JP5791934B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP5791934B2
JP5791934B2 JP2011077613A JP2011077613A JP5791934B2 JP 5791934 B2 JP5791934 B2 JP 5791934B2 JP 2011077613 A JP2011077613 A JP 2011077613A JP 2011077613 A JP2011077613 A JP 2011077613A JP 5791934 B2 JP5791934 B2 JP 5791934B2
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JP
Japan
Prior art keywords
film
oxide semiconductor
chamber
substrate
film formation
Prior art date
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Expired - Fee Related
Application number
JP2011077613A
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English (en)
Japanese (ja)
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JP2011228688A (ja
JP2011228688A5 (enExample
Inventor
山崎　舜平
舜平 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2011077613A priority Critical patent/JP5791934B2/ja
Publication of JP2011228688A publication Critical patent/JP2011228688A/ja
Publication of JP2011228688A5 publication Critical patent/JP2011228688A5/ja
Application granted granted Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C23C14/5853—Oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02551—Group 12/16 materials
    • H01L21/02554—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2011077613A 2010-04-02 2011-03-31 半導体装置の作製方法 Expired - Fee Related JP5791934B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011077613A JP5791934B2 (ja) 2010-04-02 2011-03-31 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010085714 2010-04-02
JP2010085714 2010-04-02
JP2011077613A JP5791934B2 (ja) 2010-04-02 2011-03-31 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2011228688A JP2011228688A (ja) 2011-11-10
JP2011228688A5 JP2011228688A5 (enExample) 2014-05-01
JP5791934B2 true JP5791934B2 (ja) 2015-10-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011077613A Expired - Fee Related JP5791934B2 (ja) 2010-04-02 2011-03-31 半導体装置の作製方法

Country Status (2)

Country Link
US (1) US20110240462A1 (enExample)
JP (1) JP5791934B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101942701B1 (ko) * 2011-01-20 2019-01-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체 소자 및 반도체 장치
JP6257900B2 (ja) * 2012-02-23 2018-01-10 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR102479944B1 (ko) 2012-04-13 2022-12-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6505769B2 (ja) * 2012-04-13 2019-04-24 株式会社半導体エネルギー研究所 半導体装置
KR102065926B1 (ko) * 2016-03-29 2020-01-14 가부시키가이샤 아루박 투명 도전막을 구비한 기판의 제조 방법, 투명 도전막을 구비한 기판의 제조 장치, 투명 도전막을 구비한 기판, 및 태양전지
CN107488832B (zh) * 2016-06-12 2019-11-29 北京北方华创微电子装备有限公司 沉积设备以及物理气相沉积腔室
CN113140483A (zh) * 2021-03-03 2021-07-20 上海璞芯科技有限公司 一种晶圆的传片方法和传片平台

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064222A (en) * 1976-02-20 1977-12-20 Koppers Company, Inc. Nitrogen fixation and molecular magneto hydrodynamic generation using a coal gasification gas stream
GB2204066A (en) * 1987-04-06 1988-11-02 Philips Electronic Associated A method for manufacturing a semiconductor device having a layered structure
JPH06104178A (ja) * 1992-09-18 1994-04-15 Hitachi Ltd 真空処理方法及び真空処理装置
JPH09181046A (ja) * 1995-12-21 1997-07-11 Hitachi Ltd 半導体製造方法および装置
JPH09316642A (ja) * 1996-05-23 1997-12-09 Hitachi Cable Ltd マルチチャンバー型プロセス装置及び光部品の製造方法
US7141489B2 (en) * 2003-05-20 2006-11-28 Burgener Ii Robert H Fabrication of p-type group II-VI semiconductors
JP4560502B2 (ja) * 2005-09-06 2010-10-13 キヤノン株式会社 電界効果型トランジスタ
JP2007311404A (ja) * 2006-05-16 2007-11-29 Fuji Electric Holdings Co Ltd 薄膜トランジスタの製造方法
JP4845786B2 (ja) * 2007-03-26 2011-12-28 公益財団法人国際科学振興財団 真空排気装置、半導体製造装置及び真空処理方法
JP5026397B2 (ja) * 2007-11-27 2012-09-12 株式会社半導体エネルギー研究所 成膜装置及び成膜方法
TWI637444B (zh) * 2008-08-08 2018-10-01 半導體能源研究所股份有限公司 半導體裝置的製造方法
JP5537787B2 (ja) * 2008-09-01 2014-07-02 株式会社半導体エネルギー研究所 半導体装置の作製方法

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US20110240462A1 (en) 2011-10-06
JP2011228688A (ja) 2011-11-10

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