JP5740768B2 - Manufacturing method of cylindrical current fuse - Google Patents

Manufacturing method of cylindrical current fuse Download PDF

Info

Publication number
JP5740768B2
JP5740768B2 JP2011100281A JP2011100281A JP5740768B2 JP 5740768 B2 JP5740768 B2 JP 5740768B2 JP 2011100281 A JP2011100281 A JP 2011100281A JP 2011100281 A JP2011100281 A JP 2011100281A JP 5740768 B2 JP5740768 B2 JP 5740768B2
Authority
JP
Japan
Prior art keywords
wire
solder
hole
cylinder
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011100281A
Other languages
Japanese (ja)
Other versions
JP2012234624A (en
Inventor
忠一 笠原
忠一 笠原
晃之 豊住
晃之 豊住
小林 啓
啓 小林
加藤 和行
和行 加藤
正 塩沢
正 塩沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koa Corp
Original Assignee
Koa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa Corp filed Critical Koa Corp
Priority to JP2011100281A priority Critical patent/JP5740768B2/en
Priority to CN201210128297.0A priority patent/CN102760614B/en
Publication of JP2012234624A publication Critical patent/JP2012234624A/en
Application granted granted Critical
Publication of JP5740768B2 publication Critical patent/JP5740768B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Fuses (AREA)

Description

本発明は、電子機器等の基板に表面実装して用いるのに好適な筒形電流ヒューズおよびその製造方法に関する。   The present invention relates to a cylindrical current fuse suitable for surface mounting on a substrate of an electronic device or the like and a method for manufacturing the same.

プリント基板等へ表面実装が可能な小型電流ヒューズは、従来から様々な形式のものが提案されている。例えば、特許文献1には、内部に貫通孔を設けた筒形のセラミックスからなるケース本体に可溶体ワイヤを張架し、その両端に金属製のキャップを嵌着させた筒形電流ヒューズが開示されている。   Various types of small current fuses that can be surface-mounted on a printed circuit board have been proposed. For example, Patent Literature 1 discloses a cylindrical current fuse in which a fusible wire is stretched around a case body made of a cylindrical ceramic with a through-hole provided therein, and metal caps are fitted to both ends thereof. Has been.

特許文献2には、セラミックスからなるケース本体と蓋を嵌着して形成した、直方体状のケース内部の中空空間に、可溶体ワイヤを張架したものが開示されている。この筒形電流ヒューズでは、複雑なケース本体と蓋の構造によってコストアップになるという問題がある。   Patent Document 2 discloses a fusible wire stretched in a hollow space inside a rectangular parallelepiped case formed by fitting a case body made of ceramic and a lid. This cylindrical current fuse has a problem that the cost is increased due to the complicated case body and lid structure.

これに対し、特許文献1に記載の筒形電流ヒューズはセラミックス筒体内部の貫通孔に斜めに可溶体ワイヤを張る構造であるので、セラミックス筒体自体の構造は比較的単純である。しかしながら、係る構造の電流ヒューズには以下の問題がある。即ち、セラミックス筒体貫通孔では縁部が適度の丸み(曲率半径R)を介してセラミックス筒体端面につながることが好ましいが、この適度の丸み(曲率半径R)を均一に形成することが製造上難しい。   On the other hand, the cylindrical current fuse described in Patent Document 1 has a structure in which a fusible wire is slanted in a through-hole inside the ceramic cylinder, so that the structure of the ceramic cylinder itself is relatively simple. However, the current fuse having such a structure has the following problems. In other words, it is preferable that the edge of the ceramic cylinder through-hole is connected to the end face of the ceramic cylinder via an appropriate roundness (curvature radius R), but it is possible to manufacture the moderate roundness (curvature radius R) uniformly. It ’s difficult.

実際のセラミックス製品では曲率半径Rが異なり、曲率半径Rのほとんど無い貫通孔縁部が垂直に近い(角が鋭くなっている)場合がある。この場合、可溶体ワイヤに張力を与えつつ張架する時に、セラミックス筒体の貫通孔内周縁部(角部)でワイヤが擦れるため、ワイヤに傷を付けてしまう問題が有る。そして、ワイヤに傷が付き、太さが変わると抵抗が変わり、その部分に電流が集中して溶断特性が安定しない、最悪の場合には機械的ストレスで切れてしまうこともあり得る。   In an actual ceramic product, the radius of curvature R is different, and the edge of the through hole having almost no radius of curvature R may be nearly vertical (having sharp edges). In this case, when the fusible wire is stretched while being tensioned, the wire is rubbed at the inner peripheral edge portion (corner portion) of the through hole of the ceramic cylindrical body, so that there is a problem that the wire is damaged. When the wire is scratched and the thickness changes, the resistance changes, current concentrates at that portion, and the fusing characteristics are not stable. In the worst case, the wire may be cut by mechanical stress.

