WO2013150718A1 - Illuminating light source - Google Patents
Illuminating light source Download PDFInfo
- Publication number
- WO2013150718A1 WO2013150718A1 PCT/JP2013/001586 JP2013001586W WO2013150718A1 WO 2013150718 A1 WO2013150718 A1 WO 2013150718A1 JP 2013001586 W JP2013001586 W JP 2013001586W WO 2013150718 A1 WO2013150718 A1 WO 2013150718A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light source
- sensor unit
- guide member
- light guide
- illumination
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
- F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an illumination light source including a light emitting element such as a light emitting diode (LED), and more particularly to a bulb-shaped LED lamp including a sensor such as a human sensor.
- a light emitting element such as a light emitting diode (LED)
- a bulb-shaped LED lamp including a sensor such as a human sensor.
- LEDs are used in lamps and the like as highly efficient and space-saving light sources. Among them, LED lamps using LEDs are attracting attention as alternative light sources for fluorescent lamps and incandescent lamps conventionally known.
- a lighting device with a human sensor has been known.
- a human sensor is provided in a luminaire to which a lamp (light source for illumination) is attached, and the lamp is turned on by detecting a human with the human sensor. For example, when a person enters the lighting area, the presence of the person is detected by the human sensor and the lamp is automatically turned on. When the person goes out of the lighting area, the absence of the person is detected by the human sensor. The lamp will turn off automatically after a certain period of time.
- Patent Document 1 discloses a bulb-shaped LED lamp including a human sensor.
- the LED lamp has a power supply circuit for causing the LED to emit light, and heat is generated from the power supply circuit at the time of lighting. For this reason, in the LED lamp provided with the human sensor, there is a problem that the heat from the power supply circuit may cause the output of the human sensor to fluctuate and cause a malfunction.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination light source capable of suppressing output fluctuation of a sensor unit due to heat.
- one aspect of the illumination light source according to the present invention is an illumination light source that constitutes an envelope with a globe, a housing, and a base, and includes a sensor unit and the sensor unit.
- a light emitting unit that emits light based on a detection signal, a power supply circuit unit for supplying power to the light emitting unit, and a partition plate positioned between the sensor unit and the power supply circuit unit The sensor unit and the power supply circuit unit are spatially separated.
- the light source further includes an insulating case provided in the envelope and housing the power supply circuit portion, and the partition plate is a part of the insulating case.
- the sensor unit is fixed to an outer side surface of the insulating case.
- a part of the insulating case is located in the glove, and the sensor unit is fixed to a part of the insulating case located in the glove Is preferred.
- the light emitting unit is provided so as to surround a part of the insulating case located in the glove.
- the light guide member may further include a light guide member that guides light to the sensor unit, and the light guide member may be fixed to the sensor unit.
- the sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate, and the light guide member is fixed to the mounting substrate. Is preferred.
- the sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate, and the light guide member is fixed to the sensor main body It is also good.
- the light guide member is preferably made of a translucent material containing a thermally conductive substance.
- the translucent material is preferably polyethylene.
- the illumination light source it is preferable to further include a heat dissipation member filled between the light guide member and the sensor unit.
- the light guide member is preferably a Fresnel lens.
- the sensor unit is less likely to receive the heat from the power supply circuit, so it is possible to suppress the fluctuation of the output of the sensor unit due to the heat. As a result, malfunction of the illumination light source can be reduced.
- FIG. 1 is a partially cutaway perspective view of the illumination light source according to Embodiment 1 of the present invention.
- FIG. 2 is a cross-sectional view of the illumination light source according to Embodiment 1 of the present invention.
- FIG. 3 is a top view of the illumination light source according to Embodiment 1 of the present invention.
- FIG. 4 is a cross-sectional view of an illumination light source according to Embodiment 2 of the present invention.
- FIG. 5 is a cross-sectional view of an illumination light source according to Embodiment 3 of the present invention.
- FIG. 6 is a cross-sectional view of an illumination light source according to Embodiment 4 of the present invention.
- FIG. 7 is a schematic cross-sectional view of a lighting device according to the present invention.
- FIG. 1 is a partially cutaway perspective view of the illumination light source according to Embodiment 1 of the present invention.
- FIG. 2 is a cross-sectional view of the illumination light source according to Embodiment 1 of the present invention.
- FIG. 3 is a top view of the illumination light source according to Embodiment 1 of the present invention (as viewed through a globe).
- the upper side of the drawing is the front of the illumination light source
- the lower side of the drawing is the rear of the illumination light source.
- in front means the center of the illumination light source, assuming that the middle point between the upper end of the illumination light source (the top of the globe) and the lower end of the illumination light source (the top of the base) is the illumination light source.
- backward means the direction of the nozzle side as viewed from the center of the light source for illumination.
- the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J (central axis) of the light source for illumination, and in the present embodiment, the lamp axis J and the globe axis coincide. ing. Further, the lamp axis J is an axis serving as a rotation center when attaching the illumination light source 1 to a socket of the illumination device (not shown), and coincides with the rotation axis of the base 70.
- the illumination light source 1 is a bulb-shaped LED lamp which is a substitute for a bulb-shaped fluorescent lamp or an incandescent lamp, and includes a light emitting module 10 as a light source;
- a case 60 covering the case 50, a base 70 electrically connected to the circuit unit 40, a sensor unit 80 for detecting the presence or absence of a person, and a light guide member 90 for guiding light to the sensor unit 80 are provided.
- the insulating case 50 functions as a partition plate located between the sensor unit 80 and the circuit unit 40, and the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate) It is separated.
- the illumination light source 1 includes an envelope constituted by a globe 30, a housing 60 and a base 70, and the light emitting module 10, the base 20, the circuit unit 40 and the insulating case 50 are provided in the envelope. It is housed. Further, in the present embodiment, the sensor unit 80 is also accommodated in the envelope.
