WO2013150718A1 - Illuminating light source - Google Patents

Illuminating light source Download PDF

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Publication number
WO2013150718A1
WO2013150718A1 PCT/JP2013/001586 JP2013001586W WO2013150718A1 WO 2013150718 A1 WO2013150718 A1 WO 2013150718A1 JP 2013001586 W JP2013001586 W JP 2013001586W WO 2013150718 A1 WO2013150718 A1 WO 2013150718A1
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WO
WIPO (PCT)
Prior art keywords
light source
sensor unit
guide member
light guide
illumination
Prior art date
Application number
PCT/JP2013/001586
Other languages
French (fr)
Japanese (ja)
Inventor
和繁 杉田
高橋 暁良
和浩 武田
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to CN201390000371.9U priority Critical patent/CN204213656U/en
Priority to JP2013531809A priority patent/JP5576989B2/en
Publication of WO2013150718A1 publication Critical patent/WO2013150718A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to an illumination light source including a light emitting element such as a light emitting diode (LED), and more particularly to a bulb-shaped LED lamp including a sensor such as a human sensor.
  • a light emitting element such as a light emitting diode (LED)
  • a bulb-shaped LED lamp including a sensor such as a human sensor.
  • LEDs are used in lamps and the like as highly efficient and space-saving light sources. Among them, LED lamps using LEDs are attracting attention as alternative light sources for fluorescent lamps and incandescent lamps conventionally known.
  • a lighting device with a human sensor has been known.
  • a human sensor is provided in a luminaire to which a lamp (light source for illumination) is attached, and the lamp is turned on by detecting a human with the human sensor. For example, when a person enters the lighting area, the presence of the person is detected by the human sensor and the lamp is automatically turned on. When the person goes out of the lighting area, the absence of the person is detected by the human sensor. The lamp will turn off automatically after a certain period of time.
  • Patent Document 1 discloses a bulb-shaped LED lamp including a human sensor.
  • the LED lamp has a power supply circuit for causing the LED to emit light, and heat is generated from the power supply circuit at the time of lighting. For this reason, in the LED lamp provided with the human sensor, there is a problem that the heat from the power supply circuit may cause the output of the human sensor to fluctuate and cause a malfunction.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination light source capable of suppressing output fluctuation of a sensor unit due to heat.
  • one aspect of the illumination light source according to the present invention is an illumination light source that constitutes an envelope with a globe, a housing, and a base, and includes a sensor unit and the sensor unit.
  • a light emitting unit that emits light based on a detection signal, a power supply circuit unit for supplying power to the light emitting unit, and a partition plate positioned between the sensor unit and the power supply circuit unit The sensor unit and the power supply circuit unit are spatially separated.
  • the light source further includes an insulating case provided in the envelope and housing the power supply circuit portion, and the partition plate is a part of the insulating case.
  • the sensor unit is fixed to an outer side surface of the insulating case.
  • a part of the insulating case is located in the glove, and the sensor unit is fixed to a part of the insulating case located in the glove Is preferred.
  • the light emitting unit is provided so as to surround a part of the insulating case located in the glove.
  • the light guide member may further include a light guide member that guides light to the sensor unit, and the light guide member may be fixed to the sensor unit.
  • the sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate, and the light guide member is fixed to the mounting substrate. Is preferred.
  • the sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate, and the light guide member is fixed to the sensor main body It is also good.
  • the light guide member is preferably made of a translucent material containing a thermally conductive substance.
  • the translucent material is preferably polyethylene.
  • the illumination light source it is preferable to further include a heat dissipation member filled between the light guide member and the sensor unit.
  • the light guide member is preferably a Fresnel lens.
  • the sensor unit is less likely to receive the heat from the power supply circuit, so it is possible to suppress the fluctuation of the output of the sensor unit due to the heat. As a result, malfunction of the illumination light source can be reduced.
  • FIG. 1 is a partially cutaway perspective view of the illumination light source according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view of the illumination light source according to Embodiment 1 of the present invention.
  • FIG. 3 is a top view of the illumination light source according to Embodiment 1 of the present invention.
  • FIG. 4 is a cross-sectional view of an illumination light source according to Embodiment 2 of the present invention.
  • FIG. 5 is a cross-sectional view of an illumination light source according to Embodiment 3 of the present invention.
  • FIG. 6 is a cross-sectional view of an illumination light source according to Embodiment 4 of the present invention.
  • FIG. 7 is a schematic cross-sectional view of a lighting device according to the present invention.
  • FIG. 1 is a partially cutaway perspective view of the illumination light source according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view of the illumination light source according to Embodiment 1 of the present invention.
  • FIG. 3 is a top view of the illumination light source according to Embodiment 1 of the present invention (as viewed through a globe).
  • the upper side of the drawing is the front of the illumination light source
  • the lower side of the drawing is the rear of the illumination light source.
  • in front means the center of the illumination light source, assuming that the middle point between the upper end of the illumination light source (the top of the globe) and the lower end of the illumination light source (the top of the base) is the illumination light source.
  • backward means the direction of the nozzle side as viewed from the center of the light source for illumination.
  • the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J (central axis) of the light source for illumination, and in the present embodiment, the lamp axis J and the globe axis coincide. ing. Further, the lamp axis J is an axis serving as a rotation center when attaching the illumination light source 1 to a socket of the illumination device (not shown), and coincides with the rotation axis of the base 70.
  • the illumination light source 1 is a bulb-shaped LED lamp which is a substitute for a bulb-shaped fluorescent lamp or an incandescent lamp, and includes a light emitting module 10 as a light source;
  • a case 60 covering the case 50, a base 70 electrically connected to the circuit unit 40, a sensor unit 80 for detecting the presence or absence of a person, and a light guide member 90 for guiding light to the sensor unit 80 are provided.
  • the insulating case 50 functions as a partition plate located between the sensor unit 80 and the circuit unit 40, and the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate) It is separated.
  • the illumination light source 1 includes an envelope constituted by a globe 30, a housing 60 and a base 70, and the light emitting module 10, the base 20, the circuit unit 40 and the insulating case 50 are provided in the envelope. It is housed. Further, in the present embodiment, the sensor unit 80 is also accommodated in the envelope.
  • the illumination light source 1 is a sensor-incorporated bulb-shaped LED lamp incorporating the sensor unit 80, and in the illumination light source 1 according to the present embodiment, the sensor unit 80 and the circuit unit 40 contact each other It is arranged not to.
  • the light emitting module 10 is, for example, an LED module that emits predetermined light, and is disposed inward of the globe 30.
  • the light emitting module 10 emits light based on the detection signal from the sensor unit 80.
  • the light emitting module 10 covers the mounting substrate 11, the plurality of semiconductor light emitting elements 12 mounted on the mounting substrate 11, and the semiconductor light emitting elements 12 thereof. And the sealing body 13 provided on the mounting substrate 11.
  • the mounting substrate 11 is, for example, a ceramic substrate made of alumina or the like.
  • the mounting substrate 11 in the present embodiment is a substantially annular substrate having a substantially circular hole at the center, and a tongue piece extended from one point on the inner peripheral edge of the hole toward the center of the hole. Have fourteen.
  • the connector 15 to which the electrical wires 40a and 40b of the circuit unit 40 are connected is provided on the front surface of the tongue piece 14.
  • the light emitting module 10 and the circuit unit are connected by connecting the electrical wires 40a and 40b to the connector 15. And 40 are electrically connected. Then, when the direct current power is supplied from the circuit unit 40, the semiconductor light emitting element 12 emits light.
  • the semiconductor light emitting elements 12 are, for example, LEDs (LED chips), and a plurality of the semiconductor light emitting elements 12 are mounted on one surface of the mounting substrate 11. Each of the plurality of semiconductor light emitting elements 12 is mounted in a posture in which the main emission direction is in front of the illumination light source.
  • the semiconductor light emitting element 12 may be other than the LED, and for example, a semiconductor laser, an organic EL element or an inorganic EL element may be used.
  • the semiconductor light emitting element 12 is provided to surround the insulating case 50, and in the present embodiment, for example, 32 LED chips are annularly mounted on the front surface of the mounting substrate 11 as shown in FIG. There is. More specifically, 16 sets of the semiconductor light emitting elements 12 arranged along the radial direction of the mounting substrate 11 are annularly arranged at equal intervals along the circumferential direction of the mounting substrate 11 as a set of two. It is done.
  • the semiconductor light emitting elements 12 are individually sealed by a substantially rectangular parallelepiped sealing body 13 for each set. Therefore, in the present embodiment, the number of sealing bodies 13 is 16 in all.
  • the longitudinal direction of each sealing body 13 coincides with the radial direction of the mounting substrate 11, and when viewed along the lamp axis J from the front side (in plan view), arranged radially about the lamp axis J It is done.
  • the number of semiconductor light emitting elements 12 is not limited to a plurality, and may be one. Further, the attitude of the semiconductor light emitting device 12 does not have to be such that all the semiconductor light emitting devices 12 are directed in the direction along the lamp axis J, and a portion is directed in a direction obliquely inclined to the lamp axis J It may be implemented in attitude. As a result, the controllability of the light distribution angle of the lamp is improved, so fine adjustment can be made to obtain more preferable light distribution characteristics.
  • the sealing body 13 is mainly made of a translucent material, but if it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength for converting the wavelength of light A conversion material is incorporated into the translucent material.
  • a translucent material silicone resin can be utilized, for example.
  • fluorescent substance particle can be utilized, for example.
  • the sealing body 13 can be comprised as fluorescent substance containing resin.
  • a blue LED emitting blue light is used as the semiconductor light emitting element 12, and as the sealing body 13, phosphor particles for converting blue light into yellow light and the phosphor particles are used.
  • the translucent resin material mixed is used. Thereby, a part of the blue light emitted from the semiconductor light emitting element 12 is wavelength-converted to yellow light by the sealing body 13, and white light generated by mixing the wavelength-converted yellow light and the blue light not converted. Are emitted from the light emitting module 10.
  • the light emitting module 10 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and phosphor particles of each color that emits light in three primary colors (red, green, and blue). Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
  • the base 20 is a light source attaching member for mounting the light emitting module 10.
  • the light emitting module 10 is disposed on the front surface of the base 20 and is fixed to the base 20 by, for example, fasteners, screws, adhesion, and the like.
  • the base 20 in the present embodiment has a substantially thin cylindrical shape having a through hole 20a, and the cylinder axis of the base 20 is disposed in a posture in which it coincides with the lamp axis J.
  • the light emitting module 10 is mounted on the front surface of the base 20 with the semiconductor light emitting elements 12 facing forward in the main emission direction. Since the through holes 20a are provided in the base 20, the weight of the illumination light source 1 can be reduced. Moreover, since a part of the circuit unit 40 is disposed in the through hole 20a and in the globe 30 via the through hole 20a, the illumination light source 1 can be miniaturized.
  • the base 20 in the present embodiment is made of, for example, a metal material.
  • a metal material for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered.
  • Such a metal material has good thermal conductivity, so that the heat generated by the light emitting module 10 can be efficiently conducted to the housing 60.
  • the base 20 can be a substantially disc-shaped metal substrate molded by aluminum die casting.
  • the base 20 can be functioned as a heat dissipation body for conducting the heat generated from the light emitting module 10 to the housing 60 by forming the base 20 with a metal material.
  • the globe 30 is a hemispherical translucent cover for emitting the light emitted from the light emitting module 10 to the outside of the lamp.
  • the light emitting module 10, the sensor unit 80 and a part of the insulating case 50 are covered by the globe 30.
  • the light of the light emitting module 10 incident on the inner surface of the globe 30 is transmitted through the globe 30 and taken out of the globe 30.
  • the glove 30 in the present embodiment has a shape in which the opening side (cap base side) is narrowed, and for example, a shape that simulates a bulb of A-type bulb which is a general bulb shape can be used. Further, the glove 30 is disposed so that the opening side end thereof is sandwiched between the base 20 and the housing 60.
  • the globe 30 has the light emitting module 10 and the sensor unit 80 covered by the press-in end of the glove 30 pressed into the glove-side opening of the housing 60. It is attached to the opening.
  • the globe 30 be subjected to a diffusion process for diffusing the light emitted from the light emitting module 10.
  • a diffusion process for diffusing the light emitted from the light emitting module 10.
  • the globe 30 can have a light diffusion function.
  • the light diffusion film can be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the globe 30.
  • the light diffusion function can be given to the globe 30 by forming the light diffusion dots on the globe 30.
  • the globe 30 can have a light diffusing function by forming a plurality of dots or forming a minute dimple (dimple).
  • the light diffusion function can also be provided by embossing the glove 30.
  • the globe 30 with the light diffusing function, it is possible to diffuse the light entering the globe 30 from the light emitting module 10, so that the light distribution angle of the illumination light source can be widened.
  • the shape of the globe 30 may be a spheroid or a spheroid.
  • resin materials such as a glass material or a synthetic resin, can be used, In this Embodiment, the glove
  • the circuit unit 40 is a lighting circuit (power supply circuit) for lighting (emitting) the semiconductor light emitting element 12, and includes a circuit board 41 and a plurality of electronic components 42 mounted on the circuit board 41. There is. In FIG. 2, only some electronic components are denoted by reference numerals.
  • the circuit unit 40 is accommodated in the insulating case 50 and fixed to the insulating case 50 by, for example, screwing, bonding or engagement.
  • the circuit board 41 is disposed such that its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored more compactly in the insulating case 50. Further, in the circuit unit 40, the heat-sensitive electronic component is disposed at a position far from the light emitting module 10, while the heat-resistant electronic component is disposed at a position near the light emitting module 10. In this way, it is possible to reduce the heat destruction of the heat-sensitive electronic component by the heat generated in the light emitting module 10.
  • the circuit unit 40 and the base 70 are electrically connected by electrical wires (leads) 40c and 40d.
  • the electrical wiring 40 c is connected to the shell portion 71 of the base 70 through the through hole 50 a provided in the insulating case 50.
  • the electrical wiring 40 d is connected to the eyelet portion 73 of the base 70 through the opening on the base side of the insulating case 50.
  • the circuit unit 40 and the sensor unit 80 are electrically connected by an electrical wiring (lead wire) 40 e.
  • the insulating case 50 is a circuit holder for housing and holding the circuit unit 40, and in the present embodiment, a part of the insulating case 50 is a partition plate positioned between the sensor unit 80 and the circuit unit 40. It becomes. Specifically, as described later, the plate-like top surface portion of the third case portion 53 of the insulating case 50 serves as a partition plate.
  • the insulating case 50 is preferably made of, for example, an insulating material such as a resin. Further, the insulating case 50 preferably functions as a thermal partition plate between the sensor unit 80 and the circuit unit 40, and may be made of a material having a low thermal conductivity. In the present embodiment, the insulating case 50 is made of polybutylene terephthalate (PBT) having a thermal conductivity of about 0.18 to 0.29 (W / m ⁇ ° C.).
  • PBT polybutylene terephthalate
  • the material of the insulating case 50 is not limited to PBT, and polyethylene terephthalate (PET), LCP (liquid crystal polymer), amorphous thermoplastic polyetherimide (ULTEM resin), polyimide, or the like has a high heat resistance temperature. If it is a thing, another resin material etc. can be used.
  • the insulating case 50 in the present embodiment has a cylindrical first case portion (large diameter portion) 51, a cylindrical second case portion (small diameter portion) 51 having substantially the same shape as the mouthpiece 70, and a glove side. It is comprised by the 3rd case part 53 which is a closed bottomed cylindrical cap member which closed and opened the mouthpiece side.
  • the first case portion 51 is housed in the housing 60 and configured to penetrate the through hole 20 a of the base 20.
  • the second case portion 52 is provided on the base side of the first case portion 51, and the base 70 is externally fitted to the second case portion 52. Thus, the opening on the base side of the insulating case 50 is closed.
  • the third case portion 53 is housed in the glove 30 and provided at the glove side end of the first case portion 51.
