JP5736272B2 - 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 - Google Patents

青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 Download PDF

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Publication number
JP5736272B2
JP5736272B2 JP2011173867A JP2011173867A JP5736272B2 JP 5736272 B2 JP5736272 B2 JP 5736272B2 JP 2011173867 A JP2011173867 A JP 2011173867A JP 2011173867 A JP2011173867 A JP 2011173867A JP 5736272 B2 JP5736272 B2 JP 5736272B2
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Japan
Prior art keywords
blue light
emitting phosphor
light emitting
powder
phosphor
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Expired - Fee Related
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JP2011173867A
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English (en)
Japanese (ja)
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JP2013035957A5 (enExample
JP2013035957A (ja
Inventor
福田　晃一
晃一 福田
仁 天谷
仁 天谷
誠司 野口
誠司 野口
稲垣　徹
徹 稲垣
真樹 田中
真樹 田中
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Ube Material Industries Ltd
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Ube Material Industries Ltd
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Priority to JP2011173867A priority Critical patent/JP5736272B2/ja
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Publication of JP2013035957A5 publication Critical patent/JP2013035957A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
JP2011173867A 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置 Expired - Fee Related JP5736272B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011173867A JP5736272B2 (ja) 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011173867A JP5736272B2 (ja) 2011-08-09 2011-08-09 青色発光蛍光体及び該青色発光蛍光体を用いた発光装置

Publications (3)

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JP2013035957A JP2013035957A (ja) 2013-02-21
JP2013035957A5 JP2013035957A5 (enExample) 2014-03-27
JP5736272B2 true JP5736272B2 (ja) 2015-06-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636841B2 (ja) 1990-03-27 1994-05-18 株式会社東洋製作所 加圧式凍結濃縮装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107109217A (zh) 2015-01-07 2017-08-29 宇部兴产株式会社 荧光体和发光装置以及荧光体的制造方法
CN116410745B (zh) * 2021-12-31 2023-10-24 江苏博睿光电股份有限公司 一种荧光粉材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
JP4168776B2 (ja) * 2002-02-15 2008-10-22 三菱化学株式会社 発光装置及びそれを用いた照明装置
JP4096619B2 (ja) * 2002-05-17 2008-06-04 松下電器産業株式会社 プラズマディスプレイ装置の製造方法
JP2006012770A (ja) * 2004-05-27 2006-01-12 Hitachi Ltd 発光装置及び該発光装置を用いた画像表示装置
JP2006312654A (ja) * 2005-04-07 2006-11-16 Sumitomo Chemical Co Ltd 蛍光体
JP2008050523A (ja) * 2006-08-28 2008-03-06 Hitachi Ltd プラズマディスプレイ装置および発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636841B2 (ja) 1990-03-27 1994-05-18 株式会社東洋製作所 加圧式凍結濃縮装置

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