- the illumination light source 1 is a sensor-incorporated bulb-shaped LED lamp incorporating the sensor unit 80, and in the illumination light source 1 according to the present embodiment, the sensor unit 80 and the circuit unit 40 contact each other It is arranged not to.
- the light emitting module 10 is, for example, an LED module that emits predetermined light, and is disposed inward of the globe 30.
- the light emitting module 10 emits light based on the detection signal from the sensor unit 80.
- the light emitting module 10 covers the mounting substrate 11, the plurality of semiconductor light emitting elements 12 mounted on the mounting substrate 11, and the semiconductor light emitting elements 12 thereof. And the sealing body 13 provided on the mounting substrate 11.
- the mounting substrate 11 is, for example, a ceramic substrate made of alumina or the like.
- the mounting substrate 11 in the present embodiment is a substantially annular substrate having a substantially circular hole at the center, and a tongue piece extended from one point on the inner peripheral edge of the hole toward the center of the hole. Have fourteen.
- the connector 15 to which the electrical wires 40a and 40b of the circuit unit 40 are connected is provided on the front surface of the tongue piece 14.
- the light emitting module 10 and the circuit unit are connected by connecting the electrical wires 40a and 40b to the connector 15. And 40 are electrically connected. Then, when the direct current power is supplied from the circuit unit 40, the semiconductor light emitting element 12 emits light.
- the semiconductor light emitting elements 12 are, for example, LEDs (LED chips), and a plurality of the semiconductor light emitting elements 12 are mounted on one surface of the mounting substrate 11. Each of the plurality of semiconductor light emitting elements 12 is mounted in a posture in which the main emission direction is in front of the illumination light source.
- the semiconductor light emitting element 12 may be other than the LED, and for example, a semiconductor laser, an organic EL element or an inorganic EL element may be used.
- the semiconductor light emitting element 12 is provided to surround the insulating case 50, and in the present embodiment, for example, 32 LED chips are annularly mounted on the front surface of the mounting substrate 11 as shown in FIG. There is. More specifically, 16 sets of the semiconductor light emitting elements 12 arranged along the radial direction of the mounting substrate 11 are annularly arranged at equal intervals along the circumferential direction of the mounting substrate 11 as a set of two. It is done.
- the semiconductor light emitting elements 12 are individually sealed by a substantially rectangular parallelepiped sealing body 13 for each set. Therefore, in the present embodiment, the number of sealing bodies 13 is 16 in all.
- the longitudinal direction of each sealing body 13 coincides with the radial direction of the mounting substrate 11, and when viewed along the lamp axis J from the front side (in plan view), arranged radially about the lamp axis J It is done.
- the number of semiconductor light emitting elements 12 is not limited to a plurality, and may be one. Further, the attitude of the semiconductor light emitting device 12 does not have to be such that all the semiconductor light emitting devices 12 are directed in the direction along the lamp axis J, and a portion is directed in a direction obliquely inclined to the lamp axis J It may be implemented in attitude. As a result, the controllability of the light distribution angle of the lamp is improved, so fine adjustment can be made to obtain more preferable light distribution characteristics.
- the sealing body 13 is mainly made of a translucent material, but if it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength for converting the wavelength of light A conversion material is incorporated into the translucent material.
- a translucent material silicone resin can be utilized, for example.
- fluorescent substance particle can be utilized, for example.
- the sealing body 13 can be comprised as fluorescent substance containing resin.
- a blue LED emitting blue light is used as the semiconductor light emitting element 12, and as the sealing body 13, phosphor particles for converting blue light into yellow light and the phosphor particles are used.
- the translucent resin material mixed is used. Thereby, a part of the blue light emitted from the semiconductor light emitting element 12 is wavelength-converted to yellow light by the sealing body 13, and white light generated by mixing the wavelength-converted yellow light and the blue light not converted. Are emitted from the light emitting module 10.
- the light emitting module 10 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and phosphor particles of each color that emits light in three primary colors (red, green, and blue). Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
- the base 20 is a light source attaching member for mounting the light emitting module 10.
- the light emitting module 10 is disposed on the front surface of the base 20 and is fixed to the base 20 by, for example, fasteners, screws, adhesion, and the like.
- the base 20 in the present embodiment has a substantially thin cylindrical shape having a through hole 20a, and the cylinder axis of the base 20 is disposed in a posture in which it coincides with the lamp axis J.
- the light emitting module 10 is mounted on the front surface of the base 20 with the semiconductor light emitting elements 12 facing forward in the main emission direction. Since the through holes 20a are provided in the base 20, the weight of the illumination light source 1 can be reduced. Moreover, since a part of the circuit unit 40 is disposed in the through hole 20a and in the globe 30 via the through hole 20a, the illumination light source 1 can be miniaturized.
- the base 20 in the present embodiment is made of, for example, a metal material.
- a metal material for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered.
- Such a metal material has good thermal conductivity, so that the heat generated by the light emitting module 10 can be efficiently conducted to the housing 60.
- the base 20 can be a substantially disc-shaped metal substrate molded by aluminum die casting.
- the base 20 can be functioned as a heat dissipation body for conducting the heat generated from the light emitting module 10 to the housing 60 by forming the base 20 with a metal material.
- the globe 30 is a hemispherical translucent cover for emitting the light emitted from the light emitting module 10 to the outside of the lamp.
- the light emitting module 10, the sensor unit 80 and a part of the insulating case 50 are covered by the globe 30.
- the light of the light emitting module 10 incident on the inner surface of the globe 30 is transmitted through the globe 30 and taken out of the globe 30.
