JP5704207B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5704207B2 JP5704207B2 JP2013210467A JP2013210467A JP5704207B2 JP 5704207 B2 JP5704207 B2 JP 5704207B2 JP 2013210467 A JP2013210467 A JP 2013210467A JP 2013210467 A JP2013210467 A JP 2013210467A JP 5704207 B2 JP5704207 B2 JP 5704207B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- transparent substrate
- emitting device
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 86
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 37
- 238000005286 illumination Methods 0.000 claims description 16
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 238000006243 chemical reaction Methods 0.000 description 29
- 239000004020 conductor Substances 0.000 description 25
- 239000002245 particle Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 13
- 238000007747 plating Methods 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 238000000295 emission spectrum Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910004706 CaSi2 Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910004122 SrSi Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
さらに照明装置は、前記発光素子の周囲に、前記蛍光体を配置することもできる。
さらにまた照明装置は、前記複数の発光素子を、前記透明基板上において直線状に配置させることもできる。
さらにまた照明装置は、隣接する発光素子を、前記ワイヤを介して電気的に接続することもできる。
さらにまた照明装置は、前記リード領域を、前記複数の発光素子を配置した方向に沿って延長することもできる。
(発光装置)
(透明基板20)
(ダイボンド部材52)
(金属プレート30)
(導電体22)
(被覆部材46)
(第二の透光性部材40)
(透光性バルブ60)
(支持リード62)
(発光素子10)
(蛍光体)
(波長変換部材50)
(拡散剤)
(フィラー)
10C、10D、10E…LEDチップ
20…透明基板
22、22D…導電体
23、23B…リード領域
30、30B、30C、30D…金属プレート
31、31B…プレートねじ孔
40、40B…第二の透光性部材
40C…透光性部材
40D…光学レンズ
44…ワイヤ
46、46B…被覆部材
48…蛍光体
50、50B…波長変換部材
52、52B…ダイボンド部材
60…透光性バルブ
62、62B…支持リード
63、63B…凹部
64…口金
65…リードねじ孔
66…ねじ
100、200、300、400、400B…発光装置
500、600、700…パッケージ状発光装置
Claims (6)
- 透明基板と、
前記透明基板上に載置され、ワイヤによって直列に接続された、サファイア基板を備える複数の発光素子と、
前記透明基板上に設けられた、前記複数の発光素子をワイヤボンディングにより配線するための共通のリード領域と、
前記透明基板に、端部が固定された金属プレートと、
前記金属プレートの一部が露出するよう、前記透明基板及び前記発光素子を被覆し、前記透明基板の外形とほぼ同一形状である被覆部材と、
前記被覆部材を上から被覆し、前記発光素子からの光を吸収して波長変換する蛍光体を含む第二の透光性部材と
を有する発光装置と、
前記発光装置の前記金属プレートを支持する支持リードと、
前記発光装置及び前記支持リードとを内包する透光性バルブと
を備えることを特徴とする照明装置。 - 請求項1に記載の照明装置であって、さらに
前記透光性バルブと固定された、電極を備える口金を備え、
前記口金に、前記支持リードが固定されてなることを特徴とする照明装置。 - 請求項1又は2に記載の照明装置であって、
前記発光素子の周囲に、前記蛍光体が配置されてなることを特徴とする照明装置。 - 請求項1〜3のいずれか一に記載の照明装置であって、
前記複数の発光素子が前記透明基板上においてライン状に配置されてなることを特徴とする照明装置。 - 請求項1〜4のいずれか一に記載の照明装置であって、
隣接する発光素子が、前記ワイヤを介して電気的に接続されてなることを特徴とする照明装置。 - 請求項1〜5のいずれか一に記載の照明装置であって、
前記リード領域は、前記複数の発光素子を配置した方向に沿って延長されてなることを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013210467A JP5704207B2 (ja) | 2013-10-07 | 2013-10-07 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013210467A JP5704207B2 (ja) | 2013-10-07 | 2013-10-07 | 発光装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012194542A Division JP5561330B2 (ja) | 2012-09-04 | 2012-09-04 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014026988A JP2014026988A (ja) | 2014-02-06 |
JP5704207B2 true JP5704207B2 (ja) | 2015-04-22 |
Family
ID=50200409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013210467A Active JP5704207B2 (ja) | 2013-10-07 | 2013-10-07 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5704207B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4115116B1 (en) | 2020-03-02 | 2023-10-18 | Signify Holding B.V. | Tunable led filament |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06314858A (ja) * | 1993-04-30 | 1994-11-08 | Toshiba Lighting & Technol Corp | 配線基板、発光ダイオードアレイ、照明装置および指針 |
JP3645422B2 (ja) * | 1998-07-14 | 2005-05-11 | 東芝電子エンジニアリング株式会社 | 発光装置 |
JP3785820B2 (ja) * | 1998-08-03 | 2006-06-14 | 豊田合成株式会社 | 発光装置 |
JP2001351404A (ja) * | 2000-04-06 | 2001-12-21 | Kansai Tlo Kk | 発光ダイオードを用いた面発光装置 |
JP3075689U (ja) * | 2000-08-17 | 2001-02-27 | 舶用電球株式会社 | Led電球 |
JP2002232020A (ja) * | 2001-01-31 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Ledおよびこれを用いた表示装置、照明装置、液晶のバックライト装置並びに投影装置の光源装置 |
JP2004087812A (ja) * | 2002-08-27 | 2004-03-18 | Sanyo Electric Co Ltd | 発光体 |
US6956247B1 (en) * | 2004-05-26 | 2005-10-18 | Lumileds Lighting U.S., Llc | Semiconductor light emitting device including photonic band gap material and luminescent material |
-
2013
- 2013-10-07 JP JP2013210467A patent/JP5704207B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014026988A (ja) | 2014-02-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10801676B2 (en) | Light emitting device | |
JP5561330B2 (ja) | 発光装置 | |
KR101906863B1 (ko) | 발광 모듈, 램프, 조명기구 및 표시 디바이스 | |
KR101937643B1 (ko) | 발광 모듈, 램프, 조명기구 및 디스플레이 장치 | |
WO2014080567A1 (ja) | 発光モジュール、照明装置および照明器具 | |
US20110068354A1 (en) | High power LED lighting device using high extraction efficiency photon guiding structure | |
TWI606616B (zh) | 發光裝置封裝件 | |
JP2007266579A (ja) | 発光装置 | |
US20110175511A1 (en) | Light emitting diode and light source module having same | |
JP5194675B2 (ja) | 発光装置 | |
JP2007258620A (ja) | 発光装置 | |
JP2008218998A (ja) | 発光装置 | |
JP2007288138A (ja) | 発光装置 | |
JP2009010308A (ja) | 発光装置 | |
JP2018129492A (ja) | 発光装置、及び、照明装置 | |
JP2008244468A (ja) | 発光装置 | |
JP2014135437A (ja) | 発光モジュール、照明装置および照明器具 | |
JP2009071090A (ja) | 発光装置 | |
JP2008244469A (ja) | 発光装置 | |
JP5704207B2 (ja) | 発光装置 | |
EP3327805B1 (en) | Integrated light-emitting package | |
JP6607036B2 (ja) | 発光装置 | |
WO2015072120A1 (ja) | 発光装置、発光モジュール、照明器具及びランプ | |
JP2018041806A (ja) | 発光装置、及び、照明装置 | |
KR20140015958A (ko) | 발광 소자 패키지 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131106 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140611 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140617 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140808 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150127 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150209 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5704207 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |