JP5714613B2 - プリントヘッドの噴出性能を監視する方法 - Google Patents
プリントヘッドの噴出性能を監視する方法 Download PDFInfo
- Publication number
- JP5714613B2 JP5714613B2 JP2012557472A JP2012557472A JP5714613B2 JP 5714613 B2 JP5714613 B2 JP 5714613B2 JP 2012557472 A JP2012557472 A JP 2012557472A JP 2012557472 A JP2012557472 A JP 2012557472A JP 5714613 B2 JP5714613 B2 JP 5714613B2
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- JP
- Japan
- Prior art keywords
- conductive fluid
- current
- fluid
- magnetic field
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04555—Control methods or devices therefor, e.g. driver circuits, control circuits detecting current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2002/041—Electromagnetic transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14354—Sensor in each pressure chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/04—Heads using conductive ink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Description
Claims (5)
- 噴出装置の性能を監視する方法であって、前記噴出装置は導電性流体の液滴を排出するように構成され、前記導電性流体の少なくとも一部が磁界内に位置され、前記方法は:
ステップ(a) 前記導電性流体内に圧力波を発生させるよう前記導電性流体にローレンツ力を発生させるために、前記磁界内に位置する前記導電性流体の一部に作動電流を提供すること;
ステップ(b) 前記磁界内に位置する前記導電性流体の一部の中の残留圧力波によって引き起こされる、結果として生じる電流を検出すること、したがって、検出信号を得ること;および
ステップ(c) 前記検出信号に基づいて、前記噴出装置が動作状態にあるかどうかを決定すること、を含む、
方法。 - 前記ステップ(c)は、前記検出信号の少なくとも1つの特性を、前記噴出装置の動作状態に対応する所定の検出信号の特性と比較することを含む、
請求項1に記載の方法。 - 前記噴出装置は、前記導電性流体に前記電流を供給するように前記導電性流体と接触する2つの電極を有し、
前記ステップ(a)において、前記2つの電極は、電流発生ユニットに動作可能に接続され、
前記ステップ(b)において、前記2つの電極は、電気信号検出ユニットに動作可能に接続される、
請求項1に記載の方法。 - 導電性流体の液滴を印刷するための印刷装置であって、前記印刷装置は、
ある量の前記導電性流体を保持するための流体チャンバと;
前記導電性流体の前記液滴を前記チャンバからノズルを通じて排出するように構成された作動組立体であって、
・前記流体チャンバの少なくとも一部に磁界を発生させる磁界発生ユニットと;
・前記流体チャンバの一部内の前記導電性流体に圧力波を発生させるよう前記導電性流体にローレンツ力を発生させるために、前記磁界が与えられた前記チャンバの一部内の前記導電性流体に作動電流を発生させる電流発生ユニットと、を有する、
作動組立体と、
前記磁界内に置かれた前記導電性流体の一部内の残留圧力波によって引き起こされる結果として生じる電流を検出するための、したがって検出信号を得るための電気信号検出ユニットと、を有する、
印刷装置。 - 前記電流発生ユニットは、前記導電性流体に前記作動電流を供給するために前記導電性流体と接触する2つの電極に動作可能に接続可能であり、
前記印刷装置は、前記2つの電極が作動と同時に前記電流発生ユニットに動作可能に接続されるように、且つ、前記2つの電極が作動後に前記電気信号検出ユニットに動作可能に接続されるように構成される、
請求項4に記載の印刷装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10156856 | 2010-03-18 | ||
EP10156856.6 | 2010-03-18 | ||
PCT/EP2011/053195 WO2011113703A1 (en) | 2010-03-18 | 2011-03-03 | Method for monitoring a jettin performance of a print head |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013522016A JP2013522016A (ja) | 2013-06-13 |
JP5714613B2 true JP5714613B2 (ja) | 2015-05-07 |
Family
ID=42331070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012557472A Expired - Fee Related JP5714613B2 (ja) | 2010-03-18 | 2011-03-03 | プリントヘッドの噴出性能を監視する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8721032B2 (ja) |
EP (1) | EP2547527B1 (ja) |
JP (1) | JP5714613B2 (ja) |
CN (1) | CN102811864B (ja) |
WO (1) | WO2011113703A1 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013050250A1 (en) | 2011-10-06 | 2013-04-11 | Oce-Technologies B.V. | Method and system for maintaining jetting stability in a jetting device |
US9205663B2 (en) | 2014-03-26 | 2015-12-08 | Palo Alto Research Center Incorporated | Inkjet print heads with inductive heating |
EP3124249A1 (en) | 2015-07-28 | 2017-02-01 | OCE-Technologies B.V. | Jetting device |
US10315247B2 (en) | 2015-09-24 | 2019-06-11 | Markforged, Inc. | Molten metal jetting for additive manufacturing |
EP3423277B1 (en) | 2016-03-03 | 2023-01-25 | Desktop Metal, Inc. | Magnetohydrodynamic deposition of metal in manufacturing |
US10751799B2 (en) | 2016-03-03 | 2020-08-25 | Desktop Metal, Inc. | Magnetohydrodynamic deposition rate control for metal manufacturing |
US10000011B1 (en) | 2016-12-02 | 2018-06-19 | Markforged, Inc. | Supports for sintering additively manufactured parts |