- the glove 30 in the present embodiment has a shape in which the opening side (cap base side) is narrowed, and for example, a shape that simulates a bulb of A-type bulb which is a general bulb shape can be used. Further, the glove 30 is disposed so that the opening side end thereof is sandwiched between the base 20 and the housing 60.
- the globe 30 has the light emitting module 10 and the sensor unit 80 covered by the press-in end of the glove 30 pressed into the glove-side opening of the housing 60. It is attached to the opening.
- the globe 30 be subjected to a diffusion process for diffusing the light emitted from the light emitting module 10.
- a diffusion process for diffusing the light emitted from the light emitting module 10.
- the globe 30 can have a light diffusion function.
- the light diffusion film can be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the globe 30.
- the light diffusion function can be given to the globe 30 by forming the light diffusion dots on the globe 30.
- the globe 30 can have a light diffusing function by forming a plurality of dots or forming a minute dimple (dimple).
- the light diffusion function can also be provided by embossing the glove 30.
- the globe 30 with the light diffusing function, it is possible to diffuse the light entering the globe 30 from the light emitting module 10, so that the light distribution angle of the illumination light source can be widened.
- the shape of the globe 30 may be a spheroid or a spheroid.
- resin materials such as a glass material or a synthetic resin, can be used, In this Embodiment, the glove
- the circuit unit 40 is a lighting circuit (power supply circuit) for lighting (emitting) the semiconductor light emitting element 12, and includes a circuit board 41 and a plurality of electronic components 42 mounted on the circuit board 41. There is. In FIG. 2, only some electronic components are denoted by reference numerals.
- the circuit unit 40 is accommodated in the insulating case 50 and fixed to the insulating case 50 by, for example, screwing, bonding or engagement.
- the circuit board 41 is disposed such that its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored more compactly in the insulating case 50. Further, in the circuit unit 40, the heat-sensitive electronic component is disposed at a position far from the light emitting module 10, while the heat-resistant electronic component is disposed at a position near the light emitting module 10. In this way, it is possible to reduce the heat destruction of the heat-sensitive electronic component by the heat generated in the light emitting module 10.
- the circuit unit 40 and the base 70 are electrically connected by electrical wires (leads) 40c and 40d.
- the electrical wiring 40 c is connected to the shell portion 71 of the base 70 through the through hole 50 a provided in the insulating case 50.
- the electrical wiring 40 d is connected to the eyelet portion 73 of the base 70 through the opening on the base side of the insulating case 50.
- the circuit unit 40 and the sensor unit 80 are electrically connected by an electrical wiring (lead wire) 40 e.
- the insulating case 50 is a circuit holder for housing and holding the circuit unit 40, and in the present embodiment, a part of the insulating case 50 is a partition plate positioned between the sensor unit 80 and the circuit unit 40. It becomes. Specifically, as described later, the plate-like top surface portion of the third case portion 53 of the insulating case 50 serves as a partition plate.
- the insulating case 50 is preferably made of, for example, an insulating material such as a resin. Further, the insulating case 50 preferably functions as a thermal partition plate between the sensor unit 80 and the circuit unit 40, and may be made of a material having a low thermal conductivity. In the present embodiment, the insulating case 50 is made of polybutylene terephthalate (PBT) having a thermal conductivity of about 0.18 to 0.29 (W / m ⁇ ° C.).
- PBT polybutylene terephthalate
- the material of the insulating case 50 is not limited to PBT, and polyethylene terephthalate (PET), LCP (liquid crystal polymer), amorphous thermoplastic polyetherimide (ULTEM resin), polyimide, or the like has a high heat resistance temperature. If it is a thing, another resin material etc. can be used.
- the insulating case 50 in the present embodiment has a cylindrical first case portion (large diameter portion) 51, a cylindrical second case portion (small diameter portion) 51 having substantially the same shape as the mouthpiece 70, and a glove side. It is comprised by the 3rd case part 53 which is a closed bottomed cylindrical cap member which closed and opened the mouthpiece side.
- the first case portion 51 is housed in the housing 60 and configured to penetrate the through hole 20 a of the base 20.
- the second case portion 52 is provided on the base side of the first case portion 51, and the base 70 is externally fitted to the second case portion 52. Thus, the opening on the base side of the insulating case 50 is closed.
- the third case portion 53 is housed in the glove 30 and provided at the glove side end of the first case portion 51.
- the third case portion 53 is configured of a first cap portion whose diameter is gradually reduced toward the glove side, and a cylindrical second cap portion whose diameter is uniform in the vertical direction.
- the top surface portion (bottom portion) of the first cap portion in the third case portion 53 is formed in a circular plate shape, and serves as a partition plate located between the sensor portion 80 (mounting substrate 81) and the circuit unit 40. .
- the sensor unit 80 and the circuit unit 40 are spatially separated by the third case 53 (partition plate). Thus, the sensor unit 80 and the circuit unit 40 are disposed so as not to contact each other.
- the side circumferential surface of the third case portion 53 can function as a light reflecting surface.
- the light from the light emitting module 10 is reflected by the side peripheral surface of the third case portion 53 and reaches the inner surface of the globe 30.
- the insulating case 50 (third case portion 53) can also function as a member for adjusting the light distribution characteristic (light distribution angle) of the illumination light source 1.
- the surface of the third case portion 53 may be mirror-finished.
- a through hole 50 b is provided in the insulating case 50 at a position corresponding to the tongue piece 14 of the light emitting module 10.
- the tip of the tongue portion 14 is inserted into the insulating case 50 through the through hole 50 b, and the connector 15 provided on the tongue portion 14 is located in the insulating case 50.
- the insulating case 50 and the base 20 are not in contact with each other, and between the outer surface of the insulating case 50 (first case portion 51) and the peripheral surface of the through hole 20 a of the base 20. There is a gap in the Therefore, the heat generated in the light emitting module 10 can be suppressed from propagating to the insulating case 50. Thereby, since the temperature rise of insulation case 50 can be suppressed, it can control that circuit unit 40 is thermally destroyed.