また、ワイヤに傷を付けないために緩く張架すると、キャップを嵌着し、はんだ溶融時にワイヤが弛んでしまい、ワイヤ長さが安定しないばかりか、ワイヤがセラミックス筒体内部壁面に付着することで溶断特性が安定しない不具合がある。   Also, if the wire is stretched loosely so as not to damage the wire, the cap will be fitted and the wire will loosen when the solder melts, and the wire length will not be stable, and the wire will adhere to the inner wall of the ceramic cylinder There is a problem that the fusing characteristics are not stable.

特開平6−342623号公報JP-A-6-342623 特開平8−162000号公報JP-A-8-162000

本発明は、上述の事情に基づいてなされたもので、セラミックス筒体端面の貫通孔縁部でワイヤを傷をつけずに、セラミックス筒体の貫通孔に斜めに可溶体ワイヤを張り、該ワイヤに張力を付与した状態で該ワイヤの端部を前記筒体端面に固定することができる筒形電流ヒューズの製造方法を提供することを目的とする。   The present invention has been made based on the above-mentioned circumstances, and without damaging the wire at the edge of the through hole on the end surface of the ceramic cylinder, a fusible wire is obliquely attached to the through hole of the ceramic cylinder, and the wire It is an object of the present invention to provide a method of manufacturing a cylindrical current fuse that can fix the end of the wire to the end surface of the cylindrical body in a state where tension is applied to the cylindrical body.

本発明の筒形電流ヒューズは、セラミックス筒体11内部の貫通孔12に斜めに可溶体ワイヤ16を張る構造の筒形電流ヒューズの製造方法において、ワイヤ16を貫通孔12に通して固定する際に、筒体11の貫通孔12の縁部にハトメ状のハンダ15が形成されていることを特徴とする(図5参照)。これにより、ワイヤ16が接触する貫通孔12の縁部を、セラミックスと比較して柔らかいハンダの滑らかな曲面Rとすることができ、ワイヤ16に掛かるストレスを低減でき、ワイヤ16の損傷を防止できる。   The cylindrical current fuse of the present invention is a method of manufacturing a cylindrical current fuse having a structure in which a fusible wire 16 is slanted in a through hole 12 inside a ceramic cylinder 11 when the wire 16 is fixed through the through hole 12. Further, eyelet-like solder 15 is formed at the edge of the through hole 12 of the cylindrical body 11 (see FIG. 5). Thereby, the edge part of the through-hole 12 which the wire 16 contacts can be made into the smooth curved surface R of a soft solder compared with ceramics, the stress concerning the wire 16 can be reduced, and the damage of the wire 16 can be prevented. .

また、可溶体ワイヤ16を貫通孔12に通して固定する際に、ワイヤ16をセラミックス筒体11の端面に沿わせて引っ張り、筒体11の端面のハンダ15にワイヤ16を加熱して溶着するとともに、ワイヤを切断することを特徴とする(図5参照)。これにより、ワイヤ16に張力をかけた状態で貫通孔12内部に斜めに弛み無く張ることができ、ワイヤ16の弛みに基づく溶断特性の劣化を防止できる。さらに、ワイヤ16が筒体端面のハンダ15部分で切断されるので、ワイヤ16を筒体外周面に引き出す必要がなくなり、筒体11自体の構造を簡素化できる。   Further, when the fusible body wire 16 is fixed through the through hole 12, the wire 16 is pulled along the end surface of the ceramic cylinder 11, and the wire 16 is heated and welded to the solder 15 on the end surface of the cylinder 11. At the same time, the wire is cut (see FIG. 5). As a result, the wire 16 can be stretched obliquely without slack in the through-hole 12 in a state where tension is applied to the wire 16, and deterioration of the fusing characteristics due to the slack of the wire 16 can be prevented. Furthermore, since the wire 16 is cut at the solder 15 portion on the end surface of the cylinder, it is not necessary to pull out the wire 16 to the outer peripheral surface of the cylinder, and the structure of the cylinder 11 itself can be simplified.

