WO2015053090A1 - Fuse element and manufacturing method therefor - Google Patents

Fuse element and manufacturing method therefor Download PDF

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Publication number
WO2015053090A1
WO2015053090A1 PCT/JP2014/075528 JP2014075528W WO2015053090A1 WO 2015053090 A1 WO2015053090 A1 WO 2015053090A1 JP 2014075528 W JP2014075528 W JP 2014075528W WO 2015053090 A1 WO2015053090 A1 WO 2015053090A1
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Prior art keywords
chip
point metal
low melting
melting point
fusible body
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PCT/JP2014/075528
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French (fr)
Japanese (ja)
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岩田　匡司
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矢崎総業株式会社
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Publication of WO2015053090A1 publication Critical patent/WO2015053090A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices

Definitions

  • the present invention relates to a fuse fusible body and a method for manufacturing the same.
  • FIG. 5 shows a fuse fusible body disclosed in Patent Document 1 below.
  • This fuse fusible body 100 includes a substantially strip-shaped fusible body main body 110 and a low melting point metal chip 120 welded in the middle in the longitudinal direction of the fusible body main body 110.
  • the fusible body 110 is low in a substantially strip-like body plate portion 111 that conducts and connects between a pair of connection terminal plates (not shown), and a chip placement portion 111 a that is set at an intermediate portion on the body plate portion 111.
  • a chip crimping piece 112 for temporarily fixing the melting point metal chip 120 and a damming piece 113 provided at a position away from the chip mounting part 111a in the longitudinal direction of the main body plate part 111 are provided.
  • the fusible body 110 is made of a copper or copper alloy plate and is integrally formed with a pair of connection terminal plates (not shown).
  • each damming piece 113 of the fusible body main body 110 are equipped at two places sandwiching the chip mounting portion 111a. As shown in FIG. 6, each damming piece 113 extends from the side surface of the main body plate portion 111 and is folded on the main body plate portion 111.
  • the low melting point metal chip 120 is made of a metal such as tin or lead having a melting point lower than that of the fusible body 110, and is fixed to the chip mounting portion 111a by the chip crimping piece 112 as shown in FIG. Then, it is heated and welded to the chip mounting portion 111a.
  • the damming pieces 113 on both sides of the chip mounting part 111a prevent the molten low melting point metal from flowing out beyond the expected range when the low melting point metal chip 120 is welded to the chip mounting part 111a. .
  • the structure of the fusible body main body 110 is complicated by the provision of the chip crimping piece 112, which may increase the cost.
  • the low melting point metal chip 120 is welded to the chip mounting portion 111a by irradiating the low melting point metal chip 120 with a laser. Most of the surface of the chip 120 is exposed to the air. Therefore, the surface of the low melting point metal chip 120 is oxidized by contact with oxygen, so that it does not melt within a specified time, or the current value to be melted deviates from the rating, resulting in a variation in fusing performance. Reliability could be reduced.
  • an object of the present invention is to solve the above-mentioned problems, and can reduce the cost by simplifying the structure of the fusible body, and can oxidize the low melting point metal chip welded to the fusible body.
  • An object of the present invention is to provide a fuse fusible body capable of stably producing a fuse fusible body having high reliability with respect to fusing performance and a method for manufacturing the same.
  • a low melting point metal chip that melts the fusible body when a current of a rating or more flows through the fusible body, and a fuse fusible body comprising:
  • the fusible body main body is provided with a chip engagement hole,
  • the low melting point metal chip before welding is a fuse fusible body that is temporarily fixed to the fusible body main body by engagement with the chip engagement hole.
  • the low melting point metal tip formed in a cylindrical shape has an opening larger than an opening width of at least a part of the low melting point metal chip and an opening smaller than an outer width of at least a part of the low melting point metal chip.
  • a chip positioning step The low melting point metal chip placed on the chip placement part is pressed by the chip placement part, and at least a part of the opening edge portion of the low melting point metal chip bites into the chip engagement hole.
  • a chip pressing process in which a low melting point metal chip is temporarily fixed to the chip mounting portion; A high temperature gas is supplied around the low melting point metal chip so that the surface of the low melting point metal chip temporarily fixed to the chip mounting part is covered with the high temperature gas, and the low melting point metal chip is mounted on the chip mounting part.
  • a method of manufacturing a fusible fuse body comprising: a chip welding step to be welded to the mounting portion.
  • the high temperature gas is sent from the lower side of the chip mounting portion to the inner peripheral portion of the low melting point metal chip and the outer peripheral portion of the low melting point metal tip, respectively.
  • the movement of the low melting point metal tip in a direction orthogonal to the central axis of the opening is regulated by a positioning jig for positioning the outer periphery of the low melting point metal tip.
  • the low melting point metal tip is temporarily fixed to the fusible body main body by engagement with the chip engaging hole formed in the fusible body main body. Accordingly, the fusible body does not need to be provided with a chip crimping piece that causes a complicated structure, and the cost can be reduced by simplifying the structure of the fusible body.
  • the configuration of (2) above when the low melting point metal chip temporarily fixed to the chip mounting part is welded to the chip mounting part of the fusible body, the surface of the low melting point metal chip is covered with the high temperature gas. Since the welding to the chip mounting portion proceeds in a broken state, the contact of oxygen in the air with the low melting point metal chip can be suppressed, and the oxidation of the surface of the low melting point metal chip to be welded can be suppressed. Therefore, variation in the fusing performance due to oxidation of the low melting point metal chip is suppressed, and it becomes possible to stably produce a fuse fusible body having high reliability with respect to the fusing performance.
  • the low melting point metal chip when the low melting point metal chip is welded to the chip mounting part of the fusible body, the low melting point metal chip is placed under the chip mounting part on each of the inner peripheral part and the outer peripheral part. Hot gas is sent from the side. As a result, the welding of the low melting point metal chip can proceed while the majority of the surface of the low melting point metal chip is covered with the high temperature gas, and the oxidation of the surface of the low melting point metal chip to be welded is effectively suppressed. be able to.
  • the low melting point metal chip with respect to the chip mounting part is regulated by the positioning jig in the chip pressing process, the low melting point metal chip is temporarily placed on the chip mounting part with high accuracy. Can be fixed. As a result, the supply position of the high-temperature gas in the chip welding step can be positioned with high accuracy with respect to the low melting point metal chip, and the quality of the fuse fusible body to be manufactured can be stabilized.
  • the fuse fusible body according to the present invention eliminates the need for a chip caulking piece in the fusible body, and can reduce the cost by simplifying the structure of the fusible body.
  • oxidation of the low melting point metal chip welded to the fusible body body is suppressed, and a fuse fusible body having high reliability with respect to fusing performance can be stably produced. .
  • FIG. 1 is a schematic configuration diagram of a fuse fusible body manufactured by an embodiment of a method for manufacturing a fuse fusible body according to the present invention.
  • FIG. 2 is an explanatory diagram of the steps of the method for manufacturing the fuse fuse body according to the embodiment of the present invention.
  • FIG. 3 is an explanatory diagram of the chip pressing process shown in FIG.
  • FIG. 4 is an explanatory view of the chip welding process shown in FIG.
  • FIG. 5 is a perspective view showing a configuration of a conventional fuse fusible body.
  • FIG. 6 is a perspective view showing a state in the middle of manufacturing the fuse fusible body shown in FIG.
  • a fuse fusible body 1 manufactured by a fuse fusible body manufacturing method includes a substantially strip-shaped fusible body main body 10 and a longitudinal direction of the fusible body main body 10. And a low melting point metal tip 20 provided by welding in the middle.
  • the fusible body main body 10 has a substantially strip-like structure formed in a Z-shape for conducting and connecting between a pair of connection terminal plates 2 and 3.