- the housing 60 is disposed between the glove 30 and the base 70.
- the housing 60 is a case which is open at both ends, and is formed of a substantially cylindrical truncated cone member of substantially cylindrical shape whose diameter is reduced from the glove side to the mouthpiece side.
- the base 20 and the opening side end of the glove 30 are accommodated in the opening (first opening) on the glove side of the housing 60, and the housing 60 is fixed to the base 20 by caulking, for example. .
- the housing 60 may be fixed to the base 20 by pouring an adhesive into a space 60 a surrounded by the housing 60, the base 20 and the globe 30.
- the outer peripheral edge of the nozzle-side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface of the housing 60. Since the tapered surface of the base 20 is in surface contact with the inner peripheral surface of the housing 60, the heat transmitted from the light emitting module 10 to the base 20 is more easily conducted to the housing 60. Thereby, the heat generated in the semiconductor light emitting element 12 is conducted to the base 70 mainly through the base 20 and the housing 60 and further through the second case portion 52 of the insulating case 50, and the lighting equipment (from the base 70) Heat is dissipated to the side (not shown).
- the housing 60 in the present embodiment is made of a metal material.
- the case 60 functions as a heat sink, and the heat generated from the light emitting module 10 and the circuit unit 40 can be efficiently dissipated to the outside of the illumination light source 1 through the case 60.
- a metal material of the case 60 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered.
- a metal material has good thermal conductivity, so that the heat transmitted to the housing 60 can be efficiently transmitted to the die side. Therefore, the heat generated from the light emitting module 10 and the circuit unit 40 can be dissipated to the lighting apparatus side through the base 70.
- the housing 60 is made of an aluminum alloy material. Further, in order to improve the thermal emissivity of the housing 60, the surface of the housing 60 may be subjected to an alumite treatment.
- the material of the housing 60 is not limited to metal, and may be resin.
- the housing 60 can be made of a resin having a high thermal conductivity.
- the base 70 is a power receiving unit for receiving AC power by two contacts, and is attached to, for example, a socket of a lighting fixture. In this case, when the lighting light source 1 is turned on, the base 70 receives power from the socket of the lighting fixture. Further, the power received by the base 70 is input to the power input unit of the circuit unit 40 through the electrical wirings 40c and 40d.
- the base 70 includes a shell portion 71 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72.
- An insulating ring 74 is provided between the shell portion 71 and the housing 60 in order to ensure insulation between the housing 60 and the base 70.
- the type of the base 70 is not particularly limited.
- a screw-in type Edison type (E type) base can be used, and examples include an E26 base or an E17 base.
- the sensor unit 80 is a detection unit that detects the presence or absence of a detection target (such as a person) in the irradiation area of the illumination light source 1 and includes a mounting substrate 81 and a sensor main body 82 mounted on the mounting substrate 81.
- the mounting substrate 81 is a base on which the sensor body 82 is mounted.
- the mounting substrate 81 in the present embodiment is, for example, a disk-shaped base made of a resin having a high heat resistance temperature such as epoxy.
- printed wiring is formed on the surface of the mounting substrate 81 and a circuit element (control circuit such as a control microcomputer) for processing a signal detected by the sensor main body 82 is mounted.
- the circuit element (control circuit) is electrically connected to the circuit unit 40 by the electrical wiring 40 e, and the detection signal of the sensor main body 82 is output to the circuit unit 40 through the electrical wiring 40 e.
- a circuit element (control circuit) may be mounted on the circuit unit 40 instead of the sensor unit 80.
- the sensor body 82 is a detection element that detects a detection target such as a person, and for example, a human sensor that detects the presence of a person can be used.
- the sensor body 82 in the present embodiment is a passive type human sensor, and detects the presence of a person by detecting a change in intensity of infrared light incident on the light receiving surface. That is, the sensor body 82 outputs a detection signal to the circuit element when it detects an infrared ray emitted from the human body. Then, the light emitting module is turned on or off according to the detection signal.
- the sensor main body 82 can detect the presence.
- the sensor main body 82 is configured to detect infrared rays, but may be configured to detect ultrasonic waves, visible light, or the like, or a combination thereof.
- the sensor body 82 is provided at the center of the mounting substrate 81, and the center of the sensor body 82 coincides with the lamp axis J.
- the sensor unit 80 configured in this manner is fixed to the outer side surface of the insulating case 50.
- the sensor unit 80 in the present embodiment is fixed to the upper surface of the third case portion (cap member) 53 of the insulating case 50.
- the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50, and are configured not to be in direct contact with each other via the insulating case 50. That is, the sensor unit 80 and the circuit unit 40 are not in contact with each other by the insulating case 50.
- the mounting substrate 81 of the sensor unit 80 and the circuit substrate 41 of the circuit unit 40 are configured not to be in direct contact with each other.
- the light guide member 90 is an optical member for guiding light to the light receiving surface of the sensor main body 82.
- the light guide member 90 in the present embodiment is a convex lens configured to condense infrared light emitted from a person on the light receiving surface.
- a Fresnel lens can be used as the light guide member 90.
- the light guide member 90 is disposed so as to overlap the sensor unit 80 in plan view. That is, the light guide member 90 is disposed above the sensor unit 80. Further, the lens central axis of the light guide member 90 is disposed to coincide with the lamp axis J.
- the light guide member 90 is fitted in an opening provided in the glove 30 and configured to protrude from the outer surface of the glove 30.
- the light guide member 90 can be formed using a translucent material such as glass or resin, and in the present embodiment, it is formed of polyethylene.
- the illumination light source 1 according to Embodiment 1 of the present invention configured as described above operates as follows.
