JP5741924B2 - 赤外線センサ - Google Patents
赤外線センサ Download PDFInfo
- Publication number
- JP5741924B2 JP5741924B2 JP2011091616A JP2011091616A JP5741924B2 JP 5741924 B2 JP5741924 B2 JP 5741924B2 JP 2011091616 A JP2011091616 A JP 2011091616A JP 2011091616 A JP2011091616 A JP 2011091616A JP 5741924 B2 JP5741924 B2 JP 5741924B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- infrared
- insulating film
- infrared sensor
- thermal element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 196
- 238000010521 absorption reaction Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000006229 carbon black Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011358 absorbing material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910020598 Co Fe Inorganic materials 0.000 description 2
- 229910002519 Co-Fe Inorganic materials 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910020637 Co-Cu Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011091616A JP5741924B2 (ja) | 2011-04-16 | 2011-04-16 | 赤外線センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011091616A JP5741924B2 (ja) | 2011-04-16 | 2011-04-16 | 赤外線センサ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012225693A JP2012225693A (ja) | 2012-11-15 |
JP2012225693A5 JP2012225693A5 (enrdf_load_stackoverflow) | 2014-04-17 |
JP5741924B2 true JP5741924B2 (ja) | 2015-07-01 |
Family
ID=47276033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011091616A Active JP5741924B2 (ja) | 2011-04-16 | 2011-04-16 | 赤外線センサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5741924B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6354465B2 (ja) * | 2014-09-01 | 2018-07-11 | 三菱マテリアル株式会社 | 赤外線センサおよび赤外線センサの感度調整方法 |
JP6511845B2 (ja) * | 2015-02-10 | 2019-05-15 | 三菱マテリアル株式会社 | 非接触温度センサ |
KR102743814B1 (ko) * | 2021-12-10 | 2024-12-17 | (주)세경하이테크 | 적외선 센싱이 가능한 필름 및 이를 포함한 적외선 센서 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3007244B2 (ja) * | 1993-07-22 | 2000-02-07 | シャープ株式会社 | 輻射温度検出器 |
JPH10318829A (ja) * | 1997-05-20 | 1998-12-04 | Ishizuka Denshi Kk | 赤外線センサ |
JP2011013213A (ja) * | 2009-06-02 | 2011-01-20 | Mitsubishi Materials Corp | 赤外線センサ |
-
2011
- 2011-04-16 JP JP2011091616A patent/JP5741924B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012225693A (ja) | 2012-11-15 |
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