JP5781429B2 - 真空蒸着源のためのインジェクター - Google Patents
真空蒸着源のためのインジェクター Download PDFInfo
- Publication number
- JP5781429B2 JP5781429B2 JP2011281040A JP2011281040A JP5781429B2 JP 5781429 B2 JP5781429 B2 JP 5781429B2 JP 2011281040 A JP2011281040 A JP 2011281040A JP 2011281040 A JP2011281040 A JP 2011281040A JP 5781429 B2 JP5781429 B2 JP 5781429B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- injector
- injection duct
- evaporation source
- vacuum evaporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Description
−横方向供給流路の横方向オリフィスは、該ノズルの上面の近傍に位置付けられる;
これは、インジェクターの底で凝縮してしまった材料がノズルに流れ込むのを防止することを可能にする。
−前記ノズルは、該主流路に垂直な2つの横方向供給流路を備え、該主流路と該横方向供給流路は、縦方向軸に垂直である;
−該主流路は、上部開口により該ノズルの上面を介して該インジェクション・ダクトの内部に開口した上方部分を備える;
−該ノズルの上面は、円錐形状またはとがった形状をしている。
各主流路6の直径は、異なっていてもよい。
前記横方向供給流路7は、前記主流路6から上流に位置する。
前記ノズル3の前記上面5は、角度を形成するために連結された2つの斜面を備えていてもよい。
前記第1の加熱手段15は、前記付加壁16に沿って配置され、縦方向に配置されるいくつかのカートリッジを備えてもよい。
前記第2の加熱手段15’は、前記インジェクション・ダクト1の入口2から円錐部分14まで伸びる。
Claims (5)
- 縦方向軸(11)を有し、かつ真空蒸着源に接続可能な入口(2)および蒸発された材料を拡散するための少なくとも1つのノズル(3)を備えたインジェクション・ダクト(1)を備え、このノズル(3)が側面(4)および上面(5)を持っている
真空蒸着源のためのインジェクターにおいて、
前記ノズル(3)は、インジェクション・ダクト(1)の外側に開口した主流路(6)およびインジェクション・ダクト(1)の内部を前記主流路(6)に連通する少なくとも1つの横方向供給流路(7)を備え、この横方向供給流路(7)が、酸化された材料による前記ノズル(3)の閉塞を防止するため、ノズル(3)の側面(4)を介して前記インジェクション・ダクト(1)の内部に開口する横方向オリフィス(8)を有することを特徴とする真空蒸着源のためのインジェクター。 - 前記横方向供給流路(7)の横方向オリフィス(8)は、前記ノズル(3)の上面(5)の近傍に位置していることを特徴とする請求項1に記載の真空蒸着源のためのインジェクター。
- 前記ノズル(3)は、前記主流路(6)に垂直な2つの横方向供給流路(7)を備え、前記主流路(6)と2つの横方向供給流路(7)が前記縦方向軸(11)に垂直であることを特徴とする請求項1または2に記載の真空蒸着源のためのインジェクター。
- 前記主流路(6)は、前記ノズル(3)の上面(5)を介して前記インジェクション・ダクト(1)の内部に開口した上部開口(29)を有する上方部分(9)を備えている請求項1〜3のいずれか1項に記載の真空蒸着源のためのインジェクター。
- 前記ノズル(3)の上面(5)が、円錐形状またはとがった形状をしていることを特徴とする請求項1〜4のいずれか1項に記載の真空蒸着源のためのインジェクター。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10306524.9A EP2468917B1 (en) | 2010-12-27 | 2010-12-27 | Injector for a vacuum evaporation source |
EP10306524.9 | 2010-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012136777A JP2012136777A (ja) | 2012-07-19 |
JP5781429B2 true JP5781429B2 (ja) | 2015-09-24 |
Family
ID=43875295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011281040A Active JP5781429B2 (ja) | 2010-12-27 | 2011-12-22 | 真空蒸着源のためのインジェクター |
Country Status (9)
Country | Link |
---|---|
US (1) | US8858714B2 (ja) |
EP (1) | EP2468917B1 (ja) |
JP (1) | JP5781429B2 (ja) |
KR (1) | KR101755534B1 (ja) |
CN (1) | CN102534507B (ja) |
DK (1) | DK2468917T3 (ja) |
ES (1) | ES2429343T3 (ja) |
PL (1) | PL2468917T3 (ja) |
SG (1) | SG182124A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3215650A1 (en) * | 2014-11-07 | 2017-09-13 | Applied Materials, Inc. | Material source arrangment and nozzle for vacuum deposition |
TWI737718B (zh) | 2016-04-25 | 2021-09-01 | 美商創新先進材料股份有限公司 | 含有瀉流源的沉積系統及相關方法 |
CN115279935A (zh) * | 2020-03-26 | 2022-11-01 | 应用材料公司 | 蒸发源、具有蒸发源的沉积设备及其方法 |