  • the third case portion 53 is configured of a first cap portion whose diameter is gradually reduced toward the glove side, and a cylindrical second cap portion whose diameter is uniform in the vertical direction.
  • the top surface portion (bottom portion) of the first cap portion in the third case portion 53 is formed in a circular plate shape, and serves as a partition plate located between the sensor portion 80 (mounting substrate 81) and the circuit unit 40. .
  • the sensor unit 80 and the circuit unit 40 are spatially separated by the third case 53 (partition plate). Thus, the sensor unit 80 and the circuit unit 40 are disposed so as not to contact each other.
  • the side circumferential surface of the third case portion 53 can function as a light reflecting surface.
  • the light from the light emitting module 10 is reflected by the side peripheral surface of the third case portion 53 and reaches the inner surface of the globe 30.
  • the insulating case 50 (third case portion 53) can also function as a member for adjusting the light distribution characteristic (light distribution angle) of the illumination light source 1.
  • the surface of the third case portion 53 may be mirror-finished.
  • a through hole 50 b is provided in the insulating case 50 at a position corresponding to the tongue piece 14 of the light emitting module 10.
  • the tip of the tongue portion 14 is inserted into the insulating case 50 through the through hole 50 b, and the connector 15 provided on the tongue portion 14 is located in the insulating case 50.
  • the insulating case 50 and the base 20 are not in contact with each other, and between the outer surface of the insulating case 50 (first case portion 51) and the peripheral surface of the through hole 20 a of the base 20. There is a gap in the Therefore, the heat generated in the light emitting module 10 can be suppressed from propagating to the insulating case 50. Thereby, since the temperature rise of insulation case 50 can be suppressed, it can control that circuit unit 40 is thermally destroyed.
  • the housing 60 is disposed between the glove 30 and the base 70.
  • the housing 60 is a case which is open at both ends, and is formed of a substantially cylindrical truncated cone member of substantially cylindrical shape whose diameter is reduced from the glove side to the mouthpiece side.
  • the base 20 and the opening side end of the glove 30 are accommodated in the opening (first opening) on the glove side of the housing 60, and the housing 60 is fixed to the base 20 by caulking, for example. .
  • the housing 60 may be fixed to the base 20 by pouring an adhesive into a space 60 a surrounded by the housing 60, the base 20 and the globe 30.
  • the outer peripheral edge of the nozzle-side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface of the housing 60. Since the tapered surface of the base 20 is in surface contact with the inner peripheral surface of the housing 60, the heat transmitted from the light emitting module 10 to the base 20 is more easily conducted to the housing 60. Thereby, the heat generated in the semiconductor light emitting element 12 is conducted to the base 70 mainly through the base 20 and the housing 60 and further through the second case portion 52 of the insulating case 50, and the lighting equipment (from the base 70) Heat is dissipated to the side (not shown).
  • the housing 60 in the present embodiment is made of a metal material.
  • the case 60 functions as a heat sink, and the heat generated from the light emitting module 10 and the circuit unit 40 can be efficiently dissipated to the outside of the illumination light source 1 through the case 60.
  • a metal material of the case 60 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered.
  • a metal material has good thermal conductivity, so that the heat transmitted to the housing 60 can be efficiently transmitted to the die side. Therefore, the heat generated from the light emitting module 10 and the circuit unit 40 can be dissipated to the lighting apparatus side through the base 70.
  • the housing 60 is made of an aluminum alloy material. Further, in order to improve the thermal emissivity of the housing 60, the surface of the housing 60 may be subjected to an alumite treatment.
  • the material of the housing 60 is not limited to metal, and may be resin.
  • the housing 60 can be made of a resin having a high thermal conductivity.
  • the base 70 is a power receiving unit for receiving AC power by two contacts, and is attached to, for example, a socket of a lighting fixture. In this case, when the lighting light source 1 is turned on, the base 70 receives power from the socket of the lighting fixture. Further, the power received by the base 70 is input to the power input unit of the circuit unit 40 through the electrical wirings 40c and 40d.
  • the base 70 includes a shell portion 71 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72.
  • An insulating ring 74 is provided between the shell portion 71 and the housing 60 in order to ensure insulation between the housing 60 and the base 70.
  • the type of the base 70 is not particularly limited.
  • a screw-in type Edison type (E type) base can be used, and examples include an E26 base or an E17 base.
  • the sensor unit 80 is a detection unit that detects the presence or absence of a detection target (such as a person) in the irradiation area of the illumination light source 1 and includes a mounting substrate 81 and a sensor main body 82 mounted on the mounting substrate 81.
  • the mounting substrate 81 is a base on which the sensor body 82 is mounted.
  • the mounting substrate 81 in the present embodiment is, for example, a disk-shaped base made of a resin having a high heat resistance temperature such as epoxy.
  • printed wiring is formed on the surface of the mounting substrate 81 and a circuit element (control circuit such as a control microcomputer) for processing a signal detected by the sensor main body 82 is mounted.
  • the circuit element (control circuit) is electrically connected to the circuit unit 40 by the electrical wiring 40 e, and the detection signal of the sensor main body 82 is output to the circuit unit 40 through the electrical wiring 40 e.
  • a circuit element (control circuit) may be mounted on the circuit unit 40 instead of the sensor unit 80.
  • the sensor body 82 is a detection element that detects a detection target such as a person, and for example, a human sensor that detects the presence of a person can be used.
  • the sensor body 82 in the present embodiment is a passive type human sensor, and detects the presence of a person by detecting a change in intensity of infrared light incident on the light receiving surface. That is, the sensor body 82 outputs a detection signal to the circuit element when it detects an infrared ray emitted from the human body. Then, the light emitting module is turned on or off according to the detection signal.
  • the sensor main body 82 can detect the presence.
  • the sensor main body 82 is configured to detect infrared rays, but may be configured to detect ultrasonic waves, visible light, or the like, or a combination thereof.
  • the sensor body 82 is provided at the center of the mounting substrate 81, and the center of the sensor body 82 coincides with the lamp axis J.
  • the sensor unit 80 configured in this manner is fixed to the outer side surface of the insulating case 50.
  • the sensor unit 80 in the present embodiment is fixed to the upper surface of the third case portion (cap member) 53 of the insulating case 50.
  • the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50, and are configured not to be in direct contact with each other via the insulating case 50. That is, the sensor unit 80 and the circuit unit 40 are not in contact with each other by the insulating case 50.
  • the mounting substrate 81 of the sensor unit 80 and the circuit substrate 41 of the circuit unit 40 are configured not to be in direct contact with each other.
  • the light guide member 90 is an optical member for guiding light to the light receiving surface of the sensor main body 82.
  • the light guide member 90 in the present embodiment is a convex lens configured to condense infrared light emitted from a person on the light receiving surface.
  • a Fresnel lens can be used as the light guide member 90.
  • the light guide member 90 is disposed so as to overlap the sensor unit 80 in plan view. That is, the light guide member 90 is disposed above the sensor unit 80. Further, the lens central axis of the light guide member 90 is disposed to coincide with the lamp axis J.
  • the light guide member 90 is fitted in an opening provided in the glove 30 and configured to protrude from the outer surface of the glove 30.
  • the light guide member 90 can be formed using a translucent material such as glass or resin, and in the present embodiment, it is formed of polyethylene.
  • the illumination light source 1 according to Embodiment 1 of the present invention configured as described above operates as follows.
  • the illumination light source 1 when the illumination light source 1 is turned off, when a person enters the detection range of the sensor unit 80, the sensor unit 80 (sensor main body 82) detects the infrared rays emitted from the person. Next, the sensor unit 80 (control circuit) outputs a signal indicating that a person has been detected to the circuit unit 40.
  • the circuit unit 40 that has acquired the detection signal from the sensor unit 80 supplies predetermined power to the light emitting module 10.
  • the light emitting module 10 emits light, and the illumination light source 1 is turned on.
  • the illumination light source 1 is automatically turned on.
  • the circuit unit 40 Turn off the power supply to 10.
  • the light emitting module 10 does not emit light, and the illumination light source 1 is turned off.
  • the illumination light source 1 is automatically turned off when a predetermined time elapses after the absence of a person is detected by the sensor unit 80.
  • the sensor unit 80 and the circuit unit 40 are disposed in the envelope so as not to contact each other, and the sensor unit 80 and the circuit unit 40 Is not mechanically connected. Specifically, the sensor unit 80 and the circuit unit 40 are spatially separated by a partition plate which is a part of the insulating case 50. As a result, the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40, so that the output of the sensor unit 80 can be prevented from fluctuating due to heat. Therefore, it can be reduced that the illumination light source 1 malfunctions due to the output fluctuation of the sensor unit 80.
  • FIG. 4 is a cross-sectional view of an illumination light source according to Embodiment 2 of the present invention.
  • the same numerals as Embodiment 1 are used.
  • the configuration of the light guide member is different between the illumination light source 2 according to the present embodiment and the illumination light source 1 according to the first embodiment. That is, the light guide member 290 in the present embodiment is similar to the first embodiment in that light (infrared rays) is guided to the sensor unit 80, but is formed in a cover shape so as to cover the sensor unit 80.
  • the second embodiment differs from the first embodiment in that
  • the light guide member 290 is an optical member in which one is opened and the other is closed.
  • the closed portion of the light guide member 290 is configured to guide light (infrared ray) to the light receiving surface of the sensor main body 82, and functions as a condensing lens.
  • the opened portion of the light guide member 290 is in contact with the upper surface of the third case portion 53 of the insulating case 50.
  • the light guide member 290 is disposed so as to cover the entire sensor unit 80 and is fixed to the insulating case 50. In the present embodiment, the light guide member 290 is disposed such that its central axis coincides with the lamp axis J.
  • a part of the light guide member 290 is configured to protrude from the outer surface of the globe 30, and the light guide member 290 is provided with the closed portion (lens portion) in the globe 30. It is disposed in the insulating case 50 so as to project outward from the opening. Further, the light guide member 290 is disposed so as not to contact the globe 30 with a gap between the light guide member 290 and the globe 30. Thereby, damage to the globe 30 by the light guide member 290 at the time of assembly or the like can be suppressed.
  • the light guide member 290 can be formed using a light transmissive material such as glass or resin, and in the present embodiment also, it is formed of polyethylene. Further, as in the first embodiment, the light guiding member 290 can be a Fresnel lens. Further, although the light guide member 290 is disposed so as not to be in contact with the globe 30, it may be in contact with the globe 30.
  • the illumination light source 2 configured in this manner operates in the same manner as the illumination light source 1 according to the first embodiment. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80 and the illumination light source 2 (light emitting module 10) is automatically turned on, and when the person leaves the illumination area, the sensor After the detection of the absence of a person by the unit 80, the light source 2 for illumination (light emitting module 10) is automatically turned off after a predetermined time has elapsed.
  • the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate). And arranged so as not to touch each other.
  • the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40. Therefore, the output of the sensor unit 80 can be prevented from fluctuating due to heat, so that the malfunction of the illumination light source 2 can be reduced.
  • the light guide member 290 is also fixed to the insulating case 50 in addition to the sensor unit 80.
  • the focal point of the light guide member 290 with respect to the sensor unit 80 (the sensor main body 82) can be reduced, so that the sensitivity of the sensor unit 80 (the sensor main body 82) can be suppressed from being lowered.
  • the sensor unit and the light guide member are fixed at different places, the sensor unit and the light guide member are deviated from the predetermined positions during the manufacturing process or during transportation of the illumination light source, and the sensitivity of the sensor unit is increased. There is a problem of falling.
  • the accuracy of alignment (focus) between the sensor unit 80 and the light guide member 90 is different from that of the globe 30 and the housing 60.
  • the position of the light guide member 90 with respect to the sensor unit 80 (the sensor main body 82) is hard to focus because it is determined by the alignment, the alignment of the housing 60 and the insulating case 50, and the like.
  • the sensitivity reduction of the sensor unit 80 due to the defocus of the light guide member 290 can be suppressed.
  • the light guide member 290 is fixed to the insulating case 50 instead of the globe 30, it is possible to reduce the breakage of the globe 30.
  • the globe 30 may be broken when the light guide member 90 is fixed to the globe 30.
  • the glove 30 made of a polycarbonate material is easily broken, when the light guide member 90 is fixed to the glove 30, the crack of the glove 30 tends to occur.
  • the light guide member 290 is fixed not to the globe 30 but to the insulating case 50, it is possible to reduce breakage of the globe 30 when the light guide member 290 is mounted. Can.
  • the light guide member 290 contain a thermally conductive substance.
  • the thermal conductivity of the entire light guide member 290 be larger than the thermal conductivity of the mounting substrate 81 of the sensor unit 80.
  • FIG. 5 is a cross-sectional view of an illumination light source according to Embodiment 3 of the present invention.
  • the same numerals as Embodiment 1 are used.
  • the configuration of the light guide member is different between the illumination light source 3 according to the present embodiment and the illumination light source 1 according to the first embodiment. That is, the light guide member 390 in the present embodiment is similar to the first embodiment in that light (infrared rays) is guided to the sensor unit 80, but is formed in a cover shape so as to cover the sensor unit 80.
  • the second embodiment differs from the first embodiment in that
  • the light guide member 390 is an optical member in which one is opened and the other is closed.
  • the closed portion of the light guide member 390 is configured to guide light (infrared ray) to the light receiving surface of the sensor main body 82, and functions as a condensing lens.
  • the opened portion of the light guide member 390 is in contact with the upper surface of the mounting substrate 81 of the sensor unit 80.
  • the light guide member 390 is disposed so as to cover the entire sensor unit 80, and is fixed to the mounting substrate 81 of the sensor unit 80. In the present embodiment, the light guide member 390 is disposed such that its central axis coincides with the lamp axis J.
  • a part of the light guide member 390 is configured to protrude from the outer surface of the globe 30, and the light guide member 390 is provided with the closed portion (lens portion) in the globe 30. It is disposed on the mounting substrate 81 so as to protrude outward from the opening. As in the second embodiment, the light guide member 390 is disposed so as not to contact the globe 30 with a gap between the light guide member 390 and the globe 30. Thereby, damage to the globe 30 by the light guide member 390 at the time of assembly or the like can be reduced.
  • the light guide member 390 can be formed using a light transmissive material such as glass or resin, and in this embodiment also, it is formed of polyethylene. Further, as in the first embodiment, the light guiding member 390 can be a Fresnel lens. Further, although the light guide member 390 is disposed so as not to be in contact with the globe 30, it may be in contact with the globe 30.
  • the illumination light source 3 configured in this manner operates in the same manner as the illumination light sources 1 and 2 according to the first and second embodiments. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80 and the illumination light source 3 (light emitting module 10) is turned on automatically, and when a person leaves the illumination area, the person The light source for illumination 3 (light emitting module 10) is automatically turned off after a predetermined time has elapsed since the detection of the absence of a person by the sensor.
  • the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate). And arranged so as not to touch each other.
  • the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40. Therefore, the output of the sensor unit 80 can be prevented from fluctuating due to heat, so that the malfunction of the illumination light source 3 can be reduced.
  • the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80.
  • the focal point of the light guide member 290 with respect to the sensor unit 80 (the sensor main body 82) can be reduced, so that the sensitivity of the sensor unit 80 (the sensor main body 82) can be suppressed from being lowered.
  • the sensor unit and the light guide member are deviated from the predetermined position during the manufacturing process or transport of the illumination light source, and the sensitivity of the sensor unit is increased.
  • the accuracy of alignment (focus) between the sensor unit 80 and the light guide member 90 is different from that of the globe 30 and the housing 60.
  • the position of the light guide member 90 with respect to the sensor unit 80 (the sensor main body 82) is hard to focus because it is determined by the alignment, the alignment of the housing 60 and the insulating case 50, and the like.
  • the light guide member 390 since the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, the light guide member 390 can be easily focused on the sensor unit 80 (sensor main body 82). .
