JP5731160B2 - 金型上への保護層の形成及び保護層を有する金型 - Google Patents
金型上への保護層の形成及び保護層を有する金型 Download PDFInfo
- Publication number
- JP5731160B2 JP5731160B2 JP2010224565A JP2010224565A JP5731160B2 JP 5731160 B2 JP5731160 B2 JP 5731160B2 JP 2010224565 A JP2010224565 A JP 2010224565A JP 2010224565 A JP2010224565 A JP 2010224565A JP 5731160 B2 JP5731160 B2 JP 5731160B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mandrels
- protective layer
- cavities
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
- H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1431—Logic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
4:本体
6、66:第1の実質的に平坦な面
8、68:第2の実質的に平坦な面
10、70:中間部分
20、100:保護層
30:フォトレジスト層
31、32、33:キャビティ位置
34、35、36、42、43、44、80、81、82:キャビティ
40、50、60、120:金型
87、88、89:マンドレル
90:本体部材
92:下部
93:上部
Claims (8)
- 複数の金型キャビティが設けられた少なくとも1つの平坦な面を有する金型基板を保護する方法であって、
前記複数の金型キャビティのそれぞれのものに複数のマンドレルを挿入することと、
前記少なくとも1つの平坦な面及び前記複数のマンドレルの上に金型保護材料層を堆積させることと、
前記金型基板から前記複数のマンドレルを除去することと、
を含む方法。 - 前記複数の金型キャビティのそれぞれのものに前記複数のマンドレルを挿入することは、前記複数の金型キャビティのそれぞれのものの中に延びる第1の端部と、前記平坦な面の上方に延びる第2の端部とを有する前記複数のマンドレルを挿入することを含む、請求項1に記載の方法。
- 前記少なくとも1つの平坦な面及び前記複数のマンドレルの上に前記金型保護材料層を堆積させることは、前記複数のマンドレルの各々の前記第2の端部の上に前記金型保護材料層を堆積させることを含む、請求項2に記載の方法。
- 前記複数のマンドレルの各々の前記第2の端部から前記金型保護材料層を除去することをさらに含む、請求項3に記載の方法。
- 前記複数のマンドレルの各々の前記第2の端部から前記金型保護材料層を除去することは、前記複数のマンドレルの各々を研磨して、前記第2の端部が前記金型保護材料層と同一平面上にあるようにすることを含む、請求項4に記載の方法。
- 前記金型保護材料層を堆積させることは、SiC、ダイヤモンド・ライク・カーボン(DLC)、Si3N4、TiCN、TiN、Al2O3及びPTFEのうちの少なくとも1つを堆積させることを含む、請求項1に記載の方法。
- 前記複数の金型キャビティのそれぞれのものに前記複数のマンドレルを挿入することは、ポリマー材料から形成されたマンドレルを挿入することを含む、請求項1に記載の方法。
- 前記ポリマー材料から形成されたマンドレルを挿入することは、ポリイミドから形成されたマンドレルを挿入することを含む、請求項7に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/573904 | 2009-10-06 | ||
US12/573,904 US20110079702A1 (en) | 2009-10-06 | 2009-10-06 | Forming a protective layer on a mold and mold having a protective layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011079311A JP2011079311A (ja) | 2011-04-21 |
JP5731160B2 true JP5731160B2 (ja) | 2015-06-10 |
Family
ID=43822462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010224565A Expired - Fee Related JP5731160B2 (ja) | 2009-10-06 | 2010-10-04 | 金型上への保護層の形成及び保護層を有する金型 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20110079702A1 (ja) |
JP (1) | JP5731160B2 (ja) |
KR (1) | KR101599075B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103603026B (zh) * | 2013-11-15 | 2016-03-16 | 中国科学院宁波材料技术与工程研究所 | 一种完全褪除工件表面类金刚石碳膜的方法 |
KR20230137667A (ko) * | 2022-03-22 | 2023-10-05 | 한국재료연구원 | 연속 자연 무늬 복제가 가능한 임프린팅 장치 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61272362A (ja) | 1985-05-29 | 1986-12-02 | Hitachi Ltd | 成形型の製作方法 |
JPS6483529A (en) * | 1987-09-28 | 1989-03-29 | Hoya Corp | Production of glass forming mold |
JPH01301864A (ja) * | 1988-05-31 | 1989-12-06 | Hoya Corp | ガラス成形型の製造方法 |
US5112025A (en) * | 1990-02-22 | 1992-05-12 | Tdk Corporation | Molds having wear resistant release coatings |
US6127735A (en) * | 1996-09-25 | 2000-10-03 | International Business Machines Corporation | Interconnect for low temperature chip attachment |
US6105852A (en) * | 1998-02-05 | 2000-08-22 | International Business Machines Corporation | Etched glass solder bump transfer for flip chip integrated circuit devices |
US6523803B1 (en) * | 1998-09-03 | 2003-02-25 | Micron Technology, Inc. | Mold apparatus used during semiconductor device fabrication |
US6295730B1 (en) * | 1999-09-02 | 2001-10-02 | Micron Technology, Inc. | Method and apparatus for forming metal contacts on a substrate |
DE10004647C1 (de) * | 2000-02-03 | 2001-07-26 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiterbauelementes mit einem Multichipmodul und einem Silizium-Trägersubstrat |
US20020149107A1 (en) * | 2001-02-02 | 2002-10-17 | Avery Dennison Corporation | Method of making a flexible substrate containing self-assembling microstructures |
US6875379B2 (en) * | 2000-12-29 | 2005-04-05 | Amkor Technology, Inc. | Tool and method for forming an integrated optical circuit |
US20050008821A1 (en) * | 2003-07-07 | 2005-01-13 | Pricone Robert M. | Process and apparatus for fabricating precise microstructures and polymeric molds for making same |
US7399421B2 (en) * | 2005-08-02 | 2008-07-15 | International Business Machines Corporation | Injection molded microoptics |
KR100723532B1 (ko) * | 2006-06-19 | 2007-05-30 | 삼성전자주식회사 | 도전성 범프 형성용 몰드, 그 몰드 제조방법, 및 그몰드를 이용한 웨이퍼에 범프 형성방법 |
US7348270B1 (en) * | 2007-01-22 | 2008-03-25 | International Business Machines Corporation | Techniques for forming interconnects |
US20090004840A1 (en) * | 2007-06-27 | 2009-01-01 | Farinelli Matthew J | Method of Creating Molds of Variable Solder Volumes for Flip Attach |
US8148255B2 (en) * | 2007-09-18 | 2012-04-03 | International Business Machines Corporation | Techniques for forming solder bump interconnects |
KR20090076050A (ko) * | 2008-01-07 | 2009-07-13 | 세크론 주식회사 | 솔더 범프들을 형성하기 위한 템플릿, 이를 제조하는 방법및 이를 이용하여 솔더 범프들을 검사하는 방법 |
KR101427690B1 (ko) * | 2008-01-07 | 2014-08-07 | 세메스 주식회사 | 솔더 범프들을 형성하기 위한 템플릿 및 이를 이용하여웨이퍼를 정렬하는 방법 |
JP2010102820A (ja) * | 2008-09-29 | 2010-05-06 | Fujifilm Corp | モールド構造体、並びにそれを用いたインプリント方法及び磁気転写方法 |
-
2009
- 2009-10-06 US US12/573,904 patent/US20110079702A1/en not_active Abandoned
-
2010
- 2010-09-30 KR KR1020100094944A patent/KR101599075B1/ko active IP Right Grant
- 2010-10-04 JP JP2010224565A patent/JP5731160B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-23 US US13/453,371 patent/US8668834B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR101599075B1 (ko) | 2016-03-02 |
JP2011079311A (ja) | 2011-04-21 |
US20120207920A1 (en) | 2012-08-16 |
KR20110037864A (ko) | 2011-04-13 |
US20110079702A1 (en) | 2011-04-07 |
US8668834B2 (en) | 2014-03-11 |
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