JP5752922B2 - フィルム状部材及びその貼り付け方法 - Google Patents
フィルム状部材及びその貼り付け方法 Download PDFInfo
- Publication number
- JP5752922B2 JP5752922B2 JP2010256933A JP2010256933A JP5752922B2 JP 5752922 B2 JP5752922 B2 JP 5752922B2 JP 2010256933 A JP2010256933 A JP 2010256933A JP 2010256933 A JP2010256933 A JP 2010256933A JP 5752922 B2 JP5752922 B2 JP 5752922B2
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- JP
- Japan
- Prior art keywords
- flexible substrate
- film
- region
- curved surface
- generated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000004458 analytical method Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 description 81
- 230000037303 wrinkles Effects 0.000 description 11
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1866—Handling of layers or the laminate conforming the layers or laminate to a convex or concave profile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24298—Noncircular aperture [e.g., slit, diamond, rectangular, etc.]
- Y10T428/24314—Slit or elongated
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Details Of Aerials (AREA)
- Structure Of Printed Boards (AREA)
- Support Of Aerials (AREA)
Description
図1は、本実施の形態に係るフレキシブル基板を例示する斜視図である。図1を参照するに、フレキシブル基板10は平面状のフレキシブル基板であり、平面視長方形状の4つのスリット10xが形成されている。スリット10xは、フレキシブル基板10を曲面状の面を有する部材に貼り付ける際に皺が生じ難くするために、後述する高い応力が発生する領域に形成されている。フレキシブル基板10の厚さは、例えば、50μm程度とすることができる。フレキシブル基板10は、例えば、アンテナパターン(図示せず)を有しており、携帯端末装置のアンテナとして機能する。フレキシブル基板10は、本発明に係るフィルム状部材の代表的な一例である。
次に、平面状のフレキシブル基板10を曲面状の面を有する上部材11及び下部材12に貼り付ける際にフレキシブル基板10に生じる高い応力が発生する領域をFEM解析する方法について説明する。
10x スリット
11 上部材
12 下部材
Claims (3)
- 曲面状の面を有する部材に、アンテナパターンを有する平面状のフィルム状部材を貼り付けるフィルム状部材の貼り付け方法であって、
前記フィルム状部材を前記曲面状の面を有する部材に貼り付けた場合に、前記フィルム状部材が平面状であったときに比べて高い応力が発生する領域を解析により特定する第1工程と、
前記フィルム状部材の前記高い応力が発生する領域にスリットを形成する第2工程と、
前記スリットが形成された前記フィルム状部材を前記曲面状の面を有する部材に貼り付ける第3工程と、を有し、
前記第3工程は、前記曲面状の面を有する部材を2つ準備し、前記フィルム状部材を2つの前記曲面状の面を有する部材で挟持する工程を含むことを特徴とするフィルム状部材の貼り付け方法。 - 前記第1工程では、FEM解析により、前記高い応力が発生する領域を特定することを特徴とする請求項1記載のフィルム状部材の貼り付け方法。
- 曲面状の面を有する部材に貼り付けられる、アンテナパターンを有する平面状のフィルム状部材であって、
前記フィルム状部材を前記曲面状の面を有する2つの部材で挟持し、前記2つの部材に貼り付けた場合に、前記フィルム状部材が平面状であったときに比べて高い応力が発生する領域にスリットを有することを特徴とするフィルム状部材。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010256933A JP5752922B2 (ja) | 2010-11-17 | 2010-11-17 | フィルム状部材及びその貼り付け方法 |
EP11840732.9A EP2642589A4 (en) | 2010-11-17 | 2011-11-16 | FILM TYPE ELEMENT AND METHOD OF FIXING THE SAME |
US13/884,401 US9142883B2 (en) | 2010-11-17 | 2011-11-16 | Film-like member and attaching method thereof |
CN201180054983.1A CN103210541B (zh) | 2010-11-17 | 2011-11-16 | 膜状部件及其贴附方法 |
PCT/JP2011/076386 WO2012067142A1 (ja) | 2010-11-17 | 2011-11-16 | フィルム状部材及びその貼り付け方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010256933A JP5752922B2 (ja) | 2010-11-17 | 2010-11-17 | フィルム状部材及びその貼り付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012109393A JP2012109393A (ja) | 2012-06-07 |
JP5752922B2 true JP5752922B2 (ja) | 2015-07-22 |
Family
ID=46084065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010256933A Active JP5752922B2 (ja) | 2010-11-17 | 2010-11-17 | フィルム状部材及びその貼り付け方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9142883B2 (ja) |
EP (1) | EP2642589A4 (ja) |
JP (1) | JP5752922B2 (ja) |
