JP5698636B2 - Rolled copper foil - Google Patents

Description

  The present invention relates to a rolled copper foil suitably used for an FPC that requires flexibility.

  High flexibility is required for copper foils used for bending FPCs (flexible printed circuit boards). As a method for imparting flexibility to the copper foil, a technique for increasing the orientation degree of the crystal orientation of the (100) plane on the copper foil rolled surface (Patent Document 1), the ratio of crystal grains penetrating in the thickness direction of the copper foil (Patent Document 2), and a technique (Patent Document 3) for reducing the surface roughness Ry (maximum height) corresponding to the oil pit depth of the copper foil to 2.0 μm or less is known.

The general FPC manufacturing process is as follows. First, the copper foil is bonded to the resin film. For joining, there are a method of imidizing by applying heat treatment to a varnish applied on a copper foil, and a method of laminating a resin film with an adhesive and a copper foil. The copper foil with a resin film joined by these steps is called CCL (copper-clad laminate). The copper foil is recrystallized by the heat treatment in the CCL manufacturing process.
By the way, when manufacturing FPC using copper foil, if the copper foil surface is etched to improve the adhesion to the coverlay film, a dent (dish down) with a diameter of several tens of μm may occur on the surface. In particular, it tends to occur in highly bent copper foil. This is caused by controlling the crystal orientation of the copper foil so that a cubic structure after recrystallization annealing is developed in order to impart high flexibility. In other words, even if such control is performed, the orientations of all the crystals are not aligned, and it is considered that crystal grains having different crystal orientations exist locally in a uniform structure. At this time, since the etching rate differs depending on the crystal plane to be etched, the crystal grains are etched deeper locally than the surroundings, resulting in a depression. This dent causes the circuit etchability to deteriorate, or causes the appearance to be judged to be defective in the appearance inspection.
Also, depending on the etchant, the cubic structure may be faster or slower than the random structure. Therefore, if the cubic structure after recrystallization annealing is developed too much, if the etching rate of this cubic structure is slowed, the productivity is lowered, or copper remains between the circuits during circuit formation, and the etching performance deteriorates. On the other hand, when the etching rate of the cubic structure is increased, the circuit part is easily etched, and the etching property is deteriorated.

  As a method for reducing such dents, a technique (Patent Document 4) for recrystallization after mechanically polishing the surface of the copper foil before or after rolling to give a strain that becomes a work-affected layer is reported. . According to this technique, non-uniform crystal grains are clustered on the surface after recrystallization by the work-affected layer, so that crystal grains having different crystal orientations do not exist alone.

Japanese Patent No. 3009383 JP 2006-117977 A Japanese Patent Laid-Open No. 2001-058203 JP 2009-280855 A

However, in the case of the technique described in Patent Document 4, there are many non-uniform crystal grains, and crystals on the surface of the copper foil are not oriented in the (100) plane.
On the other hand, the high-gloss copper foil described in Patent Document 3 has a uniform crystal orientation and less dishdown. However, high gloss copper foil is not preferred because it is not easy to handle, such as the surface is easily damaged.
Therefore, the present invention has been made to solve the above-described problems, and the rolled copper foil has a good handleability due to a moderately rough state of the copper foil surface, excellent flexibility, and good surface etching characteristics. For the purpose of provision.

As a result of various studies, the inventors have not made the surface of the copper foil so rough before the final pass of the final cold rolling, but roughened the surface of the copper foil in the final pass of the final cold rolling. The surface and shape of oil pits (surface condition) are less likely to generate shear bands, while maintaining a rough copper foil surface, maintaining flexibility and reducing dishdown, and etching rate differences due to the etching solution Therefore, it was found that the resulting copper foil has excellent etching properties. The present inventors have found that the form and frequency (surface state) of oil pits in which shear bands are unlikely to occur can be evaluated macroscopically from the area ratio of oil pits from a confocal microscope image.
In order to achieve the above object, the rolled copper foil of the present invention has a ratio Ra / t between the surface roughness Ra measured at a length of 175 μm in the rolling parallel direction on the copper foil surface and the thickness t of the copper foil. In the state of 0.004 or more and 0.007 or less and heated to 200 ° C. for 30 minutes and tempered to a recrystallized structure, the 200 diffraction intensity (I) obtained by X-ray diffraction of the rolled surface is X-ray diffraction of fine copper powder. For the obtained 200 diffraction intensity (I ₀ ), 20 ≦ I / I ₀ ≦ 40, three scans having a length of 175 μm in the rolling parallel direction on the copper foil surface and spaced apart by 50 μm or more in the direction perpendicular to the rolling direction. when on the line to measure the thickness direction of the profile, respectively, and the average value d of the difference between the maximum height in the thickness direction and a minimum height of each scan line corresponding to the maximum depth of the oil pits, and the thickness t of the copper foil The ratio d / t of the oil pit is 0.1 or less, and the oil pit area ratio when measured with a confocal microscope is 6 Or more and 15% or less.

