JP5763575B2 - 流量センサおよびその製造方法 - Google Patents

流量センサおよびその製造方法 Download PDF

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Publication number
JP5763575B2
JP5763575B2 JP2012062577A JP2012062577A JP5763575B2 JP 5763575 B2 JP5763575 B2 JP 5763575B2 JP 2012062577 A JP2012062577 A JP 2012062577A JP 2012062577 A JP2012062577 A JP 2012062577A JP 5763575 B2 JP5763575 B2 JP 5763575B2
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JP
Japan
Prior art keywords
semiconductor chip
flow rate
frame
rate detection
detection unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012062577A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013195231A (ja
Inventor
河野　務
務 河野
半沢　恵二
恵二 半沢
徳安　昇
徳安　　昇
忍 田代
忍 田代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2012062577A priority Critical patent/JP5763575B2/ja
Priority to PCT/JP2012/081340 priority patent/WO2013140674A1/ja
Priority to CN201280065517.8A priority patent/CN104024807B/zh
Priority to DE112012006049.0T priority patent/DE112012006049T5/de
Priority to CN201610390927.XA priority patent/CN106092233B/zh
Publication of JP2013195231A publication Critical patent/JP2013195231A/ja
Application granted granted Critical
Publication of JP5763575B2 publication Critical patent/JP5763575B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
JP2012062577A 2012-03-19 2012-03-19 流量センサおよびその製造方法 Expired - Fee Related JP5763575B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012062577A JP5763575B2 (ja) 2012-03-19 2012-03-19 流量センサおよびその製造方法
PCT/JP2012/081340 WO2013140674A1 (ja) 2012-03-19 2012-12-04 流量センサおよびその製造方法
CN201280065517.8A CN104024807B (zh) 2012-03-19 2012-12-04 流量传感器及其制造方法
DE112012006049.0T DE112012006049T5 (de) 2012-03-19 2012-12-04 Strömungssensor mit Herstellungsverfahren
CN201610390927.XA CN106092233B (zh) 2012-03-19 2012-12-04 流量传感器及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012062577A JP5763575B2 (ja) 2012-03-19 2012-03-19 流量センサおよびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015117922A Division JP6045644B2 (ja) 2015-06-11 2015-06-11 流量センサおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2013195231A JP2013195231A (ja) 2013-09-30
JP5763575B2 true JP5763575B2 (ja) 2015-08-12

Family

ID=49222161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012062577A Expired - Fee Related JP5763575B2 (ja) 2012-03-19 2012-03-19 流量センサおよびその製造方法

Country Status (4)

Country Link
JP (1) JP5763575B2 (zh)
CN (2) CN106092233B (zh)
DE (1) DE112012006049T5 (zh)
WO (1) WO2013140674A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6018903B2 (ja) 2012-12-17 2016-11-02 日立オートモティブシステムズ株式会社 物理量センサ
JP5916637B2 (ja) 2013-01-11 2016-05-11 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
US10444175B2 (en) 2015-04-03 2019-10-15 Denso Corporation Measurement device
JP6507804B2 (ja) * 2015-04-03 2019-05-08 株式会社デンソー 空気流量測定装置
JP6553587B2 (ja) * 2016-12-20 2019-07-31 Ｎｉｓｓｈａ株式会社 ガスセンサモジュール及びその製造方法
JP6905962B2 (ja) * 2018-07-12 2021-07-21 日立Astemo株式会社 流量センサ
WO2022208931A1 (ja) * 2021-03-29 2022-10-06 日立Astemo株式会社 流量測定装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0469958A (ja) * 1990-07-10 1992-03-05 Mitsubishi Electric Corp 半導体装置
CN1040577C (zh) * 1990-08-01 1998-11-04 涂相征 一种集成硅膜热流量传感器及其制造方法
JP3882592B2 (ja) * 2001-11-26 2007-02-21 松下電工株式会社 半導体イオンセンサとその製造方法
EP1365216B1 (en) * 2002-05-10 2018-01-17 Azbil Corporation Flow sensor and method of manufacturing the same
JP4609019B2 (ja) * 2004-09-24 2011-01-12 株式会社デンソー 熱式流量センサ及びその製造方法
JP4966526B2 (ja) * 2005-09-07 2012-07-04 日立オートモティブシステムズ株式会社 流量センサ
JP5012330B2 (ja) * 2007-08-29 2012-08-29 株式会社デンソー センサ装置の製造方法及びセンサ装置
JP5168184B2 (ja) * 2009-02-23 2013-03-21 株式会社デンソー センサ装置およびその製造方法
JP5208099B2 (ja) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 流量センサとその製造方法、及び流量センサモジュール
JP5315304B2 (ja) * 2010-07-30 2013-10-16 日立オートモティブシステムズ株式会社 熱式流量計

Also Published As

Publication number Publication date
CN104024807B (zh) 2016-07-06
WO2013140674A1 (ja) 2013-09-26
DE112012006049T5 (de) 2014-12-18
JP2013195231A (ja) 2013-09-30
CN104024807A (zh) 2014-09-03
CN106092233B (zh) 2019-01-22
CN106092233A (zh) 2016-11-09

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