JP5710099B2 - 半導体封止用フィルム状接着剤及びその接着剤を用いた半導体装置の製造方法並びに半導体装置 - Google Patents
半導体封止用フィルム状接着剤及びその接着剤を用いた半導体装置の製造方法並びに半導体装置 Download PDFInfo
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- JP5710099B2 JP5710099B2 JP2008264232A JP2008264232A JP5710099B2 JP 5710099 B2 JP5710099 B2 JP 5710099B2 JP 2008264232 A JP2008264232 A JP 2008264232A JP 2008264232 A JP2008264232 A JP 2008264232A JP 5710099 B2 JP5710099 B2 JP 5710099B2
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- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical group C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- GBASTSRAHRGUAB-UHFFFAOYSA-N ethylenetetracarboxylic dianhydride Chemical compound O=C1OC(=O)C2=C1C(=O)OC2=O GBASTSRAHRGUAB-UHFFFAOYSA-N 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- FLGPRDQFUUFZBL-UHFFFAOYSA-N formaldehyde;naphthalen-1-ol Chemical compound O=C.C1=CC=C2C(O)=CC=CC2=C1 FLGPRDQFUUFZBL-UHFFFAOYSA-N 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- KADGVXXDDWDKBX-UHFFFAOYSA-N naphthalene-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C21 KADGVXXDDWDKBX-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- JGGWKXMPICYBKC-UHFFFAOYSA-N phenanthrene-1,8,9,10-tetracarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=C(C(O)=O)C(C(O)=O)=C3C(C(=O)O)=CC=CC3=C21 JGGWKXMPICYBKC-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- YKWDNEXDHDSTCU-UHFFFAOYSA-N pyrrolidine-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C1NC(C(O)=O)C(C(O)=O)C1C(O)=O YKWDNEXDHDSTCU-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- NJMOHBDCGXJLNJ-UHFFFAOYSA-N trimellitic anhydride chloride Chemical compound ClC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 NJMOHBDCGXJLNJ-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Description
本発明の半導体封止用フィルム状接着剤は、(a)ポリイミド樹脂と、(b)エポキシ樹脂と、(c)フェノール樹脂と、(d)フィラーと、を含有する半導体封止用フィルム状接着剤であって、350℃での溶融粘度が2000Pa・s以下であり、85℃、85%RHの条件で336時間吸湿させた場合の吸湿率が1.2質量%以下であるものである。以下、各成分について説明する。
本発明で用いる(a)ポリイミド樹脂は、例えば、テトラカルボン酸二無水物とジアミンとを公知の方法で縮合反応させて得ることができる。すなわち、有機溶媒中で、テトラカルボン酸二無水物とジアミンとを等モル又はほぼ等モル用い(各成分の添加順序は任意)、反応温度80℃以下、好ましくは0〜60℃で付加反応させる。反応が進行するにつれて反応液の粘度が徐々に上昇し、ポリイミドの前駆体であるポリアミド酸が生成する。なお、フィルム状接着剤の諸特性の低下を抑えるため、上記の酸二無水物は無水酢酸で再結晶精製処理されることが好ましい。
[式中、mは2〜20の整数を示す。]
[式中、Q1、Q2及びQ3は各々独立に炭素数1〜10のアルキレン基を示し、rは2〜80の整数を示す。]
[式中、qは5〜20の整数を示す。]
[式中、Q4及びQ9は各々独立に炭素数1〜5のアルキレン基又は置換基を有してもよいフェニレン基を示し、Q5、Q6、Q7、及びQ8は各々独立に炭素数1〜5のアルキル基、フェニル基又はフェノキシ基を示し、pは1〜5の整数を示す。]
で表される脂肪族エーテルジアミンの他、下記式(VI)で表される脂肪族エーテルジアミンが挙げられる。これらの中でも、低温ラミネート性と有機レジスト付き基板に対する良好な接着性を確保できる点で、下記一般式(VI)で表される脂肪族エーテルジアミンがより好ましい。