セラミックス筒体端面にハトメ状のハンダを形成し可溶体ワイヤを張架し切断した段階の断面図である。It is sectional drawing of the step which formed eyelet-like solder on the ceramic cylinder end surface, stretched the soluble body wire, and cut it. セラミックス筒体端面に円板状のハンダ板を配置した断面図である。It is sectional drawing which has arrange | positioned the disk-shaped solder board to the ceramic cylinder end surface. 筒体端面に配置したハンダ板の貫通孔部分を覆う部分をジグで打ち抜く断面図である。It is sectional drawing which punches out the part which covers the through-hole part of the solder board arrange | positioned at the cylinder end surface with a jig. ハトメ状のハンダを形成した段階の断面図である。It is sectional drawing of the step which formed eyelet-like solder. 可溶体ワイヤを張架し、切断する段階の断面図である。It is sectional drawing of the step which stretches and cut | disconnects a soluble body wire. 可溶体ワイヤを切断後の断面図である。It is sectional drawing after cut | disconnecting a soluble body wire. 筒体端部にキャップを嵌着する段階の断面図である。It is sectional drawing of the step of fitting a cap to a cylindrical body edge part. 筒体端部にキャップを嵌着する段階の斜視図である。It is a perspective view of the step of fitting a cap on a cylindrical body end. 筒体端部にキャップを嵌着し、ハンダ接合した段階の拡大断面図である。It is an expanded sectional view in the stage where a cap was fitted to a cylindrical body end and soldered. 図7の変形例を示す図である。It is a figure which shows the modification of FIG.

以下、本発明の実施形態について、図1乃至図10を参照して説明する。なお、各図中、同一または相当する部材または要素には、同一の符号を付して説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 10. In addition, in each figure, the same code | symbol is attached | subjected and demonstrated to the same or equivalent member or element.

図1は本発明の筒形電流ヒューズの概要を示す。このヒューズはセラミックスの筒体11と、該筒体の両端に固定された電極キャップ18と、筒体の内部貫通孔12に設置され電極キャップ18,18間に斜めに張架した可溶体のワイヤ16を備えた筒形電流ヒューズであって、筒体11の端面から筒体11の内面に亘って形成されたハトメ状のハンダ15を備え、ワイヤ16をハンダ15の筒体の端面側で(仮止め)固着したことを特徴とする。   FIG. 1 shows an outline of a cylindrical current fuse of the present invention. This fuse includes a ceramic cylinder 11, an electrode cap 18 fixed to both ends of the cylinder, and a fusible wire installed in the inner through hole 12 of the cylinder and obliquely stretched between the electrode caps 18 and 18. 16 is a cylindrical current fuse including an eyelet-shaped solder 15 formed from the end surface of the cylinder 11 to the inner surface of the cylinder 11, and the wire 16 is connected to the end surface side of the cylinder of the solder 15 ( Temporarily fixed) It is characterized by being fixed.

そして、ワイヤ16の端部は筒体11の外周部まで及んでいない。すなわち、ワイヤ16の端部は筒体11の端面上に設けたハンダ15に固定され、固定された部分で切断されている。ワイヤ16の端部は、後のキャップ18の固定時に、貫通孔12の縁部を覆うハンダ15とキャップ18内に装填したハンダ19とが溶融し、一体となったハンダ20でキャップ18の内面に接続固定される(図7、図9参照)。   The end portion of the wire 16 does not reach the outer peripheral portion of the cylindrical body 11. That is, the end portion of the wire 16 is fixed to the solder 15 provided on the end surface of the cylindrical body 11, and is cut at the fixed portion. At the end of the wire 16, the solder 15 covering the edge of the through-hole 12 and the solder 19 loaded in the cap 18 are melted when the cap 18 is fixed later, and the inner surface of the cap 18 is joined by the integrated solder 20. (See FIGS. 7 and 9).

これにより、従来はワイヤを筒体の外周面に引き出し、外周面に設けた溝等に収容し仮止めしていたが、ワイヤに張力を与えた状態で、ワイヤの端部をハンダ15に固定し切断できる。従って、ワイヤに張力を与えた状態で、斜めに弛み無く張ることができると共に、従来の筒体外周面に設けた溝等が不要となり、構造を簡素化した筒形電流ヒューズが得られる。   As a result, the wire is conventionally pulled out to the outer peripheral surface of the cylindrical body, accommodated in a groove or the like provided on the outer peripheral surface, and temporarily fixed, but the end of the wire is fixed to the solder 15 with tension applied to the wire. Can be cut. Therefore, it is possible to stretch the wire obliquely without slacking in a state where tension is applied to the wire, and a conventional groove or the like provided on the outer peripheral surface of the cylindrical body is unnecessary, and a cylindrical current fuse having a simplified structure can be obtained.