When the copper foil surface after the above heat treatment at 200 ° C. for 30 minutes was observed by EBSD after electrolytic polishing, the area ratio of the crystal grains having an angle difference of 15 degrees or more between the crystal orientation of the rolled surface and the [100] orientation was 30 -70% is preferred.
After the ingot is hot-rolled, cold rolling and annealing are repeated, and finally the final cold-rolling is performed. In the final cold-rolling process, Ra / t is 0.002 or more before the final pass. It is preferably 0.004 or less.
It is preferable to contain 30 to 300 wtppm in total of one or more selected from the group consisting of Ag, Sn, In, Au, Pd and Mg.

  According to the present invention, it is possible to obtain a rolled copper foil having an appropriately roughened copper foil surface to improve handleability, excellent flexibility, and good surface etching characteristics.

It is a figure which shows the shape of an oil pit. It is a figure which shows the measuring method of the average value d equivalent to the maximum depth of an oil pit. 2 is a diagram showing an optical microscope image of the surface of Example 1. FIG. 6 is a diagram showing an optical microscope image of the surface of Comparative Example 1. FIG. 2 is a diagram showing a confocal microscope image of Example 1. FIG. It is a figure which shows the confocal microscope image of the comparative example 1. It is a figure which shows the method of measuring a bending fatigue life with a bending test apparatus.

  Hereinafter, the rolled copper foil which concerns on embodiment of this invention is demonstrated. In the present invention, “%” means “% by mass” unless otherwise specified.

First, the technical idea of the present invention will be described with reference to FIG. When the roll roughness in the final cold rolling is increased to roughen the copper foil surface, the handleability of the copper foil is improved, but dishdown is likely to occur and the etching property is lowered. This is considered as follows.
An oil pit is formed on the surface of the copper foil by the rough roll in the final cold rolling, but as the processing proceeds, a shear deformation band tends to occur at the tip of the oil pit. If the processing continues further, the shear deformation zone develops deeply. In this way, the portion of the oil pit in which a deep shear deformation zone has occurred becomes crystal grains having different crystal orientations in other uniform structures during recrystallization, and serves as a starting point for dishdown during etching. Conceivable.
On the other hand, a technique for increasing the glossiness (surface roughness) is conventionally known in order to obtain the flexibility of the copper foil. This is considered to be because it is difficult to produce a shear deformation band by suppressing the formation of oil pits by final cold rolling with a roll having low roughness. However, if the glossiness of the copper foil is increased (the surface roughness is reduced), the handleability of the copper foil is lowered, and therefore it is not preferred for the side using the copper foil.

On the other hand, the present inventor does not make the surface of the copper foil very rough (for example, roll with a roll having a low roughness) before the final pass of the final cold rolling. By roughening the surface of the foil (for example, rolling with a rough roll), oil pits are formed and the surface of the final copper foil becomes rough, but the shape of the oil pits where the shear deformation band does not develop so much As a result, it was found that crystal grains having different crystal orientations in a uniform structure are reduced, and the surface etching characteristics are improved while improving the flexibility.
In other words, conventionally, the orientation of copper foil has been thought to depend solely on the roughness of the copper foil surface, but in reality, the scale (development) of the shear deformation band inside the material is the orientation (and dishdown). It was found that it affects. In the final cold rolling, if the development of the shear band can be sufficiently suppressed in the pass before the final pass, the degree of orientation with good etching properties can be obtained even if the copper foil surface is finished rough in the final pass.

