JP5670210B2 - フラックス充填率判定装置、フラックス充填率判定方法、フラックス充填率判定システムおよびフラックス充填率判定プログラム - Google Patents
フラックス充填率判定装置、フラックス充填率判定方法、フラックス充填率判定システムおよびフラックス充填率判定プログラム Download PDFInfo
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- JP5670210B2 JP5670210B2 JP2011010275A JP2011010275A JP5670210B2 JP 5670210 B2 JP5670210 B2 JP 5670210B2 JP 2011010275 A JP2011010275 A JP 2011010275A JP 2011010275 A JP2011010275 A JP 2011010275A JP 5670210 B2 JP5670210 B2 JP 5670210B2
- Authority
- JP
- Japan
- Prior art keywords
- flux
- filling rate
- metal strip
- flux filling
- sectional area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B23K35/406—Filled tubular wire or rods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/44—Arrangements for executing specific programs
Landscapes
- Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonmetallic Welding Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011010275A JP5670210B2 (ja) | 2011-01-20 | 2011-01-20 | フラックス充填率判定装置、フラックス充填率判定方法、フラックス充填率判定システムおよびフラックス充填率判定プログラム |
CN201210014749.2A CN102601549B (zh) | 2011-01-20 | 2012-01-17 | 焊剂填充率的判定装置、判定方法、判定系统 |
KR1020120006336A KR101327588B1 (ko) | 2011-01-20 | 2012-01-19 | 플럭스 충전율 판정 장치, 플럭스 충전율 판정 방법, 플럭스 충전율 판정 시스템 및 플럭스 충전율 판정 프로그램을 기록한 컴퓨터 판독가능한 기억 매체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011010275A JP5670210B2 (ja) | 2011-01-20 | 2011-01-20 | フラックス充填率判定装置、フラックス充填率判定方法、フラックス充填率判定システムおよびフラックス充填率判定プログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012148330A JP2012148330A (ja) | 2012-08-09 |
JP5670210B2 true JP5670210B2 (ja) | 2015-02-18 |
Family
ID=46519522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011010275A Active JP5670210B2 (ja) | 2011-01-20 | 2011-01-20 | フラックス充填率判定装置、フラックス充填率判定方法、フラックス充填率判定システムおよびフラックス充填率判定プログラム |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5670210B2 (ko) |
KR (1) | KR101327588B1 (ko) |
CN (1) | CN102601549B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105728993B (zh) * | 2016-05-05 | 2019-01-15 | 苏州金品线材科技有限公司 | 一种药芯焊丝生产线及其生产工艺 |
CN106950144B (zh) * | 2017-04-28 | 2018-05-18 | 关忆恒 | 一种药芯焊丝填充率检测的剥皮装置 |
CN111758018B (zh) * | 2020-05-28 | 2023-07-28 | 郑州机械研究所有限公司 | 一种控制器、药芯焊丝填充率检测方法以及设备 |
CN112067545B (zh) * | 2020-10-09 | 2024-02-27 | 郑州机械研究所有限公司 | 药芯焊丝连续检测钎剂的方法及系统 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2607772B2 (ja) * | 1991-06-17 | 1997-05-07 | 株式会社神戸製鋼所 | フラックス入り溶接ワイヤのフラックス充填率検知方法 |
JPH06180289A (ja) * | 1992-12-11 | 1994-06-28 | Nippon Steel Weld Prod & Eng Co Ltd | 粉粒体充填率の測定方法 |
JP3476169B2 (ja) * | 1996-03-11 | 2003-12-10 | 日鐵住金溶接工業株式会社 | 粉粒体充填管の粉粒体充填率検出装置 |
JP2000180416A (ja) | 1998-12-18 | 2000-06-30 | Kobe Steel Ltd | フラックス充填量測定方法および装置 |
KR100425936B1 (ko) * | 2001-06-11 | 2004-04-08 | 주식회사 싸이로드 | 플럭스 충진률 검사장치 |
CN201266106Y (zh) * | 2008-10-09 | 2009-07-01 | 武汉铁锚焊接材料股份有限公司 | 药芯焊丝成型机的填充率在线测量控制装置 |
CN101537552B (zh) * | 2009-04-16 | 2011-09-07 | 武汉铁锚焊接材料股份有限公司 | 药芯焊丝成型机的填充率在线测量控制方法及装置 |
-
2011
- 2011-01-20 JP JP2011010275A patent/JP5670210B2/ja active Active
-
2012
- 2012-01-17 CN CN201210014749.2A patent/CN102601549B/zh active Active
- 2012-01-19 KR KR1020120006336A patent/KR101327588B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN102601549B (zh) | 2014-10-01 |
KR101327588B1 (ko) | 2013-11-12 |
KR20120084684A (ko) | 2012-07-30 |
JP2012148330A (ja) | 2012-08-09 |
CN102601549A (zh) | 2012-07-25 |
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