JP5702937B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5702937B2
JP5702937B2 JP2010055276A JP2010055276A JP5702937B2 JP 5702937 B2 JP5702937 B2 JP 5702937B2 JP 2010055276 A JP2010055276 A JP 2010055276A JP 2010055276 A JP2010055276 A JP 2010055276A JP 5702937 B2 JP5702937 B2 JP 5702937B2
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Japan
Prior art keywords
wire
semiconductor device
conductor
solder
resistance
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Expired - Fee Related
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JP2010055276A
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English (en)
Japanese (ja)
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JP2011192686A5 (fr
JP2011192686A (ja
Inventor
靖 池田
靖 池田
知丈 東平
知丈 東平
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2010055276A priority Critical patent/JP5702937B2/ja
Priority to DE112010005383.9T priority patent/DE112010005383B4/de
Priority to PCT/JP2010/006785 priority patent/WO2011111137A1/fr
Publication of JP2011192686A publication Critical patent/JP2011192686A/ja
Publication of JP2011192686A5 publication Critical patent/JP2011192686A5/ja
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Publication of JP5702937B2 publication Critical patent/JP5702937B2/ja
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2010055276A 2010-03-12 2010-03-12 半導体装置 Expired - Fee Related JP5702937B2 (ja)

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JP2010055276A JP5702937B2 (ja) 2010-03-12 2010-03-12 半導体装置
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JP2014103183A (ja) 2012-11-19 2014-06-05 Mitsubishi Electric Corp 電子回路、その製造方法、および電子部品
JP2015216290A (ja) * 2014-05-13 2015-12-03 カルソニックカンセイ株式会社 ビームリード、半導体装置、および、半導体装置の製造方法
DE102015103779A1 (de) * 2015-03-16 2016-09-22 Pac Tech-Packaging Technologies Gmbh Chipanordnung und Verfahren zur Ausbildung einer Kontaktverbindung
DE102016108656A1 (de) * 2016-05-11 2017-11-16 Danfoss Silicon Power Gmbh Leistungselektronische Baugruppe mit vibrationsfreier Kontaktierung
JP2017157847A (ja) * 2017-04-21 2017-09-07 三菱電機株式会社 電子回路
DE102019215438A1 (de) * 2019-10-09 2020-08-20 Vitesco Technologies Germany Gmbh Bondbändchen, Elektronikanordnung mit einem Bondbändchen, Verfahren zum Herstellen eines Bondbändchens

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JP2001332664A (ja) 2000-05-24 2001-11-30 Fuji Electric Co Ltd 半導体装置およびその製造方法
JP2003037130A (ja) * 2001-07-24 2003-02-07 Sony Corp ボンディングワイヤ、半導体装置及びその製造方法
JP2004319740A (ja) * 2003-04-16 2004-11-11 Fuji Electric Holdings Co Ltd パワー半導体装置およびその製造方法
US20040217488A1 (en) 2003-05-02 2004-11-04 Luechinger Christoph B. Ribbon bonding
WO2007125939A1 (fr) * 2006-04-27 2007-11-08 Neomax Materials Co., Ltd. Materiau de revetement pour raccordement de cablage et element de raccordement de cablage traite a partir du materiau de revetement
JP4640345B2 (ja) 2007-01-25 2011-03-02 三菱電機株式会社 電力用半導体装置
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