図2乃至図10は本発明の一実施例の筒形電流ヒューズの製造方法を示す。まず、図2に示すように、内部に貫通孔12を備えた外形が略角柱状のセラミックス筒体11を準備する。そして、筒体11の端面上に円板状のハンダ板13を配置する。ハンダ板13は、筒体縁部になめらかな曲面Rを形成するために硬度があり、かつ鉛フリーであるSn−Cu4〜15%のハンダを用いて形成することが好ましい。   2 to 10 show a method of manufacturing a cylindrical current fuse according to an embodiment of the present invention. First, as shown in FIG. 2, a ceramic cylinder 11 having a substantially prismatic outer shape with a through hole 12 therein is prepared. Then, a disk-shaped solder plate 13 is disposed on the end surface of the cylinder 11. The solder plate 13 is preferably formed using Sn—Cu 4-15% solder which is hard and lead-free in order to form a smooth curved surface R at the edge of the cylinder.

そして、図3に示すように、ハンダ板13上から貫通孔12にジグ(ポンチ)14で打ち抜く。これにより、ハンダ板13が変形し、図4に示すように、セラミックス筒体11の端面の貫通孔12の縁部(角部)にリング状のハンダ部分15aと、該ハンダ部分15aから貫通孔の内周面に延びたハンダ部分15bからなる、ハトメ状のハンダ15が形成される。上述のように板状のハンダをジグ14で打ち抜くことで、筒体11の開口部分がハンダ15で覆われ、筒体11の端面から内壁面に亘って滑らかな曲面Rが形成される。図示の例は筒体11の片端面のみを示すが、ハンダ15を筒体11の両端面に形成する。   Then, as shown in FIG. 3, a jig (punch) 14 is punched from the solder plate 13 into the through hole 12. As a result, the solder plate 13 is deformed, and as shown in FIG. 4, a ring-shaped solder portion 15a is formed at the edge (corner portion) of the through-hole 12 on the end surface of the ceramic cylinder 11, and the through-hole is formed from the solder portion 15a. A grommet-like solder 15 is formed, which is composed of a solder portion 15b extending on the inner peripheral surface. By punching the plate-shaped solder with the jig 14 as described above, the opening portion of the cylindrical body 11 is covered with the solder 15, and a smooth curved surface R is formed from the end surface of the cylindrical body 11 to the inner wall surface. Although the illustrated example shows only one end face of the cylinder 11, the solder 15 is formed on both end faces of the cylinder 11.

次に、図5に示すように、可溶体ワイヤ16を貫通孔12内に斜めに張架する。具体的には、筒体11を図示しないジグで保持し、筒体11の貫通孔12にワイヤ16を通す。ワイヤ16の両端部を保持し、セラミックス筒体の端面に対してワイヤ16の両端部を略平行にかつ反対の方向に張力Fを付与する。すなわち、ワイヤ16の図示しない端部では、図示する端部の張力Fと略平行にかつ反対の方向に張力を付与している。ワイヤ16は、張力Fで張った状態でハンダ15に接触し、張力Fを保持している。ワイヤ16は張力Fを受けつつハンダ15に摺接するが、ハンダ15は硬質のハンダであり、内周縁部に滑らかな曲面Rが形成されているので、従来のセラミックス筒体の角部と比較して、擦れて損傷する量を低減できる。なお、張力Fはワイヤ16が弛まない程度に張れる弱い張力で充分である。   Next, as shown in FIG. 5, the fusible body wire 16 is obliquely stretched in the through hole 12. Specifically, the cylindrical body 11 is held by a jig (not shown), and the wire 16 is passed through the through hole 12 of the cylindrical body 11. Both ends of the wire 16 are held, and both ends of the wire 16 are substantially parallel to the end surface of the ceramic cylinder and a tension F is applied in the opposite direction. That is, a tension is applied to the end portion (not shown) of the wire 16 in a direction substantially parallel to and opposite to the tension F of the end portion shown in the figure. The wire 16 is in contact with the solder 15 in a state of being tensioned with the tension F, and maintains the tension F. The wire 16 is in sliding contact with the solder 15 while receiving the tension F, but the solder 15 is hard solder and has a smooth curved surface R formed at the inner peripheral edge, so that it is compared with the corner of a conventional ceramic cylinder. Thus, the amount of damage caused by rubbing can be reduced. It should be noted that the tension F may be a weak tension that can be stretched to such an extent that the wire 16 does not loosen.

この段階でヒータチップ17の先端をハンダ15a上の可溶体ワイヤ16に接触させる。ワイヤ16のヒータチップ先端の接触部分は、瞬間的にハンダの融点以上に加熱される。かかる加熱により、ワイヤ16はハンダ15aに融着し、また、ヒータチップの先端部分においてワイヤが軟化する。ワイヤ16は張力Fで引っ張られているので、ヒータチップの先端部分、即ち軟化した部分でワイヤが切断される。図6はワイヤ16の切断後の状態を示す。この状態でワイヤ16はその端部16aがセラミックス筒体11の端面上に固定され、張力Fを維持しつつ、貫通孔12内に斜めに弛み無く張られる。図示の例はセラミックス筒体11の片端面のみを示すが、ワイヤ固定部16aをセラミックス筒体11の両端面に形成する。ハンダ15はヒータチップ17の押さえ圧力と加熱により変形し、貫通孔12内部に突出する。突出したハンダ15はワイヤ16を包むと同時に貫通孔12を充填する。   At this stage, the tip of the heater chip 17 is brought into contact with the fusible wire 16 on the solder 15a. The contact portion at the tip of the heater chip of the wire 16 is instantaneously heated above the melting point of the solder. By such heating, the wire 16 is fused to the solder 15a, and the wire is softened at the tip portion of the heater chip. Since the wire 16 is pulled with the tension F, the wire is cut at the tip portion of the heater chip, that is, the softened portion. FIG. 6 shows a state after the wire 16 is cut. In this state, the end portion 16a of the wire 16 is fixed on the end face of the ceramic cylinder 11, and the tension is obliquely slackened in the through hole 12 while maintaining the tension F. Although the illustrated example shows only one end face of the ceramic cylinder 11, the wire fixing portions 16 a are formed on both end faces of the ceramic cylinder 11. The solder 15 is deformed by the pressing pressure and heating of the heater chip 17 and protrudes into the through hole 12. The protruding solder 15 wraps the wire 16 and simultaneously fills the through hole 12.

なお、電流ヒューズの製造方法において、ワイヤの切断には種々の方法がある。まず、刃物で切断する方法がある。なお、刃物で切断する場合は刃寿命があるので定期的に交換する必要がある。次に、引張り荷重で切断する方法がある。ただし、この場合、例えば最大ワイヤ径では1kgの荷重が必要になり設備的に大掛かりとなり、また、破断荷重がワイヤ全体にかかるためにワイヤが延びてしまうと同時に破断箇所が一定しない恐れがある。ワイヤを潰して切断する方法もある。ただし、ワイヤに曲り等の損傷を与え特性低下になるという問題がある。上記方法ではワイヤを押さえる力とハンダ付けの熱を利用してワイヤの軟化点で張力により切断するので、ワイヤを損傷するという問題が生ぜず、簡易な設備構成で容易に切断が可能である。   In the current fuse manufacturing method, there are various methods for cutting the wire. First, there is a method of cutting with a blade. In addition, when cutting with a cutter, it has a blade life and needs to be replaced periodically. Next, there is a method of cutting with a tensile load. However, in this case, for example, the maximum wire diameter requires a load of 1 kg, which is large in terms of equipment. Further, since the breaking load is applied to the entire wire, the wire is extended and at the same time, there is a possibility that the breaking point is not constant. There is also a method of crushing and cutting the wire. However, there is a problem that the wire is damaged such as bending and the characteristics are deteriorated. In the above-described method, the wire is softened and the wire is cut by tension using the force for holding the wire and the soldering heat. Therefore, the wire is not damaged, and the wire can be easily cut with a simple equipment configuration.