In addition, the present invention is characterized by macroscopically evaluating the degree of development of the above-described shear band from the area ratio of oil pits from a confocal microscope image, and finding a range of the area ratio in which dishdown is reduced. .
On the other hand, oil pit information cannot be clearly grasped only by the conventionally used surface roughness value. That is, when the surface of the rolled copper foil is observed, the occurrence of oil pits is observed along the direction TD perpendicular to the rolling. However, as shown in FIG. 1, the oil pit has a sectional shape with a short length in the TD direction. It was found that there was a trapezoidal shape (reference numeral P2 in FIG. 1) in addition to the above-mentioned one (reference numeral P1 in FIG. 1). Moreover, even if the depth of the oil pit is the same, there are a wide pit opening degree and a narrow pit direction in the RD direction. It is considered that these differences in the shape of the oil pits cannot be sufficiently reflected in general surface roughness measurements such as Ra, Ry, Rz, and Sm that measure the surface undulation of the copper foil.
Therefore, by using a confocal microscope, the ratio (area ratio) of the image area corresponding to the oil pit is obtained to reflect the shape of the oil pit, and the difference corresponding to the quality of the dishdown or flexibility. Can be obtained. The oil pit area ratio is binarized before and after a predetermined threshold value for the altitude difference of the Z axis (height direction) imaged with a confocal microscope, and the part deeper than this threshold value is extracted as the oil pit part. The area ratio is obtained.

Next, the rule and composition of the rolled copper foil of the present invention will be described.
(1) Area ratio of oil pit As described above, the surface of the copper foil is not roughened before the final pass of the final cold rolling, but is roughened in the final pass of the final cold rolling. The final surface of the copper foil is roughened, and an oil pit shape in which a shear deformation zone is difficult to develop is obtained, and dishdown is reduced. The surface of the oil pit that is difficult to develop such a shear deformation zone has an oil pit area ratio of 6% to 15% when measured with a confocal microscope. It became clear by the Example) mentioned later.

  When the oil pit area ratio exceeds 15%, the number of oil pits with developed shear deformation zones increases. When a shear deformation band develops inside the material, during recrystallization, crystal grains having different crystal orientations are formed in another uniform structure, and dishdown is likely to occur during etching.

On the other hand, there are two conditions when the area ratio of the oil pit is less than 6%. One condition is to use a roll with low roughness for all passes of the final cold rolling. Under these conditions, since there are few deep oil pits and the shear deformation zone is difficult to develop, the dishdown is reduced, but the surface roughness of the copper foil becomes too small (not satisfying the Ra / t requirement described later), and the copper Since it is difficult to handle the foil product, it is not preferable.
The second condition is that the surface of the copper foil is roughened before the final pass of the final cold rolling, and the surface of the copper foil is smoothed using a roll having low roughness in the final pass of the final cold rolling. Under this condition, by using a roll with low roughness in the final pass, the portion of the oil pit formed in front of the final pass that is close to the copper foil surface is widened in the final pass and approaches flat, and the surface roughness is reduced. Get smaller. However, the narrow valley inside the oil pit remains intact. Therefore, the opening of the surface part of the oil pit is narrowed and the area ratio of the oil pit itself is reduced, but since a rough roll is used before the final pass, a shear deformation zone develops in the oil pit, Even after the final pass, a shear deformation band remains and many dishdowns occur. A state in which a large number of dishdowns occur although the area ratio of the oil pit is small as described above becomes remarkable when the area ratio of the oil pit is less than 6%.

  In addition, as a method of setting the area ratio of the oil pit to 6% or more, as described above, in the final cold rolling, in the oil pit that is shallow in the pass before the final pass and the shear band is not developed. In order to form an oil pit, the roll before the final pass of the final cold rolling is rolled using a roll having a relatively small roughness (surface roughness Ra is, for example, 0.05 μm or less), and the final cold rolling is performed. In the final pass, rolling may be performed using a roll having a relatively large roughness (surface roughness Ra of, for example, 0.06 μm or more), and the finally obtained copper foil surface may be roughened. Since the oil pits formed in the pass before the final pass are shallow and the shear band is not developed, even if the surface of the copper foil is roughened in the final pass of the final cold rolling, the oil pits with the developed shear band do not increase. Dish down is less. On the other hand, when rolling is performed using a roll having a large roughness (surface roughness Ra exceeds 0.05 μm, for example) in the pass before the final cold rolling pass, an oil pit in which a shear band easily develops is formed. The oil pit develops at, the area increases, the area ratio of the oil pit exceeds 15%, the development of the shear band becomes remarkable, and dishdown is likely to occur.

