JP5659806B2 - エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 - Google Patents

エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 Download PDF

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JP5659806B2
JP5659806B2 JP2011005645A JP2011005645A JP5659806B2 JP 5659806 B2 JP5659806 B2 JP 5659806B2 JP 2011005645 A JP2011005645 A JP 2011005645A JP 2011005645 A JP2011005645 A JP 2011005645A JP 5659806 B2 JP5659806 B2 JP 5659806B2
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epoxy resin
group
carbon atoms
resin composition
component
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JP2012144672A5 (enExample
JP2012144672A (ja
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正雄 冨岡
正雄 冨岡
金子　学
学 金子
三谷　和民
和民 三谷
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
Mitsubishi Rayon Co Ltd
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JP2011005645A 2011-01-14 2011-01-14 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 Active JP5659806B2 (ja)

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JP2011005645A JP5659806B2 (ja) 2011-01-14 2011-01-14 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

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JP2011005645A JP5659806B2 (ja) 2011-01-14 2011-01-14 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

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JP2012144672A JP2012144672A (ja) 2012-08-02
JP2012144672A5 JP2012144672A5 (enExample) 2014-02-13
JP5659806B2 true JP5659806B2 (ja) 2015-01-28

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6277821B2 (ja) * 2013-12-25 2018-02-14 三菱ケミカル株式会社 積層型半導体装置の層間充填材用の組成物、積層型半導体装置、および積層型半導体装置の製造方法
US11108220B2 (en) * 2015-12-30 2021-08-31 Cytec Industries Inc. Multifunctional surfacing material with burn-through resistance
CN112608580B (zh) * 2020-11-30 2023-07-11 金发科技股份有限公司 一种阻燃abs组合物及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100587483B1 (ko) * 2005-03-11 2006-06-09 국도화학 주식회사 난연성 고내열 에폭시수지 조성물
JP2007326929A (ja) * 2006-06-07 2007-12-20 Asahi Kasei Electronics Co Ltd エポキシ樹脂組成物、当該樹脂組成物を用いたプリプレグ
WO2010038644A1 (ja) * 2008-10-01 2010-04-08 東洋紡績株式会社 ポリアミドイミド樹脂、該樹脂組成物、難燃性接着剤組成物並びに該組成物からなる接着剤シート、カバーレイフィルム及びプリント配線板
CN102639640B (zh) * 2009-11-19 2014-06-11 东洋纺织株式会社 氨基甲酸酯改性聚酰亚胺系阻燃树脂组合物

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