JP5704454B2 - 画像処理装置及び画像処理方法 - Google Patents

画像処理装置及び画像処理方法 Download PDF

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Publication number
JP5704454B2
JP5704454B2 JP2011100799A JP2011100799A JP5704454B2 JP 5704454 B2 JP5704454 B2 JP 5704454B2 JP 2011100799 A JP2011100799 A JP 2011100799A JP 2011100799 A JP2011100799 A JP 2011100799A JP 5704454 B2 JP5704454 B2 JP 5704454B2
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English (en)
Japanese (ja)
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JP2012234255A (ja
Inventor
英伸 石田
英伸 石田
正美 武士
正美 武士
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Suzuki Motor Co Ltd
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Suzuki Motor Co Ltd
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Application filed by Suzuki Motor Co Ltd filed Critical Suzuki Motor Co Ltd
Priority to JP2011100799A priority Critical patent/JP5704454B2/ja
Priority to CN201210132385.8A priority patent/CN102756209B/zh
Priority to DE102012207045.1A priority patent/DE102012207045B4/de
Publication of JP2012234255A publication Critical patent/JP2012234255A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0037—Measuring of dimensions of welds

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2011100799A 2011-04-28 2011-04-28 画像処理装置及び画像処理方法 Active JP5704454B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011100799A JP5704454B2 (ja) 2011-04-28 2011-04-28 画像処理装置及び画像処理方法
CN201210132385.8A CN102756209B (zh) 2011-04-28 2012-04-27 图像处理装置以及图像处理方法
DE102012207045.1A DE102012207045B4 (de) 2011-04-28 2012-04-27 Bildverarbeitungsvorrichtung und Bildverarbeitungsverfahren

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011100799A JP5704454B2 (ja) 2011-04-28 2011-04-28 画像処理装置及び画像処理方法

Publications (2)

Publication Number Publication Date
JP2012234255A JP2012234255A (ja) 2012-11-29
JP5704454B2 true JP5704454B2 (ja) 2015-04-22

Family

ID=47007913

Family Applications (1)

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JP2011100799A Active JP5704454B2 (ja) 2011-04-28 2011-04-28 画像処理装置及び画像処理方法

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JP (1) JP5704454B2 (de)
CN (1) CN102756209B (de)
DE (1) DE102012207045B4 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY176094A (en) * 2016-01-14 2020-07-24 Nissan Motor Method for detecting hole in laser-welded portion and laser welding device
KR101787387B1 (ko) * 2016-05-27 2017-10-19 주식회사 미루시스템즈 인쇄공정을 이용한 패턴 형상 및 인쇄성 측정장치
CN107403144B (zh) * 2017-07-11 2020-09-11 北京小米移动软件有限公司 嘴巴定位方法及装置
HUE066789T2 (hu) * 2020-01-27 2024-09-28 Comau Spa Eljárás hegesztési varrat minõségének ellenõrzésére, az ehhez kapcsolódó hegesztési munkaállomás és számítógépi program termék
CN114332475B (zh) * 2021-12-07 2024-09-06 江苏科技大学 一种船舶焊缝特征识别方法
DE102023105231B4 (de) * 2023-03-03 2024-10-02 Precitec Gmbh & Co. Kg Verfahren zur Laserbearbeitung und Laserbearbeitungssystem

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757125A (en) * 1970-12-26 1973-09-04 Mitsubishi Electric Corp Optical tracking apparatus
WO1979000004A1 (en) * 1977-06-16 1979-01-11 Boc Ltd Edge followers
US4491719A (en) * 1982-12-20 1985-01-01 General Electric Company Light pattern projector especially for welding
JP3123146B2 (ja) * 1991-09-11 2001-01-09 トヨタ自動車株式会社 溶接ビードの品質検査装置
JPH05256788A (ja) * 1992-03-12 1993-10-05 Taiyo Yuden Co Ltd 電子部品の外観検査装置
JPH0763694A (ja) * 1993-08-27 1995-03-10 Hosei Brake Kogyo Kk 点溶接部の非破壊検査装置
JPH0916768A (ja) * 1995-06-27 1997-01-17 Meidensha Corp 図面読取装置における線要素とシンボル要素の分離方法
JP3565060B2 (ja) * 1998-11-30 2004-09-15 松下電器産業株式会社 導電性ボールの検査方法
JP4309987B2 (ja) * 1999-02-12 2009-08-05 武藤工業株式会社 ラスタデータの編集方法及び装置
JP4140218B2 (ja) * 2001-08-28 2008-08-27 松下電工株式会社 レーザー溶接部の検査方法及びその装置
JP3949076B2 (ja) 2003-04-11 2007-07-25 トヨタ自動車株式会社 レーザ溶接品質評価装置および方法
SE526624C2 (sv) * 2003-06-06 2005-10-18 Abb Ab Värdering av svetskvalitet
JP2007054879A (ja) 2005-08-26 2007-03-08 Nippon Steel Corp ハイブリッド溶接装置、並びに、ハイブリッド溶接装置の画像処理方法および画像処理プログラム
CN100457353C (zh) * 2006-04-25 2009-02-04 南京理工大学 焊缝外观、熔池和接缝近红外视觉一体化传感检测装置
JP5058575B2 (ja) * 2006-12-12 2012-10-24 キヤノン株式会社 画像処理装置及びその制御方法、プログラム
CN101201329B (zh) * 2007-10-16 2011-06-22 西安交通大学 基于射线衰减能量场的无损检测缺陷提取、识别方法
WO2010035517A1 (ja) * 2008-09-25 2010-04-01 コニカミノルタエムジー株式会社 医用画像処理装置及びプログラム
CN101750416A (zh) * 2008-12-19 2010-06-23 中国科学院沈阳自动化研究所 一种基于线结构光的视觉焊缝表面质量检测传感器

Also Published As

Publication number Publication date
CN102756209B (zh) 2015-01-21
CN102756209A (zh) 2012-10-31
DE102012207045A1 (de) 2012-10-31
DE102012207045B4 (de) 2021-12-23
JP2012234255A (ja) 2012-11-29

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