- the illumination light source 1 when the illumination light source 1 is turned off, when a person enters the detection range of the sensor unit 80, the sensor unit 80 (sensor main body 82) detects the infrared rays emitted from the person. Next, the sensor unit 80 (control circuit) outputs a signal indicating that a person has been detected to the circuit unit 40.
- the circuit unit 40 that has acquired the detection signal from the sensor unit 80 supplies predetermined power to the light emitting module 10.
- the light emitting module 10 emits light, and the illumination light source 1 is turned on.
- the illumination light source 1 is automatically turned on.
- the circuit unit 40 Turn off the power supply to 10.
- the light emitting module 10 does not emit light, and the illumination light source 1 is turned off.
- the illumination light source 1 is automatically turned off when a predetermined time elapses after the absence of a person is detected by the sensor unit 80.
- the sensor unit 80 and the circuit unit 40 are disposed in the envelope so as not to contact each other, and the sensor unit 80 and the circuit unit 40 Is not mechanically connected. Specifically, the sensor unit 80 and the circuit unit 40 are spatially separated by a partition plate which is a part of the insulating case 50. As a result, the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40, so that the output of the sensor unit 80 can be prevented from fluctuating due to heat. Therefore, it can be reduced that the illumination light source 1 malfunctions due to the output fluctuation of the sensor unit 80.
- FIG. 4 is a cross-sectional view of an illumination light source according to Embodiment 2 of the present invention.
- the same numerals as Embodiment 1 are used.
- the configuration of the light guide member is different between the illumination light source 2 according to the present embodiment and the illumination light source 1 according to the first embodiment. That is, the light guide member 290 in the present embodiment is similar to the first embodiment in that light (infrared rays) is guided to the sensor unit 80, but is formed in a cover shape so as to cover the sensor unit 80.
- the second embodiment differs from the first embodiment in that
- the light guide member 290 is an optical member in which one is opened and the other is closed.
- the closed portion of the light guide member 290 is configured to guide light (infrared ray) to the light receiving surface of the sensor main body 82, and functions as a condensing lens.
- the opened portion of the light guide member 290 is in contact with the upper surface of the third case portion 53 of the insulating case 50.
- the light guide member 290 is disposed so as to cover the entire sensor unit 80 and is fixed to the insulating case 50. In the present embodiment, the light guide member 290 is disposed such that its central axis coincides with the lamp axis J.
- a part of the light guide member 290 is configured to protrude from the outer surface of the globe 30, and the light guide member 290 is provided with the closed portion (lens portion) in the globe 30. It is disposed in the insulating case 50 so as to project outward from the opening. Further, the light guide member 290 is disposed so as not to contact the globe 30 with a gap between the light guide member 290 and the globe 30. Thereby, damage to the globe 30 by the light guide member 290 at the time of assembly or the like can be suppressed.
- the light guide member 290 can be formed using a light transmissive material such as glass or resin, and in the present embodiment also, it is formed of polyethylene. Further, as in the first embodiment, the light guiding member 290 can be a Fresnel lens. Further, although the light guide member 290 is disposed so as not to be in contact with the globe 30, it may be in contact with the globe 30.
- the illumination light source 2 configured in this manner operates in the same manner as the illumination light source 1 according to the first embodiment. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80 and the illumination light source 2 (light emitting module 10) is automatically turned on, and when the person leaves the illumination area, the sensor After the detection of the absence of a person by the unit 80, the light source 2 for illumination (light emitting module 10) is automatically turned off after a predetermined time has elapsed.
- the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate). And arranged so as not to touch each other.
- the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40. Therefore, the output of the sensor unit 80 can be prevented from fluctuating due to heat, so that the malfunction of the illumination light source 2 can be reduced.
- the light guide member 290 is also fixed to the insulating case 50 in addition to the sensor unit 80.
- the focal point of the light guide member 290 with respect to the sensor unit 80 (the sensor main body 82) can be reduced, so that the sensitivity of the sensor unit 80 (the sensor main body 82) can be suppressed from being lowered.
- the sensor unit and the light guide member are fixed at different places, the sensor unit and the light guide member are deviated from the predetermined positions during the manufacturing process or during transportation of the illumination light source, and the sensitivity of the sensor unit is increased. There is a problem of falling.
- the accuracy of alignment (focus) between the sensor unit 80 and the light guide member 90 is different from that of the globe 30 and the housing 60.
- the position of the light guide member 90 with respect to the sensor unit 80 (the sensor main body 82) is hard to focus because it is determined by the alignment, the alignment of the housing 60 and the insulating case 50, and the like.
- the sensitivity reduction of the sensor unit 80 due to the defocus of the light guide member 290 can be suppressed.
- the light guide member 290 is fixed to the insulating case 50 instead of the globe 30, it is possible to reduce the breakage of the globe 30.
- the globe 30 may be broken when the light guide member 90 is fixed to the globe 30.
- the glove 30 made of a polycarbonate material is easily broken, when the light guide member 90 is fixed to the glove 30, the crack of the glove 30 tends to occur.
- the light guide member 290 is fixed not to the globe 30 but to the insulating case 50, it is possible to reduce breakage of the globe 30 when the light guide member 290 is mounted. Can.
- the light guide member 290 contain a thermally conductive substance.
- the thermal conductivity of the entire light guide member 290 be larger than the thermal conductivity of the mounting substrate 81 of the sensor unit 80.
- FIG. 5 is a cross-sectional view of an illumination light source according to Embodiment 3 of the present invention.
- the same numerals as Embodiment 1 are used.
- the configuration of the light guide member is different between the illumination light source 3 according to the present embodiment and the illumination light source 1 according to the first embodiment. That is, the light guide member 390 in the present embodiment is similar to the first embodiment in that light (infrared rays) is guided to the sensor unit 80, but is formed in a cover shape so as to cover the sensor unit 80.