Here, in the final cold rolling process, the surface of the copper foil of the final cold rolling is compared by using a roll having a relatively small roughness (surface roughness Ra is, for example, 0.05 μm or less) in the pass before the final pass. Smooth. Specifically, the ratio (Ra / t) between the surface roughness Ra and the foil thickness t is preferably 0.0020 or more and 0.0040 or less at a stage one pass before the final pass of the final cold rolling process. If rolling of the final pass is performed under such a surface condition that Ra / t is in this range, even if the surface of the copper foil is roughened by the final pass, it is difficult to introduce a shear band into the formed oil pit. Therefore, it is preferable.
As will be described later, (Ra / t) after the final pass of the final cold rolling step is set to 0.004 or more and 0.007 or less.

(2) I / I ₀
In order to impart high flexibility to the copper foil of the present invention, 200 diffraction intensity (I) determined by X-ray diffraction of the rolled surface in a state of being heated to 200 ° C. for 30 minutes and tempered to a recrystallized structure, 20 ≦ I / I ₀ ≦ 40 with respect to 200 diffraction intensity (I ₀ ) obtained by X-ray diffraction of fine powder copper. Thereby, the degree of orientation of the (200) plane becomes an appropriate value, and a copper foil excellent in the balance between flexibility and etching property can be obtained. In this case, since the recrystallized texture having the crystal orientation of the (200) plane does not develop too much, the texture of the orientation other than the (200) plane is dispersed to some extent and etched uniformly. It does not matter (dishdown itself is not necessarily reduced, but the entire copper foil is etched to the same extent).
When I / I ₀ <20, the degree of orientation of the (200) plane decreases and the flexibility decreases. When 40 <I / I ₀ , the structure having the (200) plane crystal orientation increases and the flexibility becomes good, but as a result of the excessive development of the (100) plane recrystallized texture, the (200) plane A structure having an orientation other than that is partially concentrated and this structure is greatly etched to easily cause dishdown, resulting in poor etching. On the other hand, if the degree of orientation of the (200) plane is too high, the etching rate is greatly different from the other orientations, so that the etching property is lowered.
The annealing at 200 ° C. for 30 minutes imitates the temperature history given to the copper foil in the CCL manufacturing process.
In addition, if one or two or more selected from the group of Ag, Sn, In, Au, Pd and Mg are contained in the copper foil in a total amount of 30 to 300 wtppm, it is easy to manage 20 ≦ I / I ₀ ≦ 40. desirable.

As a method of managing 20 ≦ I / I ₀ ≦ 40, for example, cold rolling and annealing are repeated, the average grain size is set to 10 to 20 μm in the final annealing, and then the total processing is performed when rolling to the product sheet thickness. The degree should be 90 to 96%, and the development of the shear band should be suppressed in the pass before the final pass of the final cold rolling. In this case, rolling can be performed using a roll having a relatively small roughness (surface roughness Ra is, for example, 0.05 μm or less) in a pass before the final pass of the final cold rolling.

(3) Ra / t
In order to reduce dishdown without changing the surface roughness from the conventional one, Ra (mm) / t (mm) after final cold rolling is specified to be 0.004 or more and 0.007 or less. If it does in this way, dishdown can be reduced, making surface roughness equivalent to the conventional copper foil. In addition, by dividing the surface roughness by the thickness, the roughness of the copper foil surface can be evaluated regardless of the thickness of the copper foil. For example, if the thickness t of the copper foil is reduced, the ratio of surface irregularities in the copper foil thickness increases even if the surface roughness is the same, and the copper foil surface cannot be sufficiently evaluated by the oil pit area ratio described above. Sometimes.
Here, Ra (center line average roughness) is defined in JIS B0601, and in the present invention, on the surface of the copper foil, the length is 175 μm in the rolling parallel direction, and the three scanning lines are separated by 50 μm or more in the direction perpendicular to the rolling direction. The average value of the values measured in.