  • the fusible body 10 is integrally formed with a pair of connection terminal plates 2 and 3 from, for example, a copper or copper alloy plate material.
  • connection terminal plates 2 and 3 that are conductively connected by the fusible body 10 are connected in series to a circuit to be protected.
  • the fusible body main body 10 of the present embodiment includes a substantially strip-shaped main body plate portion 11 that conducts and connects between the pair of connection terminal plates 2 and 3 and a substantially circular shape formed in the middle of the main body plate portion 11 in the longitudinal direction. And a plate-shaped chip mounting portion 12. As shown in FIG. 3, the chip mounting portion 12 is formed with a chip engaging hole 13 penetrating through the center thereof. As shown in FIG. 3, the tip engagement hole 13 has an inner diameter d1 that is larger than an inner diameter D1 of a low-melting-point metal tip 20, which will be described later, and smaller than an outer diameter D2 of the low-melting-point metal tip 20. ing.
  • the chip engagement hole 13 is larger than at least a part of the opening width (inner diameter D1) of the low melting point metal chip 20, and is larger than at least a part of the outer width (outer diameter D2) of the low melting point metal chip 20. It has a small opening (inner diameter d1 portion).
  • the low melting point metal chip 20 is formed in a straight cylindrical shape having an inner diameter D1 and an outer diameter D2.
  • the inner diameter D1 and the outer diameter D2 of the low melting point metal tip 20 are set such that D1 ⁇ d1 ⁇ D2 with respect to the inner diameter d1 of the tip engagement hole 13 formed in the tip mounting portion 12.
  • the shape of the low melting point metal tip in the present invention is not limited to the cylindrical shape in the present embodiment, and may be a rectangular tube shape or an elliptical cylinder shape, and the shape of the chip engagement hole is also limited to a circular shape. is not.
  • the tip engagement hole has a configuration having an opening larger than the opening width of at least a part of the low melting point metal tip and an opening smaller than the outer width of at least a part of the low melting point metal tip.
  • the melting point metal tip and the tip engagement hole can take various shapes.
  • the low melting point metal chip 20 is formed of a metal such as tin or lead having a lower melting point than the fusible body 10. As shown in FIG. 3, the low melting point metal chip 20 of the present embodiment is pressed against the chip mounting portion 12 by a pressing punch 40, so that at least a part of the opening edge of the low melting point metal chip 20 is formed. The portion 20 c is engaged by biting into the chip engagement hole 13 and is temporarily fixed to the chip mounting portion 12. The low melting point metal chip 20 temporarily fixed to the chip mounting part 12 is welded to the chip mounting part 12 of the fusible body main body 10 by heating with a high temperature gas G described later. The low melting point metal chip 20 is melted when a current exceeding the rated value flows through the fusible body 10 and melts the fusible body 10.
  • a metal such as tin or lead having a lower melting point than the fusible body 10.
  • the fuse fusible body manufacturing method according to the present embodiment performs the chip positioning step S1, the chip press-contacting step S2, and the chip welding step S3 in order, so that the fuse shown in FIG. A soluble body 1 is produced.
  • the low melting point metal tip 20 formed in a cylindrical shape has a center of an inner diameter D1 of the opening in the low melting point metal chip 20 and an inner diameter d1 in the chip engagement hole 13 as shown in FIG. It is mounted on the chip mounting part 12 so that the center of the opening of the chip substantially coincides. At that time, the opening center axis of the low melting point metal chip 20 placed on the chip placement part 12 is positioned on the opening center axis of the chip engagement hole 13 by the positioning jig 30.
  • the positioning jig 30 has a guide hole 32 through which the low melting point metal chip 20 is inserted into a flat jig body 31 having a plate thickness t smaller than the height H of the low melting point metal chip 20.
  • the outer periphery of the low melting point metal tip 20 is positioned by the guide hole 32.
  • the relative position with respect to the fusible body 10 is set so that the positioning jig 30 is positioned in the middle of the height direction of the low melting point metal tip 20 (the direction of the arrow Y1 in FIG. 3).
  • the low melting point metal chip 20 placed on the chip placement unit 12 in the chip positioning step S1 is pressed by the chip placement unit 12 by the punch 40 for pressing.
  • the low melting point metal chip 20 is temporarily fixed to the chip mounting portion 12.
  • the pressing of the low melting point metal chip 20 by the punch 40 causes the positioning jig 30 to move the low melting point metal chip 20 in a direction orthogonal to the opening center axis as shown in FIG. Performed in a regulated state.
  • the inner peripheral portion 20a of the low melting point metal tip 20 and the outer peripheral portion 20b of the low melting point metal tip 20 are respectively disposed at a plurality of locations.
  • the low melting point metal chip 20 is welded to the chip mounting portion 12 by sending the high temperature gas G.
  • the supply position of the high temperature gas G in the outer peripheral portion 20b of the low melting point metal tip 20 is the outer peripheral portion 20b of the low melting point metal tip 20 and a plurality of locations equally spaced in the circumferential direction.
  • the low melting point metal chip 20 is temporarily fixed to the fusible body main body 10 by engagement with the chip engagement hole 13 formed in the fusible body main body 10. Accordingly, the fusible body 10 does not need to be provided with a chip crimping piece that leads to a complicated structure, and the cost can be reduced by simplifying the structure of the fusible body 10.
  • the low melting point metal chip 20 when the low melting point metal chip 20 is welded to the chip mounting portion 12 of the fusible body body 10, the low melting point metal chip 20 has a surface thereof. Since the welding to the chip mounting portion 12 proceeds in a state covered with the high temperature gas G, the contact of oxygen in the air with the low melting point metal chip 20 is suppressed, and the surface of the low melting point metal chip 20 to be welded is suppressed. Oxidation can be suppressed. Therefore, variation in the fusing performance due to the oxidation of the low melting point metal chip 20 is suppressed, and it becomes possible to stably produce a fuse fuse with high reliability with respect to the fusing performance.
  • the low melting point metal chip 20 when the low melting point metal chip 20 is welded to the chip mounting portion 12 of the fusible body body 10, the low melting point metal chip 20 is shown in FIG.
  • the hot gas G is sent from the lower side of the chip mounting part 12 to each of the inner peripheral part 20a and the outer peripheral part 20b.
  • welding of the low melting point metal chip 20 can be advanced in a state where most of the surface of the low melting point metal chip 20 is covered with the high temperature gas G, and the oxidation of the surface of the low melting point metal chip 20 to be welded is effective. Can be deterred.
  • the low melting point metal chip 20 since the position of the low melting point metal chip 20 with respect to the chip mounting portion 12 is regulated by the positioning jig 30 in the chip pressing step S2, the low melting point metal chip 20 is used. Can be temporarily fixed to the chip mounting portion 12 with high accuracy. As a result, the supply position of the high temperature gas G in the chip welding process can be positioned with high accuracy with respect to the low melting point metal chip 20, and the quality of the fuse fusible body 1 to be manufactured can be stabilized.
  • this invention is not limited to embodiment mentioned above, A deformation
  • the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved. Further, this application is based on a Japanese patent application (Japanese Patent Application No. 2013-213033) filed on Oct. 10, 2013, the contents of which are incorporated herein by reference.
  • the planar shape of the chip mounting portion in the fusible body is not limited to a circle but may be a rectangle or an ellipse.
  • the shape of the chip engagement hole formed in the chip mounting portion is not limited to a circle, and can be set to an arbitrary polygonal shape.
  • a fuse fusible body comprising: The fusible body (10) is provided with a tip engagement hole (13), The fuse melting body (1) in which the low melting point metal tip (20) before welding is temporarily fixed to the fusible body body (10) by engagement with the chip engagement hole (13).
  • the low melting point metal tip (20) formed in a cylindrical shape has an opening larger than the opening width (inner diameter D1) of at least a part of the low melting point metal tip (20) and the low melting point metal tip (20).
  • the low melting point metal chip (20) placed on the chip placement part (12) is pressed by the chip placement part (12), and at least a part of the opening edge of the low melting point metal chip (20).
  • a chip pressing process in which the portion (20c) bites into the chip engaging hole (13) and the low melting point metal chip (20) is temporarily fixed to the chip mounting section (12);
  • a high temperature gas (G) is provided around the low melting point metal chip (20) so that the high temperature gas (G) covers the surface of the low melting point metal chip (20) temporarily fixed to the chip mounting portion (12).
  • a chip welding step in which the low melting point metal chip (20) is welded to the chip mounting portion (12).
  • a direction perpendicular to the central axis of the opening of the low melting point metal tip (20) is determined by a positioning jig (30) for positioning the outer periphery of the low melting point metal chip (20).
  • the fuse fusible body according to the present invention no chip crimping piece is required in the fusible body, and the cost can be reduced by simplifying the structure of the fusible body.
  • the method for manufacturing a fuse fusible body according to the present invention oxidation of the low melting point metal chip welded to the fusible body body is suppressed, and a fuse fusible body having high reliability with respect to fusing performance can be stably produced. .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)

Abstract

This manufacturing method has the following steps: a chip positioning step (S1) in which a cylindrical low-melting-point metal chip is placed on a chip placement section of a main fuse-element body in which a chip engagement hole is formed so as to pass through said main fuse-element body; a chip pressure-bonding step (S2) in which the low-melting-point chip placed on the chip placement section is pressed into said chip placement section such that the edge of an opening in the low-melting-point chip bites into the inside of the chip engagement hole, provisionally affixing the low-melting-point chip to the chip placement section; and a chip welding step (S3) in which a high-temperature gas is fed to both the inside and the outside of the low-melting-point chip, welding the low-melting-point chip to the chip placement section.

Description

ヒューズ可溶体及びその製造方法Fusible fuse and method for manufacturing the same
　本発明は、ヒューズ可溶体及びその製造方法に関する。 The present invention relates to a fuse fusible body and a method for manufacturing the same.
　図５は、下記特許文献１に開示されたヒューズ可溶体を示したものである。
　このヒューズ可溶体１００は、略帯板状の可溶体本体１１０と、該可溶体本体１１０の長手方向の中間に溶着された低融点金属チップ１２０と、を備えている。 FIG. 5 shows a fuse fusible body disclosed in Patent Document 1 below.
This fuse fusible body 100 includes a substantially strip-shaped fusible body main body 110 and a low melting point metal chip 120 welded in the middle in the longitudinal direction of the fusible body main body 110.
　可溶体本体１１０は、不図示の一対の接続端子板間を導通接続する略帯板状の本体板部１１１と、この本体板部１１１上の中間部に設定されたチップ載置部１１１ａに低融点金属チップ１２０を仮固定するチップ加締め片１１２と、チップ載置部１１１ａから本体板部１１１の長手方向に離れた位置に装備された堰き止め片１１３と、を備えている。この可溶体本体１１０は、銅又は銅合金の板材で、不図示の一対の接続端子板と一体形成される。 The fusible body 110 is low in a substantially strip-like body plate portion 111 that conducts and connects between a pair of connection terminal plates (not shown), and a chip placement portion 111 a that is set at an intermediate portion on the body plate portion 111. A chip crimping piece 112 for temporarily fixing the melting point metal chip 120 and a damming piece 113 provided at a position away from the chip mounting part 111a in the longitudinal direction of the main body plate part 111 are provided. The fusible body 110 is made of a copper or copper alloy plate and is integrally formed with a pair of connection terminal plates (not shown).
　可溶体本体１１０の堰き止め片１１３は、チップ載置部１１１ａを挟む２箇所に装備されている。それぞれの堰き止め片１１３は、図６にも示すように、本体板部１１１の側面から延出して、本体板部１１１の上に折り重ねられている。 The damming pieces 113 of the fusible body main body 110 are equipped at two places sandwiching the chip mounting portion 111a. As shown in FIG. 6, each damming piece 113 extends from the side surface of the main body plate portion 111 and is folded on the main body plate portion 111.
　低融点金属チップ１２０は、可溶体本体１１０よりも低融点の錫や鉛等の金属で形成されており、図６に示すように、チップ加締め片１１２によりチップ載置部１１１ａに固定したあと、加熱されて、チップ載置部１１１ａに溶着される。チップ載置部１１１ａの両側の堰き止め片１１３は、低融点金属チップ１２０がチップ載置部１１１ａに溶着される際に、溶融した低融点金属が想定範囲以上に流出することを防止している。 The low melting point metal chip 120 is made of a metal such as tin or lead having a melting point lower than that of the fusible body 110, and is fixed to the chip mounting portion 111a by the chip crimping piece 112 as shown in FIG. Then, it is heated and welded to the chip mounting portion 111a. The damming pieces 113 on both sides of the chip mounting part 111a prevent the molten low melting point metal from flowing out beyond the expected range when the low melting point metal chip 120 is welded to the chip mounting part 111a. .
日本国特開２０１０－９２７２９号公報Japanese Unexamined Patent Publication No. 2010-92729
　ところが、上記特許文献１に示したヒューズ可溶体１００では、チップ加締め片１１２が設けられることによって可溶体本体１１０の構造が複雑化し、コストアップを招く可能性があった。 However, in the fuse fusible body 100 shown in the above-mentioned Patent Document 1, the structure of the fusible body main body 110 is complicated by the provision of the chip crimping piece 112, which may increase the cost.
　また、上記特許文献１に示したヒューズ可溶体１００では、低融点金属チップ１２０にレーザ照射を行うことで、低融点金属チップ１２０がチップ載置部１１１ａに溶着されるが、溶着時には低融点金属チップ１２０の表面の大部分が空気中に暴露している。そのため、低融点金属チップ１２０の表面が酸素との接触により酸化されて、規格時間内で溶断しなくなったり、あるいは、溶断する電流値が定格からずれるなど、溶断性能のばらつきを招き、溶断性能に対する信頼性が低下する可能性があった。 In the fuse fusible body 100 shown in Patent Document 1, the low melting point metal chip 120 is welded to the chip mounting portion 111a by irradiating the low melting point metal chip 120 with a laser. Most of the surface of the chip 120 is exposed to the air. Therefore, the surface of the low melting point metal chip 120 is oxidized by contact with oxygen, so that it does not melt within a specified time, or the current value to be melted deviates from the rating, resulting in a variation in fusing performance. Reliability could be reduced.
　そこで、本発明の目的は、上記課題を解消することに係り、可溶体本体の構造の単純化によりコスト低減を図ることができ、また、可溶体本体に溶着される低融点金属チップの酸化を抑止して、溶断性能に対する信頼性の高いヒューズ可溶体を安定生産することのできるヒューズ可溶体及びその製造方法を提供することにある。 Therefore, an object of the present invention is to solve the above-mentioned problems, and can reduce the cost by simplifying the structure of the fusible body, and can oxidize the low melting point metal chip welded to the fusible body. An object of the present invention is to provide a fuse fusible body capable of stably producing a fuse fusible body having high reliability with respect to fusing performance and a method for manufacturing the same.
　本発明の前述した目的は、下記の構成により達成される。
　（１）　一対の接続端子板間を導通接続する略帯板状に前記一対の接続端子板と一体に形成される可溶体本体と、該可溶体本体の長手方向の中間に溶着して設けられて前記可溶体本体に定格以上の電流が流れたときに前記可溶体本体を溶断させる低融点金属チップと、を備えるヒューズ可溶体であって、
　前記可溶体本体には、チップ係合孔が設けられ、
　溶着前の前記低融点金属チップは、前記チップ係合孔との係合によって前記可溶体本体に仮固定されるヒューズ可溶体。 The above-described object of the present invention is achieved by the following configuration.