- the second embodiment differs from the first embodiment in that
- the light guide member 390 is an optical member in which one is opened and the other is closed.
- the closed portion of the light guide member 390 is configured to guide light (infrared ray) to the light receiving surface of the sensor main body 82, and functions as a condensing lens.
- the opened portion of the light guide member 390 is in contact with the upper surface of the mounting substrate 81 of the sensor unit 80.
- the light guide member 390 is disposed so as to cover the entire sensor unit 80, and is fixed to the mounting substrate 81 of the sensor unit 80. In the present embodiment, the light guide member 390 is disposed such that its central axis coincides with the lamp axis J.
- a part of the light guide member 390 is configured to protrude from the outer surface of the globe 30, and the light guide member 390 is provided with the closed portion (lens portion) in the globe 30. It is disposed on the mounting substrate 81 so as to protrude outward from the opening. As in the second embodiment, the light guide member 390 is disposed so as not to contact the globe 30 with a gap between the light guide member 390 and the globe 30. Thereby, damage to the globe 30 by the light guide member 390 at the time of assembly or the like can be reduced.
- the light guide member 390 can be formed using a light transmissive material such as glass or resin, and in this embodiment also, it is formed of polyethylene. Further, as in the first embodiment, the light guiding member 390 can be a Fresnel lens. Further, although the light guide member 390 is disposed so as not to be in contact with the globe 30, it may be in contact with the globe 30.
- the illumination light source 3 configured in this manner operates in the same manner as the illumination light sources 1 and 2 according to the first and second embodiments. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80 and the illumination light source 3 (light emitting module 10) is turned on automatically, and when a person leaves the illumination area, the person The light source for illumination 3 (light emitting module 10) is automatically turned off after a predetermined time has elapsed since the detection of the absence of a person by the sensor.
- the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate). And arranged so as not to touch each other.
- the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40. Therefore, the output of the sensor unit 80 can be prevented from fluctuating due to heat, so that the malfunction of the illumination light source 3 can be reduced.
- the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80.
- the focal point of the light guide member 290 with respect to the sensor unit 80 (the sensor main body 82) can be reduced, so that the sensitivity of the sensor unit 80 (the sensor main body 82) can be suppressed from being lowered.
- the sensor unit and the light guide member are deviated from the predetermined position during the manufacturing process or transport of the illumination light source, and the sensitivity of the sensor unit is increased.
- the accuracy of alignment (focus) between the sensor unit 80 and the light guide member 90 is different from that of the globe 30 and the housing 60.
- the position of the light guide member 90 with respect to the sensor unit 80 (the sensor main body 82) is hard to focus because it is determined by the alignment, the alignment of the housing 60 and the insulating case 50, and the like.
- the light guide member 390 since the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, the light guide member 390 can be easily focused on the sensor unit 80 (sensor main body 82). .
- alignment between the light guide member 390 and the sensor unit 80 can be performed simultaneously with the mounting of the light guide member 390. Thereby, the sensitivity fall of sensor part 80 by the focus shift of light guide member 390 can be controlled.
- the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), so it is possible to reduce the breakage of the globe 30.
- the globe 30 may be broken when the light guide member 90 is fixed to the globe 30.
- the glove 30 made of a polycarbonate material is easily broken, when the light guide member 90 is fixed to the glove 30, the crack of the glove 30 tends to occur.
- the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), the globe 30 is broken when the light guide member 390 is mounted. Can be reduced.
- the light guide member 390 preferably contains a thermally conductive substance.
- the thermal conductivity of the entire light guide member 390 be larger than the thermal conductivity of the mounting substrate 81 of the sensor unit 80.
- the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, but may be fixed to the sensor main body 82.
- FIG. 6 is a cross-sectional view of an illumination light source according to Embodiment 4 of the present invention.
- the same members as in the third embodiment are assigned the same reference numerals as in the first embodiment.
- the illumination light source 4 according to the present embodiment is the illumination light source 3 according to the third embodiment further provided with a heat dissipation member 490.
- the heat radiating member 490 is a member for radiating heat of the sensor unit 80, and is provided between the light guide member 390 and the sensor unit 80.
- the heat dissipating member 490 can be made of a translucent material containing a heat conductive material, and in the present embodiment, the light guide member 390 and the sensor unit 80 are made of a transparent resin containing a heat conductive material. It is composed by filling in between.
- a translucent material polyethylene can be used, for example.
- the heat conductive substance a material having a heat conductivity higher than that of the light transmitting material may be used.
- the heat dissipating member 490 is configured such that light (infrared ray) is condensed on the sensor unit 80 by the heat dissipating member 490 together with the light guide member 390. That is, the heat dissipation member 490 also functions as a light guide member.
- the illumination light source 4 configured in this manner operates in the same manner as the illumination light source 3 according to the third embodiment. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80, the illumination light source 4 (light emitting module 10) is automatically turned on, and when a person leaves the illumination area, the person The light source for illumination 4 (light emitting module 10) is automatically turned off after a predetermined time has elapsed since the detection of the absence of a person by the sensor.
- the same effects as those of the third embodiment can be obtained. That is, according to the present embodiment, the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate), and are arranged so as not to be in contact with each other. As a result, the output of the sensor unit 80 can be prevented from fluctuating due to heat, and the malfunction of the illumination light source 4 can be reduced. Moreover, since the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, it is possible to reduce the defocus of the light guide member 290 with respect to the sensor unit 80 (sensor main body 82). It is possible to suppress the decrease in sensitivity of the main body 82). In addition, since the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), it is possible to reduce the breakage of the globe 30.