  • alignment between the light guide member 390 and the sensor unit 80 can be performed simultaneously with the mounting of the light guide member 390. Thereby, the sensitivity fall of sensor part 80 by the focus shift of light guide member 390 can be controlled.
  • the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), so it is possible to reduce the breakage of the globe 30.
  • the globe 30 may be broken when the light guide member 90 is fixed to the globe 30.
  • the glove 30 made of a polycarbonate material is easily broken, when the light guide member 90 is fixed to the glove 30, the crack of the glove 30 tends to occur.
  • the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), the globe 30 is broken when the light guide member 390 is mounted. Can be reduced.
  • the light guide member 390 preferably contains a thermally conductive substance.
  • the thermal conductivity of the entire light guide member 390 be larger than the thermal conductivity of the mounting substrate 81 of the sensor unit 80.
  • the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, but may be fixed to the sensor main body 82.
  • FIG. 6 is a cross-sectional view of an illumination light source according to Embodiment 4 of the present invention.
  • the same members as in the third embodiment are assigned the same reference numerals as in the first embodiment.
  • the illumination light source 4 according to the present embodiment is the illumination light source 3 according to the third embodiment further provided with a heat dissipation member 490.
  • the heat radiating member 490 is a member for radiating heat of the sensor unit 80, and is provided between the light guide member 390 and the sensor unit 80.
  • the heat dissipating member 490 can be made of a translucent material containing a heat conductive material, and in the present embodiment, the light guide member 390 and the sensor unit 80 are made of a transparent resin containing a heat conductive material. It is composed by filling in between.
  • a translucent material polyethylene can be used, for example.
  • the heat conductive substance a material having a heat conductivity higher than that of the light transmitting material may be used.
  • the heat dissipating member 490 is configured such that light (infrared ray) is condensed on the sensor unit 80 by the heat dissipating member 490 together with the light guide member 390. That is, the heat dissipation member 490 also functions as a light guide member.
  • the illumination light source 4 configured in this manner operates in the same manner as the illumination light source 3 according to the third embodiment. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80, the illumination light source 4 (light emitting module 10) is automatically turned on, and when a person leaves the illumination area, the person The light source for illumination 4 (light emitting module 10) is automatically turned off after a predetermined time has elapsed since the detection of the absence of a person by the sensor.
  • the same effects as those of the third embodiment can be obtained. That is, according to the present embodiment, the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate), and are arranged so as not to be in contact with each other. As a result, the output of the sensor unit 80 can be prevented from fluctuating due to heat, and the malfunction of the illumination light source 4 can be reduced. Moreover, since the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, it is possible to reduce the defocus of the light guide member 290 with respect to the sensor unit 80 (sensor main body 82). It is possible to suppress the decrease in sensitivity of the main body 82). In addition, since the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), it is possible to reduce the breakage of the globe 30.
  • the heat dissipation member 490 is provided between the sensor unit 80 and the light guide member 390, the heat of the circuit unit 40 conducted to the mounting substrate 81 of the sensor unit 80 is the heat dissipation member 490. Can be actively dissipated to the outside (in the atmosphere) of the illumination light source 1. Therefore, the sensor unit 80 is more difficult to receive the heat from the circuit unit 40, so that the output of the sensor unit 80 can be suppressed from being fluctuated by the heat.
  • the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, but may be fixed to the sensor main body 82. Further, the present embodiment can be applied to the first and second embodiments.
  • the light guide members are used in the above embodiments, the light source for illumination may be configured without providing the light guide members.
  • a part of insulation case 50 was used as a partition plate which divides sensor part 80 and circuit unit 40 spatially, it does not restrict to this.
  • a partition plate may be provided between the sensor unit 80 and the circuit unit 40.
  • the partition plate is preferably made of an insulating material having a low thermal conductivity.
  • the sensor unit 80 may be other than the insulating case 50 if the sensor unit 80 and the circuit unit 40 are disposed so as not to contact each other. You may place it in a place.
  • the sensor unit 80 may be fixed to the housing 60, or the sensor unit 80 may be disposed between the circuit unit 40 and the housing 60.
  • the light guide member may be appropriately provided according to the arrangement place of the sensor unit 80.
  • the present invention can also be applied to a surface mounted device (SMD) type or the like, which is a structure in which an LED element obtained by packaging an LED chip is mounted on a mounting substrate.
  • SMD surface mounted device
  • the present invention can also be realized as an illumination device provided with the above illumination light source.
  • the illumination device 100 may be configured to include the illumination light source 1 described above and a lighting fixture (light fixture) 110 to which the illumination light source 1 is attached. Good.
  • the lighting fixture 110 turns off and lights the illumination light source 1 and includes, for example, an appliance main body 111 attached to a ceiling, and a lamp cover 112 covering the illumination light source 1.
  • the fixture body 111 includes a socket 111 a to which the base 70 of the illumination light source 1 is attached and which supplies power to the illumination light source 1.
  • a translucent plate may be provided at the opening of the lamp cover 112.
  • the present invention is useful as a light bulb-shaped LED lamp or the like to replace a conventional incandescent light bulb or the like, and can be widely used in a lighting device or the like.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)

Abstract

In an illuminating light source (1), an envelope is configured of a globe (30), a housing (60) and a fitting (70). The illuminating light source is provided with: a sensor section (80); a light emitting module (10), which emits light on the basis of detection signals transmitted from the sensor section (80); a circuit unit (40) for supplying power to the light emitting module (10); and a partitioning plate (insulating case (50)), which is positioned between the sensor section (80) and the circuit unit (40). The sensor section (80) and the circuit unit (40) are spatially separated from each other by means of the partitioning plate.

Description

照明用光源Lighting light source
 本発明は、発光ダイオード(LED:Light Emitting Diode)等の発光素子を備える照明用光源に関し、特に、人感センサ等のセンサを備える電球形LEDランプに関する。 The present invention relates to an illumination light source including a light emitting element such as a light emitting diode (LED), and more particularly to a bulb-shaped LED lamp including a sensor such as a human sensor.
 LEDは、高効率で省スペースな光源としてランプ等に用いられている。中でも、LEDを用いたLEDランプは、従来から知られる蛍光灯や白熱電球の代替照明用光源として注目されている。 LEDs are used in lamps and the like as highly efficient and space-saving light sources. Among them, LED lamps using LEDs are attracting attention as alternative light sources for fluorescent lamps and incandescent lamps conventionally known.
 一方、従来より、人感センサ付きの照明装置が知られている。このような人感センサ付きの照明装置では、ランプ(照明用光源)が取り付けられる照明器具に人感センサが設けられており、人感センサで人を検知することでランプが点灯する。例えば、照明エリアに人が入ってくると、人感センサにより人の存在を検知して自動的にランプが点灯し、照明エリアから人が出ていくと、人感センサにより人の不在を検知してから一定時間経過後に自動的にランプが消灯する。 On the other hand, conventionally, a lighting device with a human sensor has been known. In such a lighting device with a human sensor, a human sensor is provided in a luminaire to which a lamp (light source for illumination) is attached, and the lamp is turned on by detecting a human with the human sensor. For example, when a person enters the lighting area, the presence of the person is detected by the human sensor and the lamp is automatically turned on. When the person goes out of the lighting area, the absence of the person is detected by the human sensor. The lamp will turn off automatically after a certain period of time.
 近年、人感センサを内蔵する電球形LEDランプも提案されており、例えば特許文献1には、人感センサを備える電球形LEDランプが開示されている。 In recent years, a bulb-shaped LED lamp incorporating a human sensor has also been proposed. For example, Patent Document 1 discloses a bulb-shaped LED lamp including a human sensor.
特開2011-228151号公報JP, 2011-228151, A
 LEDランプは、LEDを発光させるための電源回路を有しており、点灯時に電源回路から熱が発生する。このため、人感センサを備えるLEDランプでは、電源回路からの熱によって人感センサの出力が変動し、誤動作する場合があるという問題がある。 The LED lamp has a power supply circuit for causing the LED to emit light, and heat is generated from the power supply circuit at the time of lighting. For this reason, in the LED lamp provided with the human sensor, there is a problem that the heat from the power supply circuit may cause the output of the human sensor to fluctuate and cause a malfunction.
 本発明は、上記問題点に鑑みてなされたものであり、熱によるセンサ部の出力変動を抑制することができる照明用光源を提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination light source capable of suppressing output fluctuation of a sensor unit due to heat.
 上記課題を解決するために、本発明に係る照明用光源の一態様は、グローブと筐体と口金とで外囲器を構成する照明用光源であって、センサ部と、前記センサ部からの検知信号に基づいて発光する発光部と、前記発光部に電力を供給するための電源回路部と、前記センサ部と前記電源回路部との間に位置する仕切り板とを備え、前記仕切り板によって前記センサ部と前記電源回路部とが空間的に隔てられていることを特徴とする。 In order to solve the above problems, one aspect of the illumination light source according to the present invention is an illumination light source that constitutes an envelope with a globe, a housing, and a base, and includes a sensor unit and the sensor unit. A light emitting unit that emits light based on a detection signal, a power supply circuit unit for supplying power to the light emitting unit, and a partition plate positioned between the sensor unit and the power supply circuit unit The sensor unit and the power supply circuit unit are spatially separated.
 また、本発明に係る照明用光源の一態様において、さらに、前記外囲器内に設けられ、前記電源回路部を収容する絶縁ケースを備え、前記仕切り板は、前記絶縁ケースの一部であり、前記センサ部は、前記絶縁ケースの外側面に固定されていることが好ましい。 In one aspect of the illumination light source according to the present invention, the light source further includes an insulating case provided in the envelope and housing the power supply circuit portion, and the partition plate is a part of the insulating case. Preferably, the sensor unit is fixed to an outer side surface of the insulating case.
 さらに、本発明に係る照明用光源の一態様において、前記絶縁ケースの一部は、前記グローブ内に位置しており、前記センサ部は、前記グローブ内に位置する前記絶縁ケースの一部に固定されていることが好ましい。 Furthermore, in one aspect of the illumination light source according to the present invention, a part of the insulating case is located in the glove, and the sensor unit is fixed to a part of the insulating case located in the glove Is preferred.
 さらに、本発明に係る照明用光源の一態様において、前記発光部は、前記グローブ内に位置する前記絶縁ケースの一部を囲むように設けられていることが好ましい。 Furthermore, in one aspect of the illumination light source according to the present invention, it is preferable that the light emitting unit is provided so as to surround a part of the insulating case located in the glove.
 また、本発明に係る照明用光源の一態様において、さらに、前記センサ部に光を導く導光部材を備え、前記導光部材は、前記センサ部に固定されていてもよい。 In one aspect of the illumination light source according to the present invention, the light guide member may further include a light guide member that guides light to the sensor unit, and the light guide member may be fixed to the sensor unit.
 さらに、本発明に係る照明用光源の一態様において、前記センサ部は、実装基板と、前記実装基板に実装されたセンサ本体とを有し、前記導光部材は、前記実装基板に固定されていることが好ましい。 Furthermore, in one aspect of the illumination light source according to the present invention, the sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate, and the light guide member is fixed to the mounting substrate. Is preferred.
 あるいは、本発明に係る照明用光源の一態様において、前記センサ部は、実装基板と、前記実装基板に実装されたセンサ本体とを有し、前記導光部材は、前記センサ本体に固定されてもよい。 Alternatively, in one aspect of the illumination light source according to the present invention, the sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate, and the light guide member is fixed to the sensor main body It is also good.
 さらに、本発明に係る照明用光源の一態様において、前記導光部材は、熱導電性物質が含有された透光性材料からなることが好ましい。 Furthermore, in one aspect of the illumination light source according to the present invention, the light guide member is preferably made of a translucent material containing a thermally conductive substance.
 さらに、本発明に係る照明用光源の一態様において、前記透光性材料は、ポリエチレンであることが好ましい。 Furthermore, in one aspect of the illumination light source according to the present invention, the translucent material is preferably polyethylene.
 また、本発明に係る照明用光源の一態様において、さらに、前記導光部材と前記センサ部との間に充填された放熱部材を備えることが好ましい。 Further, in one aspect of the illumination light source according to the present invention, it is preferable to further include a heat dissipation member filled between the light guide member and the sensor unit.
 さらに、本発明に係る照明用光源の一態様において、前記導光部材は、フレネルレンズであることが好ましい。 Furthermore, in one aspect of the illumination light source according to the present invention, the light guide member is preferably a Fresnel lens.
 本発明によれば、センサ部が電源回路からの熱を受けにくくなるので、熱によってセンサ部の出力が変動してしまうことを抑制することができる。これにより、照明用光源が誤動作することを軽減することができる。 According to the present invention, the sensor unit is less likely to receive the heat from the power supply circuit, so it is possible to suppress the fluctuation of the output of the sensor unit due to the heat. As a result, malfunction of the illumination light source can be reduced.
図1は、本発明の実施の形態1に係る照明用光源の一部切り欠き斜視図である。FIG. 1 is a partially cutaway perspective view of the illumination light source according to Embodiment 1 of the present invention. 図2は、本発明の実施の形態1に係る照明用光源の断面図である。FIG. 2 is a cross-sectional view of the illumination light source according to Embodiment 1 of the present invention. 図3は、本発明の実施の形態1に係る照明用光源の上面図である。FIG. 3 is a top view of the illumination light source according to Embodiment 1 of the present invention. 図4は、本発明の実施の形態2に係る照明用光源の断面図である。FIG. 4 is a cross-sectional view of an illumination light source according to Embodiment 2 of the present invention. 図5は、本発明の実施の形態3に係る照明用光源の断面図である。FIG. 5 is a cross-sectional view of an illumination light source according to Embodiment 3 of the present invention. 図6は、本発明の実施の形態4に係る照明用光源の断面図である。FIG. 6 is a cross-sectional view of an illumination light source according to Embodiment 4 of the present invention. 図7は、本発明に係る照明装置の概略断面図である。FIG. 7 is a schematic cross-sectional view of a lighting device according to the present invention.
 以下、本発明の実施の形態に係る照明用光源について、図面を参照しながら説明する。なお、以下に説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。したがって、以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態などは、一例であって本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。なお、各図は、模式図であり、必ずしも厳密に図示したものではない。 Hereinafter, a light source for illumination according to an embodiment of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferable specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of the components, and the like described in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims indicating the highest concept of the present invention are described as optional components. Each figure is a schematic view and is not necessarily strictly illustrated.
 (実施の形態1)
 まず、本発明の実施の形態1に係る照明用光源の構成について、図1、図2及び図3を用いて説明する。図1は、本発明の実施の形態1に係る照明用光源の一部切り欠き斜視図である。図2は、本発明の実施の形態1に係る照明用光源の断面図である。図3は、本発明の実施の形態1に係る照明用光源の上面図(グローブを透過して見たときの図)である。
Embodiment 1
First, the configuration of the illumination light source according to the first embodiment of the present invention will be described with reference to FIGS. 1, 2 and 3. FIG. FIG. 1 is a partially cutaway perspective view of the illumination light source according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of the illumination light source according to Embodiment 1 of the present invention. FIG. 3 is a top view of the illumination light source according to Embodiment 1 of the present invention (as viewed through a globe).
 なお、図1及び図2において、紙面上方が照明用光源の前方であり、紙面下方が照明用光源の後方である。ここで、本明細書において、「前方」とは、照明用光源の上端(グローブの頂部)と照明用光源の下端(口金の頂部)との中点を照明用光源の中心とすると、当該中心から見てグローブ側の方向のことであり、「後方」とは、照明用光源の中心から見て口金側の方向のことである。また、図2において、紙面上下方向に沿って描かれた一点鎖線は照明用光源のランプ軸J(中心軸)を示しており、本実施の形態において、ランプ軸Jとグローブ軸とは一致している。また、ランプ軸Jとは、照明用光源1を照明装置(不図示)のソケットに取り付ける際の回転中心となる軸であり、口金70の回転軸と一致している。 1 and 2, the upper side of the drawing is the front of the illumination light source, and the lower side of the drawing is the rear of the illumination light source. Here, in the present specification, “in front” means the center of the illumination light source, assuming that the middle point between the upper end of the illumination light source (the top of the globe) and the lower end of the illumination light source (the top of the base) is the illumination light source. When viewed from the direction of the glove side, "backward" means the direction of the nozzle side as viewed from the center of the light source for illumination. Further, in FIG. 2, the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J (central axis) of the light source for illumination, and in the present embodiment, the lamp axis J and the globe axis coincide. ing. Further, the lamp axis J is an axis serving as a rotation center when attaching the illumination light source 1 to a socket of the illumination device (not shown), and coincides with the rotation axis of the base 70.