[式中、sは2〜80の整数を示す。]
本発明において用いる(b)エポキシ樹脂は、分子内に2個以上のエポキシ基を有するものであることが好ましく、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ナフタレン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ビフェニル型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂等の、各種多官能エポキシ樹脂などを使用することができる。これらは1種を単独で又は2種以上の混合体として使用することができる。また、例えば、ビスフェノールA型やビスフェノールF型の液状エポキシ樹脂は、1%熱重量減少温度が250℃以下であるため、高温加熱時に分解して揮発成分が発生する恐れがあることから、室温で固形のエポキシ樹脂を用いることが望ましい。
本発明において用いる(c)フェノール樹脂は、分子内に2個以上のフェノール性水酸基を有するものであることが好ましく、例えば、フェノールノボラック樹脂、クレゾールノボラック樹脂、フェノールアラルキル樹脂、クレゾールナフトールホルムアルデヒド重縮合物、トリフェニルメタン型多官能フェノール樹脂等の、各種多官能フェノール樹脂などを使用することができる。これらは1種を単独で又は2種以上の混合体として使用することができる。
本発明のフィルム状接着剤には、粘度や硬化物の物性を制御するため、及び、半導体チップと基板とを接続した際のボイドの発生や吸湿率の抑制のために、(d)フィラーを配合することが必要である。
μ=8πFtZ4Z0 4/3V2(Z0 4−Z4) (1)
μ:溶融粘度(Pa・s)
F:荷重(N)
t:加圧時間(s)
Z0 4:初期厚み(m)
Z4:加圧後厚み(m)
V:樹脂体積(m3)
吸湿率(質量%)={(吸湿後の質量−吸湿前の質量)/吸湿前の質量}×100 (2)
本発明の半導体装置の製造方法は、バンプを有する半導体チップと金属配線を有する基板とを300℃以上の温度で接続する際に、上記本発明の半導体封止用フィルム状接着剤を介して接続し、上記半導体チップと上記基板との間の空隙を上記半導体封止用フィルム状接着剤で封止充てんする工程を有する、方法である。
温度計、攪拌機及び塩化カルシウム管を備えた300mlフラスコに、1,12−ジアミノドデカン2.10g(0.035モル)、ポリエーテルジアミン(BASF社製、商品名:D2000、分子量:1923)17.31g(0.03モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(信越化学社製、商品名:LP−7100)2.61g(0.035モル)及びN−メチル−2−ピロリドン(関東化学社製)150gを仕込み、攪拌した。ジアミンの溶解後、フラスコを氷浴中で冷却しながら、無水酢酸で再結晶精製した4,4’−(4,4’−イソプロピリデンジフェノキシ)ビス(フタル酸二無水物)(ALDRICH社製、商品名:BPADA)15.62g(0.10モル)を少量ずつ添加した。室温で8時間反応させたのち、キシレン100gを加え、窒素ガスを吹き込みながら180℃で加熱し、水と共にキシレンを共沸除去して、ポリイミド樹脂の溶液を得た。得られたポリイミド樹脂は、Tgが22℃、重量平均分子量が47000、SP値が10.2であった。
20mlガラス製スクリュー管に、合成例にて合成したポリイミド樹脂1.00g(固形分)、エポキシ樹脂(YDCN−702)0.11g、エポキシ樹脂(VG3101L)0.11g、フェノール樹脂(カヤハードNHN)0.08g、及び、窒化ホウ素(HPP1−HJ)0.44gを仕込み、固形分が40質量%となるようにN−メチル−2−ピロリドン(NMP)を加え、撹拌・脱泡装置(商品名:AR−250、株式会社シンキー製)で撹拌・脱泡し、樹脂ワニスを得た。得られた樹脂ワニスを、離型処理を施したフィルム(商品名:ピューレックスA53、帝人デュポンフィルム(株)製)上に、塗工機(商品名:PI−1210 FILMCOATER、テスター産業株式会社製)を用いて塗工し、クリーンオーブン(ESPEC社製)にて80℃で30分間、次いで120℃で30分間乾燥し、フィルム状接着剤を得た。
樹脂ワニスの調製において、使用した材料の組成を下記の表1に示すように変更したこと以外は実施例1と同様にして、実施例2〜4及び比較例1〜3のフィルム状接着剤を得た。なお、表1において、各材料の配合量は質量部で表す。
(a)ポリイミド樹脂
合成例にて合成したポリイミド樹脂(以下、「合成ポリイミド」と言う)。
(b)エポキシ樹脂
クレゾールノボラック型エポキシ樹脂(東都化成株式会社製、商品名:YDCN−702)。
多官能特殊エポキシ樹脂(株式会社プリンテック製、商品名:VG3101L)。
(c)フェノール樹脂
クレゾールナフトールホルムアルデヒド重縮合物(日本化薬株式会社製、商品名:カヤハードNHN)。
(d)フィラー
窒化ホウ素(水島合金鉄社製、商品名:HPP1−HJ、平均粒子径:1.0μm、最大粒子径:5.1μm)。
(e)硬化促進剤
2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジンイソシアヌル酸付加物(四国化成株式会社製、商品名:2MAOK−PW)。
(f)溶媒
N−メチル−2−ピロリドン(NMP)(関東化学社製)。