- the heat dissipation member 490 is provided between the sensor unit 80 and the light guide member 390, the heat of the circuit unit 40 conducted to the mounting substrate 81 of the sensor unit 80 is the heat dissipation member 490. Can be actively dissipated to the outside (in the atmosphere) of the illumination light source 1. Therefore, the sensor unit 80 is more difficult to receive the heat from the circuit unit 40, so that the output of the sensor unit 80 can be suppressed from being fluctuated by the heat.
- the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, but may be fixed to the sensor main body 82. Further, the present embodiment can be applied to the first and second embodiments.
- the light guide members are used in the above embodiments, the light source for illumination may be configured without providing the light guide members.
- a part of insulation case 50 was used as a partition plate which divides sensor part 80 and circuit unit 40 spatially, it does not restrict to this.
- a partition plate may be provided between the sensor unit 80 and the circuit unit 40.
- the partition plate is preferably made of an insulating material having a low thermal conductivity.
- the sensor unit 80 may be other than the insulating case 50 if the sensor unit 80 and the circuit unit 40 are disposed so as not to contact each other. You may place it in a place.
- the sensor unit 80 may be fixed to the housing 60, or the sensor unit 80 may be disposed between the circuit unit 40 and the housing 60.
- the light guide member may be appropriately provided according to the arrangement place of the sensor unit 80.
- the present invention can also be applied to a surface mounted device (SMD) type or the like, which is a structure in which an LED element obtained by packaging an LED chip is mounted on a mounting substrate.
- SMD surface mounted device
- the present invention can also be realized as an illumination device provided with the above illumination light source.
- the illumination device 100 may be configured to include the illumination light source 1 described above and a lighting fixture (light fixture) 110 to which the illumination light source 1 is attached. Good.
- the lighting fixture 110 turns off and lights the illumination light source 1 and includes, for example, an appliance main body 111 attached to a ceiling, and a lamp cover 112 covering the illumination light source 1.
- the fixture body 111 includes a socket 111 a to which the base 70 of the illumination light source 1 is attached and which supplies power to the illumination light source 1.
- a translucent plate may be provided at the opening of the lamp cover 112.
- the present invention is useful as a light bulb-shaped LED lamp or the like to replace a conventional incandescent light bulb or the like, and can be widely used in a lighting device or the like.
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- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract
Description
まず、本発明の実施の形態1に係る照明用光源の構成について、図1、図2及び図3を用いて説明する。図1は、本発明の実施の形態1に係る照明用光源の一部切り欠き斜視図である。図2は、本発明の実施の形態1に係る照明用光源の断面図である。図3は、本発明の実施の形態1に係る照明用光源の上面図(グローブを透過して見たときの図)である。
First, the configuration of the illumination light source according to the first embodiment of the present invention will be described with reference to FIGS. 1, 2 and 3. FIG. FIG. 1 is a partially cutaway perspective view of the illumination light source according to
発光モジュール10は、例えば所定の光を放出するLEDモジュールであって、グローブ30の内方に配置されている。発光モジュール10は、センサ部80からの検知信号に基づいて発光する。 [Light emitting module]
The
基台20は、発光モジュール10を載置するための光源取り付け部材である。発光モジュール10は、基台20の前方面に配置されて、例えば、止め金具、ねじ、接着などにより基台20に固定されている。 [Base]
The
グローブ30は、発光モジュール10から放出される光をランプ外部に放射させるための半球状の透光性カバーである。また、発光モジュール10、センサ部80及び絶縁ケース50の一部は、このグローブ30によって覆われている。グローブ30の内面に入射した発光モジュール10の光は、グローブ30を透過してグローブ30の外部へと取り出される。 [Globe]
The
回路ユニット40は、半導体発光素子12を点灯(発光)させるための点灯回路(電源回路)であって、回路基板41と、当該回路基板41に実装された複数の電子部品42とを有している。なお、図2では一部の電子部品にのみ符号を付している。回路ユニット40は、絶縁ケース50内に収容されており、例えば、ねじ止め、接着又は係合などにより絶縁ケース50に固定されている。 [Circuit unit]
The
絶縁ケース50は、回路ユニット40を収納して保持するための回路ホルダであり、本実施の形態において、絶縁ケース50の一部は、センサ部80と回路ユニット40との間に位置する仕切り板となる。具体的には、後述するように、絶縁ケース50の第3ケース部53の板状の天面部が仕切り板となる。 [Insulation case]
The insulating
筐体60は、グローブ30と口金70との間に配置されている。筐体60は、両端が開口するケースであって、グローブ側から口金側へ向けて縮径した略円筒形状の略円錐台部材によって構成されている。 [Case]
The
口金70は、二接点によって交流電力を受電するための受電部であり、例えば、照明器具のソケットに取り付けられる。この場合、照明用光源1が点灯された際に、口金70は、照明器具のソケットから電力を受ける。また、口金70で受電した電力は、電気配線40c及び40dを介して回路ユニット40の電力入力部に入力される。 [Cap]
The
センサ部80は、照明用光源1の照射エリアにおける検出対象(人等)の有無を検知する検知手段であって、実装基板81と、実装基板81に実装されたセンサ本体82とを有する。 [Sensor section]
The
導光部材90は、センサ本体82の受光面に光を導くための光学部材である。本実施の形態における導光部材90は、人から放射される赤外線を受光面に集光するように構成された凸レンズである。導光部材90としては、例えば、フレネルレンズを用いることができる。 [Light guiding member]
The