 図1及び図2に示すように、本実施の形態に係る照明用光源1は、電球形蛍光灯又は白熱電球の代替品となる電球形LEDランプであって、光源としての発光モジュール10と、発光モジュール10を搭載する基台20と、発光モジュール10を覆うグローブ30と、発光モジュール10を点灯させるための回路ユニット(電源回路部)40と、回路ユニット40を収容する絶縁ケース50と、絶縁ケース50を覆う筐体60と、回路ユニット40と電気的に接続された口金70と、人の有無を検知するセンサ部80と、センサ部80に光を導く導光部材90とを備える。 As shown in FIGS. 1 and 2, the illumination light source 1 according to the present embodiment is a bulb-shaped LED lamp which is a substitute for a bulb-shaped fluorescent lamp or an incandescent lamp, and includes a light emitting module 10 as a light source; A base 20 on which the light emitting module 10 is mounted, a globe 30 covering the light emitting module 10, a circuit unit (power supply circuit unit) 40 for lighting the light emitting module 10, an insulating case 50 for accommodating the circuit unit 40, and insulation A case 60 covering the case 50, a base 70 electrically connected to the circuit unit 40, a sensor unit 80 for detecting the presence or absence of a person, and a light guide member 90 for guiding light to the sensor unit 80 are provided.
 照明用光源1において、絶縁ケース50は、センサ部80と回路ユニット40との間に位置する仕切り板として機能し、センサ部80と回路ユニット40とは絶縁ケース50(仕切り板)によって空間的に隔てられている。 In the illumination light source 1, the insulating case 50 functions as a partition plate located between the sensor unit 80 and the circuit unit 40, and the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate) It is separated.
 照明用光源1は、グローブ30と筐体60と口金70とによって外囲器が構成されており、当該外囲器内には、発光モジュール10、基台20、回路ユニット40及び絶縁ケース50が収容されている。また、本実施の形態では、センサ部80も外囲器内に収容されている。 The illumination light source 1 includes an envelope constituted by a globe 30, a housing 60 and a base 70, and the light emitting module 10, the base 20, the circuit unit 40 and the insulating case 50 are provided in the envelope. It is housed. Further, in the present embodiment, the sensor unit 80 is also accommodated in the envelope.
 このように、照明用光源1は、センサ部80を内蔵するセンサ内蔵型の電球形LEDランプであり、本実施の形態に係る照明用光源1では、センサ部80及び回路ユニット40は、互いに接触しないように配置されている。 Thus, the illumination light source 1 is a sensor-incorporated bulb-shaped LED lamp incorporating the sensor unit 80, and in the illumination light source 1 according to the present embodiment, the sensor unit 80 and the circuit unit 40 contact each other It is arranged not to.
 以下、照明用光源1の各構成部材について、図1、図2及び図3を用いて詳細に説明する。 Hereinafter, each component of the illumination light source 1 will be described in detail with reference to FIGS. 1, 2 and 3.
 [発光モジュール]
 発光モジュール10は、例えば所定の光を放出するLEDモジュールであって、グローブ30の内方に配置されている。発光モジュール10は、センサ部80からの検知信号に基づいて発光する。
[Light emitting module]
The light emitting module 10 is, for example, an LED module that emits predetermined light, and is disposed inward of the globe 30. The light emitting module 10 emits light based on the detection signal from the sensor unit 80.
 図2及び図3に示すように、本実施の形態における発光モジュール10は、実装基板11と、実装基板11に実装された複数の半導体発光素子12と、それらの半導体発光素子12を被覆するように実装基板11上に設けられた封止体13とを備える。 As shown in FIGS. 2 and 3, the light emitting module 10 according to the present embodiment covers the mounting substrate 11, the plurality of semiconductor light emitting elements 12 mounted on the mounting substrate 11, and the semiconductor light emitting elements 12 thereof. And the sealing body 13 provided on the mounting substrate 11.
 実装基板11は、例えば、アルミナ等からなるセラミックス基板である。本実施の形態における実装基板11は、中央に略円形の孔部を有する略円環状の基板であり、孔部の内周縁の一箇所から孔部の中心へ向けて延設された舌片部14を有する。 The mounting substrate 11 is, for example, a ceramic substrate made of alumina or the like. The mounting substrate 11 in the present embodiment is a substantially annular substrate having a substantially circular hole at the center, and a tongue piece extended from one point on the inner peripheral edge of the hole toward the center of the hole. Have fourteen.
 舌片部14の前方面には、回路ユニット40の電気配線40a及び40bが接続されるコネクタ15が設けられており、電気配線40a及び40bをコネクタ15に接続することによって発光モジュール10と回路ユニット40とが電気的に接続される。そして、回路ユニット40から直流電力が供給されることによって半導体発光素子12が発光する。 The connector 15 to which the electrical wires 40a and 40b of the circuit unit 40 are connected is provided on the front surface of the tongue piece 14. The light emitting module 10 and the circuit unit are connected by connecting the electrical wires 40a and 40b to the connector 15. And 40 are electrically connected. Then, when the direct current power is supplied from the circuit unit 40, the semiconductor light emitting element 12 emits light.
 半導体発光素子12は、例えばLED(LEDチップ)であり、実装基板11の片面上に複数個実装されている。複数の半導体発光素子12の各々は、主出射方向が照明用光源の前方に向けた姿勢で実装されている。なお、半導体発光素子12としては、LED以外でもよく、例えば、半導体レーザ、有機EL素子又は無機EL素子を用いてもよい。 The semiconductor light emitting elements 12 are, for example, LEDs (LED chips), and a plurality of the semiconductor light emitting elements 12 are mounted on one surface of the mounting substrate 11. Each of the plurality of semiconductor light emitting elements 12 is mounted in a posture in which the main emission direction is in front of the illumination light source. The semiconductor light emitting element 12 may be other than the LED, and for example, a semiconductor laser, an organic EL element or an inorganic EL element may be used.
 半導体発光素子12は、絶縁ケース50を囲むように設けられており、本実施の形態では、図3に示すように、例えば32個のLEDチップが実装基板11の前方面に環状に実装されている。より具体的には、実装基板11の径方向に沿って並べられた半導体発光素子12を2個1組として、16組が実装基板11の周方向に沿って等間隔を空けて円環状に配置されている。半導体発光素子12は、1組ごと個別に略直方体形状の封止体13によって封止されている。したがって、本実施の形態において、封止体13は全部で16個である。各封止体13の長手方向は、実装基板11の径方向と一致しており、前方側からランプ軸Jに沿って見た場合において(平面視において)、ランプ軸Jを中心として放射状に配置されている。 The semiconductor light emitting element 12 is provided to surround the insulating case 50, and in the present embodiment, for example, 32 LED chips are annularly mounted on the front surface of the mounting substrate 11 as shown in FIG. There is. More specifically, 16 sets of the semiconductor light emitting elements 12 arranged along the radial direction of the mounting substrate 11 are annularly arranged at equal intervals along the circumferential direction of the mounting substrate 11 as a set of two. It is done. The semiconductor light emitting elements 12 are individually sealed by a substantially rectangular parallelepiped sealing body 13 for each set. Therefore, in the present embodiment, the number of sealing bodies 13 is 16 in all. The longitudinal direction of each sealing body 13 coincides with the radial direction of the mounting substrate 11, and when viewed along the lamp axis J from the front side (in plan view), arranged radially about the lamp axis J It is done.
 なお、半導体発光素子12の数は複数に限らず1個であってもよい。また、半導体発光素子12の姿勢は、半導体発光素子12の全てがランプ軸J方向に沿った方向に向いている必要はなく、一部がランプ軸Jに対して斜めに傾いた方向に向けた姿勢で実装されていてもよい。これによりランプの配光角の制御性が向上するので、より好ましい配光特性となるように微調整することができる。 The number of semiconductor light emitting elements 12 is not limited to a plurality, and may be one. Further, the attitude of the semiconductor light emitting device 12 does not have to be such that all the semiconductor light emitting devices 12 are directed in the direction along the lamp axis J, and a portion is directed in a direction obliquely inclined to the lamp axis J It may be implemented in attitude. As a result, the controllability of the light distribution angle of the lamp is improved, so fine adjustment can be made to obtain more preferable light distribution characteristics.
 封止体13は、主として透光性材料からなるが、半導体発光素子12から発せられた光の波長を所定の波長へと変換する必要がある場合には、光の波長を変換するための波長変換材料が前記透光性材料に混入される。透光性材料としては、例えばシリコーン樹脂を利用することができる。また、波長変換材料としては、例えば蛍光体粒子を利用することができる。これにより、封止体13を蛍光体含有樹脂として構成することができる。 The sealing body 13 is mainly made of a translucent material, but if it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength for converting the wavelength of light A conversion material is incorporated into the translucent material. As a translucent material, silicone resin can be utilized, for example. Moreover, as a wavelength conversion material, fluorescent substance particle can be utilized, for example. Thereby, the sealing body 13 can be comprised as fluorescent substance containing resin.
 本実施の形態において、半導体発光素子12としては、青色光を出射する青色LEDを用いており、封止体13としては、青色光を黄色光に波長変換する蛍光体粒子と当該蛍光体粒子が混入される透光性樹脂材料とを用いている。これにより、半導体発光素子12から出射された青色光の一部が封止体13によって黄色光に波長変換され、当該波長変換された黄色光と変換されない青色光との混色により生成される白色光が発光モジュール10から放射される。 In the present embodiment, a blue LED emitting blue light is used as the semiconductor light emitting element 12, and as the sealing body 13, phosphor particles for converting blue light into yellow light and the phosphor particles are used. The translucent resin material mixed is used. Thereby, a part of the blue light emitted from the semiconductor light emitting element 12 is wavelength-converted to yellow light by the sealing body 13, and white light generated by mixing the wavelength-converted yellow light and the blue light not converted. Are emitted from the light emitting module 10.
 なお、発光モジュール10としては、例えば、紫外線発光の半導体発光素子と三原色(赤色、緑色、青色)に発光する各色蛍光体粒子とを組み合わせたものでもよい。さらに、波長変換材料として、半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を利用してもよい。 The light emitting module 10 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and phosphor particles of each color that emits light in three primary colors (red, green, and blue). Furthermore, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
 [基台]
 基台20は、発光モジュール10を載置するための光源取り付け部材である。発光モジュール10は、基台20の前方面に配置されて、例えば、止め金具、ねじ、接着などにより基台20に固定されている。
[Base]
The base 20 is a light source attaching member for mounting the light emitting module 10. The light emitting module 10 is disposed on the front surface of the base 20 and is fixed to the base 20 by, for example, fasteners, screws, adhesion, and the like.
 本実施の形態における基台20は、貫通孔20aを有する略薄円筒状であり、その筒軸がランプ軸Jと一致する姿勢で配置されている。そして、基台20の前方面には発光モジュール10が、各半導体発光素子12がそれぞれの主出射方向を前方に向いた状態で搭載されている。基台20に貫通孔20aが設けられているため、照明用光源1を軽量化することができる。また、貫通孔20a内と、貫通孔20aを介してグローブ30内とに、回路ユニット40の一部が配置されているため、照明用光源1を小型化することができる。 The base 20 in the present embodiment has a substantially thin cylindrical shape having a through hole 20a, and the cylinder axis of the base 20 is disposed in a posture in which it coincides with the lamp axis J. The light emitting module 10 is mounted on the front surface of the base 20 with the semiconductor light emitting elements 12 facing forward in the main emission direction. Since the through holes 20a are provided in the base 20, the weight of the illumination light source 1 can be reduced. Moreover, since a part of the circuit unit 40 is disposed in the through hole 20a and in the globe 30 via the through hole 20a, the illumination light source 1 can be miniaturized.
 また、本実施の形態における基台20は、例えば金属材料によって構成されている。金属材料としては、例えばAl、Ag、Au、Ni、Rh、Pd、あるいは、これらのうちの2以上からなる合金、又はCuとAgとの合金などが考えられる。このような金属材料は、熱伝導性が良好であるため、発光モジュール10で発生した熱を筐体60に効率良く伝導させることができる。例えば、基台20は、アルミダイキャストによって成型された略円板状の金属基板とすることができる。このように、基台20を金属材料によって構成することにより、基台20を、発光モジュール10から発生する熱を筐体60に伝導させるための放熱体として機能させることもできる。 Further, the base 20 in the present embodiment is made of, for example, a metal material. As the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered. Such a metal material has good thermal conductivity, so that the heat generated by the light emitting module 10 can be efficiently conducted to the housing 60. For example, the base 20 can be a substantially disc-shaped metal substrate molded by aluminum die casting. Thus, the base 20 can be functioned as a heat dissipation body for conducting the heat generated from the light emitting module 10 to the housing 60 by forming the base 20 with a metal material.
 [グローブ]
 グローブ30は、発光モジュール10から放出される光をランプ外部に放射させるための半球状の透光性カバーである。また、発光モジュール10、センサ部80及び絶縁ケース50の一部は、このグローブ30によって覆われている。グローブ30の内面に入射した発光モジュール10の光は、グローブ30を透過してグローブ30の外部へと取り出される。
[Globe]
The globe 30 is a hemispherical translucent cover for emitting the light emitted from the light emitting module 10 to the outside of the lamp. The light emitting module 10, the sensor unit 80 and a part of the insulating case 50 are covered by the globe 30. The light of the light emitting module 10 incident on the inner surface of the globe 30 is transmitted through the globe 30 and taken out of the globe 30.
 本実施の形態におけるグローブ30は、開口側(口金側)が絞られた形状となっており、例えば、一般電球形状であるA型の電球のバルブを模した形状のものを用いることができる。また、グローブ30は、その開口側端部が基台20と筐体60とに挟まれるようにして配置されている。本実施の形態において、グローブ30は、その開口側端部が筐体60のグローブ側開口部内に圧入されることにより、発光モジュール10及びセンサ部80を覆った状態で、筐体60のグローブ側開口部に取り付けられている。 The glove 30 in the present embodiment has a shape in which the opening side (cap base side) is narrowed, and for example, a shape that simulates a bulb of A-type bulb which is a general bulb shape can be used. Further, the glove 30 is disposed so that the opening side end thereof is sandwiched between the base 20 and the housing 60. In the present embodiment, the globe 30 has the light emitting module 10 and the sensor unit 80 covered by the press-in end of the glove 30 pressed into the glove-side opening of the housing 60. It is attached to the opening.
 また、グローブ30には、発光モジュール10から放出される光を拡散させるための拡散処理が施されていることが好ましい。例えば、グローブ30の内面又は外面に光拡散膜(光拡散層)を形成することでグローブ30に光拡散機能を持たせることができる。具体的には、シリカや炭酸カルシウム等の光拡散材を含有する樹脂や白色顔料等をグローブ30の内面又は外面の全面に塗布することによって光拡散膜を形成することができる。あるいは、グローブ30に光拡散ドットを形成することによって、グローブ30に光拡散機能を持たせることもできる。例えば、樹脂製のグローブ30の表面を加工することによって、複数のドットを形成したり、微小な窪み(ディンプル)を形成したりすることで、グローブ30に光拡散機能を持たせることができる。また、グローブ30にシボ加工を施すことによっても光拡散機能を持たせることができる。 In addition, it is preferable that the globe 30 be subjected to a diffusion process for diffusing the light emitted from the light emitting module 10. For example, by forming a light diffusion film (light diffusion layer) on the inner surface or the outer surface of the globe 30, the globe 30 can have a light diffusion function. Specifically, the light diffusion film can be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the globe 30. Alternatively, the light diffusion function can be given to the globe 30 by forming the light diffusion dots on the globe 30. For example, by processing the surface of the globe 30 made of resin, the globe 30 can have a light diffusing function by forming a plurality of dots or forming a minute dimple (dimple). The light diffusion function can also be provided by embossing the glove 30.
