JP5791908B2 - 調整装置、レーザ加工装置および調整方法 - Google Patents

調整装置、レーザ加工装置および調整方法 Download PDF

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Publication number
JP5791908B2
JP5791908B2 JP2011008119A JP2011008119A JP5791908B2 JP 5791908 B2 JP5791908 B2 JP 5791908B2 JP 2011008119 A JP2011008119 A JP 2011008119A JP 2011008119 A JP2011008119 A JP 2011008119A JP 5791908 B2 JP5791908 B2 JP 5791908B2
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JP
Japan
Prior art keywords
pattern
workpiece
laser beam
laser
conversion parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011008119A
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English (en)
Japanese (ja)
Other versions
JP2012148302A5 (fr
JP2012148302A (ja
Inventor
山崎　隆一
隆一 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2011008119A priority Critical patent/JP5791908B2/ja
Priority to TW101100184A priority patent/TW201235140A/zh
Priority to CN2012100127855A priority patent/CN102601519A/zh
Priority to KR1020120004842A priority patent/KR20120083854A/ko
Publication of JP2012148302A publication Critical patent/JP2012148302A/ja
Publication of JP2012148302A5 publication Critical patent/JP2012148302A5/ja
Application granted granted Critical
Publication of JP5791908B2 publication Critical patent/JP5791908B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
JP2011008119A 2011-01-18 2011-01-18 調整装置、レーザ加工装置および調整方法 Expired - Fee Related JP5791908B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011008119A JP5791908B2 (ja) 2011-01-18 2011-01-18 調整装置、レーザ加工装置および調整方法
TW101100184A TW201235140A (en) 2011-01-18 2012-01-03 Adjustment apparatus, laser machining apparatus, and adjustment method
CN2012100127855A CN102601519A (zh) 2011-01-18 2012-01-16 调整装置、激光加工装置和调整方法
KR1020120004842A KR20120083854A (ko) 2011-01-18 2012-01-16 조정 장치, 레이저 가공 장치 및 조정 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011008119A JP5791908B2 (ja) 2011-01-18 2011-01-18 調整装置、レーザ加工装置および調整方法

Publications (3)

Publication Number Publication Date
JP2012148302A JP2012148302A (ja) 2012-08-09
JP2012148302A5 JP2012148302A5 (fr) 2014-02-27
JP5791908B2 true JP5791908B2 (ja) 2015-10-07

Family

ID=46519495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011008119A Expired - Fee Related JP5791908B2 (ja) 2011-01-18 2011-01-18 調整装置、レーザ加工装置および調整方法

Country Status (4)

Country Link
JP (1) JP5791908B2 (fr)
KR (1) KR20120083854A (fr)
CN (1) CN102601519A (fr)
TW (1) TW201235140A (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102879905B (zh) * 2012-09-13 2015-10-28 北京国科世纪激光技术有限公司 一种用于观察光斑方位变换的装置和光束整形方法
CN102922133B (zh) * 2012-11-09 2015-09-16 武汉市楚源光电有限公司 一种自动光学检测激光焊接系统
CN103192165A (zh) * 2013-03-20 2013-07-10 黑龙江科技学院 基于视觉跟踪的六自由度焊接机器人
JP6305013B2 (ja) * 2013-10-28 2018-04-04 株式会社ディスコ 加工装置
CN103639599B (zh) * 2013-12-20 2016-07-06 大族激光科技产业集团股份有限公司 一种激光去毛刺系统及方法
JP6341731B2 (ja) 2014-04-07 2018-06-13 三菱日立パワーシステムズ株式会社 肉盛溶接装置、エロージョンシールドの形成方法及び動翼製造方法
JP2016146403A (ja) * 2015-02-06 2016-08-12 株式会社ディスコ レーザー加工装置
JP6355580B2 (ja) * 2015-03-20 2018-07-11 株式会社キーエンス レーザマーキング装置、該レーザマーキング装置を用いて印字結果を確認する印字確認方法及びコンピュータプログラム
JP6831302B2 (ja) * 2017-06-21 2021-02-17 トヨタ自動車株式会社 レーザ加工品の製造方法および電池の製造方法
KR102511543B1 (ko) 2018-03-09 2023-03-17 삼성디스플레이 주식회사 표시 장치
CN109027974B (zh) * 2018-06-20 2020-05-26 Oppo（重庆）智能科技有限公司 一种光源位置调整装置及调整方法
JP6904927B2 (ja) 2018-07-30 2021-07-21 ファナック株式会社 ロボットシステムおよびキャリブレーション方法
JP7180245B2 (ja) * 2018-09-27 2022-11-30 日本電産株式会社 加工機械用データ処理装置及び加工機械用データ管理システム
CN111872544B (zh) * 2020-07-31 2022-01-18 深圳市学而用科技有限公司 激光出光指示点的标定方法、装置和振镜同轴视觉系统
KR102465812B1 (ko) * 2021-04-08 2022-11-11 주식회사휴비스 레이저 가공장치 보정 시스템 및 레이저 가공장치 보정방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5119728B2 (ja) * 2007-05-08 2013-01-16 ソニー株式会社 レーザ加工装置の較正方法及びレーザ加工装置
JP5090121B2 (ja) * 2007-10-01 2012-12-05 オリンパス株式会社 調整装置、レーザ加工装置、調整方法、および調整プログラム

Also Published As

Publication number Publication date
TW201235140A (en) 2012-09-01
KR20120083854A (ko) 2012-07-26
CN102601519A (zh) 2012-07-25
JP2012148302A (ja) 2012-08-09

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