次に、図7と8に示すように、内部にハンダ19を含むキャップ18をセラミックス筒体11の両端部に嵌着する。図8においてはワイヤ端部16aが露出している状態を示すが、図6等に示すようにハンダ15aによりワイヤ端部16aの全部または一部が覆われる。そして、キャップ18を加熱してハンダ19,15を溶融し、ワイヤの端部16aをキャップ18に接合する。この状態を図9に示す。ここで、ハンダ20はハンダ19,15が溶融して形成されたものである。このキャップ嵌着の工程で本発明の電流ヒューズの製造工程が完了する。なお、この時点でワイヤ16は図6に示す状態から多少弛むが、弛み量は僅かである。そして、ワイヤの端部16aが同質のハンダ19,15によりサンドイッチ状に固定されるので、有機質等を含まず、溶断特性を良好なものとすることができる。また、キャップ18には図10に示すように凸部18cを形成しておいてもよい。これにより、筒体11の端部に嵌着したキャップ18が抜けにくくなる。なお、図7、図10ではキャップ内部のハンダ19が図示されているが、最初に形成するハトメ状のハンダの量がワイヤ16とキャップ18を接続するのに充分であれば、キャップ18内部のハンダ19を省略しても良い。   Next, as shown in FIGS. 7 and 8, caps 18 including solder 19 inside are fitted to both ends of the ceramic cylinder 11. FIG. 8 shows a state in which the wire end portion 16a is exposed. As shown in FIG. 6 and the like, all or a part of the wire end portion 16a is covered with the solder 15a. Then, the cap 18 is heated to melt the solders 19 and 15, and the end 16 a of the wire is joined to the cap 18. This state is shown in FIG. Here, the solder 20 is formed by melting the solders 19 and 15. The manufacturing process of the current fuse of the present invention is completed by this cap fitting process. At this point, the wire 16 is somewhat loosened from the state shown in FIG. 6, but the amount of looseness is slight. And since the edge part 16a of a wire is fixed to the sandwich form by the homogeneous solders 19 and 15, organic substance etc. are not included but a fusing characteristic can be made favorable. Further, the cap 18 may be formed with a convex portion 18c as shown in FIG. Thereby, the cap 18 fitted to the end of the cylindrical body 11 is difficult to come off. 7 and 10, the solder 19 inside the cap is illustrated. However, if the amount of the eyelet-shaped solder to be formed first is sufficient to connect the wire 16 and the cap 18, The solder 19 may be omitted.

上述した電流ヒューズの製造方法によれば、筒体端面の貫通孔縁部にハンダをジグで打ち抜き形成することで、ハンダの内周縁部には、下地セラミックス筒体の縁部(角部)の形状にかかわらず、滑らかな曲面Rが形成される。これにより、ワイヤが接触する貫通孔縁部を滑らかな曲面Rとすることができ、且つセラミックスと比較して柔らかいハンダとすることができ、ワイヤ固定時のワイヤに掛かるストレスを低減でき、ワイヤの損傷を低減できる。また、ハトメ状のハンダで内周縁部を覆う上述の方法と、セラミックス筒体の内周縁部及び外周縁部に予め適度の丸み(曲率半径R)を形成する構造とを併用することがより好ましい。   According to the above-described current fuse manufacturing method, solder is punched and formed at the edge of the through hole on the end face of the cylinder, so that the inner peripheral edge of the solder has an edge (corner) of the base ceramic cylinder. A smooth curved surface R is formed regardless of the shape. As a result, the edge of the through hole with which the wire comes into contact can be made a smooth curved surface R, and can be made of a softer solder than ceramics, and the stress applied to the wire when the wire is fixed can be reduced. Damage can be reduced. It is more preferable to use in combination the above-described method of covering the inner peripheral edge with eyelet-shaped solder and a structure in which appropriate roundness (curvature radius R) is formed in advance on the inner peripheral edge and the outer peripheral edge of the ceramic cylinder. .

さらに、ワイヤを貫通孔に通して固定する際に、ワイヤを筒体端面に沿わせて引っ張り、筒体端面のハンダにワイヤを固着するとともに、ワイヤを切断することで、ワイヤに張力をかけた状態で貫通孔内に斜めに弛み無く張ることができる。これにより、ワイヤの弛みによる貫通孔内壁面への接触等に基づく溶断特性の劣化を低減できる。   Furthermore, when fixing the wire through the through-hole, the wire was pulled along the end surface of the cylinder, the wire was fixed to the solder on the end surface of the cylinder, and the wire was cut to apply tension to the wire. In the state, it can be stretched diagonally without slack in the through hole. Thereby, deterioration of the fusing characteristic based on contact with the inner wall surface of the through hole due to loosening of the wire can be reduced.

さらに、ワイヤの固定時に、ワイヤが筒体端面のハンダ部分で切断される。これにより、ワイヤを筒体外周面に引き出す必要がなくなり、特許文献1で必要とされる溝2が不要となり、筒体自体の構造を簡素化でき、製造工程を簡素化できる。従って、本発明によれば、自動化が容易な工程で、溶断特性のバラツキの少ない筒形電流ヒューズの量産が可能である。   Further, when the wire is fixed, the wire is cut at the solder portion on the end face of the cylindrical body. Thereby, it is not necessary to pull out the wire to the outer peripheral surface of the cylinder, the groove 2 required in Patent Document 1 is unnecessary, the structure of the cylinder itself can be simplified, and the manufacturing process can be simplified. Therefore, according to the present invention, it is possible to mass-produce cylindrical current fuses with little variation in fusing characteristics in a process that is easy to automate.