 このように、グローブ30に光拡散機能を持たせることにより、発光モジュール10からグローブ30に入射する光を拡散させることができるので、照明用光源の配光角を広くすることができる。 As described above, by providing the globe 30 with the light diffusing function, it is possible to diffuse the light entering the globe 30 from the light emitting module 10, so that the light distribution angle of the illumination light source can be widened.
 なお、本実施の形態において、A型の電球のバルブを模した形状に限定されず、どのような形状であってもよい。例えば、グローブ30の形状としては、回転楕円体又は偏球体であっても構わない。また、グローブ30の材質としては、ガラス材又は合成樹脂等の樹脂材を用いることができ、本実施の形態では、ポリカーボネートによってグローブ30を形成している。 In addition, in this Embodiment, it is not limited to the shape which imitated the bulb | bulb of a A-type light bulb, What kind of shape may be sufficient. For example, the shape of the globe 30 may be a spheroid or a spheroid. Moreover, as a material of the glove | globe 30, resin materials, such as a glass material or a synthetic resin, can be used, In this Embodiment, the glove | globe 30 is formed with the polycarbonate.
 [回路ユニット]
 回路ユニット40は、半導体発光素子12を点灯(発光)させるための点灯回路(電源回路)であって、回路基板41と、当該回路基板41に実装された複数の電子部品42とを有している。なお、図2では一部の電子部品にのみ符号を付している。回路ユニット40は、絶縁ケース50内に収容されており、例えば、ねじ止め、接着又は係合などにより絶縁ケース50に固定されている。
[Circuit unit]
The circuit unit 40 is a lighting circuit (power supply circuit) for lighting (emitting) the semiconductor light emitting element 12, and includes a circuit board 41 and a plurality of electronic components 42 mounted on the circuit board 41. There is. In FIG. 2, only some electronic components are denoted by reference numerals. The circuit unit 40 is accommodated in the insulating case 50 and fixed to the insulating case 50 by, for example, screwing, bonding or engagement.
 回路基板41は、その主面がランプ軸Jと平行する姿勢で配置されている。このようにすれば、絶縁ケース50内に回路ユニット40をよりコンパクトに格納することができる。また、回路ユニット40では、熱に弱い電子部品が発光モジュール10から遠い位置となるように配置され、一方、熱に強い電子部品が発光モジュール10に近い位置となるように配置されている。このようにすれば、熱に弱い電子部品が発光モジュール10で発生する熱によって熱破壊されることを軽減することができる。 The circuit board 41 is disposed such that its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored more compactly in the insulating case 50. Further, in the circuit unit 40, the heat-sensitive electronic component is disposed at a position far from the light emitting module 10, while the heat-resistant electronic component is disposed at a position near the light emitting module 10. In this way, it is possible to reduce the heat destruction of the heat-sensitive electronic component by the heat generated in the light emitting module 10.
 回路ユニット40と口金70とは、電気配線(リード線)40c及び40dによって電気的に接続されている。電気配線40cは、絶縁ケース50に設けられた貫通孔50aを通って、口金70のシェル部71と接続されている。電気配線40dは、絶縁ケース50の口金側の開口を通って、口金70のアイレット部73と接続されている。 The circuit unit 40 and the base 70 are electrically connected by electrical wires (leads) 40c and 40d. The electrical wiring 40 c is connected to the shell portion 71 of the base 70 through the through hole 50 a provided in the insulating case 50. The electrical wiring 40 d is connected to the eyelet portion 73 of the base 70 through the opening on the base side of the insulating case 50.
 また、回路ユニット40とセンサ部80とは、電気配線(リード線)40eによって電気的に接続されている。 The circuit unit 40 and the sensor unit 80 are electrically connected by an electrical wiring (lead wire) 40 e.
 [絶縁ケース]
 絶縁ケース50は、回路ユニット40を収納して保持するための回路ホルダであり、本実施の形態において、絶縁ケース50の一部は、センサ部80と回路ユニット40との間に位置する仕切り板となる。具体的には、後述するように、絶縁ケース50の第3ケース部53の板状の天面部が仕切り板となる。
[Insulation case]
The insulating case 50 is a circuit holder for housing and holding the circuit unit 40, and in the present embodiment, a part of the insulating case 50 is a partition plate positioned between the sensor unit 80 and the circuit unit 40. It becomes. Specifically, as described later, the plate-like top surface portion of the third case portion 53 of the insulating case 50 serves as a partition plate.
 絶縁ケース50は、例えば、樹脂などの絶縁性材料で形成されていることが好ましい。また、絶縁ケース50は、センサ部80と回路ユニット40との間の熱的な仕切り板として機能させることが好ましく、熱伝導率の低い材料で構成することよい。本実施の形態において、絶縁ケース50は、熱伝導率が0.18~0.29(W/m・℃)程度のポリブチレンテレフタレート(PBT)によって構成されている。 The insulating case 50 is preferably made of, for example, an insulating material such as a resin. Further, the insulating case 50 preferably functions as a thermal partition plate between the sensor unit 80 and the circuit unit 40, and may be made of a material having a low thermal conductivity. In the present embodiment, the insulating case 50 is made of polybutylene terephthalate (PBT) having a thermal conductivity of about 0.18 to 0.29 (W / m · ° C.).
 なお、絶縁ケース50の材料は、PBTに限るものではなく、ポリエチレンテレフタレート(PET)、LCP(液晶ポリマー)、非晶性熱可塑性ポリエーテルイミド(ULTEM樹脂)、又は、ポリイミド等、耐熱温度の高いものであれば、他の樹脂材料等を用いることができる。 The material of the insulating case 50 is not limited to PBT, and polyethylene terephthalate (PET), LCP (liquid crystal polymer), amorphous thermoplastic polyetherimide (ULTEM resin), polyimide, or the like has a high heat resistance temperature. If it is a thing, another resin material etc. can be used.
 また、本実施の形態における絶縁ケース50は、筒状の第1ケース部(大径部)51と、口金70と略同形状の筒状の第2ケース部(小径部)51と、グローブ側が閉塞し口金側が開口した有底筒状のキャップ部材である第3ケース部53とによって構成されている。 Moreover, the insulating case 50 in the present embodiment has a cylindrical first case portion (large diameter portion) 51, a cylindrical second case portion (small diameter portion) 51 having substantially the same shape as the mouthpiece 70, and a glove side. It is comprised by the 3rd case part 53 which is a closed bottomed cylindrical cap member which closed and opened the mouthpiece side.
 第1ケース部51は、筐体60内に収容され、基台20の貫通孔20aを貫通するように構成されている。第2ケース部52は、第1ケース部51の口金側に設けられており、第2ケース部52には口金70が外嵌されている。これによって絶縁ケース50の口金側の開口が塞がれている。 The first case portion 51 is housed in the housing 60 and configured to penetrate the through hole 20 a of the base 20. The second case portion 52 is provided on the base side of the first case portion 51, and the base 70 is externally fitted to the second case portion 52. Thus, the opening on the base side of the insulating case 50 is closed.
 第3ケース部53は、グローブ30内に収容され、第1ケース部51のグローブ側端部に設けられている。第3ケース部53は、グローブ側へ向かって漸次縮径した第1キャップ部と、上下方向に径が均一な円筒状の第2キャップ部とで構成されている。 The third case portion 53 is housed in the glove 30 and provided at the glove side end of the first case portion 51. The third case portion 53 is configured of a first cap portion whose diameter is gradually reduced toward the glove side, and a cylindrical second cap portion whose diameter is uniform in the vertical direction.
 第3ケース部53における第1キャップ部の天面部(底部)は、円形の板状に構成されており、センサ部80(実装基板81)と回路ユニット40との間に位置する仕切り板となる。この第3ケース部53(仕切り板)によってセンサ部80と回路ユニット40とが空間的に隔てられている。これにより、センサ部80と回路ユニット40とは、互いに接触しないように配置されることになる。 The top surface portion (bottom portion) of the first cap portion in the third case portion 53 is formed in a circular plate shape, and serves as a partition plate located between the sensor portion 80 (mounting substrate 81) and the circuit unit 40. . The sensor unit 80 and the circuit unit 40 are spatially separated by the third case 53 (partition plate). Thus, the sensor unit 80 and the circuit unit 40 are disposed so as not to contact each other.
 また、第3ケース部53の側周面は光反射面として機能させることができる。この場合、発光モジュール10からの光は第3ケース部53の側周面によって反射して、グローブ30の内面に到達する。このように、絶縁ケース50(第3ケース部53)は、照明用光源1の配光特性(配光角)を調整する部材として機能させることもできる。なお、第3ケース部53の反射性を向上させるために、第3ケース部53の表面に鏡面処理を施してもよい。 In addition, the side circumferential surface of the third case portion 53 can function as a light reflecting surface. In this case, the light from the light emitting module 10 is reflected by the side peripheral surface of the third case portion 53 and reaches the inner surface of the globe 30. Thus, the insulating case 50 (third case portion 53) can also function as a member for adjusting the light distribution characteristic (light distribution angle) of the illumination light source 1. In order to improve the reflectivity of the third case portion 53, the surface of the third case portion 53 may be mirror-finished.
 絶縁ケース50には、発光モジュール10の舌片部14に対応した位置に貫通孔50bが設けられている。舌片部14の先端は、貫通孔50bを介して絶縁ケース50内に挿入されており、舌片部14に設けられたコネクタ15は、絶縁ケース50内に位置している。 A through hole 50 b is provided in the insulating case 50 at a position corresponding to the tongue piece 14 of the light emitting module 10. The tip of the tongue portion 14 is inserted into the insulating case 50 through the through hole 50 b, and the connector 15 provided on the tongue portion 14 is located in the insulating case 50.
 また、図2に示すように、絶縁ケース50と基台20とは接触しておらず、絶縁ケース50(第1ケース部51)の外面と基台20の貫通孔20aの周面との間には隙間が設けられている。したがって、発光モジュール10で発生した熱が絶縁ケース50に伝搬することを抑制することができる。これにより、絶縁ケース50の温度上昇を抑制することができるので、回路ユニット40が熱破壊されることを抑制できる。 Further, as shown in FIG. 2, the insulating case 50 and the base 20 are not in contact with each other, and between the outer surface of the insulating case 50 (first case portion 51) and the peripheral surface of the through hole 20 a of the base 20. There is a gap in the Therefore, the heat generated in the light emitting module 10 can be suppressed from propagating to the insulating case 50. Thereby, since the temperature rise of insulation case 50 can be suppressed, it can control that circuit unit 40 is thermally destroyed.
 [筐体]
 筐体60は、グローブ30と口金70との間に配置されている。筐体60は、両端が開口するケースであって、グローブ側から口金側へ向けて縮径した略円筒形状の略円錐台部材によって構成されている。
[Case]
The housing 60 is disposed between the glove 30 and the base 70. The housing 60 is a case which is open at both ends, and is formed of a substantially cylindrical truncated cone member of substantially cylindrical shape whose diameter is reduced from the glove side to the mouthpiece side.
 筐体60のグローブ側の開口(第1開口)内には、基台20とグローブ30の開口側端部とが収容されており、例えばカシメにより筐体60が基台20に固定されている。なお、筐体60、基台20及びグローブ30で囲まれた空間60aに接着剤を流し込むなどして筐体60を基台20に固着してもよい。 The base 20 and the opening side end of the glove 30 are accommodated in the opening (first opening) on the glove side of the housing 60, and the housing 60 is fixed to the base 20 by caulking, for example. . The housing 60 may be fixed to the base 20 by pouring an adhesive into a space 60 a surrounded by the housing 60, the base 20 and the globe 30.
 基台20の口金側端部の外周縁は、筐体60の内周面の形状にあわせてテーパ形状となっている。その基台20のテーパ面が筐体60の内周面と面接触しているため、発光モジュール10から基台20へ伝搬した熱が、さらに筐体60へ伝導し易くなっている。これにより、半導体発光素子12で発生した熱は、主に基台20及び筐体60を介し、さらに絶縁ケース50の第2ケース部52を介して口金70へ伝導し、口金70から照明器具(不図示)側へ放熱される。 The outer peripheral edge of the nozzle-side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface of the housing 60. Since the tapered surface of the base 20 is in surface contact with the inner peripheral surface of the housing 60, the heat transmitted from the light emitting module 10 to the base 20 is more easily conducted to the housing 60. Thereby, the heat generated in the semiconductor light emitting element 12 is conducted to the base 70 mainly through the base 20 and the housing 60 and further through the second case portion 52 of the insulating case 50, and the lighting equipment (from the base 70) Heat is dissipated to the side (not shown).
 本実施の形態における筐体60は、金属材料によって構成されている。これにより、筐体60はヒートシンクとして機能し、発光モジュール10及び回路ユニット40から発生する熱を、筐体60を介して照明用光源1の外部に効率的に放熱させることができる。筐体60の金属材料としては、例えばAl、Ag、Au、Ni、Rh、Pd、あるいは、これらのうちの2以上からなる合金、又はCuとAgとの合金などが考えられる。このような金属材料は、熱伝導性が良好であるため、筐体60に伝搬した熱を効率良く口金側に伝搬させることができる。したがって、発光モジュール10及び回路ユニット40から発生する熱を、口金70を介して照明器具側にも放熱させることができる。本実施の形態において、筐体60は、アルミニウム合金材料で構成されている。また、筐体60の熱放射率を向上させるために、筐体60の表面にアルマイト処理を施してもよい。なお、筐体60の材料は、金属に限定されず、樹脂であってもよい。例えば、熱伝導率の高い樹脂などで筐体60を構成することができる。 The housing 60 in the present embodiment is made of a metal material. Thereby, the case 60 functions as a heat sink, and the heat generated from the light emitting module 10 and the circuit unit 40 can be efficiently dissipated to the outside of the illumination light source 1 through the case 60. As a metal material of the case 60, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, or the like can be considered. Such a metal material has good thermal conductivity, so that the heat transmitted to the housing 60 can be efficiently transmitted to the die side. Therefore, the heat generated from the light emitting module 10 and the circuit unit 40 can be dissipated to the lighting apparatus side through the base 70. In the present embodiment, the housing 60 is made of an aluminum alloy material. Further, in order to improve the thermal emissivity of the housing 60, the surface of the housing 60 may be subjected to an alumite treatment. The material of the housing 60 is not limited to metal, and may be resin. For example, the housing 60 can be made of a resin having a high thermal conductivity.
 [口金]
 口金70は、二接点によって交流電力を受電するための受電部であり、例えば、照明器具のソケットに取り付けられる。この場合、照明用光源1が点灯された際に、口金70は、照明器具のソケットから電力を受ける。また、口金70で受電した電力は、電気配線40c及び40dを介して回路ユニット40の電力入力部に入力される。
[Cap]
The base 70 is a power receiving unit for receiving AC power by two contacts, and is attached to, for example, a socket of a lighting fixture. In this case, when the lighting light source 1 is turned on, the base 70 receives power from the socket of the lighting fixture. Further, the power received by the base 70 is input to the power input unit of the circuit unit 40 through the electrical wirings 40c and 40d.
 口金70は、略円筒状であって外周面が雄ネジとなっているシェル部71と、シェル部71に絶縁部72を介して装着されたアイレット部73とを備える。なお、シェル部71と筐体60との間には、筐体60と口金70との絶縁を確保するための絶縁リング74が設けられている。 The base 70 includes a shell portion 71 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72. An insulating ring 74 is provided between the shell portion 71 and the housing 60 in order to ensure insulation between the housing 60 and the base 70.
