circuit board 84. In the first embodiment, the circuit board 84 is fixed to the light guide member 56 by the adhesive 74, but in this example, it is supported by four wires 124.

  One end of the wire 124 is fixed to an insulating substrate portion on which a wiring pattern is formed on the circuit board 84, and the other end is an attachment hole 126 formed in the base 30 and the leg portion 60 of the light guide member 56. It is press-fitted into and fixed.

In addition, it is also possible to use the existing wiring as a support rather than providing a wire separately.
FIG. 6A and FIG. 6B are modifications regarding the shape of the light guide member and the LED arrangement method. In the first embodiment and the second embodiment, the shape of the light guide member is a bottomed cylindrical shape and a cylindrical shape with both ends open, but in this example, it is a columnar shape having no hollow part. Moreover, in Embodiment 1 and Embodiment 2, the incident part of the light guide member is shaped to cover the upper side and the side of the LED, but in this example, the incident part of the light guide member 128 Covers only above the LED 134. Furthermore, compared with Embodiment 1 and Embodiment 2, the space | interval of the entrance part of the light guide member 128 and LED134 is wide.

  Here, the interval between the incident portion of the light guide member 128 and the upper surface of the LED 134 is preferably in the range of about 0 to 10 [mm], but is not limited to this range and can be adjusted according to a desired light distribution. is there. In addition, LED134 which comprises LED module 136 is white LED which consists of a blue LED chip and the yellow fluorescent substance which covers this, and emits white.

By doing in this way, the light from LED134 can be radiate | emitted toward the globe 96 also from the clearance gap between the base 30 and the incident part of the light guide member 128. FIG.
In the first and second embodiments, a plurality of LEDs are arranged in a ring shape on the annular mounting substrate. However, in this example, a plurality of LEDs need not necessarily be arranged in a ring shape. For example, a plurality of LEDs may be arranged in a matrix.

  The light guide member 128 is supported by a wire 130. One end of the wire 130 is fixed to the light guide member 128, and the other end is press-fitted and fixed to a mounting hole 132 formed in the base 30.

  FIG.6 (b) is a figure which shows the modification of the LED lamp shown to Fig.6 (a). In FIG. 6B, the LED 138 is a blue LED, and a yellow phosphor layer 142 containing a yellow phosphor for obtaining white light is formed on the inner surface of the globe 96. The yellow phosphor layer 142 may be formed not on the inner surface of the globe 96 but on the outer surface of the light guide member 128.

  Although not particularly illustrated, the circuit unit 82 shown in FIGS. 6A and 6B may be stored in a circuit case whose outer surface is a reflective surface. Thereby, the amount of light emitted from the gap between the base 30 and the incident portion of the light guide member 128 and absorbed by the circuit unit 82 can be reduced. That is, the light that should be absorbed by the circuit unit 82 can be reflected toward the globe side by the reflective film provided on the outer surface of the circuit case, thereby suppressing a decrease in the amount of light emitted from the globe. It becomes possible to do. In this case, it is not necessary to arrange all the electronic components constituting the circuit unit in the circuit case. In the above-described embodiment and the like, the circuit unit has a plurality of electronic components mounted on one circuit board, but the plurality of electronic components are separately mounted on a plurality of circuit boards, for example, two circuit boards. Only a part thereof may be arranged in the circuit case.

  Moreover, you may arrange | position the heat-resistant electronic component not in the circuit case but in the inside of a base or a nozzle | cap | die, for example. In this case, since the circuit unit arranged inside the globe can be made smaller, the circuit case can be made smaller accordingly, and the light extraction efficiency to the top of the globe can be improved.

  FIG. 7 is a modification of the shape of the light guide member and the shape of the globe. In FIG. 7, the same components as those of the LED lamp 10 according to Embodiment 1 are denoted by the same reference numerals.

  The light guide member 144 in this example has a substantially spherical shape, and is configured by combining the first member 146 and the second member 148 in the same manner as the light guide member 56 according to the first embodiment. A reflective film 154 is formed on the inner surface of the light guide member 144. Along with the light guide member 144 having a substantially spherical shape, a G type having a shape similar to a ball bulb is employed as the shape of the globe 96 in this example.

  White LEDs are used as the LEDs constituting the LED module 156 (only the LEDs 150 and 152 appear in the figure), and the LEDs are arranged in a ring shape. In the present example in which the light guide member 144 has a substantially spherical shape, the exit surface can be a substantially spherical shape with one end cut off. Therefore, it is possible to emit light at a wider angle than in the first embodiment.

In addition, in FIG. 7, although the shape of the light guide member was made into the substantially spherical shape which has a hollow part, it is not limited to this, It can also be made into the substantially spherical shape which does not have a hollow part.
FIG. 8 shows a modified example regarding the arrangement of LEDs and the light guide member. Like FIG. 7, the same code | symbol is attached | subjected to the component similar to the LED lamp 10 which concerns on Embodiment 1. FIG.

  In this example, in addition to the annular LED module in the first embodiment, an LED module 164 on which a white LED 162 is mounted is also arranged at the center of the pedestal. A light guide member 158 is provided so as to cover the LED module 164. A reflection film 160 is formed on the inner surface of the light guide member 158, and the light emitted from the LED module 164 and incident from the incident portion of the light guide member 158 travels inside the light guide member 158, and exits its end face. It is emitted from. Thus, the light quantity of an LED lamp can be increased by mounting an LED module also in the center part of a base.