実施例及び比較例で作製したフィルム状接着剤を切り抜き(φ6mm、厚み約0.1mm)、図1に示すように、切り抜いたフィルム状接着剤4をガラスチップ3(15mm×15mm×0.7mmt)上に貼付し、カバーガラス7(18mm×18mm×0.12〜0.17mmt)を被せ、サンプルAを作製した。サンプルAを、FCB3(フリップチップボンダー、パナソニック社製)で圧着し(圧着条件:ヘッド温度350℃、ステージ温度100℃、5秒間、1MPa)、圧着前後のフィルム状接着剤の体積変化を測定した。溶融粘度は平行板プラストメータ法により体積変化から下記式(1)に基づいて算出した。その結果を表2に示す。
μ=8πFtZ4Z0 4/3V2(Z0 4−Z4) (1)
μ:溶融粘度(Pa・s)
F:荷重(N)
t:加圧時間(s)
Z0 4:初期厚み(m)
Z4:加圧後厚み(m)
V:樹脂体積(m3)
実施例及び比較例で作製したフィルム状接着剤を切り抜き(5mm×5mm×0.03mmt)、図2に示すように、切り抜いたフィルム状接着剤4をガラスチップ3(15mm×15mm×0.7mmt)上に貼付し、金バンプ6付チップ5(4.26mm×4.26mm×0.27mmt、バンプ高さ0.02mm)を被せ、サンプルBを作製した。サンプルBをFCB3(パナソニック社製)で圧着し(圧着条件:ヘッド温度350℃、ステージ温度100℃、5秒間、1MPa)、圧着後のボイド発生率を測定した。ボイド発生率は、上記の金バンプ付チップの面積に対する圧着後の発生ボイド面積の比率で算出した。その結果を表2に示す。
実施例及び比較例で作製したフィルム状接着剤を切り抜き(2.5mm×15.5mm×0.03mmt)、ポリイミド基板(ポリイミド基材:38μm厚、銅配線:8μm厚、配線スズめっき:0.2μm厚、株式会社日立超LSIシステムズ製、商品名:JKIT COF TEG_30−B)上に貼付し、金バンプ付きチップ(チップサイズ1.6mm×15.1mm×0.4mmt、バンプサイズ:20μm×100μm×15μmt、バンプ数726、株式会社日立超LSIシステムズ製、商品名:JTEG PHASE6_30)をFCB3(パナソニック製)で実装した(実装条件:ヘッド温度350℃、ステージ温度100℃、5秒間、50N)。ここで、図3は、実施例2で得られた半導体装置の全体を示す写真であり、ポリイミド基板8上に半導体チップ9が実装されている状態を示している。また、図4は、実施例2で得られた半導体装置におけるチップ実装部分の断面を示す写真であり、ポリイミド基板8のスズめっきされた銅配線2と、半導体チップ9の金バンプ10とが金−スズ共晶により接続されており、半導体チップ9とポリイミド基板8との間の空隙がフィルム状接着剤11の硬化物により封止充てんされている状態を示している。
実施例及び比較例で作製したフィルム状接着剤(厚み:30μm)をクリーンオーブン(ESPEC社製)中、180℃で1時間キュアした。キュア後のフィルム状接着剤を2cm×2cmに切り取り、秤量瓶に入れ、小型恒温試験機(ETAC社製)にて125℃で24時間乾燥した。その後、低温恒温恒湿器(エスペック社製、商品名:PL−2KT、条件:85℃/85%RH)に入れ、所定の時間毎に低温恒温恒湿器から秤量瓶を取り出し、質量を測定した。この条件で336時間吸湿させた後の質量と、吸湿前の質量とから、下記式(2)に基づいて吸湿率を求めた。その結果を表2に示す。
吸湿率(質量%)={(吸湿後の質量−吸湿前の質量)/吸湿前の質量}×100 (2)
実施例及び比較例で作製したフィルム状接着剤(厚み:30μm)を、くし型電極評価TEG(新藤電子社製、perflex−S、配線ピッチ:30μm)に貼付し、クリーンオーブン(ESPEC社製)中、180℃で1時間キュアした。キュア後、サンプルを取り出し、加速寿命試験装置(HIRAYAMA社製、商品名:PL−422R8、条件:110℃/85%RH/100時間)に設置し、絶縁抵抗を測定した。評価方法としては、100時間を通して絶縁抵抗が1×108Ω以上である場合を「A」、絶縁抵抗の最低値が1×107Ω以上1×108Ω未満である場合を「B」、絶縁抵抗の最低値が1×107Ω未満である場合を「C」とする。なお、評価結果が「C」であるものは、実用上問題がある。その結果を表2に示す。
Claims (5)
- (a)ポリイミド樹脂と、(b)エポキシ樹脂と、(c)フェノール樹脂と、(d)フィラーと、を含有する半導体封止用フィルム状接着剤であって、
前記(a)ポリイミド樹脂は、重量平均分子量が30000以上であり、且つ、ガラス転移温度が100℃以下であり、
前記(d)フィラーの含有量は、前記フィルム状接着剤の固形分全量を基準として、25〜35質量%であり、
350℃での溶融粘度が2000Pa・s以下であり、85℃、85%RHの条件で336時間吸湿させた場合の吸湿率が1.2質量%以下である、半導体封止用フィルム状接着剤。 - 350℃、1MPaで5秒間圧着した際のボイド発生率が5%以下である、請求項1に記載の半導体封止用フィルム状接着剤。
- バンプを有する半導体チップと金属配線を有する基板とを300℃以上の温度で接続する際に、請求項1又は2に記載の半導体封止用フィルム状接着剤を介して接続し、前記半導体チップと前記基板との間の空隙を前記半導体封止用フィルム状接着剤で封止充てんする工程を有する、半導体装置の製造方法。
- 前記バンプは金バンプであり、前記金属配線は表面がスズめっきされた金属配線であり、前記基板はポリイミド基板であり、前記半導体チップと前記基板とを300℃以上の温度で金−スズ共晶を形成させて接続する、請求項3に記載の半導体装置の製造方法。
- 請求項3又は4に記載の半導体装置の製造方法によって製造される、半導体装置。
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