CA3040929C (en) | 2016-12-02 | 2023-08-01 | Markforged, Inc. | Sintering additively manufactured parts with a densification linking platform |
US10800108B2 (en) | 2016-12-02 | 2020-10-13 | Markforged, Inc. | Sinterable separation material in additive manufacturing |
IL266909B2 (en) | 2016-12-06 | 2024-01-01 | Markforged Inc | Additive manufacturing with heat flexible material feed |
EP3814037A4 (en) | 2018-06-26 | 2022-01-19 | Markforged, Inc. | FLEXIBLE BASIC MATERIAL |
EP3819049B1 (en) | 2019-11-05 | 2024-04-24 | Markforged, Inc. | Method for minimizing stress-related deformations in 3d printed and sintered parts |
US11440321B2 (en) * | 2019-12-12 | 2022-09-13 | Xerox Corporation | Gas expansion material jetting actuator |
US11919226B2 (en) | 2021-09-27 | 2024-03-05 | Xerox Corporation | Method of jetting print material and method of printing |
US11872751B2 (en) | 2021-09-27 | 2024-01-16 | Xerox Corporation | Printer jetting mechanism and printer employing the printer jetting mechanism |
US11806783B2 (en) | 2021-09-27 | 2023-11-07 | Xerox Corporation | Method of jetting print material and method of printing |
US11794241B2 (en) * | 2021-09-27 | 2023-10-24 | Xerox Corporation | Method of jetting print material and method of printing |
CN115055777B (zh) * | 2022-07-19 | 2023-07-28 | 盐城工学院 | 一种非接触电池片互联条焊接压紧装置、焊接装置及焊接装置的控制方法 |
Family Cites Families (12)
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JPH01113254A (ja) * | 1987-10-27 | 1989-05-01 | Matsushita Electric Ind Co Ltd | インクジェットプリンタ |
FR2670505B1 (fr) * | 1990-12-17 | 1994-03-25 | Solems | Procede et appareil pour apporter un compose metallique fondu a un substrat. |
US5876615A (en) * | 1997-01-02 | 1999-03-02 | Hewlett-Packard Company | Molten solder drop ejector |
KR100213721B1 (ko) * | 1997-06-28 | 1999-08-02 | 윤종용 | 잉크분사장치 |
US6202734B1 (en) * | 1998-08-03 | 2001-03-20 | Sandia Corporation | Apparatus for jet application of molten metal droplets for manufacture of metal parts |
NL1010798C2 (nl) * | 1998-12-14 | 2000-06-19 | Oce Tech Bv | Drukinrichting. |
WO2004022343A2 (en) * | 2002-09-04 | 2004-03-18 | John Daniels | Printer and method for manufacturing electronic circuits and displays |
US7637403B2 (en) * | 2004-10-25 | 2009-12-29 | Plex Llc | Liquid metal droplet generator |
US7449703B2 (en) * | 2005-02-25 | 2008-11-11 | Cymer, Inc. | Method and apparatus for EUV plasma source target delivery target material handling |
DE112005003693T5 (de) * | 2005-09-30 | 2008-08-07 | Inspire AG für mechatronische Produktionssysteme und Fertigungstechnik | Druckzelle und Druckkopf zum Drucken geschmolzener Metalle |
US8453595B2 (en) * | 2005-11-14 | 2013-06-04 | Mydata Automation Ab | Jetting apparatus and method of improving the performance of a jetting apparatus |
EP2328756B1 (en) * | 2008-08-27 | 2014-05-07 | OCE-Technologies B.V. | Method for detecting an operating state of a fluid chamber of an inkjet print head |
-
2011
- 2011-03-03 JP JP2012557472A patent/JP5714613B2/ja not_active Expired - Fee Related
- 2011-03-03 CN CN201180014514.7A patent/CN102811864B/zh not_active Expired - Fee Related
- 2011-03-03 EP EP11706592.0A patent/EP2547527B1/en active Active
- 2011-03-03 WO PCT/EP2011/053195 patent/WO2011113703A1/en active Application Filing
-
2012
- 2012-09-04 US US13/602,838 patent/US8721032B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN102811864B (zh) | 2015-11-25 |
US20130021404A1 (en) | 2013-01-24 |
US8721032B2 (en) | 2014-05-13 |
EP2547527B1 (en) | 2014-11-26 |
CN102811864A (zh) | 2012-12-05 |
WO2011113703A1 (en) | 2011-09-22 |
JP2013522016A (ja) | 2013-06-13 |
EP2547527A1 (en) | 2013-01-23 |
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