 口金70の種類は、特に限定されるものではないが、例えばねじ込み型のエジソンタイプ(E型)の口金を用いることができ、E26口金又はE17口金等が挙げられる。 The type of the base 70 is not particularly limited. For example, a screw-in type Edison type (E type) base can be used, and examples include an E26 base or an E17 base.
 [センサ部]
 センサ部80は、照明用光源1の照射エリアにおける検出対象(人等)の有無を検知する検知手段であって、実装基板81と、実装基板81に実装されたセンサ本体82とを有する。
[Sensor section]
The sensor unit 80 is a detection unit that detects the presence or absence of a detection target (such as a person) in the irradiation area of the illumination light source 1 and includes a mounting substrate 81 and a sensor main body 82 mounted on the mounting substrate 81.
 実装基板81は、センサ本体82が実装される基台である。本実施の形態における実装基板81は、例えば、エポキシなどの耐熱温度の高い樹脂などからなる円盤状の基台である。図示しないが、実装基板81の表面には、プリント配線が形成されているとともに、センサ本体82で検知した信号を処理する等するための回路素子(制御用マイコン等の制御回路)が実装されている。回路素子(制御回路)は、電気配線40eによって回路ユニット40と電気的に接続されており、電気配線40eを通じてセンサ本体82の検出信号が回路ユニット40に出力される。なお、このような回路素子(制御回路)は、センサ部80ではなく、回路ユニット40に実装されていてもよい。 The mounting substrate 81 is a base on which the sensor body 82 is mounted. The mounting substrate 81 in the present embodiment is, for example, a disk-shaped base made of a resin having a high heat resistance temperature such as epoxy. Although not shown, printed wiring is formed on the surface of the mounting substrate 81 and a circuit element (control circuit such as a control microcomputer) for processing a signal detected by the sensor main body 82 is mounted. There is. The circuit element (control circuit) is electrically connected to the circuit unit 40 by the electrical wiring 40 e, and the detection signal of the sensor main body 82 is output to the circuit unit 40 through the electrical wiring 40 e. Note that such a circuit element (control circuit) may be mounted on the circuit unit 40 instead of the sensor unit 80.
 センサ本体82は、人等の検出対象を検知する検知素子であり、例えば、人の存在を検知する人感センサを用いることができる。本実施の形態におけるセンサ本体82は、パッシブ型の人感センサであって、受光面に入射した赤外線の強度変化を検出することにより、人の存在を検知する。すなわち、センサ本体82は、人体から放射される赤外線を検知した場合に、回路素子に検知信号を出力する。そして、この検知信号に応じて発光モジュールが点灯又は消灯する。なお、センサ本体82は、人以外であっても、動物などの赤外線を発するものが感知範囲(検知範囲)に入れば、その存在を検知することができる。 The sensor body 82 is a detection element that detects a detection target such as a person, and for example, a human sensor that detects the presence of a person can be used. The sensor body 82 in the present embodiment is a passive type human sensor, and detects the presence of a person by detecting a change in intensity of infrared light incident on the light receiving surface. That is, the sensor body 82 outputs a detection signal to the circuit element when it detects an infrared ray emitted from the human body. Then, the light emitting module is turned on or off according to the detection signal. In addition, even if it is other than a person, if the thing which emits infrared rays, such as an animal, enters the sensing range (detection range), the sensor main body 82 can detect the presence.
 本実施の形態において、センサ本体82は、赤外線を検知するように構成されているが、超音波や可視光など、又はこれらの組み合わせを検知するように構成してもよい。なお、本実施の形態において、センサ本体82は、実装基板81の中心に設けられており、センサ本体82の中心は、ランプ軸Jと一致している。 In the present embodiment, the sensor main body 82 is configured to detect infrared rays, but may be configured to detect ultrasonic waves, visible light, or the like, or a combination thereof. In the present embodiment, the sensor body 82 is provided at the center of the mounting substrate 81, and the center of the sensor body 82 coincides with the lamp axis J.
 このように構成されるセンサ部80は、絶縁ケース50に外側面に固定されている。本実施の形態におけるセンサ部80は、絶縁ケース50の第3ケース部(キャップ部材)53の上面に固定されている。このように、センサ部80と回路ユニット40とは、絶縁ケース50によって空間的に隔てられており、絶縁ケース50を介して直接接触しないように構成されている。つまり、センサ部80と回路ユニット40とは、絶縁ケース50によって非接触状態となっている。 The sensor unit 80 configured in this manner is fixed to the outer side surface of the insulating case 50. The sensor unit 80 in the present embodiment is fixed to the upper surface of the third case portion (cap member) 53 of the insulating case 50. As described above, the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50, and are configured not to be in direct contact with each other via the insulating case 50. That is, the sensor unit 80 and the circuit unit 40 are not in contact with each other by the insulating case 50.
 より具体的には、センサ部80の実装基板81と回路ユニット40の回路基板41とが直接接触しないように構成されている。 More specifically, the mounting substrate 81 of the sensor unit 80 and the circuit substrate 41 of the circuit unit 40 are configured not to be in direct contact with each other.
 [導光部材]
 導光部材90は、センサ本体82の受光面に光を導くための光学部材である。本実施の形態における導光部材90は、人から放射される赤外線を受光面に集光するように構成された凸レンズである。導光部材90としては、例えば、フレネルレンズを用いることができる。
[Light guiding member]
The light guide member 90 is an optical member for guiding light to the light receiving surface of the sensor main body 82. The light guide member 90 in the present embodiment is a convex lens configured to condense infrared light emitted from a person on the light receiving surface. For example, a Fresnel lens can be used as the light guide member 90.
 また、導光部材90は、図3に示すように、平面視において、センサ部80と重なるように配置されている。すなわち、導光部材90は、センサ部80の上方に配置されている。また、導光部材90のレンズ中心軸は、ランプ軸Jと一致するように配置されている。 Further, as shown in FIG. 3, the light guide member 90 is disposed so as to overlap the sensor unit 80 in plan view. That is, the light guide member 90 is disposed above the sensor unit 80. Further, the lens central axis of the light guide member 90 is disposed to coincide with the lamp axis J.
 本実施の形態において、導光部材90は、グローブ30に設けられた開口に嵌め込まれており、グローブ30の外表面から突出するように構成されている。導光部材90は、ガラス又は樹脂等の透光性材料を用いて形成することができ、本実施の形態では、ポリエチレンによって形成されている。 In the present embodiment, the light guide member 90 is fitted in an opening provided in the glove 30 and configured to protrude from the outer surface of the glove 30. The light guide member 90 can be formed using a translucent material such as glass or resin, and in the present embodiment, it is formed of polyethylene.
 このように構成される本発明の実施の形態1に係る照明用光源1は、以下のように動作する。 The illumination light source 1 according to Embodiment 1 of the present invention configured as described above operates as follows.
 まず、照明用光源1が消灯している場合において、センサ部80の検知範囲内に人が入ると、センサ部80(センサ本体82)は、その人から放射される赤外線を検知する。次に、センサ部80(制御回路)は、人が検知されたことを示す信号を回路ユニット40に出力する。センサ部80からの検知信号を取得した回路ユニット40は、発光モジュール10に所定の電力を供給する。これにより、発光モジュール10が発光し、照明用光源1が点灯状態となる。このように、照明エリアに人が入ってくると、センサ部80によって人の存在が検知されると、自動的に照明用光源1が点灯する。 First, when the illumination light source 1 is turned off, when a person enters the detection range of the sensor unit 80, the sensor unit 80 (sensor main body 82) detects the infrared rays emitted from the person. Next, the sensor unit 80 (control circuit) outputs a signal indicating that a person has been detected to the circuit unit 40. The circuit unit 40 that has acquired the detection signal from the sensor unit 80 supplies predetermined power to the light emitting module 10. Thus, the light emitting module 10 emits light, and the illumination light source 1 is turned on. As described above, when a person enters the illumination area, when the sensor unit 80 detects the presence of the person, the illumination light source 1 is automatically turned on.
 一方、照明用光源1が点灯している場合において、センサ部80の検知範囲から人が出ていく等して、赤外線の強度が変化しない状態が一定時間継続すると、回路ユニット40は、発光モジュール10への電力の供給を停止する。これにより、発光モジュール10が非発光となり、照明用光源1が消灯状態となる。このように、センサ部80によって人の不在が検知されてから一定時間経過すると、自動的に照明用光源1が消灯する。 On the other hand, when the illumination light source 1 is on, if a state in which the intensity of the infrared light does not change continues for a certain period of time, for example, a person goes out of the detection range of the sensor unit 80, the circuit unit 40 Turn off the power supply to 10. As a result, the light emitting module 10 does not emit light, and the illumination light source 1 is turned off. As described above, the illumination light source 1 is automatically turned off when a predetermined time elapses after the absence of a person is detected by the sensor unit 80.
 以上、本発明の実施の形態1に係る照明用光源1によれば、センサ部80及び回路ユニット40が互いに接触しないように外囲器内に配置されており、センサ部80と回路ユニット40とが機械的に接続されてない構造となっている。具体的には、センサ部80と回路ユニット40とは、絶縁ケース50の一部である仕切り板によって空間的に隔てられている。これにより、センサ部80は、回路ユニット40で発生する熱を受けにくくなるので、センサ部80の出力が熱によって変動してしまうことを抑制することができる。したがって、センサ部80の出力変動に伴って照明用光源1が誤動作してしまうことを軽減することができる。 As described above, according to the illumination light source 1 according to the first embodiment of the present invention, the sensor unit 80 and the circuit unit 40 are disposed in the envelope so as not to contact each other, and the sensor unit 80 and the circuit unit 40 Is not mechanically connected. Specifically, the sensor unit 80 and the circuit unit 40 are spatially separated by a partition plate which is a part of the insulating case 50. As a result, the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40, so that the output of the sensor unit 80 can be prevented from fluctuating due to heat. Therefore, it can be reduced that the illumination light source 1 malfunctions due to the output fluctuation of the sensor unit 80.
 (実施の形態2)
 次に、本発明の実施の形態2に係る照明用光源2の構成について、図4を用いて説明する。図4は、本発明の実施の形態2に係る照明用光源の断面図である。なお、実施の形態1と同じ部材については、実施の形態1と同じ符号を用いている。
Second Embodiment
Next, the configuration of the illumination light source 2 according to the second embodiment of the present invention will be described using FIG. FIG. 4 is a cross-sectional view of an illumination light source according to Embodiment 2 of the present invention. About the same member as Embodiment 1, the same numerals as Embodiment 1 are used.
 本実施の形態に係る照明用光源2と実施の形態1に係る照明用光源1とは、導光部材の構成が異なっている。すなわち、本実施の形態における導光部材290は、センサ部80に光(赤外線)を導光する点では実施の形態1と同様であるが、センサ部80を覆うようにカバー形状に形成されている点で実施の形態1と異なる。 The configuration of the light guide member is different between the illumination light source 2 according to the present embodiment and the illumination light source 1 according to the first embodiment. That is, the light guide member 290 in the present embodiment is similar to the first embodiment in that light (infrared rays) is guided to the sensor unit 80, but is formed in a cover shape so as to cover the sensor unit 80. The second embodiment differs from the first embodiment in that
 本実施の形態において、導光部材290は、一方が開口され他方が閉塞された光学部材である。導光部材290の閉塞された部分は、センサ本体82の受光面に光(赤外線)を導光させるように構成されており、集光レンズとして機能する。一方、導光部材290の開口された部分は、絶縁ケース50の第3ケース部53の上面に当接されている。 In the present embodiment, the light guide member 290 is an optical member in which one is opened and the other is closed. The closed portion of the light guide member 290 is configured to guide light (infrared ray) to the light receiving surface of the sensor main body 82, and functions as a condensing lens. On the other hand, the opened portion of the light guide member 290 is in contact with the upper surface of the third case portion 53 of the insulating case 50.
 導光部材290は、センサ部80全体を覆うように配置され、絶縁ケース50に固定されている。なお、本実施の形態において、導光部材290は、その中心軸がランプ軸Jと一致するように配置されている。 The light guide member 290 is disposed so as to cover the entire sensor unit 80 and is fixed to the insulating case 50. In the present embodiment, the light guide member 290 is disposed such that its central axis coincides with the lamp axis J.
 また、本実施の形態において、導光部材290の一部がグローブ30の外表面から突出するように構成されており、導光部材290は、閉塞された部分(レンズ部分)がグローブ30に設けられた開口から外部に向かって突出するように絶縁ケース50に配置されている。また、導光部材290は、グローブ30との間に隙間をあけて、グローブ30と接触しないように配置されている。これにより、組み立て時等において導光部材290によってグローブ30が破損してしまうことを抑制することができる。 Further, in the present embodiment, a part of the light guide member 290 is configured to protrude from the outer surface of the globe 30, and the light guide member 290 is provided with the closed portion (lens portion) in the globe 30. It is disposed in the insulating case 50 so as to project outward from the opening. Further, the light guide member 290 is disposed so as not to contact the globe 30 with a gap between the light guide member 290 and the globe 30. Thereby, damage to the globe 30 by the light guide member 290 at the time of assembly or the like can be suppressed.
 なお、導光部材290は、実施の形態1と同様に、ガラス又は樹脂等の透光性材料を用いて形成することができ、本実施の形態でも、ポリエチレンによって形成されている。また、導光部材290は、実施の形態1と同様に、フレネルレンズとすることができる。また、導光部材290は、グローブ30と接触しないように配置されているが、グローブ30と接触させても構わない。 As in the first embodiment, the light guide member 290 can be formed using a light transmissive material such as glass or resin, and in the present embodiment also, it is formed of polyethylene. Further, as in the first embodiment, the light guiding member 290 can be a Fresnel lens. Further, although the light guide member 290 is disposed so as not to be in contact with the globe 30, it may be in contact with the globe 30.
 このようにして構成される照明用光源2は、実施の形態1に係る照明用光源1と同様にして動作する。すなわち、照明エリアに人が入ってくると、センサ部80によって人の存在が検知されて自動的に照明用光源2(発光モジュール10)が点灯し、照明エリアから人が出ていくと、センサ部80により人の不在を検知してから一定時間経過後に自動的に照明用光源2(発光モジュール10)が消灯する。 The illumination light source 2 configured in this manner operates in the same manner as the illumination light source 1 according to the first embodiment. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80 and the illumination light source 2 (light emitting module 10) is automatically turned on, and when the person leaves the illumination area, the sensor After the detection of the absence of a person by the unit 80, the light source 2 for illumination (light emitting module 10) is automatically turned off after a predetermined time has elapsed.
 以上、本発明の実施の形態2に係る照明用光源2によれば、実施の形態1と同様に、センサ部80と回路ユニット40とは、絶縁ケース50(仕切り板)によって空間的に隔てられており、互いに接触しないように配置されている。これにより、センサ部80は、回路ユニット40で発生する熱を受けにくくなる。したがって、センサ部80の出力が熱によって変動してしまうことを抑制することができるので、照明用光源2が誤動作してしまうことを軽減することができる。 As described above, according to the illumination light source 2 according to the second embodiment of the present invention, as in the first embodiment, the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate). And arranged so as not to touch each other. Thus, the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40. Therefore, the output of the sensor unit 80 can be prevented from fluctuating due to heat, so that the malfunction of the illumination light source 2 can be reduced.
 さらに、本実施の形態に係る照明用光源2では、センサ部80に加えて導光部材290も絶縁ケース50に固定されている。これにより、センサ部80(センサ本体82)に対する導光部材290の焦点がずれること軽減することができるので、センサ部80(センサ本体82)の感度が低下することを抑えることができる。 Furthermore, in the illumination light source 2 according to the present embodiment, the light guide member 290 is also fixed to the insulating case 50 in addition to the sensor unit 80. Thus, the focal point of the light guide member 290 with respect to the sensor unit 80 (the sensor main body 82) can be reduced, so that the sensitivity of the sensor unit 80 (the sensor main body 82) can be suppressed from being lowered.