(4) d / t
Even when the roughness of the copper foil surface is not so great and many of the oil pits are considered to have less developed shear deformation bands, there may be some deep oil pits. In a deep oil pit, there is a high possibility that a shear deformation zone has developed, and in this case, dishdown starts. Therefore, in the present invention, the average value d of the maximum depth of the oil pit is defined as d / t ≦ 0.1.
By dividing the average value d of the maximum depth of the oil pit by the thickness t, the copper foil surface can be evaluated regardless of the thickness of the copper foil. That is, even if the maximum depth of the oil pit is the same, the influence becomes greater as the thickness t of the copper foil is reduced.
Here, the average value d of the maximum depth of the oil pits is three scanning lines having a length of 175 μm in the rolling parallel direction RD and 50 μm or more in the rolling perpendicular direction TD on the copper foil surface as shown in FIG. on L ₁ ~L _3, the average value of the differences di maximum height _{H M} and a minimum height _{H S} in the thickness direction of each scanning line _L 1 ~L ₃ corresponding to the maximum depth of the oil pits. Specifically, a contact-type _roughness, maximum calculated height _{H M} and a minimum height _{H S} by measuring the thickness direction of the profile on the L 1 ~L _3, di of each scanning line _L 1 ~L ₃ Should be averaged.
Although the thickness in particular of copper foil (or copper alloy foil) is not restrict | limited, For example, the thing of 5-50 micrometers can be used conveniently.

(5) Orientation difference due to EBSD As described above, dishdown is the ratio of crystal grains having different crystal orientations in a uniform structure recrystallized by heat treatment when copper foil is bonded to a resin film. In many cases, the single crystal grains are etched deeper than the surroundings during etching. Therefore, as the heat treatment, the copper foil is heated under the heat treatment conditions (200 ° C. for 30 minutes) simulating the temperature history applied to the copper foil in the CCL manufacturing process, and the recrystallized structure is tempered. And, as the crystal orientation in this state, when the copper foil surface is observed by EBSD after electrolytic polishing, the area ratio of crystal grains having an angle difference of 15 degrees or more between the crystal orientation of the rolled surface and the [100] orientation is 30 to 30 It is preferably 70%. In addition, you may heat for 30 minutes at 200 degreeC also about the copper foil used as CCL which has already received thermal history. The one that has been heat-treated until it is recrystallized does not change even if it is heated further. Therefore, in observation observed with EBSD, it is not distinguished between copper foil that has undergone thermal history and copper foil that has not received heat, at 200 ° C. Heat for 30 minutes.
When the area ratio is 30 to 70% when observed by EBSD, a copper foil excellent in both flexibility and etching property can be obtained. When the area ratio is less than 30%, the etching property is inferior, and when it exceeds 70%, the flexibility may be lowered. In order to make the area ratio 30 to 70% when observed with EBSD, as described above, in the final cold rolling, the development of the shear band is suppressed in the pass before the final pass, that is, the final cold rolling. It is desirable to roll using a roll having a relatively small roughness (surface roughness Ra is, for example, 0.05 μm or less) in the pass before the final pass. In addition, if the copper foil contains a total of 30 to 300 wtppm of one or more selected from the group of Ag, Sn, In, Au, Pd and Mg, the area ratio can be easily controlled to 30 to 70%. desirable.

(6) Composition As copper foil, tough pitch copper, oxygen-free copper, electrolytic copper having a purity of 99.9 wt% or more can be used, and one kind selected from the group of Ag, Sn, In, Au, Pd and Mg Or it is desirable to contain 30-300 wtppm in total of 2 or more types. Oxygen-free copper is standardized by JIS-H3510 (alloy number C1011) and JIS-H3100 (alloy number C1020), and tough pitch copper is standardized by JIS-H3100 (alloy number C1100).

Next, an example of the manufacturing method of the rolled copper foil of this invention is demonstrated. First, an ingot made of copper, necessary alloy elements, and inevitable impurities is hot-rolled, and then cold-rolling and annealing are repeated, and finally, it is finished to a predetermined thickness by final cold-rolling.
Here, as described above, the surface of the copper foil is not roughened before the final pass of the final cold rolling, and the final copper is roughened by roughening the surface of the copper foil in the final pass of the final cold rolling. Although the surface of the foil is rough, it becomes a surface state having oil pits which are difficult to develop in the shear deformation band, and dishdown is reduced. And the surface ratio with such a small shear deformation band has an oil pit area ratio of 6 to 15%.

Therefore, before the final pass of the final cold rolling, the surface of the copper foil is rolled using a roll having a relatively small roughness (surface roughness Ra is, for example, 0.05 μm or less) or the final cold rolling is performed. What is necessary is just to roll by increasing the degree of 1-pass processing in hot rolling. On the other hand, in the final pass of the final cold rolling, rolling is performed using a roll having a relatively large roughness (surface roughness Ra is, for example, 0.06 μm or more), or rolling is performed using a highly viscous rolling oil. The obtained copper foil surface is roughened.
In addition, in order to create a surface state having oil pits that are rough on the surface of the final copper foil but are difficult to develop in the shear deformation zone, as described above, in the final two passes or the final pass of the final cold rolling. It is necessary to use a coarse roll or a high-viscosity rolling oil, but it is preferable to adjust the rolling conditions in the final pass because it is easy to adjust. On the other hand, when the roughness of the roll is increased before the final three passes of the final cold rolling, a shear deformation band develops further in the formed oil pit by the processing of the final pass.