CN (1) | CN103210541B (ja) |
WO (1) | WO2012067142A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105383146B (zh) * | 2015-12-10 | 2017-10-31 | 重庆茂江低空交通科技有限公司 | 用于汽车玻璃的刮膜装置 |
CN111862799A (zh) * | 2019-04-26 | 2020-10-30 | 华为技术有限公司 | 贴合设备及其承载膜 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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GB9106317D0 (en) * | 1991-03-25 | 1991-05-08 | Nat Res Dev | Material having a passage therethrough |
JP2737545B2 (ja) * | 1992-06-17 | 1998-04-08 | 日立電線株式会社 | 半導体装置用フィルムキャリアテープ及びその製造方法 |
JPH0618856A (ja) * | 1992-06-30 | 1994-01-28 | Toyota Motor Corp | 3次曲面用液晶調光素子 |
US5863471A (en) * | 1996-12-20 | 1999-01-26 | Emerson Electric Co. | Compressible/expandable humidifier wick and method for manufacture |
US6300140B1 (en) * | 1997-10-01 | 2001-10-09 | Leonard Bloom | Rapid test employing an adhesive slide |
JP2000234506A (ja) * | 1999-02-12 | 2000-08-29 | Fuji Oozx Inc | 内燃機関用バルブスプリングリテーナ |
JP2000258209A (ja) * | 1999-03-08 | 2000-09-22 | Yokogawa Electric Corp | 挿入孔付きパイプ |
US7189447B2 (en) | 2002-01-04 | 2007-03-13 | 3M Innovative Properties Company | Laminates |
JP2003258483A (ja) * | 2002-02-28 | 2003-09-12 | Toppan Printing Co Ltd | 電磁波シールド転写材及び電磁波シールド材 |
CN2554879Y (zh) | 2002-05-24 | 2003-06-04 | 莫列斯公司 | 通讯设备的天线装置 |
JP3859659B2 (ja) * | 2004-03-01 | 2006-12-20 | 株式会社錦織 | アンテナ取付け具 |
JP2005348066A (ja) | 2004-06-02 | 2005-12-15 | Sharp Corp | アンテナ配置構造、および通信端末 |
JP4315290B2 (ja) * | 2005-02-08 | 2009-08-19 | ソニー・エリクソン・モバイルコミュニケーションズ株式会社 | 携帯無線装置及びアンテナ装置 |
JP2008117944A (ja) | 2006-11-06 | 2008-05-22 | Sony Corp | アンテナモジュール用磁芯部材、アンテナモジュール及びこれを備えた携帯情報端末 |
US8105246B2 (en) * | 2007-08-03 | 2012-01-31 | Boston Scientific Scimed, Inc. | Elongate medical device having enhanced torque and methods thereof |
CN201146245Y (zh) | 2007-12-24 | 2008-11-05 | 比亚迪股份有限公司 | 一种无线电信号收发天线装置 |
EP2246185B1 (en) * | 2008-02-19 | 2012-06-27 | Nissha Printing Co., Ltd. | Mesh sheet and housing for electronic devices |
CN102484308A (zh) * | 2009-04-21 | 2012-05-30 | 莫列斯公司 | 三维天线 |
GB0907010D0 (en) * | 2009-04-23 | 2009-06-03 | Vestas Wind Sys As | Improvements in or relating to composite structures |
TW201102702A (en) * | 2010-05-11 | 2011-01-16 | Mastouch Optoelectronics Technologies Co Ltd | Capacitive touch panel |
JP2012019064A (ja) | 2010-07-08 | 2012-01-26 | Mitsubishi Steel Mfg Co Ltd | フレキシブル基板の貼着方法 |
JP5631690B2 (ja) * | 2010-10-15 | 2014-11-26 | セイコーインスツル株式会社 | 粘着ラベルとその作製方法および作製装置 |
-
2010
- 2010-11-17 JP JP2010256933A patent/JP5752922B2/ja active Active
-
2011
- 2011-11-16 CN CN201180054983.1A patent/CN103210541B/zh active Active
- 2011-11-16 US US13/884,401 patent/US9142883B2/en active Active
- 2011-11-16 EP EP11840732.9A patent/EP2642589A4/en not_active Withdrawn
- 2011-11-16 WO PCT/JP2011/076386 patent/WO2012067142A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2642589A1 (en) | 2013-09-25 |
CN103210541B (zh) | 2016-08-10 |
US9142883B2 (en) | 2015-09-22 |
CN103210541A (zh) | 2013-07-17 |
EP2642589A4 (en) | 2014-05-28 |
WO2012067142A1 (ja) | 2012-05-24 |
JP2012109393A (ja) | 2012-06-07 |
US20130222189A1 (en) | 2013-08-29 |
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