これまで本発明の一実施形態について説明したが、本発明は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。   Although one embodiment of the present invention has been described so far, it is needless to say that the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea.

本発明は、表面実装に好適な筒形電流ヒューズの製造に利用可能である。   The present invention can be used for manufacturing a cylindrical current fuse suitable for surface mounting.

Claims (6)

セラミックス筒体内部の貫通孔に斜めに可溶体ワイヤを張る構造の筒形電流ヒューズの製造方法において、
前記ワイヤを前記貫通孔に通して固定する際に、前記筒体両端面の貫通孔縁部にハンダを予め形成し、前記ワイヤを前記ハンダで固定することを特徴とする筒形電流ヒューズの製造方法。
In the method of manufacturing a cylindrical current fuse having a structure in which a fusible wire is slanted in a through hole inside a ceramic cylinder,
When the wire is fixed through the through hole, solder is formed in advance at the edge of the through hole on both end faces of the cylindrical body, and the wire is fixed with the solder. Method.
前記ワイヤを前記貫通孔に通して固定する際に、前記ワイヤを前記筒体両端面に沿って引っ張り、前記筒体両端面の前記ハンダに前記ワイヤを固定するとともに、前記ワイヤを破断することを特徴とする請求項1に記載の筒形電流ヒューズの製造方法。   When fixing the wire through the through-hole, the wire is pulled along both end surfaces of the cylindrical body, the wire is fixed to the solder on both end surfaces of the cylindrical body, and the wire is broken. The method of manufacturing a cylindrical current fuse according to claim 1, wherein: 前記筒体端面上にハンダ円板を配置し、前記ハンダ円板上から前記貫通孔にジグで打ち抜くことで、前記筒体端面の前記貫通孔縁部にリング上のハンダ部分と該ハンダ部分から延びる前記貫通孔内周面のハンダ部分からなる前記ハンダを形成することを特徴とする請求項1に記載の筒形電流ヒューズの製造方法。   A solder disk is arranged on the end surface of the cylinder, and a jig is punched out from the solder disk to the through hole, so that the edge of the through hole on the end surface of the cylinder has a solder portion on the ring and the solder portion. 2. The method of manufacturing a cylindrical current fuse according to claim 1, wherein the solder is formed of a solder portion on the inner peripheral surface of the through hole that extends. 前記ハンダは鉛フリーで硬度のあるSn−Cu4〜15%のハンダを用いて形成することを特徴とする請求項1に記載の筒形電流ヒューズの製造方法。   2. The method of manufacturing a cylindrical current fuse according to claim 1, wherein the solder is formed by using lead-free and hard Sn—Cu 4 to 15% solder. 3. セラミックスの筒体と、該筒体の両端に固定された電極キャップと、前記筒体の内部に設置され前記電極キャップ間に張架した可溶体のワイヤを備えた筒形電流ヒューズであって、
前記筒体の端面から前記筒体の内面に亘って形成されたハンダを備え、
前記ワイヤの端部を前記ハンダの前記筒体の内壁面からの延長面を超える端面で固着し、前記ワイヤの端部は前記筒体の外周部まで及んでいないことを特徴とする筒形電流ヒューズ。
A cylindrical current fuse comprising a ceramic cylinder, electrode caps fixed to both ends of the cylinder, and a fusible wire installed inside the cylinder and stretched between the electrode caps,
Solder formed from the end surface of the cylindrical body to the inner surface of the cylindrical body,
Cylindrical, characterized in that said end of the wire is fixed on the end face than the extended surface from the inner wall surface of the cylindrical body of the solder, the end of the wire does not extend to the outer peripheral portion of the cylindrical body Current fuse.
前記ワイヤが貫通孔縁部を覆うハンダとキャップ内に装填したハンダとが溶融し、一体となったハンダで固定されていることを特徴とする請求項5に記載の筒形電流ヒューズ。
The cylindrical current fuse according to claim 5, wherein the solder covering the edge of the through hole and the solder loaded in the cap are melted and fixed with an integrated solder.
JP2011100281A 2011-04-28 2011-04-28 Manufacturing method of cylindrical current fuse Active JP5740768B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011100281A JP5740768B2 (en) 2011-04-28 2011-04-28 Manufacturing method of cylindrical current fuse
CN201210128297.0A CN102760614B (en) 2011-04-28 2012-04-27 The manufacture method of tubular current fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011100281A JP5740768B2 (en) 2011-04-28 2011-04-28 Manufacturing method of cylindrical current fuse