 すなわち、センサ部と導光部材とが別々の箇所に固定されていると、照明用光源の製造工程中や運搬中にセンサ部と導光部材とが所定の位置からずれてセンサ部の感度が低下するという問題がある。例えば、実施の形態1のように導光部材90がグローブ30に固定されていると、センサ部80と導光部材90との位置合わせ(焦点)の精度は、グローブ30と筐体60との位置合わせや、筐体60と絶縁ケース50との位置合わせ等によって決定されるので、センサ部80(センサ本体82)に対する導光部材90の焦点が合いにくい。これに対して、本実施の形態では、センサ部80と導光部材290とが絶縁ケース50に固定されているので、センサ部80(センサ本体82)に対して導光部材290の焦点が合いやすく、導光部材290の焦点ずれによるセンサ部80の感度低下を抑制することができる。 That is, when the sensor unit and the light guide member are fixed at different places, the sensor unit and the light guide member are deviated from the predetermined positions during the manufacturing process or during transportation of the illumination light source, and the sensitivity of the sensor unit is increased. There is a problem of falling. For example, when the light guide member 90 is fixed to the globe 30 as in the first embodiment, the accuracy of alignment (focus) between the sensor unit 80 and the light guide member 90 is different from that of the globe 30 and the housing 60. The position of the light guide member 90 with respect to the sensor unit 80 (the sensor main body 82) is hard to focus because it is determined by the alignment, the alignment of the housing 60 and the insulating case 50, and the like. On the other hand, in the present embodiment, since the sensor unit 80 and the light guide member 290 are fixed to the insulating case 50, the light guide member 290 is focused on the sensor unit 80 (the sensor main body 82). Therefore, the sensitivity reduction of the sensor unit 80 due to the defocus of the light guide member 290 can be suppressed.
 さらに、本実施の形態では、導光部材290は、グローブ30ではなく絶縁ケース50に固定されているので、グローブ30の割れを軽減することができる。 Furthermore, in the present embodiment, since the light guide member 290 is fixed to the insulating case 50 instead of the globe 30, it is possible to reduce the breakage of the globe 30.
 すなわち、実施の形態1のように導光部材90がグローブ30に機械的に固定されている形態では、導光部材90をグローブ30に固定する際にグローブ30が割れてしまう場合がある。特に、ポリカーボネート材からなるグローブ30は割れやすいので、導光部材90をグローブ30に固定するとグローブ30の割れが発生しやすい。これに対して、本実施の形態では、導光部材290がグローブ30ではなく絶縁ケース50に固定されているので、導光部材290を実装する際にグローブ30が割れてしまうことを軽減することができる。 That is, in the embodiment in which the light guide member 90 is mechanically fixed to the globe 30 as in the first embodiment, the globe 30 may be broken when the light guide member 90 is fixed to the globe 30. In particular, since the glove 30 made of a polycarbonate material is easily broken, when the light guide member 90 is fixed to the glove 30, the crack of the glove 30 tends to occur. On the other hand, in the present embodiment, since the light guide member 290 is fixed not to the globe 30 but to the insulating case 50, it is possible to reduce breakage of the globe 30 when the light guide member 290 is mounted. Can.
 なお、本実施の形態において、導光部材290に熱導電性物質を含有することが好ましい。この場合、導光部材290全体の熱伝導率は、センサ部80の実装基板81の熱伝導率よりも大きくすることが好ましい。これにより、絶縁ケース50に伝導した回路ユニット40の熱は、センサ部80よりも導光部材290の方に伝導しやすくなるので、回路ユニット40の熱を、導光部材290に伝導させて照明用光源1の外部(大気中)に放熱させることができる。したがって、さらにセンサ部80は回路ユニット40からの熱を受けにくくなるので、センサ部80の出力が熱によって変動してしまうことを一層抑制することができる。 In the present embodiment, it is preferable that the light guide member 290 contain a thermally conductive substance. In this case, it is preferable that the thermal conductivity of the entire light guide member 290 be larger than the thermal conductivity of the mounting substrate 81 of the sensor unit 80. Thereby, the heat of the circuit unit 40 conducted to the insulating case 50 is more easily conducted to the light guide member 290 than to the sensor unit 80, so the heat of the circuit unit 40 is conducted to the light guide member 290 for illumination The heat can be radiated to the outside (in the atmosphere) of the light source 1. Therefore, since the sensor unit 80 is less likely to receive the heat from the circuit unit 40, the output of the sensor unit 80 can be further suppressed from being fluctuated by the heat.
 (実施の形態3)
 次に、本発明の実施の形態3に係る照明用光源3の構成について、図5を用いて説明する。図5は、本発明の実施の形態3に係る照明用光源の断面図である。なお、実施の形態1と同じ部材については、実施の形態1と同じ符号を用いている。
Third Embodiment
Next, the configuration of the illumination light source 3 according to the third embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view of an illumination light source according to Embodiment 3 of the present invention. About the same member as Embodiment 1, the same numerals as Embodiment 1 are used.
 本実施の形態に係る照明用光源3と実施の形態1に係る照明用光源1とは、導光部材の構成が異なっている。すなわち、本実施の形態における導光部材390は、センサ部80に光(赤外線)を導光する点では実施の形態1と同様であるが、センサ部80を覆うようにカバー形状に形成されている点で実施の形態1と異なる。 The configuration of the light guide member is different between the illumination light source 3 according to the present embodiment and the illumination light source 1 according to the first embodiment. That is, the light guide member 390 in the present embodiment is similar to the first embodiment in that light (infrared rays) is guided to the sensor unit 80, but is formed in a cover shape so as to cover the sensor unit 80. The second embodiment differs from the first embodiment in that
 本実施の形態において、導光部材390は、実施の形態2と同様に、一方が開口され他方が閉塞された光学部材である。導光部材390の閉塞された部分は、センサ本体82の受光面に光(赤外線)を導光させるように構成されており、集光レンズとして機能する。一方、導光部材390の開口された部分は、センサ部80の実装基板81の上面に当接されている。 In the present embodiment, as in the second embodiment, the light guide member 390 is an optical member in which one is opened and the other is closed. The closed portion of the light guide member 390 is configured to guide light (infrared ray) to the light receiving surface of the sensor main body 82, and functions as a condensing lens. On the other hand, the opened portion of the light guide member 390 is in contact with the upper surface of the mounting substrate 81 of the sensor unit 80.
 導光部材390は、センサ部80全体を覆うように配置され、センサ部80の実装基板81に固定されている。なお、本実施の形態において、導光部材390は、その中心軸がランプ軸Jと一致するように配置されている。 The light guide member 390 is disposed so as to cover the entire sensor unit 80, and is fixed to the mounting substrate 81 of the sensor unit 80. In the present embodiment, the light guide member 390 is disposed such that its central axis coincides with the lamp axis J.
 また、本実施の形態において、導光部材390の一部がグローブ30の外表面から突出するように構成されており、導光部材390は、閉塞された部分(レンズ部分)がグローブ30に設けられた開口から外部に向かって突出するように実装基板81に配置されている。なお、実施の形態2と同様に、導光部材390は、グローブ30との間に隙間をあけて、グローブ30と接触しないように配置されている。これにより、組み立て時等において導光部材390によってグローブ30が破損してしまうことを軽減することができる。 Further, in the present embodiment, a part of the light guide member 390 is configured to protrude from the outer surface of the globe 30, and the light guide member 390 is provided with the closed portion (lens portion) in the globe 30. It is disposed on the mounting substrate 81 so as to protrude outward from the opening. As in the second embodiment, the light guide member 390 is disposed so as not to contact the globe 30 with a gap between the light guide member 390 and the globe 30. Thereby, damage to the globe 30 by the light guide member 390 at the time of assembly or the like can be reduced.
 なお、導光部材390は、実施の形態1と同様に、ガラス又は樹脂等の透光性材料を用いて形成することができ、本実施の形態でも、ポリエチレンによって形成されている。また、導光部材390は、実施の形態1と同様に、フレネルレンズとすることができる。また、導光部材390は、グローブ30と接触しないように配置されているが、グローブ30と接触させても構わない。 As in the first embodiment, the light guide member 390 can be formed using a light transmissive material such as glass or resin, and in this embodiment also, it is formed of polyethylene. Further, as in the first embodiment, the light guiding member 390 can be a Fresnel lens. Further, although the light guide member 390 is disposed so as not to be in contact with the globe 30, it may be in contact with the globe 30.
 このようにして構成される照明用光源3は、実施の形態1、2に係る照明用光源1、2と同様にして動作する。すなわち、照明エリアに人が入ってくると、センサ部80によって人の存在が検知されて自動的に照明用光源3(発光モジュール10)が点灯し、照明エリアから人が出ていくと、人感センサにより人の不在を検知してから一定時間経過後に自動的に照明用光源3(発光モジュール10)が消灯する。 The illumination light source 3 configured in this manner operates in the same manner as the illumination light sources 1 and 2 according to the first and second embodiments. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80 and the illumination light source 3 (light emitting module 10) is turned on automatically, and when a person leaves the illumination area, the person The light source for illumination 3 (light emitting module 10) is automatically turned off after a predetermined time has elapsed since the detection of the absence of a person by the sensor.
 以上、本発明の実施の形態3に係る照明用光源3によれば、実施の形態1と同様に、センサ部80と回路ユニット40とは、絶縁ケース50(仕切り板)によって空間的に隔てられており、互いに接触しないように配置されている。これにより、センサ部80は、回路ユニット40で発生する熱を受けにくくなる。したがって、センサ部80の出力が熱によって変動してしまうことを抑制することができるので、照明用光源3が誤動作してしまうことを軽減することができる。 As described above, according to the illumination light source 3 according to the third embodiment of the present invention, as in the first embodiment, the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate). And arranged so as not to touch each other. Thus, the sensor unit 80 is less likely to receive the heat generated in the circuit unit 40. Therefore, the output of the sensor unit 80 can be prevented from fluctuating due to heat, so that the malfunction of the illumination light source 3 can be reduced.
 さらに、本実施の形態に係る照明用光源3では、導光部材390がセンサ部80の実装基板81に固定されている。これにより、センサ部80(センサ本体82)に対する導光部材290の焦点がずれること軽減することができるので、センサ部80(センサ本体82)の感度が低下することを抑えることができる。 Furthermore, in the illumination light source 3 according to the present embodiment, the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80. Thus, the focal point of the light guide member 290 with respect to the sensor unit 80 (the sensor main body 82) can be reduced, so that the sensitivity of the sensor unit 80 (the sensor main body 82) can be suppressed from being lowered.
 すなわち、導光部材がセンサ部とは別の箇所に固定されていると、照明用光源の製造工程中や運搬中にセンサ部と導光部材とが所定の位置からずれてセンサ部の感度が低下するという問題がある。例えば、実施の形態1のように導光部材90がグローブ30に固定されていると、センサ部80と導光部材90との位置合わせ(焦点)の精度は、グローブ30と筐体60との位置合わせや、筐体60と絶縁ケース50との位置合わせ等によって決定されるので、センサ部80(センサ本体82)に対する導光部材90の焦点が合いにくい。これに対して、本実施の形態では、導光部材390がセンサ部80の実装基板81に固定されているので、センサ部80(センサ本体82)に対して導光部材390の焦点が合いやすい。例えば、本実施の形態では、導光部材390の実装と同時に導光部材390とセンサ部80との位置合わせを行うことができる。これにより、導光部材390の焦点ずれによるセンサ部80の感度低下を抑制することができる。 That is, when the light guide member is fixed at a different place from the sensor unit, the sensor unit and the light guide member are deviated from the predetermined position during the manufacturing process or transport of the illumination light source, and the sensitivity of the sensor unit is increased. There is a problem of falling. For example, when the light guide member 90 is fixed to the globe 30 as in the first embodiment, the accuracy of alignment (focus) between the sensor unit 80 and the light guide member 90 is different from that of the globe 30 and the housing 60. The position of the light guide member 90 with respect to the sensor unit 80 (the sensor main body 82) is hard to focus because it is determined by the alignment, the alignment of the housing 60 and the insulating case 50, and the like. On the other hand, in the present embodiment, since the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, the light guide member 390 can be easily focused on the sensor unit 80 (sensor main body 82). . For example, in the present embodiment, alignment between the light guide member 390 and the sensor unit 80 can be performed simultaneously with the mounting of the light guide member 390. Thereby, the sensitivity fall of sensor part 80 by the focus shift of light guide member 390 can be controlled.
 さらに、本実施の形態では、導光部材390は、グローブ30ではなくセンサ部80(実装基板81)に固定されているので、グローブ30の割れを軽減することができる。 Furthermore, in the present embodiment, the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), so it is possible to reduce the breakage of the globe 30.
 すなわち、実施の形態1のように導光部材90がグローブ30に機械的に固定されている形態では、導光部材90をグローブ30に固定する際にグローブ30が割れてしまう場合がある。特に、ポリカーボネート材からなるグローブ30は割れやすいので、導光部材90をグローブ30に固定するとグローブ30の割れが発生しやすい。これに対して、本実施の形態では、導光部材390がグローブ30ではなくセンサ部80(実装基板81)に固定されているので、導光部材390を実装する際にグローブ30が割れてしまうことを軽減することができる。 That is, in the embodiment in which the light guide member 90 is mechanically fixed to the globe 30 as in the first embodiment, the globe 30 may be broken when the light guide member 90 is fixed to the globe 30. In particular, since the glove 30 made of a polycarbonate material is easily broken, when the light guide member 90 is fixed to the glove 30, the crack of the glove 30 tends to occur. On the other hand, in the present embodiment, since the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), the globe 30 is broken when the light guide member 390 is mounted. Can be reduced.
 なお、本実施の形態において、導光部材390に熱導電性物質を含有することが好ましい。この場合、導光部材390全体の熱伝導率は、センサ部80の実装基板81の熱伝導率よりも大きくすることが好ましい。これにより、センサ部80の実装基板81に伝導した回路ユニット40の熱を、導光部材290も伝導させて照明用光源1の外部(大気中)に放熱させることができる。したがって、さらにセンサ部80は回路ユニット40からの熱を受けにくくなるので、センサ部80の出力が熱によって変動してしまうことを一層抑制することができる。 In the present embodiment, the light guide member 390 preferably contains a thermally conductive substance. In this case, it is preferable that the thermal conductivity of the entire light guide member 390 be larger than the thermal conductivity of the mounting substrate 81 of the sensor unit 80. As a result, the heat of the circuit unit 40 conducted to the mounting substrate 81 of the sensor unit 80 can be conducted also to the outside of the illumination light source 1 (in the atmosphere). Therefore, since the sensor unit 80 is less likely to receive the heat from the circuit unit 40, the output of the sensor unit 80 can be further suppressed from being fluctuated by the heat.
 また、本実施の形態において、導光部材390は、センサ部80の実装基板81に固定したが、センサ本体82に固定しても構わない。 Further, in the present embodiment, the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, but may be fixed to the sensor main body 82.
 (実施の形態4)
 次に、本発明の実施の形態4に係る照明用光源4の構成について、図6を用いて説明する。図6は、本発明の実施の形態4に係る照明用光源の断面図である。なお、実施の形態3と同じ部材については、実施の形態1と同じ符号を用いている。
Embodiment 4
Next, the configuration of the illumination light source 4 according to Embodiment 4 of the present invention will be described using FIG. FIG. 6 is a cross-sectional view of an illumination light source according to Embodiment 4 of the present invention. The same members as in the third embodiment are assigned the same reference numerals as in the first embodiment.
 本実施の形態に係る照明用光源4は、実施の形態3に係る照明用光源3に対して、さらに、放熱部材490が設けられたものである。 The illumination light source 4 according to the present embodiment is the illumination light source 3 according to the third embodiment further provided with a heat dissipation member 490.