(1) A fusible body main body integrally formed with the pair of connection terminal plates in a substantially strip shape for conductively connecting the pair of connection terminal plates, and welded in the middle in the longitudinal direction of the fusible body main body. A low melting point metal chip that melts the fusible body when a current of a rating or more flows through the fusible body, and a fuse fusible body comprising:
The fusible body main body is provided with a chip engagement hole,
The low melting point metal chip before welding is a fuse fusible body that is temporarily fixed to the fusible body main body by engagement with the chip engagement hole.
　（２）　上記（１）に記載のヒューズ可溶体を製造するヒューズ可溶体の製造方法であって、
　筒状に形成された前記低融点金属チップが、前記低融点金属チップの少なくとも一部の開口幅よりも大きい開口部と前記低融点金属チップの少なくとも一部の外形幅よりも小さい開口部とを有する前記チップ係合孔が貫通形成された前記可溶体本体のチップ載置部に、前記低融点金属チップの開口中心軸と前記チップ係合孔の開口中心軸とが略一致するように載置されるチップ位置決め工程と、
　前記チップ載置部に載置された前記低融点金属チップが前記チップ載置部に押圧されて、前記低融点金属チップにおける少なくとも一部の開口縁部が前記チップ係合孔内に食い込んで前記低融点金属チップが前記チップ載置部に仮固定された状態にするチップ圧接工程と、
　前記チップ載置部に仮固定されている前記低融点金属チップの表面を高温ガスが覆うように、前記低融点金属チップの周囲に高温ガスが供給されて、前記低融点金属チップが前記チップ載置部に溶着されるチップ溶着工程と、を備えたヒューズ可溶体の製造方法。 (2) A method for manufacturing a fuse fusible body according to (1), wherein the fuse fusible body is manufactured.
The low melting point metal tip formed in a cylindrical shape has an opening larger than an opening width of at least a part of the low melting point metal chip and an opening smaller than an outer width of at least a part of the low melting point metal chip. Placed on the chip mounting portion of the fusible body main body through which the chip engagement hole is formed so that the opening center axis of the low melting point metal chip and the opening center axis of the chip engagement hole substantially coincide with each other. A chip positioning step,
The low melting point metal chip placed on the chip placement part is pressed by the chip placement part, and at least a part of the opening edge portion of the low melting point metal chip bites into the chip engagement hole. A chip pressing process in which a low melting point metal chip is temporarily fixed to the chip mounting portion;
A high temperature gas is supplied around the low melting point metal chip so that the surface of the low melting point metal chip temporarily fixed to the chip mounting part is covered with the high temperature gas, and the low melting point metal chip is mounted on the chip mounting part. A method of manufacturing a fusible fuse body, comprising: a chip welding step to be welded to the mounting portion.
　（３）　前記チップ溶着工程は、前記チップ載置部の下側から、前記低融点金属チップの内周部、及び前記低融点金属チップの外周部のそれぞれに前記高温ガスが送られることによって前記低融点金属チップが前記チップ載置部に溶着される上記（２）に記載のヒューズ可溶体の製造方法。 (3) In the chip welding step, the high temperature gas is sent from the lower side of the chip mounting portion to the inner peripheral portion of the low melting point metal chip and the outer peripheral portion of the low melting point metal tip, respectively. The method for manufacturing a fuse fusible body according to (2), wherein the low melting point metal chip is welded to the chip mounting portion.
　（４）　前記チップ圧接工程では、前記低融点金属チップの外周を位置決めする位置決め治具によって、前記低融点金属チップの前記開口中心軸と直交する方向への移動が規制される上記（２）又は（３）に記載のヒューズ可溶体の製造方法。 (4) In the tip pressure welding step, the movement of the low melting point metal tip in a direction orthogonal to the central axis of the opening is regulated by a positioning jig for positioning the outer periphery of the low melting point metal tip. (3) The method for producing a fuse fusible body according to (3).
　上記（１）の構成によれば、低融点金属チップは、可溶体本体に形成されたチップ係合孔との係合によって可溶体本体に仮固定される。したがって、可溶体本体は、構造の複雑化を招くチップ加締め片を設ける必要がなくなり、当該可溶体本体の構造の単純化によりコスト低減を図ることができる。 According to the configuration of (1) above, the low melting point metal tip is temporarily fixed to the fusible body main body by engagement with the chip engaging hole formed in the fusible body main body. Accordingly, the fusible body does not need to be provided with a chip crimping piece that causes a complicated structure, and the cost can be reduced by simplifying the structure of the fusible body.
　上記（２）の構成によれば、チップ載置部に仮固定された低融点金属チップが可溶体本体のチップ載置部に溶着される際、低融点金属チップはその表面が高温ガスで覆われた状態でチップ載置部への溶着が進むため、空気中の酸素の低融点金属チップへの接触が抑えられ、溶着される低融点金属チップの表面の酸化を抑止することができる。したがって、低融点金属チップの酸化に起因した溶断性能のばらつきが抑止されて、溶断性能に対する信頼性の高いヒューズ可溶体を安定生産することが可能になる。 According to the configuration of (2) above, when the low melting point metal chip temporarily fixed to the chip mounting part is welded to the chip mounting part of the fusible body, the surface of the low melting point metal chip is covered with the high temperature gas. Since the welding to the chip mounting portion proceeds in a broken state, the contact of oxygen in the air with the low melting point metal chip can be suppressed, and the oxidation of the surface of the low melting point metal chip to be welded can be suppressed. Therefore, variation in the fusing performance due to oxidation of the low melting point metal chip is suppressed, and it becomes possible to stably produce a fuse fusible body having high reliability with respect to the fusing performance.
　上記（３）の構成によれば、低融点金属チップが可溶体本体のチップ載置部に溶着される際、低融点金属チップはその内周部及び外周部のそれぞれにチップ載置部の下側から高温ガスが送られる。これにより、低融点金属チップの表面の大部分が高温ガスで覆われた状態で低融点金属チップの溶着を進めることができ、溶着される低融点金属チップの表面の酸化を効果的に抑止することができる。 According to the configuration of (3) above, when the low melting point metal chip is welded to the chip mounting part of the fusible body, the low melting point metal chip is placed under the chip mounting part on each of the inner peripheral part and the outer peripheral part. Hot gas is sent from the side. As a result, the welding of the low melting point metal chip can proceed while the majority of the surface of the low melting point metal chip is covered with the high temperature gas, and the oxidation of the surface of the low melting point metal chip to be welded is effectively suppressed. be able to.
　上記（４）の構成によれば、チップ圧接工程では、チップ載置部に対する低融点金属チップの位置が位置決め治具によって規制されるため、低融点金属チップを高精度でチップ載置部に仮固定することができる。その結果、チップ溶着工程における高温ガスの供給位置も、低融点金属チップに対して高精度に位置決めすることが可能になり、製造するヒューズ可溶体の品質を安定させることができる。 According to the configuration of (4) above, since the position of the low melting point metal chip with respect to the chip mounting part is regulated by the positioning jig in the chip pressing process, the low melting point metal chip is temporarily placed on the chip mounting part with high accuracy. Can be fixed. As a result, the supply position of the high-temperature gas in the chip welding step can be positioned with high accuracy with respect to the low melting point metal chip, and the quality of the fuse fusible body to be manufactured can be stabilized.
　本発明によるヒューズ可溶体は、可溶体本体にチップ加締め片が不要となり、可溶体本体の構造の単純化によりコスト低減を図ることができる。また、本発明によるヒューズ可溶体の製造方法によれば、可溶体本体に溶着される低融点金属チップの酸化が抑止されて、溶断性能に対する信頼性の高いヒューズ可溶体を安定生産することができる。 The fuse fusible body according to the present invention eliminates the need for a chip caulking piece in the fusible body, and can reduce the cost by simplifying the structure of the fusible body. In addition, according to the method for manufacturing a fuse fusible body according to the present invention, oxidation of the low melting point metal chip welded to the fusible body body is suppressed, and a fuse fusible body having high reliability with respect to fusing performance can be stably produced. .
　以上、本発明について簡潔に説明した。さらに、以下に説明される発明を実施するための形態（以下、「実施形態」という。）を添付の図面を参照して通読することにより、本発明の詳細は更に明確化されるであろう。 The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading through a mode for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings. .
図１は本発明に係るヒューズ可溶体の製造方法の一実施形態で製造されるヒューズ可溶体の概略構成図である。FIG. 1 is a schematic configuration diagram of a fuse fusible body manufactured by an embodiment of a method for manufacturing a fuse fusible body according to the present invention. 図２は本発明の一実施形態のヒューズ可溶体の製造方法の工程の説明図である。FIG. 2 is an explanatory diagram of the steps of the method for manufacturing the fuse fuse body according to the embodiment of the present invention. 図３は図２に示したチップ圧接工程の説明図である。FIG. 3 is an explanatory diagram of the chip pressing process shown in FIG. 図４は図２に示したチップ溶着工程の説明図である。FIG. 4 is an explanatory view of the chip welding process shown in FIG. 図５は従来のヒューズ可溶体の構成を示す斜視図である。FIG. 5 is a perspective view showing a configuration of a conventional fuse fusible body. 図６は図５に示したヒューズ可溶体の製造途中の状態を示す斜視図である。FIG. 6 is a perspective view showing a state in the middle of manufacturing the fuse fusible body shown in FIG.
　以下、本発明に係るヒューズ可溶体の製造方法の好適な実施形態について、図面を参照して詳細に説明する。 Hereinafter, a preferred embodiment of a method for manufacturing a fuse fuse according to the present invention will be described in detail with reference to the drawings.
　本発明の一実施形態に係るヒューズ可溶体の製造方法で製造されるヒューズ可溶体１は、図１に示すように、略帯板状の可溶体本体１０と、この可溶体本体１０の長手方向の中間に溶着して設けられる低融点金属チップ２０と、を備えている。 As shown in FIG. 1, a fuse fusible body 1 manufactured by a fuse fusible body manufacturing method according to an embodiment of the present invention includes a substantially strip-shaped fusible body main body 10 and a longitudinal direction of the fusible body main body 10. And a low melting point metal tip 20 provided by welding in the middle.
　可溶体本体１０は、図１に示すように、一対の接続端子板２，３間を導通接続するＺ字形に形成された略帯板状の構造である。この可溶体本体１０は、例えば、銅又は銅合金の板材から、一対の接続端子板２，３と一体に形成される。 As shown in FIG. 1, the fusible body main body 10 has a substantially strip-like structure formed in a Z-shape for conducting and connecting between a pair of connection terminal plates 2 and 3. The fusible body 10 is integrally formed with a pair of connection terminal plates 2 and 3 from, for example, a copper or copper alloy plate material.
　可溶体本体１０によって導通接続されている一対の接続端子板２，３は、保護する回路に直列に接続される。 The pair of connection terminal plates 2 and 3 that are conductively connected by the fusible body 10 are connected in series to a circuit to be protected.
　本実施形態の可溶体本体１０は、一対の接続端子板２，３間を導通接続する略帯板状の本体板部１１と、該本体板部１１の長手方向の中間に形成された略円板状のチップ載置部１２と、を備えている。チップ載置部１２には、図３に示すように、その中心部に、チップ係合孔１３が貫通形成されている。このチップ係合孔１３は、図３に示すように、その内径ｄ１が、後述する低融点金属チップ２０の内径Ｄ１よりも大きく、且つ、低融点金属チップ２０の外径Ｄ２よりも小さく設定されている。即ち、チップ係合孔１３は、低融点金属チップ２０の少なくとも一部の開口幅（内径Ｄ１）よりも大きく、且つ、低融点金属チップ２０の少なくとも一部の外形幅（外径Ｄ２）よりも小さい開口部（内径ｄ１部分）を有している。 The fusible body main body 10 of the present embodiment includes a substantially strip-shaped main body plate portion 11 that conducts and connects between the pair of connection terminal plates 2 and 3 and a substantially circular shape formed in the middle of the main body plate portion 11 in the longitudinal direction. And a plate-shaped chip mounting portion 12. As shown in FIG. 3, the chip mounting portion 12 is formed with a chip engaging hole 13 penetrating through the center thereof. As shown in FIG. 3, the tip engagement hole 13 has an inner diameter d1 that is larger than an inner diameter D1 of a low-melting-point metal tip 20, which will be described later, and smaller than an outer diameter D2 of the low-melting-point metal tip 20. ing. That is, the chip engagement hole 13 is larger than at least a part of the opening width (inner diameter D1) of the low melting point metal chip 20, and is larger than at least a part of the outer width (outer diameter D2) of the low melting point metal chip 20. It has a small opening (inner diameter d1 portion).
　本実施形態の場合、低融点金属チップ２０は、図３に示すように、内径がＤ１で、外径がＤ２の真直な円筒状に形成されている。低融点金属チップ２０の内径Ｄ１及び外径Ｄ２は、前述したように、チップ載置部１２に形成されたチップ係合孔１３の内径ｄ１に対して、Ｄ１＜ｄ１＜Ｄ２の関係に設定されている。
　なお、本発明における低融点金属チップの形状は、本実施形態における円筒状に限らず角筒状や楕円筒状等にすることも可能であり、チップ係合孔の形状も、円形に限るものではない。即ち、チップ係合孔が、低融点金属チップの少なくとも一部の開口幅よりも大きい開口部と低融点金属チップの少なくとも一部の外形幅よりも小さい開口部とを有する構成であれば、低融点金属チップ及びチップ係合孔は種々の形状を採り得る。 In the case of the present embodiment, as shown in FIG. 3, the low melting point metal chip 20 is formed in a straight cylindrical shape having an inner diameter D1 and an outer diameter D2. As described above, the inner diameter D1 and the outer diameter D2 of the low melting point metal tip 20 are set such that D1 <d1 <D2 with respect to the inner diameter d1 of the tip engagement hole 13 formed in the tip mounting portion 12. ing.
In addition, the shape of the low melting point metal tip in the present invention is not limited to the cylindrical shape in the present embodiment, and may be a rectangular tube shape or an elliptical cylinder shape, and the shape of the chip engagement hole is also limited to a circular shape. is not. That is, if the tip engagement hole has a configuration having an opening larger than the opening width of at least a part of the low melting point metal tip and an opening smaller than the outer width of at least a part of the low melting point metal tip, The melting point metal tip and the tip engagement hole can take various shapes.
　低融点金属チップ２０は、可溶体本体１０よりも低融点の錫や鉛等の金属で形成されている。本実施形態の低融点金属チップ２０は、図３に示すように、プレス用のパンチ４０によってチップ載置部１２に押圧されることにより、少なくともその一部である低融点金属チップ２０の開口縁部２０ｃがチップ係合孔１３内に食い込むことで係合して、チップ載置部１２に仮固定される。そして、チップ載置部１２に仮固定された低融点金属チップ２０は、後述する高温ガスＧによる加熱によって、可溶体本体１０のチップ載置部１２に溶着される。この低融点金属チップ２０は、可溶体本体１０に定格以上の電流が流れたときに溶融して、可溶体本体１０を溶断させる。 The low melting point metal chip 20 is formed of a metal such as tin or lead having a lower melting point than the fusible body 10. As shown in FIG. 3, the low melting point metal chip 20 of the present embodiment is pressed against the chip mounting portion 12 by a pressing punch 40, so that at least a part of the opening edge of the low melting point metal chip 20 is formed. The portion 20 c is engaged by biting into the chip engagement hole 13 and is temporarily fixed to the chip mounting portion 12. The low melting point metal chip 20 temporarily fixed to the chip mounting part 12 is welded to the chip mounting part 12 of the fusible body main body 10 by heating with a high temperature gas G described later. The low melting point metal chip 20 is melted when a current exceeding the rated value flows through the fusible body 10 and melts the fusible body 10.
