JP5725942B2 - 粉塵排出装置 - Google Patents
粉塵排出装置 Download PDFInfo
- Publication number
- JP5725942B2 JP5725942B2 JP2011083360A JP2011083360A JP5725942B2 JP 5725942 B2 JP5725942 B2 JP 5725942B2 JP 2011083360 A JP2011083360 A JP 2011083360A JP 2011083360 A JP2011083360 A JP 2011083360A JP 5725942 B2 JP5725942 B2 JP 5725942B2
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- JP
- Japan
- Prior art keywords
- wafer
- unit
- dust
- adhesive tape
- charging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000428 dust Substances 0.000 title claims description 33
- 239000002390 adhesive tape Substances 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- 238000007599 discharging Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Description
波長 :1064nm
繰り返し周波数 :100kHz
パルス出力 :10μJ
集光スポット径 :φ1μm
加工送り速度 :100mm/秒
13 分割予定ライン
15 デバイス
17 改質層
18 集光器
20 分割装置
25 ウエーハユニット
40 粉塵排出装置
42 支持プレート
82 電圧印加手段
86 帯電ユニット
88,90 帯電板
100 スピンナ洗浄装置
106 スピンナテーブル
126 洗浄水ノズル
132 エアノズル
Claims (1)
- 外周部が環状フレームに貼着された粘着テープ上に貼着され、複数の分割溝により個々のデバイスに分割されたウエーハの該分割溝から粉塵を排出する粉塵排出装置であって、
開口を有するフレーム支持手段と、
該フレーム支持手段で支持された該環状フレームに貼着された該粘着テープに配設されたウエーハを挟むように該粘着テープ側及びウエーハ側に位置付けられる一対の帯電板と、
該一対の帯電板に直流高電圧を印加する電圧印加手段と、
を具備したことを特徴とする粉塵排出装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011083360A JP5725942B2 (ja) | 2011-04-05 | 2011-04-05 | 粉塵排出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011083360A JP5725942B2 (ja) | 2011-04-05 | 2011-04-05 | 粉塵排出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012222017A JP2012222017A (ja) | 2012-11-12 |
JP5725942B2 true JP5725942B2 (ja) | 2015-05-27 |
Family
ID=47273240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011083360A Active JP5725942B2 (ja) | 2011-04-05 | 2011-04-05 | 粉塵排出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5725942B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7227688B2 (ja) | 2017-03-31 | 2023-02-22 | 立川ブラインド工業株式会社 | プリーツスクリーン |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014229806A (ja) * | 2013-05-24 | 2014-12-08 | 株式会社ディスコ | レーザー加工装置及びウエーハのレーザー加工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4744833A (en) * | 1987-06-11 | 1988-05-17 | International Business Machines Corporation | Electrostatic removal of contaminants |
JP5342772B2 (ja) * | 2007-10-12 | 2013-11-13 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
JP2010021397A (ja) * | 2008-07-11 | 2010-01-28 | Disco Abrasive Syst Ltd | ウエーハのクリーニング方法 |
-
2011
- 2011-04-05 JP JP2011083360A patent/JP5725942B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7227688B2 (ja) | 2017-03-31 | 2023-02-22 | 立川ブラインド工業株式会社 | プリーツスクリーン |
Also Published As
Publication number | Publication date |
---|---|
JP2012222017A (ja) | 2012-11-12 |
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