CN112342529B (zh) * | 2020-09-24 | 2022-12-06 | 杭州盾源聚芯半导体科技有限公司 | 一种具有连接头的喷射管 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1471916A (en) * | 1974-03-14 | 1977-04-27 | Plessey Co Ltd | Fuel injection arrangements having vibrating fuel injection nozzles |
JPH0745530A (ja) * | 1993-07-27 | 1995-02-14 | Shin Etsu Handotai Co Ltd | 縦型気相成長装置 |
US5421522A (en) * | 1993-09-24 | 1995-06-06 | Bex Engineering Ltd. | Nozzle assembly |
JP4063565B2 (ja) * | 2002-03-26 | 2008-03-19 | トヨタ自動車株式会社 | 薄膜の成膜方法 |
KR100490537B1 (ko) * | 2002-07-23 | 2005-05-17 | 삼성에스디아이 주식회사 | 가열용기와 이를 이용한 증착장치 |
DE10256038A1 (de) * | 2002-11-30 | 2004-06-17 | Applied Films Gmbh & Co. Kg | Bedampfungsvorrichtung |
JP4557170B2 (ja) | 2004-11-26 | 2010-10-06 | 三星モバイルディスプレイ株式會社 | 蒸発源 |
WO2008004792A1 (en) * | 2006-07-03 | 2008-01-10 | Yas Co., Ltd. | Multiple nozzle evaporator for vacuum thermal evaporation |
WO2008079209A1 (en) | 2006-12-19 | 2008-07-03 | Veeco Instruments Inc. | Vapor deposition sources and methods |
EP1967604A1 (en) * | 2007-03-08 | 2008-09-10 | Applied Materials, Inc. | Evaporation crucible and evaporation apparatus with directional evaporation |
US7827646B2 (en) * | 2008-02-08 | 2010-11-09 | Tdw Delaware, Inc. | Vortex inhibitor dispersal pig |
EP2321443B1 (en) | 2008-08-11 | 2015-07-22 | Veeco Instruments Inc. | Vacuum deposition sources having heated effusion orifices |
KR101015336B1 (ko) * | 2008-08-22 | 2011-02-16 | 삼성모바일디스플레이주식회사 | 내부 플레이트 및 이를 구비한 증착용 도가니 장치 |
US20100159132A1 (en) * | 2008-12-18 | 2010-06-24 | Veeco Instruments, Inc. | Linear Deposition Source |
WO2010110871A2 (en) * | 2009-03-25 | 2010-09-30 | Veeco Instruments Inc. | Deposition of high vapor pressure materials |
KR100977374B1 (ko) * | 2009-08-03 | 2010-08-20 | 텔리오솔라 테크놀로지스 인크 | 대면적 박막형 cigs 태양전지 고속증착 및 양산장비, 그 공정방법 |
-
2010
- 2010-12-27 PL PL10306524T patent/PL2468917T3/pl unknown
- 2010-12-27 EP EP10306524.9A patent/EP2468917B1/en active Active
- 2010-12-27 DK DK10306524.9T patent/DK2468917T3/da active
- 2010-12-27 ES ES10306524T patent/ES2429343T3/es active Active
-
2011
- 2011-01-06 US US12/985,524 patent/US8858714B2/en active Active
- 2011-01-17 KR KR1020110004651A patent/KR101755534B1/ko active IP Right Grant
- 2011-12-22 JP JP2011281040A patent/JP5781429B2/ja active Active
- 2011-12-22 SG SG2011095981A patent/SG182124A1/en unknown
- 2011-12-27 CN CN201110444997.6A patent/CN102534507B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102534507A (zh) | 2012-07-04 |
JP2012136777A (ja) | 2012-07-19 |
KR20120074172A (ko) | 2012-07-05 |
CN102534507B (zh) | 2016-10-26 |
US8858714B2 (en) | 2014-10-14 |
ES2429343T3 (es) | 2013-11-14 |
KR101755534B1 (ko) | 2017-07-07 |
SG182124A1 (en) | 2012-07-30 |
EP2468917A1 (en) | 2012-06-27 |
DK2468917T3 (da) | 2013-10-14 |
PL2468917T3 (pl) | 2013-11-29 |
US20120160171A1 (en) | 2012-06-28 |
EP2468917B1 (en) | 2013-07-10 |
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