JP5728259B2 - プログラム及び決定方法 - Google Patents

プログラム及び決定方法 Download PDF

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Publication number
JP5728259B2
JP5728259B2 JP2011053556A JP2011053556A JP5728259B2 JP 5728259 B2 JP5728259 B2 JP 5728259B2 JP 2011053556 A JP2011053556 A JP 2011053556A JP 2011053556 A JP2011053556 A JP 2011053556A JP 5728259 B2 JP5728259 B2 JP 5728259B2
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JP
Japan
Prior art keywords
value
evaluation
target
evaluation item
cost
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JP2011053556A
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English (en)
Japanese (ja)
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JP2012191018A5 (enExample
JP2012191018A (ja
Inventor
裕一 行田
裕一 行田
辻田　好一郎
好一郎 辻田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011053556A priority Critical patent/JP5728259B2/ja
Priority to US13/409,466 priority patent/US8584055B2/en
Priority to KR1020120024427A priority patent/KR101390586B1/ko
Priority to CN201210061014.5A priority patent/CN102681354B/zh
Publication of JP2012191018A publication Critical patent/JP2012191018A/ja
Publication of JP2012191018A5 publication Critical patent/JP2012191018A5/ja
Application granted granted Critical
Publication of JP5728259B2 publication Critical patent/JP5728259B2/ja
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/44—Arrangements for executing specific programs
    • G06F9/445—Program loading or initiating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70125—Use of illumination settings tailored to particular mask patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G03F7/70441—Optical proximity correction [OPC]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011053556A 2011-03-10 2011-03-10 プログラム及び決定方法 Active JP5728259B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011053556A JP5728259B2 (ja) 2011-03-10 2011-03-10 プログラム及び決定方法
US13/409,466 US8584055B2 (en) 2011-03-10 2012-03-01 Non-transitory computer-readable storage medium, decision method and computer for deciding exposure condition using evaluation item of interest and auxiliary evaluation item
KR1020120024427A KR101390586B1 (ko) 2011-03-10 2012-03-09 컴퓨터 판독가능 저장 매체, 결정 방법 및 컴퓨터
CN201210061014.5A CN102681354B (zh) 2011-03-10 2012-03-09 决定方法和计算机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011053556A JP5728259B2 (ja) 2011-03-10 2011-03-10 プログラム及び決定方法

Publications (3)

Publication Number Publication Date
JP2012191018A JP2012191018A (ja) 2012-10-04
JP2012191018A5 JP2012191018A5 (enExample) 2014-04-17
JP5728259B2 true JP5728259B2 (ja) 2015-06-03

Family

ID=46797206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011053556A Active JP5728259B2 (ja) 2011-03-10 2011-03-10 プログラム及び決定方法

Country Status (4)

Country Link
US (1) US8584055B2 (enExample)
JP (1) JP5728259B2 (enExample)
KR (1) KR101390586B1 (enExample)
CN (1) CN102681354B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5835968B2 (ja) * 2011-07-05 2015-12-24 キヤノン株式会社 決定方法、プログラム及び露光方法
JP5784657B2 (ja) 2013-02-26 2015-09-24 株式会社東芝 フォーカス位置調整装置、レチクル、フォーカス位置調整プログラムおよび半導体装置の製造方法
WO2017211538A1 (en) 2016-06-09 2017-12-14 Asml Netherlands B.V. Projection system modelling method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6563566B2 (en) * 2001-01-29 2003-05-13 International Business Machines Corporation System and method for printing semiconductor patterns using an optimized illumination and reticle
JP3910032B2 (ja) * 2001-09-25 2007-04-25 大日本スクリーン製造株式会社 基板現像装置
KR20050121728A (ko) * 2003-04-16 2005-12-27 가부시키가이샤 니콘 패턴 결정 방법 및 시스템, 마스크의 제조 방법, 결상 성능조정 방법, 노광 방법 및 장치, 그리고 프로그램 및 정보기록 매체
JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
JP4778685B2 (ja) * 2004-03-10 2011-09-21 株式会社日立ハイテクノロジーズ 半導体デバイスのパターン形状評価方法及びその装置
TW200745771A (en) * 2006-02-17 2007-12-16 Nikon Corp Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
US8134681B2 (en) * 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
JP5235322B2 (ja) 2006-07-12 2013-07-10 キヤノン株式会社 原版データ作成方法及び原版データ作成プログラム
US20080158529A1 (en) 2006-12-28 2008-07-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5217442B2 (ja) 2008-01-08 2013-06-19 富士通セミコンダクター株式会社 露光データ作成方法及び露光方法
JP2010045309A (ja) * 2008-08-18 2010-02-25 Fujitsu Microelectronics Ltd 露光方法及び半導体装置の製造方法
US8739079B2 (en) * 2009-10-30 2014-05-27 Canon Kabushiki Kaisha Recording medium and determination method

Also Published As

Publication number Publication date
CN102681354A (zh) 2012-09-19
KR20120104497A (ko) 2012-09-21
US8584055B2 (en) 2013-11-12
US20120233574A1 (en) 2012-09-13
KR101390586B1 (ko) 2014-04-30
JP2012191018A (ja) 2012-10-04
CN102681354B (zh) 2014-09-10

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