JP5701002B2 - 基板支持部材及び熱処理装置 - Google Patents
基板支持部材及び熱処理装置 Download PDFInfo
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- JP5701002B2 JP5701002B2 JP2010228029A JP2010228029A JP5701002B2 JP 5701002 B2 JP5701002 B2 JP 5701002B2 JP 2010228029 A JP2010228029 A JP 2010228029A JP 2010228029 A JP2010228029 A JP 2010228029A JP 5701002 B2 JP5701002 B2 JP 5701002B2
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- substrate
- support member
- heat
- substrate support
- resistant resin
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- 239000000758 substrate Substances 0.000 title claims description 111
- 238000010438 heat treatment Methods 0.000 title claims description 25
- 239000004973 liquid crystal related substance Substances 0.000 claims description 31
- 229920006015 heat resistant resin Polymers 0.000 claims description 25
- 125000006850 spacer group Chemical group 0.000 claims description 24
- 239000011162 core material Substances 0.000 claims description 21
- 238000003860 storage Methods 0.000 claims description 15
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
- F27D3/12—Travelling or movable supports or containers for the charge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Furnace Charging Or Discharging (AREA)
Description
スペーサとして長手方向が基板の挿入方向に平行に配置されたものを備え、スペーサの長手方向と耐熱樹脂チューブの長手方向とが平行となるようにすることが好ましい。スペーサの塑性変形及び基板の厚さの変化をより確実に防止でき、液晶の表示ムラを防止できる。
1A,21A−取付面
2−ガイド
3−薄肉チューブ(耐熱樹脂チューブ)
5−芯材
22−ボルト(突起)
10,20,30,40−基板支持部材
100−熱処理装置(基板収納装置)
200−液晶基板
300−搬送装置
Claims (6)
- 熱処理装置内の基板収納位置に対する基板の搬入方向に直交する方向に一定の間隔で複数配置され、前記基板収納位置に搬入された基板の底面に当接して該基板を支持する基板支持部材であって、
長手方向が前記搬入方向に平行な取付面を有する本体と、
前記取付面に固定され、上面及び前記搬入方向の両面に開放した凹部を有するガイドと、
前記取付面に沿って上側部分を前記凹部の上方に露出させた状態で前記凹部内に挿入されるPEEKを素材とした耐熱樹脂チューブであって、長手方向を前記取付面の前記長手方向に平行にして配置され、前記基板が載置された際に弾性変形を生じる耐熱樹脂チューブと、
を備え、
前記基板は、その内側に、当該基板の厚さ方向の寸法を規定するスペーサが所定間隔毎に配置されるとともに、該スペーサ間に液晶が充填される基板支持部材。 - 前記スペーサとして長手方向が前記基板の挿入方向に平行に配置されるものを備え、当該スペーサの長手方向と前記耐熱樹脂チューブの長手方向とが平行となる請求項1に記載の基板支持部材。
- 前記ガイドは、各対が互いの間に所定の間隙を設けて前記取付面に固定される複数対の突起で構成した請求項1又は2に記載の基板支持部材。
- 前記耐熱樹脂チューブの内径よりも小径の芯材であって、前記耐熱樹脂チューブを貫通して前記耐熱樹脂チューブの周方向の一部を挟んで前記本体に固定される芯材を備えた請求項1乃至3の何れかに記載の基板支持部材。
- 前記芯材は、前記耐熱樹脂チューブから露出した一端側でのみ前記本体に固定される請求項4に記載の基板支持部材。
- 請求項5に記載の基板支持部材と、背面を開閉するドアと、を備え、前記芯材は前面側でのみ前記本体に固定される熱処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010228029A JP5701002B2 (ja) | 2010-10-08 | 2010-10-08 | 基板支持部材及び熱処理装置 |
TW100119938A TWI578435B (zh) | 2010-10-08 | 2011-06-08 | 基板支撐構件及基板收納裝置 |
KR1020110063159A KR101780471B1 (ko) | 2010-10-08 | 2011-06-28 | 기판 지지 부재 및 기판 수납 장치 |
CN201110179649.0A CN102446798B (zh) | 2010-10-08 | 2011-06-28 | 基板支承构件和基板容纳装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010228029A JP5701002B2 (ja) | 2010-10-08 | 2010-10-08 | 基板支持部材及び熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012083003A JP2012083003A (ja) | 2012-04-26 |
JP5701002B2 true JP5701002B2 (ja) | 2015-04-15 |
Family
ID=46009182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010228029A Active JP5701002B2 (ja) | 2010-10-08 | 2010-10-08 | 基板支持部材及び熱処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5701002B2 (ja) |
KR (1) | KR101780471B1 (ja) |
CN (1) | CN102446798B (ja) |
TW (1) | TWI578435B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6008643B2 (ja) * | 2012-07-31 | 2016-10-19 | 京セラメディカル株式会社 | 生体インプラント材料の製造方法および生体インプラント材料 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002267370A (ja) * | 2001-03-08 | 2002-09-18 | Denkoo:Kk | 加熱炉及び被加熱物の加熱方法 |
CN1324670C (zh) * | 2002-09-29 | 2007-07-04 | 光洋热系统株式会社 | 热处理装置用工件装载装置 |
JP2005340480A (ja) * | 2004-05-26 | 2005-12-08 | Nippon Oil Corp | 基板カセット用サポートバー |
JP4029104B2 (ja) * | 2006-01-30 | 2008-01-09 | 新日本石油株式会社 | 楕円状支持部材 |
JP4933292B2 (ja) | 2006-02-28 | 2012-05-16 | キヤノン株式会社 | 情報処理装置、無線通信方法、記憶媒体、プログラム |
JP4853204B2 (ja) | 2006-09-28 | 2012-01-11 | 大日本印刷株式会社 | 板状物の搬送方法および板状物の搬送装置 |
JP2010192524A (ja) * | 2009-02-16 | 2010-09-02 | Sharp Corp | 基板保持具 |
-
2010
- 2010-10-08 JP JP2010228029A patent/JP5701002B2/ja active Active
-
2011
- 2011-06-08 TW TW100119938A patent/TWI578435B/zh active
- 2011-06-28 CN CN201110179649.0A patent/CN102446798B/zh active Active
- 2011-06-28 KR KR1020110063159A patent/KR101780471B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201216403A (en) | 2012-04-16 |
CN102446798A (zh) | 2012-05-09 |
KR101780471B1 (ko) | 2017-09-21 |
TWI578435B (zh) | 2017-04-11 |
CN102446798B (zh) | 2016-01-20 |
KR20120036735A (ko) | 2012-04-18 |
JP2012083003A (ja) | 2012-04-26 |
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