　本実施形態に係るヒューズ可溶体の製造方法は、図２に示すように、チップ位置決め工程Ｓ１、チップ圧接工程Ｓ２、チップ溶着工程Ｓ３の各工程を順に実施することで、図１に示したヒューズ可溶体１を製造する。 The fuse fusible body manufacturing method according to the present embodiment, as shown in FIG. 2, performs the chip positioning step S1, the chip press-contacting step S2, and the chip welding step S3 in order, so that the fuse shown in FIG. A soluble body 1 is produced.
　先ず、チップ位置決め工程Ｓ１では、円筒状に形成された低融点金属チップ２０が、図３に示すように、当該低融点金属チップ２０における開口の内径Ｄ１の中心とチップ係合孔１３における内径ｄ１の開口の中心とが略一致するように、チップ載置部１２に載せ置かれる。その際、チップ載置部１２上に載置される低融点金属チップ２０の開口中心軸は、位置決め治具３０によって、チップ係合孔１３の開口中心軸上に位置決めされる。 First, in the chip positioning step S1, the low melting point metal tip 20 formed in a cylindrical shape has a center of an inner diameter D1 of the opening in the low melting point metal chip 20 and an inner diameter d1 in the chip engagement hole 13 as shown in FIG. It is mounted on the chip mounting part 12 so that the center of the opening of the chip substantially coincides. At that time, the opening center axis of the low melting point metal chip 20 placed on the chip placement part 12 is positioned on the opening center axis of the chip engagement hole 13 by the positioning jig 30.
　位置決め治具３０は、図３に示すように、板厚ｔが低融点金属チップ２０の高さＨよりも小さな平板状の治具本体３１に、低融点金属チップ２０を挿通させるガイド孔３２が貫通形成されたもので、ガイド孔３２により低融点金属チップ２０の外周が位置決めされる。 As shown in FIG. 3, the positioning jig 30 has a guide hole 32 through which the low melting point metal chip 20 is inserted into a flat jig body 31 having a plate thickness t smaller than the height H of the low melting point metal chip 20. The outer periphery of the low melting point metal tip 20 is positioned by the guide hole 32.
　位置決め治具３０は、低融点金属チップ２０の高さ方向（図３では、矢印Ｙ１方向）の中間に位置するように、可溶体本体１０に対する相対位置が設定される。 The relative position with respect to the fusible body 10 is set so that the positioning jig 30 is positioned in the middle of the height direction of the low melting point metal tip 20 (the direction of the arrow Y1 in FIG. 3).
　チップ圧接工程Ｓ２では、図３に示すように、チップ位置決め工程Ｓ１によってチップ載置部１２に載置された低融点金属チップ２０が、プレス用のパンチ４０によってチップ載置部１２に押圧されて、低融点金属チップ２０がチップ載置部１２に仮固定される。 In the chip pressing step S2, as shown in FIG. 3, the low melting point metal chip 20 placed on the chip placement unit 12 in the chip positioning step S1 is pressed by the chip placement unit 12 by the punch 40 for pressing. The low melting point metal chip 20 is temporarily fixed to the chip mounting portion 12.
　このチップ圧接工程Ｓ２では、パンチ４０による押圧荷重によって、低融点金属チップ２０の開口縁部２０ｃがチップ係合孔１３内に食い込む塑性変形が起こり、低融点金属チップ２０がチップ載置部１２に仮固定された状態になる。 In this chip press-contacting process S <b> 2, due to the pressing load by the punch 40, plastic deformation occurs in which the opening edge portion 20 c of the low melting point metal chip 20 bites into the chip engagement hole 13, and the low melting point metal chip 20 is applied to the chip mounting portion 12. Temporarily fixed.
　なお、チップ圧接工程Ｓ２においては、パンチ４０による低融点金属チップ２０の押圧が、図３に示すように、位置決め治具３０によって低融点金属チップ２０の開口中心軸と直交する方向への移動が規制された状態で行われる。 In the chip pressing process S2, the pressing of the low melting point metal chip 20 by the punch 40 causes the positioning jig 30 to move the low melting point metal chip 20 in a direction orthogonal to the opening center axis as shown in FIG. Performed in a regulated state.
　チップ溶着工程Ｓ３では、図４に示すように、チップ載置部１２の下側から、低融点金属チップ２０の内周部２０ａ、及び低融点金属チップ２０の外周部２０ｂの複数箇所のそれぞれに高温ガスＧを送って、低融点金属チップ２０がチップ載置部１２に溶着される。 In the chip welding step S3, as shown in FIG. 4, from the lower side of the chip mounting portion 12, the inner peripheral portion 20a of the low melting point metal tip 20 and the outer peripheral portion 20b of the low melting point metal tip 20 are respectively disposed at a plurality of locations. The low melting point metal chip 20 is welded to the chip mounting portion 12 by sending the high temperature gas G.
　なお、低融点金属チップ２０の外周部２０ｂにおける高温ガスＧの供給位置は、低融点金属チップ２０の外周部２０ｂで、且つ周方向に均等に離間配置された複数箇所である。 In addition, the supply position of the high temperature gas G in the outer peripheral portion 20b of the low melting point metal tip 20 is the outer peripheral portion 20b of the low melting point metal tip 20 and a plurality of locations equally spaced in the circumferential direction.
　以上に説明した一実施形態のヒューズ可溶体１の場合、低融点金属チップ２０は、可溶体本体１０に形成されたチップ係合孔１３との係合によって可溶体本体１０に仮固定される。したがって、可溶体本体１０は、構造の複雑化を招くチップ加締め片を設ける必要がなくなり、当該可溶体本体１０の構造の単純化によりコスト低減を図ることができる。 In the case of the fuse fusible body 1 according to the embodiment described above, the low melting point metal chip 20 is temporarily fixed to the fusible body main body 10 by engagement with the chip engagement hole 13 formed in the fusible body main body 10. Accordingly, the fusible body 10 does not need to be provided with a chip crimping piece that leads to a complicated structure, and the cost can be reduced by simplifying the structure of the fusible body 10.
　また、以上に説明した一実施形態のヒューズ可溶体の製造方法によれば、低融点金属チップ２０が可溶体本体１０のチップ載置部１２に溶着される際、低融点金属チップ２０はその表面が高温ガスＧで覆われた状態でチップ載置部１２への溶着が進むため、空気中の酸素の低融点金属チップ２０への接触が抑えられ、溶着される低融点金属チップ２０の表面の酸化を抑止することができる。したがって、低融点金属チップ２０の酸化に起因した溶断性能のばらつきが抑止されて、溶断性能に対する信頼性の高いヒューズ可溶体を安定生産することが可能になる。 Further, according to the method for manufacturing a fuse fusible body of the embodiment described above, when the low melting point metal chip 20 is welded to the chip mounting portion 12 of the fusible body body 10, the low melting point metal chip 20 has a surface thereof. Since the welding to the chip mounting portion 12 proceeds in a state covered with the high temperature gas G, the contact of oxygen in the air with the low melting point metal chip 20 is suppressed, and the surface of the low melting point metal chip 20 to be welded is suppressed. Oxidation can be suppressed. Therefore, variation in the fusing performance due to the oxidation of the low melting point metal chip 20 is suppressed, and it becomes possible to stably produce a fuse fuse with high reliability with respect to the fusing performance.
