JP5740901B2 - 発光装置および表示装置 - Google Patents
発光装置および表示装置 Download PDFInfo
- Publication number
- JP5740901B2 JP5740901B2 JP2010232752A JP2010232752A JP5740901B2 JP 5740901 B2 JP5740901 B2 JP 5740901B2 JP 2010232752 A JP2010232752 A JP 2010232752A JP 2010232752 A JP2010232752 A JP 2010232752A JP 5740901 B2 JP5740901 B2 JP 5740901B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting elements
- column
- emitting element
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N9/00—Details of colour television systems
- H04N9/12—Picture reproducers
- H04N9/30—Picture reproducers using solid-state colour display devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010232752A JP5740901B2 (ja) | 2010-10-15 | 2010-10-15 | 発光装置および表示装置 |
| US13/268,245 US9373274B2 (en) | 2010-10-15 | 2011-10-07 | Light-emitting device and display device |
| US15/167,410 US9786638B2 (en) | 2010-10-15 | 2016-05-27 | Light-emitting device and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010232752A JP5740901B2 (ja) | 2010-10-15 | 2010-10-15 | 発光装置および表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012089572A JP2012089572A (ja) | 2012-05-10 |
| JP2012089572A5 JP2012089572A5 (https=) | 2013-11-14 |
| JP5740901B2 true JP5740901B2 (ja) | 2015-07-01 |
Family
ID=45933785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010232752A Expired - Fee Related JP5740901B2 (ja) | 2010-10-15 | 2010-10-15 | 発光装置および表示装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US9373274B2 (https=) |
| JP (1) | JP5740901B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12009452B2 (en) | 2018-07-23 | 2024-06-11 | Samsung Electronics Co., Ltd. | Electronic device including LED transmission device, and control method therefor |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5845557B2 (ja) | 2010-03-30 | 2016-01-20 | ソニー株式会社 | 半導体発光素子の製造方法 |
| JP5740901B2 (ja) | 2010-10-15 | 2015-07-01 | ソニー株式会社 | 発光装置および表示装置 |
| US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
| TWI457890B (zh) * | 2012-08-17 | 2014-10-21 | 聚積科技股份有限公司 | Display structure and display |
| KR101452768B1 (ko) * | 2012-08-21 | 2014-10-21 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| US9252375B2 (en) | 2013-03-15 | 2016-02-02 | LuxVue Technology Corporation | Method of fabricating a light emitting diode display with integrated defect detection test |
| KR101820275B1 (ko) * | 2013-03-15 | 2018-01-19 | 애플 인크. | 리던던시 스킴을 갖춘 발광 다이오드 디스플레이 및 통합 결함 검출 테스트를 갖는 발광 다이오드 디스플레이를 제작하는 방법 |
| DE102013104046A1 (de) * | 2013-04-22 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Optische Anordnung und Anzeigegerät |
| US9111464B2 (en) | 2013-06-18 | 2015-08-18 | LuxVue Technology Corporation | LED display with wavelength conversion layer |
| JP2015092529A (ja) * | 2013-10-01 | 2015-05-14 | ソニー株式会社 | 発光装置、発光ユニット、表示装置、電子機器、および発光素子 |
| US9450147B2 (en) | 2013-12-27 | 2016-09-20 | Apple Inc. | LED with internally confined current injection area |
| JP6328497B2 (ja) * | 2014-06-17 | 2018-05-23 | ソニーセミコンダクタソリューションズ株式会社 | 半導体発光素子、パッケージ素子、および発光パネル装置 |
| US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
| CN105552190B (zh) * | 2015-04-30 | 2018-10-09 | 美科米尚技术有限公司 | 微型发光二极管 |
| CN105405943A (zh) * | 2015-05-21 | 2016-03-16 | 美科米尚技术有限公司 | 微型发光二极管 |
| KR102377794B1 (ko) * | 2015-07-06 | 2022-03-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| KR102396325B1 (ko) * | 2015-10-12 | 2022-05-13 | 삼성전자주식회사 | 엘이디 디스플레이 장치의 광학 부재 및 엘이디 디스플레이 장치 |
| CN106097900B (zh) * | 2016-06-22 | 2019-04-30 | 深圳市华星光电技术有限公司 | 微发光二极管显示面板 |
| TWI589023B (zh) * | 2016-06-27 | 2017-06-21 | 國立暨南國際大學 | 半導體裝置用基材及使用其之半導體裝置 |
| US10529701B2 (en) * | 2016-09-26 | 2020-01-07 | Prilit Optronics, Inc. | MicroLED display panel |
| US10356858B2 (en) * | 2016-09-26 | 2019-07-16 | Prilit Optronics, Inc. | MicroLED display panel |
| US10141215B2 (en) | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
| JP6298962B1 (ja) * | 2016-11-21 | 2018-03-28 | 台湾▲ロ▼旦股▲分▼有限公司 | チップの固定方法 |