次に、本発明の実施の形態2に係る照明用光源2の構成について、図4を用いて説明する。図4は、本発明の実施の形態2に係る照明用光源の断面図である。なお、実施の形態1と同じ部材については、実施の形態1と同じ符号を用いている。 Second Embodiment
Next, the configuration of the
次に、本発明の実施の形態3に係る照明用光源3の構成について、図5を用いて説明する。図5は、本発明の実施の形態3に係る照明用光源の断面図である。なお、実施の形態1と同じ部材については、実施の形態1と同じ符号を用いている。 Third Embodiment
Next, the configuration of the
次に、本発明の実施の形態4に係る照明用光源4の構成について、図6を用いて説明する。図6は、本発明の実施の形態4に係る照明用光源の断面図である。なお、実施の形態3と同じ部材については、実施の形態1と同じ符号を用いている。
Next, the configuration of the
10 発光モジュール
11、81 実装基板
12 半導体発光素子
13 封止体
14 舌片部
15 コネクタ
20 基台
20a、50a、50b 貫通孔
30 グローブ
40 回路ユニット
40a、40b、40c、40d、40e 電気配線
41 回路基板
42 電子部品
50 絶縁ケース
51 第1ケース部
52 第2ケース部
53 第3ケース部
60 筐体
60a 空間
70 口金
71 シェル部
72 絶縁部
73 アイレット部
74 絶縁リング
80 センサ部
82 センサ本体
90、290、390 導光部材
100 照明装置
110 点灯器具
111 器具本体
111a ソケット
112 ランプカバー
490 放熱部材 DESCRIPTION OF
Claims (11)
- グローブと筐体と口金とで外囲器を構成する照明用光源であって、
センサ部と、
前記センサ部からの検知信号に基づいて発光する発光部と、
前記発光部に電力を供給するための電源回路部と、
前記センサ部と前記電源回路部との間に位置する仕切り板とを備え、
前記仕切り板によって前記センサ部と前記電源回路部とが空間的に隔てられている、
照明用光源。 It is a light source for illumination which comprises an envelope with a glove, a case and a base,
A sensor unit,
A light emitting unit that emits light based on a detection signal from the sensor unit;
A power supply circuit unit for supplying power to the light emitting unit;
A partition plate positioned between the sensor unit and the power supply circuit unit;
The sensor unit and the power supply circuit unit are spatially separated by the partition plate;
Light source for illumination. - さらに、前記外囲器内に設けられ、前記電源回路部を収容する絶縁ケースを備え、
前記仕切り板は、前記絶縁ケースの一部であり、
前記センサ部は、前記絶縁ケースの外側面に固定されている、
請求項1に記載の照明用光源。 And an insulating case provided in the envelope and housing the power supply circuit unit,
The partition plate is a part of the insulating case,
The sensor unit is fixed to the outer surface of the insulating case.
The illumination light source according to claim 1. - 前記絶縁ケースの一部は、前記グローブ内に位置しており、
前記センサ部は、前記グローブ内に位置する前記絶縁ケースの一部に固定されている、
請求項2に記載の照明用光源。 A part of the insulating case is located in the glove,
The sensor unit is fixed to a part of the insulating case located in the glove.
The illumination light source according to claim 2. - 前記発光部は、前記グローブ内に位置する前記絶縁ケースの一部を囲むように設けられている、
請求項3に記載の照明用光源。 The light emitting unit is provided so as to surround a part of the insulating case located in the glove.
The illumination light source according to claim 3. - さらに、前記センサ部に光を導く導光部材を備え、
前記導光部材は、前記センサ部に固定されている、
請求項1~4のいずれか1項に記載の照明用光源。 And a light guide member for guiding light to the sensor unit.
The light guide member is fixed to the sensor unit.
The illumination light source according to any one of claims 1 to 4. - 前記センサ部は、実装基板と、前記実装基板に実装されたセンサ本体とを有し、
前記導光部材は、前記実装基板に固定されている、
請求項5に記載の照明用光源。 The sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate.
The light guide member is fixed to the mounting substrate.
The illumination light source according to claim 5. - 前記センサ部は、実装基板と、前記実装基板に実装されたセンサ本体とを有し、
前記導光部材は、前記センサ本体に固定されている、
請求項5に記載の照明用光源。 The sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate.
The light guide member is fixed to the sensor body.
The illumination light source according to claim 5. - 前記導光部材は、熱導電性物質が含有された透光性材料からなる、
請求項5~7のいずれか1項に記載の照明用光源。 The light guide member is made of a translucent material containing a thermally conductive substance.
The illumination light source according to any one of claims 5 to 7. - 前記透光性材料は、ポリエチレンである、
請求項8に記載の照明用光源。 The translucent material is polyethylene,
The illumination light source according to claim 8. - さらに、前記導光部材と前記センサ部との間に充填された放熱部材を備える、
請求項5に記載の照明用光源。 And a heat dissipation member filled between the light guide member and the sensor unit.
The illumination light source according to claim 5. - 前記導光部材は、フレネルレンズである、
請求項5~10のいずれか1項に記載の照明用光源。 The light guide member is a Fresnel lens.
An illumination light source according to any one of claims 5 to 10.
Priority Applications (2)
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CN201390000371.9U CN204213656U (en) | 2012-04-06 | 2013-03-12 | Illumination light source and lighting device |
JP2013531809A JP5576989B2 (en) | 2012-04-06 | 2013-03-12 | Light source for illumination |
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PCT/JP2013/001586 WO2013150718A1 (en) | 2012-04-06 | 2013-03-12 | Illuminating light source |
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JP2017112070A (en) * | 2015-12-18 | 2017-06-22 | パナソニックIpマネジメント株式会社 | Lighting fixture |
EP3510318A4 (en) * | 2016-12-23 | 2020-05-13 | Zhejiang Shenghui Lighting Co., Ltd | A sensor light and a system for preventing false triggering of a sensor |
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Publication number | Publication date |
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CN204213656U (en) | 2015-03-18 |
JP5576989B2 (en) | 2014-08-20 |
JPWO2013150718A1 (en) | 2015-12-17 |
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