  In addition, it is good to adjust annealing conditions so that the average particle diameter of the recrystallized grain obtained by annealing immediately before final cold rolling may be 10-20 micrometers. Further, the rolling degree in the final cold rolling is preferably 92 to 99%.

The elements listed in Table 1 were added to electrolytic copper, and ingots in the atmosphere (Examples 1 to 3 and 5) and in a reducing atmosphere (mixed gas of N2 and CO) (Examples 4, 6, and 7 to 14), respectively. Was cast. In Comparative Examples 1 to 6, ingots were cast in an argon atmosphere. Those cast in the atmosphere contained 150-300 ppm oxygen, and those cast in the reducing atmosphere contained oxygen in the same degree as oxygen-free copper (C1020). The produced ingot is hot-rolled at a temperature of 800 ° C. or more to a thickness of 10 mm, and after chamfering the oxide scale on the surface, cold rolling and annealing are repeated, and then 0.24 mm (Examples 1 to 12), 0.12 Annealing after thicknesses of mm (Example 13), 0.36 mm (Example 14), 1.20 mm (Comparative Examples 1-3, 5), 0.30 mm (Comparative Example 4), 0.08 mm (Comparative Example 6) Thus, the average crystal grain size was set to 13 μm. Furthermore, the thickness was 0.012 mm (Examples 1 to 12, Comparative Examples 1 to 6), 0.006 mm (Example 13), and 0.018 mm (Example 14) by final cold rolling.
The final cold rolling was performed in 5 to 15 passes, and as shown in Table 1, rolling was performed by changing the surface roughness of the roll up to the front of the final pass and the surface roughness of the roll in the final pass. The surface roughness of the roll from the first pass of the final pass to the front of the final pass is the same. The degree of workability of the final cold rolling is shown in Table 1.

Various characteristics of each copper foil sample thus obtained were evaluated.
(1) Surface roughness Ra: Ra (center line average roughness) is measured in accordance with JIS B0601, and the sample surface is length in the rolling parallel direction using a confocal microscope (manufactured by Lasertec, model number: HD100D). The value measured at 175 μm was used.
(2) Cube texture After heating the sample at 200 ° C. for 30 minutes, an integral value (I) of 200 diffraction intensities obtained by X-ray diffraction of the rolled surface was determined. This value was divided by the integral value (I0) of 200 diffraction intensity of finely powdered copper (325 mesh, heated for 1 hour at 300 ° C. in a hydrogen stream), and the I / I0 value was calculated. .

(3) Maximum oil pit depth (average value d)
Using a confocal microscope (made by Lasertec, model number: HD100D), as shown in FIG. 2, three pieces having a length of 175 μm in the rolling parallel direction RD and 50 μm or more in the rolling perpendicular direction TD on the copper foil surface, respectively. The difference di between the maximum height H _M and the minimum height H _S on the scanning lines L _{1 to} L ₃ was determined. The di of each of the scanning lines L _{1 to} L ₃ was averaged to be d. In addition, it was set as d (mm) / t (mm).
(4) Orientation difference by EBSD EBSD (backscattered electron diffraction device, JEOL Ltd. JXA8500F, acceleration voltage 20kV, current 2e-8A) after electrolytic polishing of sample surface after heating at 200 ° C for 30 minutes in (2) Observation range 1000 μm × 1000 μm, step width 1 μm). The area ratio of crystal grains with an angular difference of 15 degrees or more between the rolling plane orientation and the [100] orientation was obtained by image analysis.