　また、一実施形態のヒューズ可溶体の製造方法によれば、低融点金属チップ２０が可溶体本体１０のチップ載置部１２に溶着される際、低融点金属チップ２０は、図４に示したように、その内周部２０ａ及び外周部２０ｂのそれぞれにチップ載置部１２の下側から高温ガスＧが送られる。これにより、低融点金属チップ２０の表面の大部分が高温ガスＧで覆われた状態で低融点金属チップ２０の溶着を進めることができ、溶着される低融点金属チップ２０の表面の酸化を効果的に抑止することができる。 Further, according to the method for manufacturing a fuse fusible body according to one embodiment, when the low melting point metal chip 20 is welded to the chip mounting portion 12 of the fusible body body 10, the low melting point metal chip 20 is shown in FIG. Thus, the hot gas G is sent from the lower side of the chip mounting part 12 to each of the inner peripheral part 20a and the outer peripheral part 20b. Thereby, welding of the low melting point metal chip 20 can be advanced in a state where most of the surface of the low melting point metal chip 20 is covered with the high temperature gas G, and the oxidation of the surface of the low melting point metal chip 20 to be welded is effective. Can be deterred.
　また、一実施形態のヒューズ可溶体の製造方法の場合、チップ圧接工程Ｓ２では、チップ載置部１２に対する低融点金属チップ２０の位置が位置決め治具３０によって規制されるため、低融点金属チップ２０を高精度でチップ載置部１２に仮固定することができる。その結果、チップ溶着工程における高温ガスＧの供給位置も、低融点金属チップ２０に対して高精度に位置決めすることが可能になり、製造するヒューズ可溶体１の品質を安定させることができる。 In the fuse fusible body manufacturing method according to the embodiment, since the position of the low melting point metal chip 20 with respect to the chip mounting portion 12 is regulated by the positioning jig 30 in the chip pressing step S2, the low melting point metal chip 20 is used. Can be temporarily fixed to the chip mounting portion 12 with high accuracy. As a result, the supply position of the high temperature gas G in the chip welding process can be positioned with high accuracy with respect to the low melting point metal chip 20, and the quality of the fuse fusible body 1 to be manufactured can be stabilized.
　なお、本発明は、上述した実施形態に限定されるものではなく、適宜、変形、改良、等が可能である。その他、上述した実施形態における各構成要素の材質、形状、寸法、数、配置箇所、等は本発明を達成できるものであれば任意であり、限定されない。
　また、本出願は、２０１３年１０月１０日出願の日本特許出願（特願２０１３－２１３０３３）に基づくものであり、その内容はここに参照として取り込まれる。 In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.
Further, this application is based on a Japanese patent application (Japanese Patent Application No. 2013-213033) filed on Oct. 10, 2013, the contents of which are incorporated herein by reference.
　例えば、可溶体本体におけるチップ載置部の平面形状は、円形に限らず矩形や楕円形にすることも可能である。また、チップ載置部に形成するチップ係合孔の形状も、円形に限るものではなく、任意の多角形状に設定することが可能である。 For example, the planar shape of the chip mounting portion in the fusible body is not limited to a circle but may be a rectangle or an ellipse. Further, the shape of the chip engagement hole formed in the chip mounting portion is not limited to a circle, and can be set to an arbitrary polygonal shape.
　ここで、上述した本発明に係るヒューズ可溶体及びその製造方法の実施形態の特徴をそれぞれ以下［１］～［４］に簡潔に纏めて列記する。 Here, the features of the above-described fuse fusible body according to the present invention and the method of manufacturing the same are briefly summarized and listed in the following [1] to [4], respectively.
　［１］　一対の接続端子板（２，３）間を導通接続する略帯板状に前記一対の接続端子板（２，３）と一体に形成される可溶体本体（１０）と、該可溶体本体（１０）の長手方向の中間に溶着して設けられて前記可溶体本体（１０）に定格以上の電流が流れたときに前記可溶体本体（１０）を溶断させる低融点金属チップ（２０）と、を備えるヒューズ可溶体であって、
　前記可溶体本体（１０）には、チップ係合孔（１３）が設けられ、
　溶着前の前記低融点金属チップ（２０）は、前記チップ係合孔（１３）との係合によって前記可溶体本体（１０）に仮固定されるヒューズ可溶体（１）。 [1] A fusible body (10) integrally formed with the pair of connection terminal plates (2, 3) in a substantially strip shape for conductively connecting the pair of connection terminal plates (2, 3), A low melting point metal tip (20) which is welded and provided in the middle of the longitudinal direction of the melt body (10) and melts the melt body (10) when a current exceeding the rated value flows through the melt body (10). And a fuse fusible body comprising:
The fusible body (10) is provided with a tip engagement hole (13),
The fuse melting body (1) in which the low melting point metal tip (20) before welding is temporarily fixed to the fusible body body (10) by engagement with the chip engagement hole (13).
　［２］　上記［１］に記載のヒューズ可溶体（１）を製造するヒューズ可溶体の製造方法であって、
　筒状に形成された前記低融点金属チップ（２０）が、前記低融点金属チップ（２０）の少なくとも一部の開口幅（内径Ｄ１）よりも大きい開口部と前記低融点金属チップ（２０）の少なくとも一部の外形幅（外径Ｄ２）よりも小さい開口部とを有する前記チップ係合孔（１３）が貫通形成された前記可溶体本体（１０）のチップ載置部（１２）に、前記低融点金属チップ（２０）の開口中心軸と前記チップ係合孔（１３）の開口中心軸とが略一致するように載置されるチップ位置決め工程（Ｓ１）と、
　前記チップ載置部（１２）に載置された前記低融点金属チップ（２０）が前記チップ載置部（１２）に押圧されて、前記低融点金属チップ（２０）における少なくとも一部の開口縁部（２０ｃ）が前記チップ係合孔（１３）内に食い込んで前記低融点金属チップ（２０）が前記チップ載置部（１２）に仮固定された状態にするチップ圧接工程（Ｓ２）と、
　前記チップ載置部（１２）に仮固定されている前記低融点金属チップ（２０）の表面を高温ガス（Ｇ）が覆うように、前記低融点金属チップ（２０）の周囲に高温ガス（Ｇ）が供給されて、前記低融点金属チップ（２０）が前記チップ載置部（１２）に溶着されるチップ溶着工程（Ｓ３）と、を備えたヒューズ可溶体の製造方法。 [2] A method for manufacturing a fuse fuselage (1) according to [1] above,
The low melting point metal tip (20) formed in a cylindrical shape has an opening larger than the opening width (inner diameter D1) of at least a part of the low melting point metal tip (20) and the low melting point metal tip (20). In the chip mounting portion (12) of the fusible body (10) in which the chip engagement hole (13) having an opening smaller than at least a part of the outer width (outer diameter D2) is formed, A chip positioning step (S1) placed so that the opening center axis of the low melting point metal chip (20) and the opening center axis of the chip engaging hole (13) substantially coincide;
The low melting point metal chip (20) placed on the chip placement part (12) is pressed by the chip placement part (12), and at least a part of the opening edge of the low melting point metal chip (20). A chip pressing process (S2) in which the portion (20c) bites into the chip engaging hole (13) and the low melting point metal chip (20) is temporarily fixed to the chip mounting section (12);
A high temperature gas (G) is provided around the low melting point metal chip (20) so that the high temperature gas (G) covers the surface of the low melting point metal chip (20) temporarily fixed to the chip mounting portion (12). ) And a chip welding step (S3) in which the low melting point metal chip (20) is welded to the chip mounting portion (12).
