JP5712585B2 - 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 - Google Patents

電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Download PDF

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Publication number
JP5712585B2
JP5712585B2 JP2010270890A JP2010270890A JP5712585B2 JP 5712585 B2 JP5712585 B2 JP 5712585B2 JP 2010270890 A JP2010270890 A JP 2010270890A JP 2010270890 A JP2010270890 A JP 2010270890A JP 5712585 B2 JP5712585 B2 JP 5712585B2
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Japan
Prior art keywords
copper alloy
atomic
electronic devices
less
electronic equipment
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JP2010270890A
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English (en)
Japanese (ja)
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JP2012117142A (ja
JP2012117142A5 (enExample
Inventor
牧　一誠
一誠 牧
優樹 伊藤
優樹 伊藤
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2010270890A priority Critical patent/JP5712585B2/ja
Priority to PCT/JP2011/077011 priority patent/WO2012073777A1/ja
Priority to CN201180057533.8A priority patent/CN103228804B/zh
Priority to US13/990,939 priority patent/US20130284327A1/en
Priority to TW100143571A priority patent/TWI591191B/zh
Publication of JP2012117142A publication Critical patent/JP2012117142A/ja
Publication of JP2012117142A5 publication Critical patent/JP2012117142A5/ja
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Publication of JP5712585B2 publication Critical patent/JP5712585B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
JP2010270890A 2010-12-03 2010-12-03 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 Expired - Fee Related JP5712585B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010270890A JP5712585B2 (ja) 2010-12-03 2010-12-03 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
PCT/JP2011/077011 WO2012073777A1 (ja) 2010-12-03 2011-11-24 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
CN201180057533.8A CN103228804B (zh) 2010-12-03 2011-11-24 电子设备用铜合金、电子设备用铜合金的制造方法及电子设备用铜合金轧材
US13/990,939 US20130284327A1 (en) 2010-12-03 2011-11-24 Copper alloy for electronic device, method of producing copper alloy for electronic device, and copper alloy rolled material for electronic device
TW100143571A TWI591191B (zh) 2010-12-03 2011-11-28 電子機器用銅合金、電子機器用銅合金的製造方法及電子機器用銅合金輥軋材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010270890A JP5712585B2 (ja) 2010-12-03 2010-12-03 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Publications (3)

Publication Number Publication Date
JP2012117142A JP2012117142A (ja) 2012-06-21
JP2012117142A5 JP2012117142A5 (enExample) 2013-08-01
JP5712585B2 true JP5712585B2 (ja) 2015-05-07

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Family Applications (1)

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JP2010270890A Expired - Fee Related JP5712585B2 (ja) 2010-12-03 2010-12-03 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Country Status (5)

Country Link
US (1) US20130284327A1 (enExample)
JP (1) JP5712585B2 (enExample)
CN (1) CN103228804B (enExample)
TW (1) TWI591191B (enExample)
WO (1) WO2012073777A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
CN103388089B (zh) * 2013-04-25 2015-06-17 刘春忠 电流通、断金属材料及其用途
CN103290254A (zh) * 2013-05-07 2013-09-11 锡山区羊尖泓之盛五金厂 一种耐高温超导铜线及其制备方法
CN107531527B (zh) * 2015-05-18 2021-04-09 三菱电机株式会社 水处理系统及水处理方法
JP6736869B2 (ja) * 2015-11-09 2020-08-05 三菱マテリアル株式会社 銅合金素材
CN106834787A (zh) * 2015-12-03 2017-06-13 黄波 一种Gu-Pm-Au-B合金导线及其制备方法
CN106834788A (zh) * 2015-12-03 2017-06-13 黄波 一种含钐元素抗拉伸铜合金导线及其制备方法
CN106834790A (zh) * 2015-12-03 2017-06-13 黄波 一种Gu-Gd-Au-B合金导线及其制备方法
CN106834789A (zh) * 2015-12-03 2017-06-13 黄波 一种Gu-Ce-Au-B合金导线及其制备方法
CN108598058B (zh) * 2017-12-21 2020-05-19 汕头市骏码凯撒有限公司 一种铜合金键合丝及其制造方法
CN108162564A (zh) * 2018-01-23 2018-06-15 东北大学 用于薄规格电连接器端子的铜钢铜复合材料及其制备方法
CN109022878B (zh) * 2018-09-11 2020-12-22 广东美的制冷设备有限公司 用于空调消音降噪的泡沫合金及其制备方法和应用
CN111192704A (zh) * 2019-12-30 2020-05-22 南通南平电子科技有限公司 一种耐弯折的无座板片式电容引线
CN111334729B (zh) * 2020-02-28 2021-09-24 交大材料科技(江苏)研究院有限公司 一种高密度纳米孪晶高性能镍铝青铜合金板材及其制备方法
CN114951609B (zh) * 2022-04-13 2024-04-19 佛山市陶本科技有限公司 具有均匀闭孔的泡沫铝板及其制备方法
CN115786764B (zh) * 2022-11-22 2023-12-22 广州番禺职业技术学院 一种铜镜材料及其制备方法
CN117604321B (zh) * 2024-01-22 2024-03-29 西安稀有金属材料研究院有限公司 一种完全共格氧化物弥散强化铜基复合材料及其制备方法
CN120452906B (zh) * 2025-06-16 2025-11-07 西安中实金属有限公司 一种耐腐蚀铜槽线及其防电化学腐蚀工艺

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US4715910A (en) * 1986-07-07 1987-12-29 Olin Corporation Low cost connector alloy
JPH06100983A (ja) * 1992-09-22 1994-04-12 Nippon Steel Corp 高ヤング率・高降伏強度を有するｔａｂテープ用金属箔およびその製造方法
JPH06100984A (ja) * 1992-09-22 1994-04-12 Nippon Steel Corp バネ限界値と形状凍結性に優れたバネ用材料及びその製造方法
SE525460C2 (sv) * 2002-02-28 2005-02-22 Sandvik Ab Användning av en kopparlegering i uppkolande miljöer
JP4787986B2 (ja) * 2002-11-25 2011-10-05 Ｄｏｗａメタルテック株式会社 銅合金およびその製造方法
US8715431B2 (en) * 2004-08-17 2014-05-06 Kobe Steel, Ltd. Copper alloy plate for electric and electronic parts having bending workability
US7628873B2 (en) * 2005-09-09 2009-12-08 Ngk Insulators, Ltd. Beryllium copper alloy and method of manufacturing beryllium copper alloy
CN101646792B (zh) * 2007-03-30 2012-02-22 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si系合金
CN101952465B (zh) * 2008-01-31 2012-09-19 古河电气工业株式会社 电气电子零件用铜合金材料及其制造方法
JP5260992B2 (ja) * 2008-03-19 2013-08-14 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5420328B2 (ja) * 2008-08-01 2014-02-19 三菱マテリアル株式会社 フラットパネルディスプレイ用配線膜形成用スパッタリングターゲット
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Also Published As

Publication number Publication date
CN103228804B (zh) 2016-05-25
JP2012117142A (ja) 2012-06-21
CN103228804A (zh) 2013-07-31
TWI591191B (zh) 2017-07-11
WO2012073777A1 (ja) 2012-06-07
TW201235484A (en) 2012-09-01
US20130284327A1 (en) 2013-10-31

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