JP5722236B2 - 接合微小電気機械アセンブリ - Google Patents

接合微小電気機械アセンブリ Download PDF

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Publication number
JP5722236B2
JP5722236B2 JP2011548062A JP2011548062A JP5722236B2 JP 5722236 B2 JP5722236 B2 JP 5722236B2 JP 2011548062 A JP2011548062 A JP 2011548062A JP 2011548062 A JP2011548062 A JP 2011548062A JP 5722236 B2 JP5722236 B2 JP 5722236B2
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JP
Japan
Prior art keywords
assembly
die
substrate
die body
laser
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Active
Application number
JP2011548062A
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English (en)
Japanese (ja)
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JP2012516246A5 (https=
JP2012516246A (ja
Inventor
エイ ホイジントン，ポール
エイ ホイジントン，ポール
エイ トーリ，マーク
エイ トーリ，マーク
Original Assignee
フジフィルム ディマティックス， インコーポレイテッド
フジフィルム ディマティックス， インコーポレイテッド
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Application filed by フジフィルム ディマティックス， インコーポレイテッド, フジフィルム ディマティックス， インコーポレイテッド filed Critical フジフィルム ディマティックス， インコーポレイテッド
Publication of JP2012516246A publication Critical patent/JP2012516246A/ja
Publication of JP2012516246A5 publication Critical patent/JP2012516246A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00904—Multistep processes for the separation of wafers into individual elements not provided for in groups B81C1/00873 - B81C1/00896
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2011548062A 2009-01-28 2010-01-20 接合微小電気機械アセンブリ Active JP5722236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/361,439 US20100187667A1 (en) 2009-01-28 2009-01-28 Bonded Microelectromechanical Assemblies
US12/361,439 2009-01-28
PCT/US2010/021470 WO2010088111A2 (en) 2009-01-28 2010-01-20 Bonded microelectromechanical assemblies

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015014260A Division JP6052915B2 (ja) 2009-01-28 2015-01-28 接合微小電気機械アセンブリ

Publications (3)

Publication Number Publication Date
JP2012516246A JP2012516246A (ja) 2012-07-19
JP2012516246A5 JP2012516246A5 (https=) 2013-03-07
JP5722236B2 true JP5722236B2 (ja) 2015-05-20

Family

ID=42353497

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011548062A Active JP5722236B2 (ja) 2009-01-28 2010-01-20 接合微小電気機械アセンブリ
JP2015014260A Active JP6052915B2 (ja) 2009-01-28 2015-01-28 接合微小電気機械アセンブリ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015014260A Active JP6052915B2 (ja) 2009-01-28 2015-01-28 接合微小電気機械アセンブリ

Country Status (6)

Country Link
US (2) US20100187667A1 (https=)
EP (1) EP2382151B1 (https=)
JP (2) JP5722236B2 (https=)
KR (1) KR101700100B1 (https=)
CN (1) CN102300801B (https=)
WO (1) WO2010088111A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6048794B2 (ja) * 2012-07-31 2016-12-21 株式会社リコー ノズルプレート、ノズルプレートの製造方法、インクジェットヘッド及びインクジェット印刷装置
US9132634B2 (en) * 2012-11-29 2015-09-15 Palo Alto Research Center Incorporated Bypass flow path for ink jet bubbles
US12610742B2 (en) 2019-11-25 2026-04-21 Aita Bio Inc. Micropump and method of fabricating the same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2827884B2 (ja) * 1994-02-09 1998-11-25 富士ゼロックス株式会社 インクジェットヘッドの作製方法
EP0867289B1 (en) * 1994-04-20 2000-03-15 Seiko Epson Corporation Inkjet recording apparatus
JP3389732B2 (ja) * 1994-04-20 2003-03-24 セイコーエプソン株式会社 インクジェット記録装置及びインクジェットヘッドの製造方法
JPH09141879A (ja) * 1995-11-28 1997-06-03 Tec Corp インクジェットプリンタヘッドの製造方法
JPH09174861A (ja) * 1995-12-28 1997-07-08 Tec Corp インクジェットプリンタヘッドの製造方法
US6648453B2 (en) * 1997-07-15 2003-11-18 Silverbrook Research Pty Ltd Ink jet printhead chip with predetermined micro-electromechanical systems height
JPH11254675A (ja) * 1998-03-10 1999-09-21 Oki Data Corp インクジェットヘッド及びその製造方法
CN1250720A (zh) 1998-03-27 2000-04-19 莱克斯马克国际公司 形成单个喷嘴板并将喷嘴板连接到打印头上的方法
JP3555653B2 (ja) 1998-09-30 2004-08-18 セイコーエプソン株式会社 インクジェット式記録ヘッド及びその製造方法
AUPQ130399A0 (en) * 1999-06-30 1999-07-22 Silverbrook Research Pty Ltd A method and apparatus (IJ47V9)
US6464324B1 (en) * 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
JP2001315337A (ja) * 2000-05-01 2001-11-13 Fuji Xerox Co Ltd インクジェット記録ヘッド、インクジェット記録装置及びヘッド作製方法
US6464347B2 (en) * 2000-11-30 2002-10-15 Xerox Corporation Laser ablated filter
WO2003022584A1 (en) * 2001-09-06 2003-03-20 Ricoh Company, Ltd. Liquid drop discharge head and manufacture method thereof, micro device, ink-jet head, ink cartridge, and ink-jet printing device
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
CN100548692C (zh) * 2003-10-10 2009-10-14 富士胶卷迪马蒂克斯股份有限公司 具有薄膜的打印头
US7302309B2 (en) * 2004-04-26 2007-11-27 Hewlett-Packard Development Company, L.P. Laser micromachining methods and systems
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
US8091987B2 (en) * 2005-07-07 2012-01-10 Xaar Plc Ink jet print head with improved reliability
JP2007048958A (ja) * 2005-08-10 2007-02-22 Renesas Technology Corp 半導体装置の製造方法および半導体装置
US7838331B2 (en) * 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
JP4816406B2 (ja) 2005-11-16 2011-11-16 株式会社デンソー ウェハの加工方法
ATE496772T1 (de) * 2006-03-20 2011-02-15 Brother Ind Ltd Verfahren zur herstellung eines piezoelektrischen aktors, tintenstrahlkopf und tintenstrahldrucker mit aerosolablagerungsverfahren, piezoelektrischer aktor, tintenstrahlkopf und tintenstrahldrucker
US7819506B2 (en) * 2006-03-29 2010-10-26 Lexmark International, Inc. Flexible encapsulant materials for micro-fluid ejection heads and methods relating thereto
US7487678B2 (en) * 2006-12-13 2009-02-10 Honeywell International Inc. Z offset MEMS devices and methods
JP2008311333A (ja) * 2007-06-13 2008-12-25 Seiko Epson Corp 基板分割方法、及び表示装置の製造方法

Also Published As

Publication number Publication date
EP2382151A2 (en) 2011-11-02
KR101700100B1 (ko) 2017-01-26
EP2382151B1 (en) 2019-04-10
EP2382151A4 (en) 2017-03-22
WO2010088111A3 (en) 2010-11-04
US20100187667A1 (en) 2010-07-29
JP2012516246A (ja) 2012-07-19
CN102300801B (zh) 2016-02-03
US8979247B2 (en) 2015-03-17
KR20110113641A (ko) 2011-10-17
US20120019598A1 (en) 2012-01-26
WO2010088111A2 (en) 2010-08-05
JP6052915B2 (ja) 2016-12-27
CN102300801A (zh) 2011-12-28
JP2015133491A (ja) 2015-07-23

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