(5) Etching property Etching property was evaluated as follows. First, the sample surface is etched for 2 minutes at room temperature using an etching solution (each of which is ADEKA TECH CL-8 (manufactured by ADEKA CORPORATION) and DP-200 (manufactured by EBARA Eugeneite)). An image obtained by photographing the surface of the observation range with an optical microscope was binarized, and the ratio of light and dark was calculated. The structure with [100] orientation is bright because it is a plane parallel to the copper foil surface, and in other orientations it appears dark due to diffuse reflection because of fine irregularities on the surface.
Next, of the bright part and the dark part, the one having a ratio of less than 50% was regarded as the structure having the smaller area ratio. Since the tissue with the smaller area ratio is surrounded by the tissue with the larger area ratio, the tissue with the smaller area ratio is approximated by a polygon, and the minimum diameter of the circumscribed circle of this polygon is 50 μm. The number of points that exceeded was counted. Regardless of which solution of Adecatec CL-8 or DP-200 is used, the corresponding area is 10 or less within the observation range, and after the final cold rolling, the etching amount before heating at 200 ° C. for 30 minutes and the final cold The difference in etching amount within ± 10% after rolling at 200 ° C. for 30 minutes after rolling is good etching property (◯), and the number is more than 10 or the difference in etching amount is ± 10 % Exceeding% was regarded as poor etching property (x).
Here, the etching amount is calculated by (copper foil weight before etching−copper foil weight after etching), and if the difference in the etching amount is within ± 10%, the presence or absence of recrystallization after the final cold rolling Regardless of the etching amount, it is considered that the etching amount hardly changes and the etching property is excellent.
In addition, the etching property tends to be better when either the bright surface or the dark surface is larger than when the bright surface and the dark surface are mixed on the copper foil surface. The I / I0 value of the rolled copper foil after the final cold rolling and before heating at 200 ° C. for 30 minutes is sufficiently smaller than 1 in any of the examples and comparative examples, and the rolling texture is sufficiently developed. It was. Therefore, when the same etching solution was used, the etching amount of the copper foil before heating for 30 minutes at 200 ° C. after the final cold rolling became almost the same value in any of the examples and comparative examples. This shows that the orientation state in the recrystallized structure heated after the final cold rolling affects the etching property.

(6) Area ratio of oil pit The surface of the sample was measured with a confocal microscope (manufactured by Lasertec, model number: HD100D) per 300 × 300 μm measurement field. The sample was moved in the optical axis (Z-axis) direction within the measurement field of view, and an image having a depth of 10 nm (this is called FMS (Focus Scan Memory) image) was captured from the copper foil surface. And the binarization process was performed considering the part deeper than 10 nm from the copper foil surface as an oil pit. The example of the image is FIG.5 and FIG.6, and the bright color part is an oil pit. Then, the area of the oil pit (bright color area) was obtained using a commercially available image processing software with respect to the measurement visual field of 300 × 300 μm, and the area ratio of the oil pit was calculated.

(7) was visually scratches the surface of each sample surface, scratches with a length greater than or equal 10mm in rolling direction, a case where there are five points / m ² or more was ×.
(8) Flexibility After heating the sample at 200 ° C. for 30 minutes for recrystallization, a thermoplastic PI adhesive on one side of polyimide film (trade name: Kapton (registered trademark) EN) (surface to be bonded to copper foil) Was coated and dried to form a 27 μm thick resin layer. A copper clad laminate was produced by laminating the resin layer on the copper foil on a copper foil and performing vacuum hot pressing. The bending fatigue life of the copper clad laminate was measured with a bending test apparatus shown in FIG. This apparatus has a structure in which a vibration transmitting member 3 is coupled to an oscillation driver 4, and a copper foil 1 to be tested is fixed to the apparatus at a total of four points including a screw 2 part indicated by an arrow and a tip part of 3. Is done. When the vibration part 3 is driven up and down, the intermediate part of the copper foil 1 is bent into a hairpin shape with a predetermined radius of curvature r. In this test, the number of times until breakage when bending was repeated under the following conditions was determined.
The test conditions are as follows: Specimen width: 12.7 mm, Specimen length: 200 mm, Specimen sampling direction: Collected so that the length direction of the specimen is parallel to the rolling direction, curvature radius r : 2.5 mm, vibration stroke: 25 mm, vibration speed: 1500 times / minute. In addition, when the bending fatigue life was 500,000 times or more, it was judged to have excellent flexibility.

If the bending fatigue life is 500,000 times or more, it has good flexibility to withstand severe bending such as folding movable parts of a folding mobile phone.

  The obtained results are shown in Table 1.

As is clear from Table 1, in the case of each example in which 20 ≦ I / I ₀ ≦ 40, d / t is 0.1 or less, and the area ratio of the oil pit is 6 to 15%, the etching property is good. Furthermore, the copper foil surface was not damaged and was excellent in flexibility. In each example, Ra / t of the final product was 0.004 or more and 0.007 or less.

