JP5737064B2 - 光源ユニット - Google Patents
光源ユニット Download PDFInfo
- Publication number
- JP5737064B2 JP5737064B2 JP2011182258A JP2011182258A JP5737064B2 JP 5737064 B2 JP5737064 B2 JP 5737064B2 JP 2011182258 A JP2011182258 A JP 2011182258A JP 2011182258 A JP2011182258 A JP 2011182258A JP 5737064 B2 JP5737064 B2 JP 5737064B2
- Authority
- JP
- Japan
- Prior art keywords
- window member
- light source
- cylindrical casing
- light
- source unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002093 peripheral effect Effects 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004939 coking Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- 238000001723 curing Methods 0.000 description 10
- 239000011342 resin composition Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000013500 performance material Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011182258A JP5737064B2 (ja) | 2011-08-24 | 2011-08-24 | 光源ユニット |
| TW101117818A TW201309968A (zh) | 2011-08-24 | 2012-05-18 | 光源單元 |
| KR1020120073398A KR20130023060A (ko) | 2011-08-24 | 2012-07-05 | 광원 유닛 |
| CN201210303110.6A CN102954374B (zh) | 2011-08-24 | 2012-08-23 | 光源单元 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011182258A JP5737064B2 (ja) | 2011-08-24 | 2011-08-24 | 光源ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013045606A JP2013045606A (ja) | 2013-03-04 |
| JP5737064B2 true JP5737064B2 (ja) | 2015-06-17 |
Family
ID=47763556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011182258A Active JP5737064B2 (ja) | 2011-08-24 | 2011-08-24 | 光源ユニット |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5737064B2 (enExample) |
| KR (1) | KR20130023060A (enExample) |
| CN (1) | CN102954374B (enExample) |
| TW (1) | TW201309968A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7281761B2 (ja) * | 2018-06-15 | 2023-05-26 | パナソニックIpマネジメント株式会社 | 照明器具 |
| KR102216980B1 (ko) * | 2019-06-12 | 2021-02-17 | 정상옥 | 방수 및 방진을 위한 led 조명장치 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4214747B2 (ja) * | 2002-09-19 | 2009-01-28 | パナソニック電工株式会社 | 防雨型照明器具 |
| JP4127015B2 (ja) * | 2002-10-24 | 2008-07-30 | 松下電工株式会社 | 埋込型照明器具 |
| US8097221B2 (en) * | 2005-01-21 | 2012-01-17 | Multisorb Technologies, Inc. | Lamp assembly |
| CN201462604U (zh) * | 2009-07-06 | 2010-05-12 | 浙江琅盛光电科技股份有限公司 | 一种led地埋灯 |
| JP4893806B2 (ja) * | 2009-11-12 | 2012-03-07 | ウシオ電機株式会社 | 発光素子光源ユニット |
| CN201885036U (zh) * | 2010-09-07 | 2011-06-29 | 袁汝平 | 一种新型led灯条 |
| CN201892093U (zh) * | 2010-12-08 | 2011-07-06 | 重庆星河光电科技有限公司 | 一种灯具 |
-
2011
- 2011-08-24 JP JP2011182258A patent/JP5737064B2/ja active Active
-
2012
- 2012-05-18 TW TW101117818A patent/TW201309968A/zh unknown
- 2012-07-05 KR KR1020120073398A patent/KR20130023060A/ko not_active Ceased
- 2012-08-23 CN CN201210303110.6A patent/CN102954374B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013045606A (ja) | 2013-03-04 |
| KR20130023060A (ko) | 2013-03-07 |
| TWI561768B (enExample) | 2016-12-11 |
| TW201309968A (zh) | 2013-03-01 |
| CN102954374A (zh) | 2013-03-06 |
| CN102954374B (zh) | 2015-10-14 |
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