Publications (2)

Publication Number Publication Date
JP2012234624A JP2012234624A (en) 2012-11-29
JP5740768B2 true JP5740768B2 (en) 2015-07-01

Family

ID=47055030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011100281A Active JP5740768B2 (en) 2011-04-28 2011-04-28 Manufacturing method of cylindrical current fuse

Country Status (2)

Country Link
JP (1) JP5740768B2 (en)
CN (1) CN102760614B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11996253B2 (en) 2019-05-14 2024-05-28 Korea Electric Terminal Co., Ltd. High voltage fuse having ring separation prevention structure

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6373640B2 (en) * 2014-05-12 2018-08-15 Koa株式会社 Manufacturing method of cylindrical current fuse
US20180108507A1 (en) * 2016-10-14 2018-04-19 GM Global Technology Operations LLC Fuse element and method of fabrication
DE102019122611A1 (en) * 2019-08-22 2021-02-25 Endress+Hauser SE+Co. KG SMD-solderable component and method for producing an SMD-solderable component
JP7302627B2 (en) * 2021-06-11 2023-07-04 株式会社プロテリアル Wire connection structure, wire connection method, medical device, and method for manufacturing medical device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235307A (en) * 1992-08-10 1993-08-10 Littelfuse, Inc. Solderless cartridge fuse
JPH06342623A (en) * 1993-06-01 1994-12-13 S O C Kk Chip fuse
DE19644026A1 (en) * 1996-10-31 1998-05-07 Wickmann Werke Gmbh Electrical fuse element and method for its production
US6147585A (en) * 1997-01-30 2000-11-14 Cooper Technologies Company Subminiature fuse and method for making a subminiature fuse
US20060119465A1 (en) * 2004-12-03 2006-06-08 Dietsch G T Fuse with expanding solder
CN101807500B (en) * 2009-02-13 2012-01-11 Aem科技(苏州)股份有限公司 Surface mounting fuse protector and manufacturing method thereof
US9224564B2 (en) * 2010-06-04 2015-12-29 Littelfuse, Inc. Fuse with counter-bore body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11996253B2 (en) 2019-05-14 2024-05-28 Korea Electric Terminal Co., Ltd. High voltage fuse having ring separation prevention structure

Also Published As

Publication number Publication date
CN102760614A (en) 2012-10-31
JP2012234624A (en) 2012-11-29
CN102760614B (en) 2016-06-22

Similar Documents

Publication Publication Date Title
JP5740768B2 (en) Manufacturing method of cylindrical current fuse
JP5268970B2 (en) Press-fit terminal
JP5622480B2 (en) Fast blow fuse
US20100060406A1 (en) Small-sized surface-mounted fuse and method of manufacturing the same
US20110181385A1 (en) Thermal fuse
JP2011511406A (en) Electrical protection parts with short circuit device
JP2007087930A (en) Threaded terminal
US5398165A (en) Electronic circuit component and mounting method therefor
JP4348385B2 (en) Surface-mount current fuse
JP5789882B2 (en) Manufacturing method of cylindrical current fuse
JP2006059568A (en) Fuse and circuit board
JP2008052961A (en) Surface-mounted current fuse, and its manufacturing method
KR100929822B1 (en) Surface-Mount Small Fuses
KR102461381B1 (en) Fuse element and manufacturing method of it
JP4752139B2 (en) Manufacturing method of thermal fuse
US20090079288A1 (en) Motor winding bobbin and terminal structure thereof
JP2007035424A (en) Connection method of wire
JP7023557B1 (en) Electronic component removal jig
JP2012226932A (en) Thermal fuse and method of manufacturing the same
JP2009289513A (en) Fuse
JP2007180255A (en) Printed wiring board and substitutive pad
JP3563202B2 (en) Electronic components
JP2005286182A (en) Electronic component and manufacturing method thereof
JP5955597B2 (en) Electric wire fuse and method of manufacturing electric wire fuse
WO2015053090A1 (en) Fuse element and manufacturing method therefor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140404

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141216

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141217

RD13 Notification of appointment of power of sub attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7433

Effective date: 20150108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150122

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150407

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150410

R150 Certificate of patent or registration of utility model

Ref document number: 5740768

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250