JP5785862B2 - 静電チャック及びその製造方法、基板温調固定装置 - Google Patents

静電チャック及びその製造方法、基板温調固定装置 Download PDF

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JP5785862B2
JP5785862B2 JP2011262320A JP2011262320A JP5785862B2 JP 5785862 B2 JP5785862 B2 JP 5785862B2 JP 2011262320 A JP2011262320 A JP 2011262320A JP 2011262320 A JP2011262320 A JP 2011262320A JP 5785862 B2 JP5785862 B2 JP 5785862B2
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substrate
green sheet
gas flow
flow path
holes
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JP2013115352A5 (enExample
JP2013115352A (ja
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林　直人
直人 林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011262320A 2011-11-30 2011-11-30 静電チャック及びその製造方法、基板温調固定装置 Active JP5785862B2 (ja)

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JP2013115352A JP2013115352A (ja) 2013-06-10
JP2013115352A5 JP2013115352A5 (enExample) 2014-09-25
JP5785862B2 true JP5785862B2 (ja) 2015-09-30

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10832931B2 (en) * 2014-05-30 2020-11-10 Applied Materials, Inc. Electrostatic chuck with embossed top plate and cooling channels
US11133212B2 (en) * 2018-05-16 2021-09-28 Applied Materials, Inc. High temperature electrostatic chuck
KR102188779B1 (ko) * 2018-10-15 2020-12-08 세메스 주식회사 기판 지지 장치 및 그 제조방법
US12215420B2 (en) 2020-06-09 2025-02-04 Lam Research Corporation Pedestal thermal profile tuning using multiple heated zones and thermal voids

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118915A (ja) * 1999-10-15 2001-04-27 Applied Materials Inc 内蔵チャンネルを有する多層セラミック静電チャック
JP4944600B2 (ja) * 2006-12-28 2012-06-06 新光電気工業株式会社 基板温調固定装置
JP4418484B2 (ja) * 2007-07-04 2010-02-17 日本碍子株式会社 静電チャック及びそれを用いたワークの冷却方法
JP4929150B2 (ja) * 2007-12-27 2012-05-09 新光電気工業株式会社 静電チャック及び基板温調固定装置
JP4612707B2 (ja) * 2008-05-15 2011-01-12 日本特殊陶業株式会社 静電チャック、静電チャック装置、及び静電チャックの製造方法

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