JP5671724B2 - 液相レーザーアブレーション方法及び装置 - Google Patents
液相レーザーアブレーション方法及び装置 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
Description
a)ナノ粒子の飛散が少なく、生成したナノ粒子を全て製品として利用できる点、
b)高価な真空装置が不要であり、装置構成が簡素で設備費が安価である点、
c)生成したナノ粒子の粒度分布がシャープであり、粒径のばらつきが少ない点、
d)生成したナノ粒子が外気に接触しないために、不純物の混入が無く、高純度のナノ粒子が得られる点、
e)生成したナノ粒子が気相中よりも凝集しにくく、ナノ粒子が液相中に均一に分散した状態で取り出すことができ、ナノ粒子の濃度の調整も容易である点、
等の理由で、液相中でアブレーション操作を行う液相レーザーアブレーション方法の研究が鋭意進められている。
上記実施形態に係る液相レーザーアブレーション装置において、レーザー発振装置21から発振されたレーザー光Lは、反射面が回動自在な反射ミラー22によって所定角度の方向に反射される。反射されたレーザー光Lの、液体31の液面に対する入射角度θは0度を超え90度未満、好ましくは、10度以上80度以下に設定される。反射されたレーザー光Lは、さらに集光レンズ23によって集光されてレーザー光導入口13を経て、液体31の底部に配置されたターゲット32に照射される。このとき、ターゲット32に含有される被微細化成分はレーザー光によってアブレーションされて微細粒径のナノ粒子が生成される。
(1)容器としては、内のり寸法が縦50mm×横75mm×深さ52mmの寸法を有する内容積が200cm3である箱状のガラス容器であり、充填される液体の有効内容積が160cm3である容器を使用した。
(2)容器に充填する液体は純水とした。
(3)ターゲットとしては金(Au)を使用した。
(4)レーザー発振装置としては、波長が266nmである紫外線領域のレーザー光を発振し、出力が100mJ/パルスであり、パルス回数が10パルス/secであるNd:YAGレーザー発振装置を使用した。
Claims (9)
- 被微細化成分を配置した液体を貯留する容器と、上記液体を介して上記被微細化成分に照射するレーザー光を発振するためのレーザー発振装置と、上記液体の液面に対するレーザー光の入射角度を変更自在に構成した反射ミラーと、上記レーザー発振装置から発振されたレーザー光を集光する集光レンズと、上記容器の上面を覆う蓋体と、上記蓋体又は上記容器の側面の一部を開口して形成されたレーザー光導入口であり、上記液体の液面上方に設けられたレーザー光導入口とを備え、上記液体の液面に対するレーザー光の入射角度が0度を超え90度未満の所定角度に設定されていることを特徴とする液相レーザーアブレーション装置。
- 請求項1記載の液相レーザーアブレーション装置において、前記被微細化成分は被微細化成分を含有するターゲット成形体として上記液体中に配置されていることを特徴とする液相レーザーアブレーション装置。
- 請求項1記載の液相レーザーアブレーション装置において、前記被微細化成分は被微細化成分の粒子が上記液体中に分散したスラリーとして配置されていることを特徴とする液相レーザーアブレーション装置。
- 請求項1記載の液相レーザーアブレーション装置において、前記レーザー光の導入口に、光透過性を有する窓体が嵌め込まれていることを特徴とする液相レーザーアブレーション装置。
- 請求項1記載の液相レーザーアブレーション装置において、前記レーザー光の導入口から、液面に対するレーザー光の入射角度と同じ取付け角度でレーザー光導入管を導出したことを特徴とする液相レーザーアブレーション装置。
- 請求項5記載の液相レーザーアブレーション装置において、前記レーザー光導入管の先端部に、光透過性を有する窓体が嵌め込まれていることを特徴とする液相レーザーアブレーション装置。
- 被微細化成分を配置した液体にレーザー光を照射して被微細化成分をアブレーションして微細化粒子を生成する液相レーザーアブレーション方法において、上記液体を収容した容器上面を蓋体で覆い、上記液体の液面に対するレーザー光の入射角度を、0度を超え90度未満の所定角度に設定することを特徴とする液相レーザーアブレーション方法。
- 請求項7記載の液相レーザーアブレーション方法において、前記被微細化成分は被微細化成分を含有するターゲット成形体として上記液体中に配置することを特徴とする液相レーザーアブレーション方法。
- 請求項7記載の液相レーザーアブレーション方法において、前記被微細化成分は被微細化成分の粒子を上記液体中に分散したスラリーとして配置することを特徴とする液相レーザーアブレーション方法。
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JP2011035060A JP5671724B2 (ja) | 2011-02-21 | 2011-02-21 | 液相レーザーアブレーション方法及び装置 |
EP12748971.4A EP2679300A4 (en) | 2011-02-21 | 2012-02-13 | LIQUID PHASE LASER ABLATION METHOD AND DEVICE |
US14/000,721 US9339891B2 (en) | 2011-02-21 | 2012-02-13 | Liquid phase laser ablation method and apparatus |
PCT/JP2012/053285 WO2012114923A1 (ja) | 2011-02-21 | 2012-02-13 | 液相レーザーアブレーション方法及び装置 |
KR1020137021510A KR101536838B1 (ko) | 2011-02-21 | 2012-02-13 | 액상 레이저 애브레이션 방법 및 장치 |
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US20130150231A1 (en) * | 2011-12-07 | 2013-06-13 | Imra America, Inc. | Method of manufacturing ordered intermetallic catalysts |
JP6130316B2 (ja) | 2014-03-11 | 2017-05-17 | 信越化学工業株式会社 | 研磨組成物及び研磨方法並びに研磨組成物の製造方法 |
US20160236296A1 (en) * | 2015-02-13 | 2016-08-18 | Gold Nanotech Inc | Nanoparticle Manufacturing System |
JP5908623B1 (ja) * | 2015-02-13 | 2016-04-26 | 京華堂實業股▲ふん▼有限公司 | ナノ粒子製造システム |
JP2018040033A (ja) * | 2016-09-07 | 2018-03-15 | 株式会社スギノマシン | レーザアブレーションによる金属ナノコロイド生成方法 |
JP6965094B2 (ja) * | 2017-10-17 | 2021-11-10 | 株式会社ディスコ | レーザー加工装置 |
CN111992876B (zh) * | 2020-08-31 | 2022-05-20 | 北京理工大学重庆创新中心 | 基于激光与液体相互作用调控的复杂三维微孔加工方法 |
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JP2006122845A (ja) | 2004-10-29 | 2006-05-18 | Nara Kikai Seisakusho:Kk | 液相レーザーアブレーション装置 |
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- 2012-02-13 WO PCT/JP2012/053285 patent/WO2012114923A1/ja active Application Filing
- 2012-02-13 EP EP12748971.4A patent/EP2679300A4/en not_active Ceased
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KR101536838B1 (ko) | 2015-07-14 |
US20130320595A1 (en) | 2013-12-05 |
KR20130121939A (ko) | 2013-11-06 |
WO2012114923A1 (ja) | 2012-08-30 |
EP2679300A4 (en) | 2016-05-11 |
JP2012170881A (ja) | 2012-09-10 |
US9339891B2 (en) | 2016-05-17 |
EP2679300A1 (en) | 2014-01-01 |
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