On the other hand, in the case of Comparative Example 4 in which the surface roughness of the rolls in all the final cold rolling passes (including the final pass) is Ra = 0.04 μm or less, Ra / t of the final pass is less than 0.004, and the oil pit Since the area ratio of the copper foil was less than 6%, the surface of the copper foil was scratched and the handleability was poor.
In the case of Comparative Example 4, although the surface roughness was small and the oil pit area ratio was less than 6%, I / I ₀ > 40, and many dishdowns occurred, resulting in poor etching properties.

  In the case of Comparative Example 1 in which the surface roughness of the roll before the final pass is roughened to Ra = 0.06 μm or more in the final cold rolling and the surface roughness of the roll in the final pass is Ra = 0.05 μm or less, Since the Ra / t of the product was smaller than 0.004, the copper foil surface was scratched and the handleability was poor. Also, since a rough roll was used before the final pass, a shear deformation band developed in the oil pit, and even if a roll with a small roughness was used in the final pass, a shear deformation band remained, and the area of the oil pit The rate was less than 6%, many dishdowns occurred, and the etching property deteriorated.

In the case of Comparative Examples 2, 3, and 5 in which the surface roughness of the roll until the final pass and the surface roughness of the roll in the final pass are both roughened to Ra = 0.06 μm or more in the final cold rolling, the final pass Ra / t before the first pass became 0.004 or more, and many oil pits with shear deformation zones developed before the final pass. As a result, the oil pit area ratio exceeded 15% after the final pass, resulting in a large number of dishdowns and poor etchability.
In the case of Comparative Examples 2 and 3, since the degree of workability of the final cold rolling is high and the roll surface roughness of all passes of the final cold rolling is roughened, a shear deformation band is remarkably developed inside the material, and the oil Many pits occurred. For this reason, not only the oil pit area ratio exceeded 15%, but also the degree of crystal orientation on the copper foil surface was 40 <I / I ₀ , and dishdown was likely to occur, and the etching property deteriorated.
On the other hand, in the case of Comparative Example 5, since the roll roughness before the final pass of the final cold rolling was smoother than Comparative Examples 2 and 3, the flexibility was good, but I / I ₀ was Comparative Example Since it was higher than 2 and 3, the difference in the etching amount described above exceeded ± 10%, and there were 10 or more dishdowns, and the etching property deteriorated.
In the case of Comparative Example 6 in which the final cold rolling degree was made smaller than those of other Examples and Comparative Examples, I / I ₀ was too low and the flexibility was deteriorated.

Claims (4)

The ratio Ra / t between the surface roughness Ra measured at a length of 175 μm in the rolling parallel direction on the copper foil surface and the thickness t of the copper foil is 0.004 or more and 0.007 or less, and is recrystallized by heating at 200 ° C. for 30 minutes. In a state of tempering the structure, the 200 diffraction intensity (I) obtained by X-ray diffraction of the rolled surface is 20 ≦ I / I with respect to the 200 diffraction intensity (I ₀ ) obtained by X-ray diffraction of fine powder copper. ₀ ≦ 40,
Length 175μm in the direction parallel to the rolling direction in the copper foil surface, and in the direction perpendicular to the rolling direction on the three scan lines away respectively 50μm or more when measured in the thickness direction of the profile, respectively, each corresponding to the maximum depth of the oil pit The average value d of the difference between the maximum height and the minimum height in the thickness direction of the scanning line, and the ratio d / t of the thickness t of the copper foil is 0.1 or less,
Rolled copper foil with an oil pit area ratio of 6% to 15% as measured with a confocal microscope.   When the copper foil surface after heat treatment at 200 ° C. × 30 minutes is observed by EBSD after electrolytic polishing, the area ratio of crystal grains having an angle difference of 15 degrees or more between the crystal orientation of the rolled surface and the [100] orientation is 30 to 30 The rolled copper foil according to claim 1, which is 70%.   After the ingot is hot-rolled, cold rolling and annealing are repeated, and finally the final cold-rolling is performed. In the final cold-rolling process, Ra / t is 0.002 or more before the final pass. The rolled copper foil according to claim 1 or 2, which is 0.004 or less. The rolled copper foil in any one of Claims 1-3 which contains 30-300 wtppm in total in the 1 type (s) or 2 or more types chosen from the group of Ag, Sn, In, Au, Pd, and Mg.