| US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
| US10471545B2 (en) | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
| KR102415243B1 (ko) * | 2017-09-19 | 2022-06-30 | 엘지이노텍 주식회사 | 반도체 모듈 및 이를 포함하는 표시 장치 |
| JP6411685B1 (ja) * | 2017-10-12 | 2018-10-24 | ルーメンス カンパニー リミテッド | ディスプレイ用ledモジュール組立体 |
| KR102419272B1 (ko) * | 2017-12-19 | 2022-07-11 | 엘지디스플레이 주식회사 | 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치 |
| KR101953797B1 (ko) * | 2017-12-26 | 2019-03-04 | 엘지디스플레이 주식회사 | 마이크로led 표시장치 제조방법 |
| JP7157331B2 (ja) * | 2017-12-27 | 2022-10-20 | 日亜化学工業株式会社 | 発光装置 |
| US11037911B2 (en) | 2017-12-27 | 2021-06-15 | Nichia Corporation | Light emitting device |
| US10593852B2 (en) * | 2018-06-20 | 2020-03-17 | Innolux Corporation | Display device having a plurality of main pads, a plurality of redundant pads, and a light-emitting device |
| US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
| KR102558857B1 (ko) | 2018-11-16 | 2023-07-25 | 삼성전자주식회사 | 디스플레이 모듈 및 이를 이용한 대형 디스플레이 장치 |
| KR102653341B1 (ko) | 2018-11-16 | 2024-04-02 | 삼성전자주식회사 | 마스크를 포함하는 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법 |
| KR102652723B1 (ko) | 2018-11-20 | 2024-04-01 | 삼성전자주식회사 | 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법 |
| WO2020167401A1 (en) * | 2019-02-12 | 2020-08-20 | Corning Incorporated | Uniformizing an array of leds having asymmetric optical characteristics |
| KR102801393B1 (ko) | 2019-03-27 | 2025-04-30 | 삼성전자주식회사 | 마이크로 led 전사 장치 및 이를 이용한 마이크로 led 전사 방법 |
| US11387384B2 (en) | 2019-04-16 | 2022-07-12 | Samsung Electronics Co., Ltd. | LED transferring method and display module manufactured by the same |
| KR102702310B1 (ko) | 2019-04-29 | 2024-09-04 | 삼성전자주식회사 | 마이크로 led 전사 방법 및 이에 의해 제조된 디스플레이 모듈 |
| KR102755912B1 (ko) * | 2019-07-12 | 2025-01-17 | 삼성전자주식회사 | Led 전사 방법 및 이에 의해 제조된 디스플레이 모듈 |
| CN110709917B (zh) * | 2019-09-06 | 2021-09-24 | 重庆康佳光电技术研究院有限公司 | 一种led模块及led显示装置 |
| TWI727428B (zh) * | 2019-09-20 | 2021-05-11 | 東貝光電科技股份有限公司 | 微型led面板之製造方法及其微型led面板 |
| US11574895B2 (en) * | 2019-12-19 | 2023-02-07 | Innolux Corporation | Method of manufacturing electronic device |
| WO2020256272A2 (ko) * | 2020-04-23 | 2020-12-24 | 엘지전자 주식회사 | 반도체 발광소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| JP2022152153A (ja) * | 2021-03-29 | 2022-10-12 | セイコーエプソン株式会社 | プロジェクター |
| KR20250020224A (ko) * | 2023-08-03 | 2025-02-11 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072197A (en) * | 1996-02-23 | 2000-06-06 | Fujitsu Limited | Semiconductor light emitting device with an active layer made of semiconductor having uniaxial anisotropy |
| JP4538951B2 (ja) | 2000-12-15 | 2010-09-08 | ソニー株式会社 | 素子の選択転写方法、画像表示装置の製造方法及び液晶表示装置の製造方法 |
| JP4178385B2 (ja) * | 2002-12-03 | 2008-11-12 | 東芝ライテック株式会社 | 照明装置 |
| JP2005306189A (ja) * | 2004-04-21 | 2005-11-04 | Kojima Press Co Ltd | 光源ユニットおよび照明装置 |
| JP2006041283A (ja) * | 2004-07-28 | 2006-02-09 | Sony Corp | 転写方法及び電子装置 |
| JP5564162B2 (ja) * | 2006-09-29 | 2014-07-30 | フューチャー ライト リミテッド ライアビリティ カンパニー | 発光ダイオード装置 |
| JP2010161221A (ja) * | 2009-01-08 | 2010-07-22 | Sony Corp | 実装基板の製造方法、実装基板および発光装置 |
| JP5740901B2 (ja) * | 2010-10-15 | 2015-07-01 | ソニー株式会社 | 発光装置および表示装置 |
-
2010
- 2010-10-15 JP JP2010232752A patent/JP5740901B2/ja not_active Expired - Fee Related
-
2011
- 2011-10-07 US US13/268,245 patent/US9373274B2/en not_active Expired - Fee Related
-
2016
- 2016-05-27 US US15/167,410 patent/US9786638B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12009452B2 (en) | 2018-07-23 | 2024-06-11 | Samsung Electronics Co., Ltd. | Electronic device including LED transmission device, and control method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012089572A (ja) | 2012-05-10 |
| US9786638B2 (en) | 2017-10-10 |
| US9373274B2 (en) | 2016-06-21 |
| US20160276323A1 (en) | 2016-09-22 |
| US20120092389A1 (en) | 2012-04-19 |
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