　［３］　前記チップ溶着工程（Ｓ３）は、前記チップ載置部（１２）の下側から、前記低融点金属チップ（２０）の内周部（２０ａ）、及び前記低融点金属チップ（２０）の外周部（２０ｂ）のそれぞれに前記高温ガス（Ｇ）が送られることによって前記低融点金属チップ（２０）が前記チップ載置部（１２）に溶着される上記［２］に記載のヒューズ可溶体の製造方法。 [3] In the chip welding step (S3), from the lower side of the chip mounting part (12), the inner peripheral part (20a) of the low melting point metal chip (20) and the low melting point metal chip (20) The low melting point metal chip (20) is welded to the chip mounting portion (12) by sending the high temperature gas (G) to each of the outer peripheral portions (20b) of the fuse. A method for producing a solution.
　［４］　前記チップ圧接工程（Ｓ２）では、前記低融点金属チップ（２０）の外周を位置決めする位置決め治具（３０）によって、前記低融点金属チップ（２０）の前記開口中心軸と直交する方向への移動が規制される上記［２］又は［３］に記載のヒューズ可溶体の製造方法。 [4] In the chip pressing step (S2), a direction perpendicular to the central axis of the opening of the low melting point metal tip (20) is determined by a positioning jig (30) for positioning the outer periphery of the low melting point metal chip (20). The method for producing a fusible fuse body according to [2] or [3], wherein movement to the is regulated.
　本発明に係るヒューズ可溶体によれば、可溶体本体にチップ加締め片が不要となり、可溶体本体の構造の単純化によりコスト低減を図ることができる。また、本発明によるヒューズ可溶体の製造方法によれば、可溶体本体に溶着される低融点金属チップの酸化が抑止されて、溶断性能に対する信頼性の高いヒューズ可溶体を安定生産することができる。 According to the fuse fusible body according to the present invention, no chip crimping piece is required in the fusible body, and the cost can be reduced by simplifying the structure of the fusible body. In addition, according to the method for manufacturing a fuse fusible body according to the present invention, oxidation of the low melting point metal chip welded to the fusible body body is suppressed, and a fuse fusible body having high reliability with respect to fusing performance can be stably produced. .
　２，３　接続端子板
　１０　可溶体本体
　１２　チップ載置部
　１３　チップ係合孔
　２０　低融点金属チップ
　２０ａ　内周部
　２０ｂ　外周部
　２０ｃ　開口縁部
　３０　位置決め治具
　Ｇ　高温ガス
　Ｓ１　チップ位置決め工程
　Ｓ２　チップ圧接工程
　Ｓ３　チップ溶着工程 2, 3 Connection terminal board 10 Fusible body 12 Chip mounting part 13 Chip engaging hole 20 Low melting point metal chip 20a Inner peripheral part 20b Outer peripheral part 20c Opening edge part 30 Positioning jig G High temperature gas S1 Chip positioning process S2 Chip press contact Process S3 Chip welding process

Claims (4)

  1. 　一対の接続端子板間を導通接続する略帯板状に前記一対の接続端子板と一体に形成される可溶体本体と、該可溶体本体の長手方向の中間に溶着して設けられて前記可溶体本体に定格以上の電流が流れたときに前記可溶体本体を溶断させる低融点金属チップと、を備えるヒューズ可溶体であって、
    　前記可溶体本体には、チップ係合孔が設けられ、
    　溶着前の前記低融点金属チップは、前記チップ係合孔との係合によって前記可溶体本体に仮固定されるヒューズ可溶体。     A fusible body formed integrally with the pair of connecting terminal plates in a substantially strip-like shape for conducting electrical connection between the pair of connecting terminal plates, and welded to the middle of the fusible body main body in the longitudinal direction; A fuse fusible body comprising a low melting point metal chip that melts the fusible body when a current greater than or equal to the rating flows in the melt body,
    The fusible body main body is provided with a chip engagement hole,
    The low melting point metal chip before welding is a fuse fusible body that is temporarily fixed to the fusible body main body by engagement with the chip engagement hole.
  2. 　請求項１に記載のヒューズ可溶体を製造するヒューズ可溶体の製造方法であって、
    　筒状に形成された前記低融点金属チップが、前記低融点金属チップの少なくとも一部の開口幅よりも大きい開口部と前記低融点金属チップ）の少なくとも一部の外形幅よりも小さい開口部とを有する前記チップ係合孔が貫通形成された前記可溶体本体のチップ載置部に、前記低融点金属チップの開口中心軸と前記チップ係合孔の開口中心軸とが略一致するように載置されるチップ位置決め工程と、
    　前記チップ載置部に載置された前記低融点金属チップが前記チップ載置部に押圧されて、前記低融点金属チップにおける少なくとも一部の開口縁部が前記チップ係合孔内に食い込んで前記低融点金属チップが前記チップ載置部に仮固定された状態にするチップ圧接工程と、
    　前記チップ載置部に仮固定されている前記低融点金属チップの表面を高温ガスが覆うように、前記低融点金属チップの周囲に高温ガスが供給されて、前記低融点金属チップが前記チップ載置部に溶着されるチップ溶着工程と、
    を備えたヒューズ可溶体の製造方法。     A method for manufacturing a fuse fusible body according to claim 1, wherein the fuse fusible body is manufactured.
    The low melting point metal tip formed in a cylindrical shape has an opening larger than an opening width of at least a part of the low melting point metal chip and an opening smaller than an outer width of at least a part of the low melting point metal chip); A chip mounting portion of the fusible body main body through which the chip engaging hole having a hole is formed is mounted so that the opening center axis of the low melting point metal chip and the opening center axis of the chip engaging hole substantially coincide with each other. A chip positioning step to be placed;
    The low melting point metal chip placed on the chip placement part is pressed by the chip placement part, and at least a part of the opening edge portion of the low melting point metal chip bites into the chip engagement hole. A chip pressing process in which a low melting point metal chip is temporarily fixed to the chip mounting portion;
    A high temperature gas is supplied around the low melting point metal chip so that the surface of the low melting point metal chip temporarily fixed to the chip mounting part is covered with the high temperature gas, and the low melting point metal chip is mounted on the chip mounting part. Chip welding process to be welded to the mounting portion;
    A fuse fusible body manufacturing method comprising:
  3. 　前記チップ溶着工程は、前記チップ載置部の下側から、前記低融点金属チップの内周部、及び前記低融点金属チップの外周部のそれぞれに前記高温ガスが送られることによって前記低融点金属チップが前記チップ載置部に溶着される請求項２に記載のヒューズ可溶体の製造方法。 In the chip welding step, the low-melting-point metal is sent by sending the high-temperature gas from the lower side of the chip mounting portion to the inner peripheral portion of the low-melting-point metal tip and the outer peripheral portion of the low-melting-point metal tip. The method for manufacturing a fuse fusible body according to claim 2, wherein the chip is welded to the chip mounting portion.
  4. 　前記チップ圧接工程では、前記低融点金属チップの外周を位置決めする位置決め治具によって、前記低融点金属チップの前記開口中心軸と直交する方向への移動が規制される請求項２又は３に記載のヒューズ可溶体の製造方法。
          The said chip | tip press-contact process WHEREIN: The movement to the direction orthogonal to the said opening center axis | shaft of the said low melting metal chip is controlled by the positioning jig which positions the outer periphery of the said low melting metal chip. Method for manufacturing fuse fusible body.
PCT/JP2014/075528 2013-10-10 2014-09-25 Fuse element and manufacturing method therefor WO2015053090A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63271842A (en) * 1987-01-22 1988-11-09 モリル、グラステク、インコーポレーテッド Fuse and its manufacture
JP2013073674A (en) * 2011-09-26 2013-04-22 Yazaki Corp Fuse

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63271842A (en) * 1987-01-22 1988-11-09 モリル、グラステク、インコーポレーテッド Fuse and its manufacture
JP2013073674A (en) * 2011-09-26 2013-04-22 Yazaki Corp Fuse

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