JP5660926B2 - プレート積層型冷却装置 - Google Patents
プレート積層型冷却装置 Download PDFInfo
- Publication number
- JP5660926B2 JP5660926B2 JP2011037014A JP2011037014A JP5660926B2 JP 5660926 B2 JP5660926 B2 JP 5660926B2 JP 2011037014 A JP2011037014 A JP 2011037014A JP 2011037014 A JP2011037014 A JP 2011037014A JP 5660926 B2 JP5660926 B2 JP 5660926B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- flow path
- double
- core material
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 title claims description 34
- 239000000463 material Substances 0.000 claims description 85
- 238000005219 brazing Methods 0.000 claims description 38
- 239000011162 core material Substances 0.000 claims description 25
- 238000005260 corrosion Methods 0.000 claims description 17
- 230000007797 corrosion Effects 0.000 claims description 17
- 239000003507 refrigerant Substances 0.000 claims description 13
- 239000010405 anode material Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910018131 Al-Mn Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018461 Al—Mn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002528 anti-freeze Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011037014A JP5660926B2 (ja) | 2011-02-23 | 2011-02-23 | プレート積層型冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011037014A JP5660926B2 (ja) | 2011-02-23 | 2011-02-23 | プレート積層型冷却装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012172936A JP2012172936A (ja) | 2012-09-10 |
| JP2012172936A5 JP2012172936A5 (enrdf_load_stackoverflow) | 2013-12-05 |
| JP5660926B2 true JP5660926B2 (ja) | 2015-01-28 |
Family
ID=46976005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011037014A Active JP5660926B2 (ja) | 2011-02-23 | 2011-02-23 | プレート積層型冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5660926B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3021067B1 (en) | 2013-07-08 | 2018-08-22 | Mitsubishi Electric Corporation | Laminated header, heat exchanger, air conditioning device, and method for connecting plate-shaped body and pipe of laminated header |
| JP6098760B2 (ja) * | 2014-05-20 | 2017-03-22 | 富士電機株式会社 | 半導体モジュール用冷却器及びその製造方法 |
| JP2016015381A (ja) * | 2014-07-01 | 2016-01-28 | 株式会社フジクラ | コールドプレート |
| JP2016018953A (ja) * | 2014-07-10 | 2016-02-01 | 株式会社フジクラ | コールドプレート |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09105592A (ja) * | 1995-10-05 | 1997-04-22 | Mitsubishi Electric Corp | プレート積層型熱交換器及びその製造方法 |
| JP3759215B2 (ja) * | 1995-12-27 | 2006-03-22 | 昭和電工株式会社 | 真空ろう付用Ａｌブレージングシート、ならびにドロンカップ式熱交換器用チューブエレメントおよびドロンカップ式熱交換器 |
| JPH1183372A (ja) * | 1997-09-10 | 1999-03-26 | Matsushita Electric Ind Co Ltd | 積層式熱交換器及びその製造方法 |
| JP4482997B2 (ja) * | 2000-02-02 | 2010-06-16 | パナソニック株式会社 | 積層式熱交換器およびその製造方法 |
| EP1555079B1 (de) * | 2004-01-12 | 2008-07-23 | Electrovac AG | Verfahren zum Herstellen von aus Plattenstapeln bestehenden Kühlern oder Kühlerelementen, mit Fügemittel auf Innenflächen der Plattendurchbrüchen oder -öffnungen |
| JP2005282951A (ja) * | 2004-03-30 | 2005-10-13 | Institute Of Tsukuba Liaison Co Ltd | 一体型積層構造熱交換器 |
| JP2008036650A (ja) * | 2006-08-02 | 2008-02-21 | Denso Corp | 熱交換器の製造方法 |
| JP2008300596A (ja) * | 2007-05-31 | 2008-12-11 | Sony Corp | ヒートシンクおよび半導体レーザ装置 |
-
2011
- 2011-02-23 JP JP2011037014A patent/JP5660926B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012172936A (ja) | 2012-09-10 |
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