  As for the number of LEDs mounted on the LED module 164, only one LED 162 appears in FIG. 8, but it goes without saying that a plurality of LEDs can be mounted on the LED module 164. is there. Thereby, the further light quantity increase of an LED lamp can be aimed at.

As mentioned above, although this invention has been demonstrated based on embodiment, it cannot be overemphasized that this invention is not limited to said example, For example, it can also be set as the following forms.
(1) In the above-described form and modification, the LEDs are arranged in an annular shape, but the form of arrangement is not limited to this. For example, they may be arranged in an elliptical ring shape, a rectangular ring shape, or a polygonal ring shape.

  In accordance with this, the shape of the light guide member is also an elliptical cylindrical shape, a rectangular cylindrical shape, or a polygonal cylindrical shape. That is, in order to make the emitted light from the annularly arranged LEDs enter from the incident portion of the cylindrical light guide member, the shape of the light guide member (the shape at the incident portion) is matched with the arrangement shape of the LEDs. It shall be.

(2) In the above embodiment, six LEDs are used. However, the number of LEDs constituting the LED lamp is not limited to this, and can be changed as appropriate according to required luminance and the like.
(3) In the above embodiment, white light is obtained with the blue LED and the yellow phosphor. However, the present invention is not limited to this, and a near ultraviolet LED, a red phosphor, a blue phosphor, and a green phosphor are mixed. It does not matter as a combination with a mixed color phosphor.

  (4) In the above embodiment, the example in which the direction of the circuit board on which the electronic component is mounted is arranged in the direction orthogonal to the lamp axis is shown, but the present invention is not limited to this example. You may incline and arrange | position in the direction parallel to a lamp | ramp axis | shaft, or the direction which inclines.

  (5) In the above embodiment, the inside of the base and the base is hollow, but for example, an insulating material having a higher conductivity than air may be filled. Thereby, the heat from the LED module at the time of light emission is transmitted to the lighting fixture via the base and the socket, and the heat dissipation characteristics of the entire lamp can be improved. Examples of the material include a silicone resin.

  The lamp according to the present invention can be suitably used, for example, as a bulb-type LED lamp that replaces an incandescent bulb.

DESCRIPTION OF SYMBOLS 10,102 LED lamp 12 Holder 14 Small cylindrical part 16 Tapered cylindrical part 18 Large cylindrical part 20 Base part 22 Shell 24 Eyelet 26 First insulator 28A, 36 Through-hole 28 Second insulator 30 Base 30A Large diameter part 30B Small diameter part 30C Stepped portion 32 Inner groove 34 Outer groove 38 Module mounting surface 40, 104, 136, 140, 156, 164 LED module 42 Mounting substrate 44, 46, 48, 50, 52, 54, 106, 114, 120, 134, 138 , 150, 152, 162 LED
56, 108, 128, 144, 158 Light guide member 58 Main body 60 Leg 64 Internal leg 64A Notch 66 Outer leg 68, 110, 154, 160 Reflective film 70, 146 First member 70A Matching surface 72, 148 Second member 74, 98 Adhesive 82 Circuit unit 84 Circuit board 86 Electronic component 88, 90 Lead wire 92, 94 Internal wiring 96 Globe 96A First member 96B Second member 100 Envelope 112, 116, 118, 122, 142 Yellow phosphor layer 124, 130 Wire 126, 132 Mounting hole

Claims (9)

A lamp that houses a semiconductor light emitting element and a circuit unit that converts electric power received from the base to emit light from the semiconductor light emitting element in an envelope including a globe, a base, and a holder that connects them. And
The semiconductor light emitting element is arranged in a posture in which the light emitting direction is directed in the direction opposite to the base;
In the globe, a light guide member having an incident part for allowing the light of the semiconductor light emitting element to enter is provided in a state where the incident part faces the light emitting part of the semiconductor light emitting element,
The volume of the space defined by the inner surface of the globe and the outer surface of the light guide member is larger than the space volume in the base and the space volume in the holder,
The lamp is characterized in that the circuit unit is disposed in a space defined by an inner surface of the globe and an outer surface of the light guide member . A plurality of the semiconductor light emitting elements are arranged in a ring shape,
The light guide member has a cylindrical shape whose one end surface matches the annular shape,
The lamp according to claim 1, wherein the one end surface is the incident portion. The circuit unit includes a plurality of electronic components and a ring-shaped circuit board on which the electronic components are mounted.
The lamp according to claim 1, wherein the light guide member is inserted through the ring-shaped circuit board.   The lamp according to claim 1, wherein the light guide member is columnar or spherical. A mounting substrate on which the semiconductor light emitting element is mounted;
A pedestal on which the mounting substrate is mounted;
A heat conductive member that connects the base and the base;
The lamp of claim 1, comprising: The pedestal has a plate shape,
The heat conducting member has a tapered cylindrical shape,
The lamp according to claim 5, wherein the pedestal is attached to the large-diameter side end of the heat conducting member, and the base is attached to the small-diameter side end.   The lamp according to claim 1, wherein a wavelength conversion layer for converting light emitted from the semiconductor light emitting element into light having a wavelength different from the light emitted from the semiconductor light emitting element is formed on an outer surface of the light guide member.   2. The lamp according to claim 1, wherein a wavelength conversion layer for converting light emitted from the semiconductor light emitting element into light having a wavelength different from the light is formed on an inner surface of the globe.   The lamp according to claim 2, wherein a reflection film is formed on an inner surface of the light guide member.

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