 放熱部材490は、センサ部80の熱を放熱させるための部材であり、導光部材390とセンサ部80との間に設けられている。放熱部材490は、熱導電性物質が含有された透光性材料によって構成することができ、本実施の形態では、熱導電性物質が含有された透明樹脂を導光部材390とセンサ部80との間に充填することによって構成している。このような透光性材料としては、例えば、ポリエチレンを用いることができる。熱導電性物質としては、透光性材料よりも熱伝導率が高い材料を用いればよい。 The heat radiating member 490 is a member for radiating heat of the sensor unit 80, and is provided between the light guide member 390 and the sensor unit 80. The heat dissipating member 490 can be made of a translucent material containing a heat conductive material, and in the present embodiment, the light guide member 390 and the sensor unit 80 are made of a transparent resin containing a heat conductive material. It is composed by filling in between. As such a translucent material, polyethylene can be used, for example. As the heat conductive substance, a material having a heat conductivity higher than that of the light transmitting material may be used.
 なお、本実施の形態において、放熱部材490は、導光部材390とともに当該放熱部材490によってセンサ部80に光(赤外線)が集光するように構成されている。すなわち、放熱部材490は、導光部材としても機能する。 In the present embodiment, the heat dissipating member 490 is configured such that light (infrared ray) is condensed on the sensor unit 80 by the heat dissipating member 490 together with the light guide member 390. That is, the heat dissipation member 490 also functions as a light guide member.
 このようにして構成される照明用光源4は、実施の形態3に係る照明用光源3と同様に動作する。すなわち、照明エリアに人が入ってくると、センサ部80によって人の存在が検知されて自動的に照明用光源4(発光モジュール10)が点灯し、照明エリアから人が出ていくと、人感センサにより人の不在を検知してから一定時間経過後に自動的に照明用光源4(発光モジュール10)が消灯する。 The illumination light source 4 configured in this manner operates in the same manner as the illumination light source 3 according to the third embodiment. That is, when a person enters the illumination area, the presence of the person is detected by the sensor unit 80, the illumination light source 4 (light emitting module 10) is automatically turned on, and when a person leaves the illumination area, the person The light source for illumination 4 (light emitting module 10) is automatically turned off after a predetermined time has elapsed since the detection of the absence of a person by the sensor.
 以上、本発明の実施の形態4に係る照明用光源4によれば、実施の形態3と同様の効果を奏する。すなわち、本実施の形態によれば、センサ部80と回路ユニット40とは、絶縁ケース50(仕切り板)によって空間的に隔てられており、互いに接触しないように配置されている。これにより、センサ部80の出力が熱によって変動してしまうことを抑制することができ、照明用光源4が誤動作してしまうことを軽減することができる。また、導光部材390がセンサ部80の実装基板81に固定されているので、センサ部80(センサ本体82)に対する導光部材290の焦点がずれること軽減することができ、センサ部80(センサ本体82)の感度が低下することを抑えることができる。また、導光部材390がグローブ30ではなくセンサ部80(実装基板81)に固定されているので、グローブ30の割れを軽減することもできる。 As described above, according to the illumination light source 4 of the fourth embodiment of the present invention, the same effects as those of the third embodiment can be obtained. That is, according to the present embodiment, the sensor unit 80 and the circuit unit 40 are spatially separated by the insulating case 50 (partition plate), and are arranged so as not to be in contact with each other. As a result, the output of the sensor unit 80 can be prevented from fluctuating due to heat, and the malfunction of the illumination light source 4 can be reduced. Moreover, since the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, it is possible to reduce the defocus of the light guide member 290 with respect to the sensor unit 80 (sensor main body 82). It is possible to suppress the decrease in sensitivity of the main body 82). In addition, since the light guide member 390 is fixed not to the globe 30 but to the sensor unit 80 (mounting substrate 81), it is possible to reduce the breakage of the globe 30.
 さらに、本実施の形態では、センサ部80と導光部材390との間に放熱部材490が設けられているので、センサ部80の実装基板81に伝導した回路ユニット40の熱を、放熱部材490を介して積極的に照明用光源1の外部(大気中)に放熱させることができる。したがって、センサ部80は回路ユニット40からの熱を一層受けにくくなるので、センサ部80の出力が熱によって変動してしまうことを抑制することができる。 Furthermore, in the present embodiment, since the heat dissipation member 490 is provided between the sensor unit 80 and the light guide member 390, the heat of the circuit unit 40 conducted to the mounting substrate 81 of the sensor unit 80 is the heat dissipation member 490. Can be actively dissipated to the outside (in the atmosphere) of the illumination light source 1. Therefore, the sensor unit 80 is more difficult to receive the heat from the circuit unit 40, so that the output of the sensor unit 80 can be suppressed from being fluctuated by the heat.
 なお、本実施の形態においても、導光部材390は、センサ部80の実装基板81に固定したが、センサ本体82に固定しても構わない。また、本実施の形態は、実施の形態1、2にも適用することができる。 Also in the present embodiment, the light guide member 390 is fixed to the mounting substrate 81 of the sensor unit 80, but may be fixed to the sensor main body 82. Further, the present embodiment can be applied to the first and second embodiments.
 以上、本発明に係る照明用光源について、実施形態に基づいて説明したが、本発明は、これらの実施形態に限定されるものではない。 As mentioned above, although the light source for illumination which concerns on this invention was demonstrated based on embodiment, this invention is not limited to these embodiment.
 例えば、上記の実施の形態では、いずれも導光部材を用いたが、導光部材を設けることなく照明用光源を構成しても構わない。 For example, although the light guide members are used in the above embodiments, the light source for illumination may be configured without providing the light guide members.
 また、上記の実施の形態では、センサ部80と回路ユニット40とを空間的に仕切る仕切り板として絶縁ケース50の一部を用いたが、これに限らない。例えば、絶縁ケース50とは別に、センサ部80と回路ユニット40との間に位置する仕切り板を設けてもよい。この場合、仕切り板は、絶縁性を有する熱伝導率の低い材料によって構成することが好ましい。 Moreover, in said embodiment, although a part of insulation case 50 was used as a partition plate which divides sensor part 80 and circuit unit 40 spatially, it does not restrict to this. For example, in addition to the insulating case 50, a partition plate may be provided between the sensor unit 80 and the circuit unit 40. In this case, the partition plate is preferably made of an insulating material having a low thermal conductivity.
 また、上記の実施の形態において、センサ部80は絶縁ケース50に設けたが、センサ部80と回路ユニット40とが互いに接触しないように配置されていれば、センサ部80は絶縁ケース50以外の場所に配置しても構わない。例えば、センサ部80を筐体60に固定して構わないし、センサ部80を回路ユニット40と筐体60との間に配置しても構わない。この場合、導光部材は、センサ部80の配置場所に応じて適宜設ければよい。 Although the sensor unit 80 is provided in the insulating case 50 in the above embodiment, the sensor unit 80 may be other than the insulating case 50 if the sensor unit 80 and the circuit unit 40 are disposed so as not to contact each other. You may place it in a place. For example, the sensor unit 80 may be fixed to the housing 60, or the sensor unit 80 may be disposed between the circuit unit 40 and the housing 60. In this case, the light guide member may be appropriately provided according to the arrangement place of the sensor unit 80.
 また、上記の実施の形態では、E型の口金の照明用光源について説明したが、これに限らない。例えば、本発明は、GX53型等の他の口金にも適用することができる。 Moreover, although said embodiment demonstrated the light source for illumination of E-type nozzle | cap | die, it does not restrict to this. For example, the present invention can be applied to other base such as GX53 type.
 また、上記の実施の形態において、発光モジュールにおけるLEDの構造としては、LEDチップ(ベアチップ)が実装基板に実装された構造であるCOB(Chip On Board)型としたが、これに限らない。例えば、本発明は、LEDチップをパッケージ化したLED素子が実装基板に実装された構造である表面実装(Surface Mounted Device:SMD)型等にも適用することができる。 Moreover, in said embodiment, although it was set as the COB (Chip On Board) type | mold which is a structure where LED chip (bare chip) was mounted in the mounting board as a structure of LED in a light emitting module, it does not restrict to this. For example, the present invention can also be applied to a surface mounted device (SMD) type or the like, which is a structure in which an LED element obtained by packaging an LED chip is mounted on a mounting substrate.
 また、本発明は、上記の照明用光源を備える照明装置として実現することもできる。例えば、図7に示すように、本発明に係る照明装置100として、上記の照明用光源1と、当該照明用光源1が取り付けられる点灯器具(照明器具)110とを備えるように構成してもよい。この場合、点灯器具110は、照明用光源1の消灯及び点灯を行うものであり、例えば、天井に取り付けられる器具本体111と、照明用光源1を覆うランプカバー112とを備える。器具本体111は、照明用光源1の口金70が装着されるとともに照明用光源1に給電を行うソケット111aを有する。なお、ランプカバー112の開口部に透光性プレートを設けてもよい。 Furthermore, the present invention can also be realized as an illumination device provided with the above illumination light source. For example, as shown in FIG. 7, the illumination device 100 according to the present invention may be configured to include the illumination light source 1 described above and a lighting fixture (light fixture) 110 to which the illumination light source 1 is attached. Good. In this case, the lighting fixture 110 turns off and lights the illumination light source 1 and includes, for example, an appliance main body 111 attached to a ceiling, and a lamp cover 112 covering the illumination light source 1. The fixture body 111 includes a socket 111 a to which the base 70 of the illumination light source 1 is attached and which supplies power to the illumination light source 1. A translucent plate may be provided at the opening of the lamp cover 112.
 その他、本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態に施したもの、又は、異なる実施の形態における構成要素を組み合わせて構築される形態も、本発明の範囲内に含まれる。 In addition, within the scope of the present invention, various modifications that can be conceived by those skilled in the art are applied to the present embodiment without departing from the spirit of the present invention, or a form constructed by combining components in different embodiments is also within the scope of the present invention. include.
 本発明は、従来の白熱電球等に代替する電球形LEDランプ等として有用であり、照明装置等において広く利用することができる。 INDUSTRIAL APPLICABILITY The present invention is useful as a light bulb-shaped LED lamp or the like to replace a conventional incandescent light bulb or the like, and can be widely used in a lighting device or the like.
 1、2、3、4 照明用光源
 10 発光モジュール
 11、81 実装基板
 12 半導体発光素子
 13 封止体
 14 舌片部
 15 コネクタ
 20 基台
 20a、50a、50b 貫通孔
 30 グローブ
 40 回路ユニット
 40a、40b、40c、40d、40e 電気配線
 41 回路基板
 42 電子部品
 50 絶縁ケース
 51 第1ケース部
 52 第2ケース部
 53 第3ケース部
 60 筐体
 60a 空間
 70 口金
 71 シェル部
 72 絶縁部
 73 アイレット部
 74 絶縁リング
 80 センサ部
 82 センサ本体
 90、290、390 導光部材
 100 照明装置
 110 点灯器具
 111 器具本体
 111a ソケット
 112 ランプカバー
 490 放熱部材
DESCRIPTION OF SYMBOLS 1, 2, 3 and 4 Light source for illumination 10 Light emitting module 11, 81 Mounting substrate 12 Semiconductor light emitting element 13 Sealing body 14 Tongue piece 15 Connector 20 Base 20a, 50a, 50b Through hole 30 Globe 40 Circuit unit 40a, 40b , 40c, 40d, 40e electrical wiring 41 circuit board 42 electronic component 50 insulation case 51 first case portion 52 second case portion 53 third case portion 60 housing 60a space 70 base 71 shell portion 72 insulation portion 73 eyelet portion 74 insulation Ring 80 Sensor section 82 Sensor body 90, 290, 390 Light guide member 100 Lighting device 110 Lighting fixture 111 Fixture body 111a Socket 112 Lamp cover 490 Heat dissipation member

Claims (11)

  1.  グローブと筐体と口金とで外囲器を構成する照明用光源であって、
     センサ部と、
     前記センサ部からの検知信号に基づいて発光する発光部と、
     前記発光部に電力を供給するための電源回路部と、
     前記センサ部と前記電源回路部との間に位置する仕切り板とを備え、
     前記仕切り板によって前記センサ部と前記電源回路部とが空間的に隔てられている、
     照明用光源。
    It is a light source for illumination which comprises an envelope with a glove, a case and a base,
    A sensor unit,
    A light emitting unit that emits light based on a detection signal from the sensor unit;
    A power supply circuit unit for supplying power to the light emitting unit;
    A partition plate positioned between the sensor unit and the power supply circuit unit;
    The sensor unit and the power supply circuit unit are spatially separated by the partition plate;
    Light source for illumination.
  2.  さらに、前記外囲器内に設けられ、前記電源回路部を収容する絶縁ケースを備え、
     前記仕切り板は、前記絶縁ケースの一部であり、
     前記センサ部は、前記絶縁ケースの外側面に固定されている、
     請求項1に記載の照明用光源。
    And an insulating case provided in the envelope and housing the power supply circuit unit,
    The partition plate is a part of the insulating case,
    The sensor unit is fixed to the outer surface of the insulating case.
    The illumination light source according to claim 1.
  3.  前記絶縁ケースの一部は、前記グローブ内に位置しており、
     前記センサ部は、前記グローブ内に位置する前記絶縁ケースの一部に固定されている、
     請求項2に記載の照明用光源。
    A part of the insulating case is located in the glove,
    The sensor unit is fixed to a part of the insulating case located in the glove.
    The illumination light source according to claim 2.
  4.  前記発光部は、前記グローブ内に位置する前記絶縁ケースの一部を囲むように設けられている、
     請求項3に記載の照明用光源。
    The light emitting unit is provided so as to surround a part of the insulating case located in the glove.
    The illumination light source according to claim 3.
  5.  さらに、前記センサ部に光を導く導光部材を備え、
     前記導光部材は、前記センサ部に固定されている、
     請求項1~4のいずれか1項に記載の照明用光源。
    And a light guide member for guiding light to the sensor unit.
    The light guide member is fixed to the sensor unit.
    The illumination light source according to any one of claims 1 to 4.
  6.  前記センサ部は、実装基板と、前記実装基板に実装されたセンサ本体とを有し、
     前記導光部材は、前記実装基板に固定されている、
     請求項5に記載の照明用光源。
    The sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate.
    The light guide member is fixed to the mounting substrate.
    The illumination light source according to claim 5.
  7.  前記センサ部は、実装基板と、前記実装基板に実装されたセンサ本体とを有し、
     前記導光部材は、前記センサ本体に固定されている、
     請求項5に記載の照明用光源。
    The sensor unit includes a mounting substrate and a sensor main body mounted on the mounting substrate.
    The light guide member is fixed to the sensor body.
    The illumination light source according to claim 5.
  8.  前記導光部材は、熱導電性物質が含有された透光性材料からなる、
     請求項5~7のいずれか1項に記載の照明用光源。
    The light guide member is made of a translucent material containing a thermally conductive substance.
    The illumination light source according to any one of claims 5 to 7.
  9.  前記透光性材料は、ポリエチレンである、
     請求項8に記載の照明用光源。
    The translucent material is polyethylene,
    The illumination light source according to claim 8.
  10.  さらに、前記導光部材と前記センサ部との間に充填された放熱部材を備える、
     請求項5に記載の照明用光源。
    And a heat dissipation member filled between the light guide member and the sensor unit.
    The illumination light source according to claim 5.
  11.  前記導光部材は、フレネルレンズである、
     請求項5~10のいずれか1項に記載の照明用光源。
    The light guide member is a Fresnel lens.
    An illumination light source according to any one of claims 5 to 10.
PCT/JP2013/001586 2012-04-06 2013-03-12 Illuminating light source WO2013150718A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201390000371.9U CN204213656U (en) 2012-04-06 2013-03-12 Illumination light source and lighting device
JP2013531809A JP5576989B2 (en) 2012-04-06 2013-03-12 Light source for illumination

Applications Claiming Priority (2)

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EP3510318A4 (en) * 2016-12-23 2020-05-13 Zhejiang Shenghui Lighting Co., Ltd A sensor light and a system for preventing false triggering of a sensor

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JP5576989B2 (en) 2014-08-20
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